CN201773836U - Package lead of integrated circuit device - Google Patents
Package lead of integrated circuit device Download PDFInfo
- Publication number
- CN201773836U CN201773836U CN 201020263321 CN201020263321U CN201773836U CN 201773836 U CN201773836 U CN 201773836U CN 201020263321 CN201020263321 CN 201020263321 CN 201020263321 U CN201020263321 U CN 201020263321U CN 201773836 U CN201773836 U CN 201773836U
- Authority
- CN
- China
- Prior art keywords
- lead
- integrated circuit
- circuit device
- package lead
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model relates to a package lead of an integrated circuit device. The package lead comprises a shell (1) and a group of leads (3) which are connected with the shell, and is characterized in that one end of each lead connected with the shell is provided with a T-shaped end head. The package lead has the advantages that: after the T-shaped end head is used at one end of the lead, the metal wire bonding area of an integrated circuit chip and the lead is increased, the phenomenon of insufficient bonding strength or stripping is avoided through metal wire bonding connection, and the reliability of the integrated circuit device is greatly improved.
Description
Technical field
The utility model relates to integrated circuit (IC)-components, particularly a kind of package lead of integrated circuit (IC)-components.
Background technology
Develop rapidly along with China's Electronic Packaging industry is directly promoting the development of metal-glass packaging technology, as the metal-glass packaging of one of packing forms, has formed a huge technical industry in recent years.Metal-packaged shell is mainly used in the series products such as integrated circuit, hybrid integrated circuit, microwave device, these products are widely used in the every field of mankind's activity, as industry such as Aeronautics and Astronautics, weapons, boats and ships, automobiles, all kinds of household electrical appliance and all kinds of Communication Equipment are until toy for children.
Its structure of the integrated circuit (IC)-components of metallic packaging mainly is made up of two big parts, wherein metal-packaged shell is one of its critical component, and the insulation property of integrated circuit (IC)-components, withstand voltage properties, sealing property, bonding performance are all realized by metal-packaged shell.When making integrated circuit (IC)-components, epoxy resin is coated at the back side of chip to stick on the enclosure interior surface, by gold wire bonding integrated circuit (IC) chip and lead-in wire are coupled together then, very out-of-flatness of end after general lead-in wire cuts off, bonding area is less, directly influence the intensity of gold wire bonding, cause integrated circuit (IC)-components to lose efficacy easily.
The utility model content
The purpose of this utility model is exactly less in order to overcome the bonding area that has package lead now, the irregular shortcoming in end, the package lead of a kind of integrated circuit (IC)-components that provides.
The technical scheme that its technical problem that solves the utility model adopts is:
The package lead of integrated circuit (IC)-components comprises housing and the one group of lead-in wire that is connected with housing, it is characterized in that: the end that each lead-in wire is connected with housing is provided with T type termination.
In the lead-in wire end, make a call to a T type termination by mould, the end of this T type termination can be controlled by mould, can accomplish bright and clean smoothly, satisfies the requirement of gold wire bonding fully, has improved the intensity of bonding greatly.
The beneficial effects of the utility model are after lead-in wire one end uses T type termination, and integrated circuit (IC) chip increases with lead-in wire gold wire bonding area, connect by gold wire bonding and the not enough or obscission of bond strength do not occur, have improved the reliability of integrated circuit (IC)-components greatly.
Below in conjunction with drawings and Examples the utility model is further specified.
Description of drawings:
Fig. 1 is a front view of the present utility model;
Fig. 2 is a vertical view of the present utility model.
Embodiment
As depicted in figs. 1 and 2, the package lead of the utility model integrated circuit (IC)-components, comprise a housing 1, be arranged with two row's lead-in wires 3 on the housing, lead-in wire 3 is fixed on the housing 1 by vitreum 2, is provided with T type termination at an end of each lead-in wire of integrated chip correspondence, after lead-in wire one end uses T type termination, integrated circuit (IC) chip is connected by gold wire bonding with lead-in wire and the not enough or obscission of bond strength do not occur, has improved the reliability of integrated circuit greatly.
The utility model can be provided with three rows or more lead-in wire according to the pin difference, satisfies the requirement of product.
Claims (1)
1. the package lead of integrated circuit (IC)-components comprises housing (1) and the one group of lead-in wire (3) that is connected with housing, it is characterized in that: the end that each lead-in wire is connected with housing is provided with T type termination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020263321 CN201773836U (en) | 2010-07-15 | 2010-07-15 | Package lead of integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020263321 CN201773836U (en) | 2010-07-15 | 2010-07-15 | Package lead of integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201773836U true CN201773836U (en) | 2011-03-23 |
Family
ID=43753679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020263321 Expired - Fee Related CN201773836U (en) | 2010-07-15 | 2010-07-15 | Package lead of integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201773836U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105470705A (en) * | 2015-12-28 | 2016-04-06 | 泰州市航宇电器有限公司 | Weldable mixed metal package housing used for quick plugging |
| CN106409773A (en) * | 2016-12-01 | 2017-02-15 | 中国电子科技集团公司第四十研究所 | Lightweight, multi-cavity, multi-line hybrid IC metal package tube casing |
-
2010
- 2010-07-15 CN CN 201020263321 patent/CN201773836U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105470705A (en) * | 2015-12-28 | 2016-04-06 | 泰州市航宇电器有限公司 | Weldable mixed metal package housing used for quick plugging |
| CN105470705B (en) * | 2015-12-28 | 2018-02-23 | 泰州市航宇电器有限公司 | A kind of solderable hybrid metal package casing for fast insert-pull |
| CN106409773A (en) * | 2016-12-01 | 2017-02-15 | 中国电子科技集团公司第四十研究所 | Lightweight, multi-cavity, multi-line hybrid IC metal package tube casing |
| CN106409773B (en) * | 2016-12-01 | 2019-01-18 | 中国电子科技集团公司第四十研究所 | A kind of light-duty, multi-cavity, multi-thread Mixed LB films Metal Packaging shell |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110323 Termination date: 20140715 |
|
| EXPY | Termination of patent right or utility model |