CN203690297U - High-power multicolor COB integration encapsulation structure - Google Patents
High-power multicolor COB integration encapsulation structure Download PDFInfo
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- CN203690297U CN203690297U CN201320785987.3U CN201320785987U CN203690297U CN 203690297 U CN203690297 U CN 203690297U CN 201320785987 U CN201320785987 U CN 201320785987U CN 203690297 U CN203690297 U CN 203690297U
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Abstract
A high-power multicolor COB integration encapsulation structure includes a cooling pad, LED chips, a light reflection cavity, an electrode; the cooling pad is a copper-based circuit board, the middle position of the cooling pad is provided with a light reflection cavity which is an inverted and cone-shaped groove; and the LED chips are installed on the bottom of the light reflection cavity and are on the front side of the cooling pad by eutectic welding; the LED chips include a plurality of red laser chips, blue laser chips, green laser chips, yellow laser chips, white laser chips, wherein some of the red laser chips, blue laser chips, green laser chips and yellow laser chips are evenly installed in a plurality of white laser chip arrays. A substrate of the utility model adopts the high thermal conductivity copper-based circuit board, and the chips in five colors: red (R), green (G), blue (B), yellow (Y), white (W) are arranged on the substrate according to the demands of power and luminance; the five colors' chips can not only emit five monochromatic lights but also can arrange and combine more delicate and richer colors.
Description
Technical field
The utility model relates to LED light source technical field, especially relates to a kind of high-power polychrome COB integrated encapsulation structure.
Background technology
At present common colorful LED light source on the market, a kind of is the LED light source that comprises three kinds of colors of red, green, blue, although color change is abundant, but color is fine and smooth not, between color and color transition natural not, colorimetric purity is not high, spectrum is saturated not, and color rendering is not good.
Summary of the invention
The purpose of this utility model is to overcome the deficiency that prior art exists, and provides a kind of high-power polychrome COB integrated encapsulation structure, in order to solve the problems of the technologies described above.
For achieving the above object, the technical scheme that the utility model adopts is: a kind of high-power polychrome COB integrated encapsulation structure, comprises heating panel, LED chip, reflector cavity, electrode; Described heating panel is copper base circuit board, and this heating panel centre position is provided with reflector cavity, and reflector cavity is inverted truncated cone-shaped groove; Described LED chip is arranged on this reflector cavity bottom, LED chip comprises several red light chips, blue chip, green glow chip, gold-tinted chip, white chip, and wherein multiple red light chips, blue chip, green glow chip, gold-tinted chip are evenly arranged in multiple white chip arrays.
As preferably, described LED chip is 100～200.
As preferably, the quantity of red light chips in described LED chip, blue chip, green glow chip, gold-tinted chip, white chip is identical.
As preferably, described LED chip is bipolar electrode LED chip, and this LED chip electrode is electrically connected.
Substrate of the present utility model adopts high heat-conducting copper base circuit board, by power and brightness requirement arrange on substrate red (R), green (G), blue (B), Y(Huang), white (W), five colors chip, five colors chip both can have been sent out five kinds of monochromatic light, can permutation and combination become color more, abundanter exquisiteness again.
The beneficial effects of the utility model are:
1) adopt red (R), green (G), blue (B), Y(Huang), white (W), multicolored chip.
2) more illusion-colour, exquisiteness, abundant of multicolored combined colors, is applicable to light of stage and uses.
3) power can be accomplished 200 watts from 100.
4) light-emitting area is circular, in chipset, is applicable to joining lens, and light type easily converges, and output intensity is stronger, and irradiation distance is farther.
5) unique appearance design, installs more convenient.
6) circuit independent design, both can do 5 look encapsulation, also can encapsulate monochromatic chip, or the combination of a few color chip, flexible design.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Embodiment
Below by embodiment, and by reference to the accompanying drawings, the technical solution of the utility model is further described in detail.
Fig. 1 is structural representation of the present utility model.As shown in Figure 1, a kind of high-power polychrome COB integrated encapsulation structure, is mainly made up of heating panel 2, LED chip, reflector cavity 3, electrode etc., described heating panel 2 is copper base circuit board, and these heating panel 2 centre positions are provided with reflector cavity 3, and reflector cavity 3 is inverted truncated cone-shaped groove, described LED chip is arranged on this reflector cavity 3 bottoms, wherein LED chip is 100～200, this LED chip is welded on the front of heating panel 2 by eutectic, LED chip is bipolar electrode LED chip, this LED chip and electrode are electrically connected, wherein LED chip is by several red light chips 4, blue chip 6, green glow chip 7, gold-tinted chip 5, white chip 8 forms, red light chips 4 in this LED chip, blue chip 6, green glow chip 7, gold-tinted chip 5, the quantity of white chip 8 is identical, wherein multiple red light chips 4, blue chip 6, green glow chip 77, gold-tinted chip 5 is evenly arranged in multiple white chip 8 arrays.Electrode 40, electrode 60, electrode 70, electrode 50, electrode 80 that red light chips 4, blue chip 6, green glow chip 7, gold-tinted chip 5, white chip 8 are answered respectively in contrast connect.Substrate of the present utility model adopts high heat-conducting copper base circuit board, by power and brightness requirement arrange on substrate red (R), green (G), blue (B), Y(Huang), white (W), five colors chip, five colors chip both can have been sent out five kinds of monochromatic light, can permutation and combination become color more, abundanter exquisiteness again.
Claims (2)
1. a high-power polychrome COB integrated encapsulation structure, comprises heating panel, LED chip, reflector cavity, electrode; It is characterized in that, described heating panel is copper base circuit board, and this heating panel centre position is provided with reflector cavity, and reflector cavity is inverted truncated cone-shaped groove; Described LED chip is arranged on this reflector cavity bottom, and this LED chip is welded on the front of heating panel by eutectic; Described LED chip comprises several red light chips, blue chip, green glow chip, gold-tinted chip, white chip, and wherein multiple red light chips, blue chip, green glow chip, gold-tinted chip are evenly arranged in multiple white chip arrays.
2. the high-power polychrome COB of one according to claim 1 integrated encapsulation structure, is characterized in that, described LED chip is 100～200.
3.the high-power polychrome COB of one according to claim 1 integrated encapsulation structure, is characterized in that, the quantity of red light chips in described LED chip, blue chip, green glow chip, gold-tinted chip, white chip is identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320785987.3U CN203690297U (en) | 2013-12-04 | 2013-12-04 | High-power multicolor COB integration encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320785987.3U CN203690297U (en) | 2013-12-04 | 2013-12-04 | High-power multicolor COB integration encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203690297U true CN203690297U (en) | 2014-07-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320785987.3U Expired - Fee Related CN203690297U (en) | 2013-12-04 | 2013-12-04 | High-power multicolor COB integration encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203690297U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105957862A (en) * | 2016-06-14 | 2016-09-21 | 江苏欧密格光电科技股份有限公司 | 1615 red-green-blue-yellow-white five-color luminous element and production process |
-
2013
- 2013-12-04 CN CN201320785987.3U patent/CN203690297U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105957862A (en) * | 2016-06-14 | 2016-09-21 | 江苏欧密格光电科技股份有限公司 | 1615 red-green-blue-yellow-white five-color luminous element and production process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140702 Termination date: 20151204 |
|
| EXPY | Termination of patent right or utility model |