CN110137168A - Side with IC shines PLC technology LED - Google Patents

Side with IC shines PLC technology LED Download PDF

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Publication number
CN110137168A
CN110137168A CN201910439455.6A CN201910439455A CN110137168A CN 110137168 A CN110137168 A CN 110137168A CN 201910439455 A CN201910439455 A CN 201910439455A CN 110137168 A CN110137168 A CN 110137168A
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CN
China
Prior art keywords
pad
pin
luminescence chip
welded
area
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Pending
Application number
CN201910439455.6A
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Chinese (zh)
Inventor
刘明剑
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DONGGUAN OPCSO OPTOELECTRONICS TECHNOLOGY Co Ltd
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DONGGUAN OPCSO OPTOELECTRONICS TECHNOLOGY Co Ltd
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Priority to CN201910439455.6A priority Critical patent/CN110137168A/en
Publication of CN110137168A publication Critical patent/CN110137168A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention discloses the luminous PLC technology LED in side of band IC a kind of, including insulating body and four conductive terminals；The pin that each conductive terminal is equipped with pad and connect with each self-brazing pad, four pads are respectively first to fourth pad；The arrangement of each pad are as follows: the first pad is exposed to the upper left side of reflector, and second pad is exposed to the middle part of reflector on the lower and lower left side, third pad are exposed to the lower right side of reflector, and the 4th pad is exposed to top and upper right side in the middle part of reflector；It is isolated from each other between each pad；The first luminescence chip and the second luminescence chip are welded on second pad, third luminescence chip is welded on third pad, driving IC is welded on 4th pad, make the upside for driving IC to be distributed in reflector, each luminescence chip is distributed in the downside of reflector, driving IC is PLC technology integrated chip, and controllable first luminescence chip, the second luminescence chip, third luminescence chip are only solely lighted respectively, light or light two-by-two simultaneously.

Description

Side with IC shines PLC technology LED
The application is application No. is 201710499632.0, and the applying date is on 06 27th, 2017, entitled " band IC Side shine PLC technology LED " divisional application.
Technical field
The present invention relates to LED field technologies, and referring in particular to one kind has multiple pins, and each pin is according to heat dissipation capacity Different and with different heat dissipation areas the luminous PLC technology LED in the sides with IC.
Background technique
Side light source type LED support structure as shown in Chinese invention CN202678400U, including a pair of conductive terminal and with lead The integrally formed insulating body of electric terminal.Wherein, insulating body has the receiving portion for packaging LED chips, a pair of conductive end Son has solid welding zone to expose receiving portion, and two weld parts are accommodated in the two sides of insulating body after multiple bending.This existing side Light source led bracket has following defect: only a pair of conductive terminal, is only used for providing power supply, Gu the LED chip in welding zone is Single colored chip can not achieve the full-color light-emitting of LED.Its weld part has multiple bending, and production process is more, inefficiency, and The bending times fixing power that will lead between its conductive terminal and insulating body insufficient more, reduces red ink test passes rate.
Another side light source LED support as shown in Chinese invention CN205595372U, including a rectangle insulating body and 6PIN conductive terminal has 6 die bond pads, client is facilitated to carry out LED core according to demand due to there is 6 conductive terminals The adjustment of piece quantity, so as to be made into full-color light-emitting.However, there is no according to different heat dissipations for the pin of each conductive terminal It measures and changes heat dissipation area.In addition, these pins are also to have multiple bending, the height and thickness of LED support are increased, it is unfavorable In the design requirement of miniaturization, miniaturization.
Summary of the invention
In view of this, in view of the deficiencies of the prior art, the present invention aims to provide a kind of side of band IC hairs Light PLC technology LED can shine more uniformly, be not in intermediate bright, both sides secretly or there is bright border on entering light side, or is different Phenomena such as angular intensity is inconsistent.
Secondary objective is that with multiple pins, and each pin has different radiating surfaces according to heat dissipation capacity difference Product, can effectively extend the service life of LED.
To achieve the above object, the present invention is using following technical solution:
A kind of luminous PLC technology LED in the side of band IC, including insulating body and four conductive terminals, the insulating body and four A conductive terminal is integrated produced by insert molding, and the leading flank of the insulating body is concaved with a reflector, by each luminescence chip And driving IC is installed in reflector, to form the LED support of lateral emitting；
The pin that each conductive terminal is equipped with pad and connect with each self-brazing pad, four pads are respectively the first pad, second Pad, third pad, the 4th pad；The arrangement of each pad are as follows: first pad is exposed to the upper left side of reflector, and described Two pads are exposed to the middle part of reflector on the lower and lower left side, and the third pad is exposed to the lower right side of reflector, and described Four pads are exposed to top and upper right side in the middle part of reflector；It is isolated from each other between each pad；
It is welded with the first luminescence chip and the second luminescence chip on second pad, third hair is welded on the third pad Optical chip is welded with driving IC on the 4th pad, makes the upside for driving IC to be distributed in reflector, each luminescence chip distribution In the downside of reflector, the driving IC is PLC technology integrated chip, can control the first luminescence chip, the second luminous core Piece, third luminescence chip are only solely lighted respectively, light or light two-by-two simultaneously.
As a preferred embodiment, there is the driving IC first conducting wire to be welded in the first pad, lead with Article 2 Wire bonding is connected to the second pad, and there is Article 3 conducting wire to be welded in third pad, and there is Article 4 conducting wire to be welded in the 4th pad, has There is Article 5 conducting wire to be welded in the first luminescence chip, there is Article 6 conducting wire to be welded in the second luminescence chip, led with Article 7 Wire bonding is connected to third luminescence chip；Also, there is the first luminescence chip Article 8 conducting wire to be welded in the second pad, third luminescence chip The second pad is welded in Article 9 conducting wire.
As a preferred embodiment, the area of each pad are as follows: the area > third pad of the 4th pad of area > of the second pad The first pad of area > area.
As a preferred embodiment, first pad is oblong-shaped, and second pad is " ﹄ " shape, described the Three pads are oblong-shaped, and the 4th pad is " " " shape.
As a preferred embodiment, it is green wafer, the second hair on the left of the second pad that first luminescence chip, which is located at, It is red wafer that optical chip, which is located on the right side of the second pad, and the third luminescence chip is blue light chip.
As a preferred embodiment, each luminescence chip is distributed in the downside of driving IC and is located in same horizontal line.
As a preferred embodiment, each pin stretches out the bottom surface of insulating body, is arranged in a row in the bottom surface of insulating body, Each pin keeps gap each other, wherein and the first pin is signal input pin DI, and second pin is power pins VDD, the Three pins are signal output pin DO, and the 4th pin is grounding pin GND.
As a preferred embodiment, the arrangement sequence of each pin are as follows: press the first pin, second pin, third pin, the 4th Pin is from left to right arranged successively.
As a preferred embodiment, the area of each pin is different, wherein the area of the 4th pin of area > of second pin The area of the area > third pin of the first pin of >.
As a preferred embodiment, the thickness of each pin is identical, length is identical, of different size, wherein the width of each pin Are as follows: the width of width G T.GT.GT the first pin > third pin of the 4th pin of width G T.GT.GT of second pin.
The present invention has obvious advantages and beneficial effects compared with the existing technology, specifically, by above-mentioned technical proposal Known to: since the area of the leading flank of LED support is maximum, after reflector to be set to the leading flank of insulating body, each conducting end The pin of son is located at the bottom surface of insulating body, forms the LED of lateral emitting；The installation driving IC, three luminous cores in reflector Piece, wherein driving IC is distributed in the upside of reflector, and three luminescence chips are arranged in the downside of glow cup, can shine more Uniformly, be not in intermediate bright, both sides secretly or there is phenomena such as bright border or different angle brightness are inconsistent on entering light side, further more, according to According to driving IC and power supply and the request signal transmission of luminescence chip, it is not of uniform size that each pin is designed as heat dissipation area, is the Area > the first pin (signal input pin of the 4th pin (grounding pin GND) of area > of two pins (power pins VDD) DI the area of area > third pin (signal output pin DO)) meets the different radiating requirements of each pin, can effectively prolong The service life of long LED.
In order to explain the structural features and functions of the invention more clearly, come with reference to the accompanying drawing with specific embodiment to this hair It is bright to be described in detail.
Detailed description of the invention
Fig. 1 is the assembling schematic perspective view of the preferred embodiments of the invention；
Fig. 2 is the exploded view of the preferred embodiments of the invention；
Fig. 3 is the partial assembly drawing of the preferred embodiments of the invention, shows the relative positional relationship between each magnet；
Fig. 4 is the sectional view in Fig. 1 at the position M-M；
Fig. 5 is the sectional view in Fig. 4 at the position N-N.
Description of drawing identification:
10, insulating body 101, left side
102, right side 103, leading flank
104, trailing flank 105, top surface
106, bottom surface 11, reflector
111, it leads and faces directly or rounding face 12, unfilled corner
13, recessing groove 20, conductive terminal
211, the first pad 212, the second pad
213, third pad 214, the 4th pad
221, the first pin 222, second pin
223, third pin 224, the 4th pin
31, the first luminescence chip 32, the second luminescence chip
33, third luminescence chip 34, driving IC
301, first conducting wire 302, Article 2 conducting wire
303, Article 3 conducting wire 304, Article 4 conducting wire
305, Article 5 conducting wire 306, Article 6 conducting wire
307, Article 7 conducting wire 308, Article 8 conducting wire
309, Article 9 conducting wire.
Specific embodiment
It please refers to shown in Fig. 1 to Fig. 5, it to be a kind of band IC that show the specific structures of the preferred embodiments of the invention Side shine PLC technology LED, including insulating body 10 and four conductive terminals 20, the insulating body 10 and four conductions Terminal 20 is integrated produced by insert molding.
Wherein, the insulating body 10 be in rectangular parallelepiped structure, have left side 101, right side 102, leading flank 103, after The area of side 104, top surface 105, bottom surface 106, the leading flank 103 is greater than remaining each individual area in side.The insulation The leading flank 103 of main body 10 is concaved with a reflector 11, in this way, reflector 11 is set to the maximum leading flank 103 of area, Each luminescence chip and driving IC 34 are installed in reflector 11 again, to form the LED support of lateral emitting.It is described exhausted The upper right corner of the leading flank 103 of edge main body 10 is equipped with unfilled corner 12, and convenient for bracket lamp bead, knowledge is debated in direction in use.This implementation In example, the reflector 11 is rectangle structure, is faced directly or rounding face between each reflective surface of the reflector 11 by leading 111 transition.
In four conductive terminals 20, each conductive terminal 20 is equipped with pad and and connect with each self-brazing pad integral type Pin.Four pads are respectively the first pad 211, the second pad 212, third pad 213, the 4th pad 214, four pins point It Wei not the first pin 221, second pin 222, third pin 223, the 4th pin 224.Specifically, the first pad 211 and One pin 221 is an integral structure, and the second pad 212 is an integral structure with second pin 222, third pad 213 and third Pin 223 is an integral structure, and the 4th pad 214 is an integral structure with the 4th pin 224.
Each pad is all exposed in reflector 11.The arrangement of each pad are as follows: first pad 211 is exposed to reflector 11 Upper left side, second pad 212 is exposed to the middle part of reflector 11 on the lower and lower left side, the third pad 213 are exposed to The lower right side of reflector 11, the 4th pad 214 are exposed to the 11 top and upper right side in middle part of reflector；Between each pad each other Isolation, so that electricity and signal isolation, do not interfere with each other, and short circuit does not occur.In the present embodiment, the area of each pad are as follows: second The area of the first pad of area > 211 of the area > third pad 213 of the 4th pad 214 of area > of pad 212.Described One pad 211 is oblong-shaped, and second pad 212 is " ﹄ " shape, and the third pad 213 is oblong-shaped, described 4th pad 214 is " " " shape, the pad design of this structure, so that the second pad 212 has the sufficiently large double hairs of area installation Optical chip (being the first luminescence chip 31 and the second luminescence chip 32), the 4th pad 214 have sufficiently large area installation driving IC 34。
The first luminescence chip 31 and the second luminescence chip 32, the third pad 213 are welded on second pad 212 On be welded with third luminescence chip 33, be welded on the 4th pad 214 driving IC 34, make drive IC 34 be distributed in it is reflective The upside of cup 11, three luminescence chips are distributed in the downside of reflector 11, and three luminescence chips are located at below driving IC.Its In, there is the driving IC 34 first conducting wire 301 to be welded in the first pad 211, and there is Article 2 conducting wire 302 to be welded in the Two pads 212 with having Article 3 conducting wire 303 to be welded in third pad 213 there is Article 4 conducting wire 304 to be welded in the 4th There is pad 214 Article 5 conducting wire 305 to be welded in the first luminescence chip 31, and there is Article 6 conducting wire 306 to be welded in second and shine There is chip 32 Article 7 conducting wire 307 to be welded in third luminescence chip 33；Also, the first luminescence chip 31 has Article 8 conducting wire 308 are welded in the second pad 212, and there is third luminescence chip 33 Article 9 conducting wire 309 to be welded in the second pad 212；Drive IC 34 respectively with signal input DI, signal output DO, power supply line VDD, ground line GND is connected, then respectively with full-color three-colour light-emitting Chip 31/32/33 is connected, since driving IC 34 is the integrated chip of PLC technology, in this way, in the control of driving IC 34 Under, three luminescence chips are individually lighted, and are perhaps lighted or three while being lighted two-by-two.
In the present embodiment, three luminescence chips 31,32,33 can be located in same horizontal line, or can not also be same One horizontal line.And three luminescence chips in the present embodiment can for red (R), green (G), blue (B) three kinds of colors luminous crystalline substance Piece.Specific arrangement position are as follows: in the second pad, what the first luminescence chip 31 was located at left side is green chip, the second luminescence chip 32 to be located at right side be red chip, and third luminescence chip 33 is blue dies.This arrangement mode enables LED emission true Light, and can shine more uniformly, be not in intermediate bright, both sides secretly or there are bright border or different angle brightness in entering light side not Phenomena such as consistent.
Each pin stretches out the bottom surface 106 of insulating body 10, is arranged in a row in the bottom surface of insulating body 10 106, wherein the One pin 221 is signal input pin DI, and second pin 222 is power pins VDD, and third pin 223 is signal output pin DO, the 4th pin 224 are grounding pin GND；The arrangement sequence of each pin are as follows: press the first pin 221, second pin 222, third Pin 223, the 4th pin 224 are from left to right arranged successively；Each pin keeps gap each other.
The area of each pin is different, wherein the first pin of area > of the 4th pin 224 of area > of second pin 222 The area of 221 area > third pin 223.Since second pin 222 is power pins VDD, the 4th pin 224 is grounding lead Foot GND is the equal of the positive and negative anodes of LED support, and when for each pin powered, high current generates more second pin 222 The area design of second pin 222 is maximum by heat, therefore, this product, and the 4th pin 224 takes second place.And the first pin 221 with And third pin 223 is inputted as data-signal and output pin, without being powered, to generate lesser heat, is equivalent to not Fever, thus, the area of the first pin 221 and third pin 223 is done small, on the one hand can save material, on the other hand increase Gap between big adjacent leads makes to be less prone to after welding and eats tin and generate short circuit phenomenon, improve product product convenient for welding Matter.
There are many modes for keeping each pin heat dissipation area not of uniform size, in the present embodiment, takes following preferred embodiment: each The thickness of pin is identical, length is identical, of different size.Wherein, the width of each pin are as follows: the width G T.GT.GT the 4th of second pin 222 The width of the 221 > third pin 223 of the first pin of width G T.GT.GT of pin 224.It takes same thickness to be advantageous in that, makes each draw Foot can be formed with a piece of smooth copper sheet blanking, quickly be produced, and taking equal length to be advantageous in that can be convenient welding, Leg is smooth, and performance is stablized after welding.Take of different size be advantageous in that the different pin of heat dissipation area can quickly be made.
In the present embodiment, recessing groove 13 is equipped on rear side of the bottom surface 106 of the insulating body 10, each pin is located at recessing groove 13 Interior, the bottom of each pin flushes in the bottom edge edge of insulating body 10.To which each leg is smooth in the bottom surface of insulating body 10 106 Arrangement, without departing from the outside of insulating body 10, and, after being welded using scolding tin, tin solidifies in recessing groove 13, and shape is clean and tidy, Stable connection.In addition, each pin is without bending, straight, patch type pin, in this way, LED support is easier to produce and is easy to weld It is connected on circuit board.
The working principle that the present embodiment is described in detail is as follows: passing through second pin 222(power pins VDD) and the 4th pin 224 (grounding pin GND) forms power supply closed circuit after connecting, and is that each luminescence chip and driving IC 34 power.Meanwhile first draws Foot 221(signal input pin D1) and third pin 223(signal output pin DO) closed circuit that data-signal controls is formed, It is transferred to driving IC 34, the driving IC 34 is PLC technology integrated chip, receives control command triggering three and shines Chip 31/32/33 is individually lighted, and is perhaps lighted or three while being lighted two-by-two.
Design focal point of the invention is: since the area of the leading flank 103 of LED support is maximum, reflector 11 being arranged After the leading flank 103 of insulating body 10, the pin of each conductive terminal 20 is located at the bottom surface 106 of insulating body 10, forms side Luminous LED；Installation driving IC 34, the first luminescence chip 31, the second luminescence chip 32, the luminous core of third in reflector 11 Piece 33, nationality by drive IC PLC technology characteristic, realize each luminescence chip individually light, two kinds light together or all light. Wherein, driving IC 34 is distributed in the upside of reflector 11, and three luminescence chips 31/32/33 are arranged in the downside of glow cup, energy It is enough to shine more uniformly, be not in that intermediate bright, both sides are dark or entering light side have bright border or different angle brightness it is inconsistent it is equal now As further more, it is big that each pin is designed as heat dissipation area according to driving IC 34 and power supply and the request signal transmission of luminescence chip Small different, be second pin 222(power pins VDD) the 4th pin 224(grounding pin GND of area >) area > The area of the area > third pin 223 (signal output pin DO) of one pin 221 (signal input pin DI), meets each draw The different radiating requirements of foot can effectively extend the service life of LED.
The above described is only a preferred embodiment of the present invention, be not intended to limit the scope of the present invention, Therefore any subtle modifications, equivalent variations and modifications to the above embodiments according to the technical essence of the invention, still Belong in the range of technical solution of the present invention.

Claims (10)

  1. The PLC technology LED 1. a kind of side of band IC shines, including insulating body and four conductive terminals, the insulating body with Four conductive terminals are integrated produced by insert molding, it is characterised in that:
    The leading flank of the insulating body is concaved with a reflector, each luminescence chip and driving IC is installed on reflective In cup, to form the LED support of lateral emitting；
    The pin that each conductive terminal is equipped with pad and connect with each self-brazing pad, four pads are respectively the first pad, second Pad, third pad, the 4th pad；The arrangement of each pad are as follows: first pad is exposed to the upper left side of reflector, and described Two pads are exposed to the middle part of reflector on the lower and lower left side, and the third pad is exposed to the lower right side of reflector, and described Four pads are exposed to top and upper right side in the middle part of reflector；It is isolated from each other between each pad；
    It is welded with the first luminescence chip and the second luminescence chip on second pad, third hair is welded on the third pad Optical chip is welded with driving IC on the 4th pad, makes the upside for driving IC to be distributed in reflector, each luminescence chip distribution In the downside of reflector, the driving IC is PLC technology integrated chip, can control the first luminescence chip, the second luminous core Piece, third luminescence chip are only solely lighted respectively, light or light two-by-two simultaneously.
  2. The PLC technology LED 2. the side of band IC according to claim 1 shines, it is characterised in that: the driving IC has First conducting wire is welded in the first pad, and there is Article 2 conducting wire to be welded in the second pad, and there is Article 3 conducting wire to be welded in the There is three pads Article 4 conducting wire to be welded in the 4th pad, and there is Article 5 conducting wire to be welded in the first luminescence chip, have the 6th Bar conducting wire is welded in the second luminescence chip, and there is Article 7 conducting wire to be welded in third luminescence chip；Also, the first luminescence chip has Article 8 conducting wire is welded in the second pad, and there is third luminescence chip Article 9 conducting wire to be welded in the second pad.
  3. The PLC technology LED 3. the side of band IC according to claim 1 shines, it is characterised in that: the area of each pad are as follows: The area of the first pad of area > of the area > third pad of the 4th pad of area > of second pad.
  4. The PLC technology LED 4. the side of band IC according to claim 1 shines, it is characterised in that: first pad is Oblong-shaped, second pad are " ﹄ " shape, and the third pad is oblong-shaped, and the 4th pad is " " " shape.
  5. The PLC technology LED 5. the side of band IC according to claim 1 shines, it is characterised in that: the first luminous core It is green wafer on the left of the second pad that piece, which is located at, and it is red wafer that the second luminescence chip, which is located on the right side of the second pad, described Third luminescence chip is blue light chip.
  6. The PLC technology LED 6. the side of band IC according to claim 1 shines, it is characterised in that: each luminescence chip point It is distributed in the downside of driving IC and is located in same horizontal line.
  7. The PLC technology LED 7. the side of band IC according to claim 1 shines, it is characterised in that: each pin stretches out absolutely The bottom surface of edge main body is arranged in a row in the bottom surface of insulating body, and each pin keeps gap each other, wherein the first pin is Signal input pin DI, second pin are power pins VDD, and third pin is signal output pin DO, and the 4th pin is ground connection Pin GND.
  8. The PLC technology LED 8. the side of band IC according to claim 7 shines, it is characterised in that: the arrangement sequence of each pin It is classified as: being from left to right arranged successively by the first pin, second pin, third pin, the 4th pin.
  9. The PLC technology LED 9. the side of band IC according to claim 7 shines, it is characterised in that: the area of each pin is not Together, the wherein area of the area > third pin of the first pin of area > of the 4th pin of area > of second pin.
  10. The PLC technology LED 10. the side of band IC according to claim 7 shines, it is characterised in that: the thickness phase of each pin It is identical, of different size with, length, wherein the width of each pin are as follows: the width G T.GT.GT first of the 4th pin of width G T.GT.GT of second pin The width of pin > third pin.
CN201910439455.6A 2017-06-27 2017-06-27 Side with IC shines PLC technology LED Pending CN110137168A (en)

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Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108305871A (en) * 2018-01-26 2018-07-20 深圳市天成照明有限公司 The lamp bead of IC built in a kind of more cup type holders
CN108615726A (en) * 2018-07-12 2018-10-02 深圳市天成照明有限公司 A kind of lamp bead of built-in IC
CN108615727A (en) * 2018-07-20 2018-10-02 深圳市天成照明有限公司 A kind of full-color integrated LED of built-in IC PLC technologies
CN109065530A (en) * 2018-09-28 2018-12-21 深圳市天成照明有限公司 A kind of LED of six channel PLC technology
CN109411588B (en) * 2018-12-11 2020-03-13 深圳市晶族科技有限公司 Parallel mounting LED element, transparent display screen module and production method thereof
CN110335863B (en) * 2019-07-04 2024-02-23 今台电子(惠州)有限公司 LED support packaging structure and packaging technology
CN110350065A (en) * 2019-07-17 2019-10-18 苏州市悠越电子有限公司 With interior drive IC side-emitting LED
CN110312348B (en) * 2019-08-07 2024-05-24 深圳市炫鼎光电科技有限公司 Three-point type flip constant current driving chip and LED lamp
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CN110957312B (en) * 2019-11-29 2022-11-22 深圳极光王科技股份有限公司 Four-pin LED lamp bead with built-in chip and LED display module
CN114883315B (en) * 2022-07-08 2022-11-11 珠海华萃科技有限公司 Side-emitting LED driving chip integrated structure and manufacturing method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202678400U (en) * 2012-05-10 2013-01-16 广东长盈精密技术有限公司 Side light source type LED bracket
CN104167483A (en) * 2014-08-19 2014-11-26 深圳市丽晶光电科技股份有限公司 LED packaging structure and manufacturing method thereof
CN204834666U (en) * 2015-06-23 2015-12-02 东莞市欧思科光电科技有限公司 LED product of built -in IC chip and WWA wafer and LED support thereof
CN205595372U (en) * 2016-04-13 2016-09-21 博罗承创精密工业有限公司 Ultra -thin superbright sidelight source type LED support

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202523708U (en) * 2012-04-23 2012-11-07 深圳市聚飞光电股份有限公司 Multi-chip light-emitting diode (LED)
CN204289443U (en) * 2014-12-25 2015-04-22 深圳市安普光光电科技有限公司 Disjunctor full-color light-emitting diode and LED show module
CN206976341U (en) * 2017-06-27 2018-02-06 东莞市欧思科光电科技有限公司 The luminous PLC technology LED in side with IC

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202678400U (en) * 2012-05-10 2013-01-16 广东长盈精密技术有限公司 Side light source type LED bracket
CN104167483A (en) * 2014-08-19 2014-11-26 深圳市丽晶光电科技股份有限公司 LED packaging structure and manufacturing method thereof
CN204834666U (en) * 2015-06-23 2015-12-02 东莞市欧思科光电科技有限公司 LED product of built -in IC chip and WWA wafer and LED support thereof
CN205595372U (en) * 2016-04-13 2016-09-21 博罗承创精密工业有限公司 Ultra -thin superbright sidelight source type LED support

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