CN206364056U

CN206364056U - LED encapsulation structure

Info

Publication number: CN206364056U
Application number: CN201621492534.1U
Authority: CN
Inventors: 林书弘
Original assignee: Shenzhen City Branch Yixing Optoelectronic Technology Co Ltd
Current assignee: Shenzhen City Branch Yixing Optoelectronic Technology Co Ltd
Priority date: 2016-12-30
Filing date: 2016-12-30
Publication date: 2017-07-28
Anticipated expiration: 2026-12-30

Abstract

The utility model discloses a kind of LED encapsulation structure, and the LED encapsulation structure includes packing colloid, the chip and at least two sheet metals being packaged in the packing colloid, and each sheet metal is connected with the chip.In LED encapsulation structure of the present utility model, chip is not easily disconnected from packing colloid.

Description

LED encapsulation structure

Technical field

The utility model is related to encapsulation technology field, particularly a kind of LED encapsulation structure.

Background technology

LED, which is encapsulated, refers to the encapsulation of luminescence chip, and LED encapsulation is not only required to protect wick, but also will can Printing opacity.Wafer-level package LED in the market is in encapsulation process, and packing colloid is weaker to the sticking strength of chip, easily The phenomenon for causing chip to depart from packing colloid.

Utility model content

Main purpose of the present utility model is to provide a kind of LED encapsulation structure, it is intended to strengthen the knot of chip and packing colloid Spend with joint efforts.

To achieve the above object, the utility model proposes LED encapsulation structure include packing colloid, have in packing colloid Chip and at least two sheet metals, each sheet metal are connected with the chip.

It is preferred that, LED encapsulation structure described in the LED encapsulation structure also includes positive electrode and negative electrode, the one of chip Side is provided with positive electrode and negative electrode, and side of the positive electrode away from the chip is connected with a sheet metal, the negative electrode Side away from the chip is connected with another sheet metal.

It is preferred that, accommodating chamber, the chip, the positive electrode and the negative electricity are collectively forming between at least two sheet metals The accommodating chamber is extremely contained in, the sheet metal includes bottom plate and the support member being connected with the bottom plate, the bottom plate and institute The one side for stating positive electrode back to the chip is connected, or the bottom plate is connected with the one side of the negative electrode back to the chip.

It is preferred that, the support member includes first connecting portion, and the first connecting portion is by one end of the bottom plate along remote The direction bending extension of chip is formed.

It is preferred that, the support member includes second connecting portion, and the second connecting portion is by one end of the bottom plate along close The direction bending extension of chip is formed.

It is preferred that, the support member includes the 3rd connecting portion and bends the bending that extension is formed by the 3rd connecting portion Portion, the 3rd connecting portion is formed by one end of the bottom plate along the direction bending extension away from chip.

It is preferred that, the support member includes the 3rd connecting portion and bends the bending that extension is formed by the 3rd connecting portion Portion, the 3rd connecting portion is formed by one end of the bottom plate along close to the bending extension of the direction of chip.

It is preferred that, the support member includes the 3rd connecting portion and bends the bending that extension is formed by the 3rd connecting portion Portion, is at right angles set between the 3rd connecting portion and the bottom plate, in straight between the 3rd connecting portion and the kink Angle is set.

It is preferred that, the chip is flip-chip.

It is preferred that, the packing colloid is transparent configuration.

LED encapsulation structure of the present utility model strengthens the chimeric degree of chip and packing colloid by increasing sheet metal, and then Prevent packing colloid from departing from chip.

Brief description of the drawings

, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art Or the accompanying drawing used required in description of the prior art is briefly described, it should be apparent that, drawings in the following description are only It is some embodiments of the present utility model, for those of ordinary skill in the art, is not paying the premise of creative work Under, other accompanying drawings can also be obtained according to the structure shown in these accompanying drawings.

Fig. 1 is the cross-sectional view of the embodiment LED encapsulation structure of the utility model one；

Fig. 2 is the cross-sectional view of another embodiment LED encapsulation structure of utility model；

Fig. 3 is the cross-sectional view of the another embodiment LED encapsulation structure of utility model；

Fig. 4 is the cross-sectional view of the another embodiment LED encapsulation structure of utility model.

Drawing reference numeral explanation：

Label	Title	Label	Title
				100	LED encapsulation structure	320	First connecting portion
10	Packing colloid	321	Second connecting portion
				20	Chip	322	3rd connecting portion
30	Sheet metal	323	Kink
				31	Bottom plate	40	Positive electrode
32	Support member	50	Negative electrode

Realization, functional characteristics and the advantage of the utility model purpose will be described further referring to the drawings in conjunction with the embodiments.

Embodiment

Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the present utility model, rather than all Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not making creative work premise Lower obtained every other embodiment, belongs to the scope of the utility model protection.

It is to be appreciated that institute is directional in the utility model embodiment indicates (such as up, down, left, right, before and after ...) Relative position relation, motion conditions for being only used for explaining under a certain particular pose (as shown in drawings) between each part etc., such as When really the particular pose changes, then directionality indicates also correspondingly therewith to change.

In the utility model, unless otherwise clearly defined and limited, term " connection ", " fixation " etc. should do broad sense reason Solution, for example, " fixation " can be fixedly connected or be detachably connected, or integrally；Can mechanically connect, also may be used Be electrical connection；Can be joined directly together, can also be indirectly connected to by intermediary, can be the connection of two element internals Or the interaction relationship of two elements, unless otherwise clear and definite restriction.For the ordinary skill in the art, can be with Concrete meaning of the above-mentioned term in the utility model is understood as the case may be.

In addition, and can not be managed in the utility model such as relating to the description of " first ", " second " etc. is only used for describing purpose Solve to indicate or imply its relative importance or the implicit quantity for indicating indicated technical characteristic.Thus, define " the One ", at least one this feature can be expressed or be implicitly included to the feature of " second ".In addition, the skill between each embodiment Art scheme can be combined with each other, but must can be implemented as basis with those of ordinary skill in the art, when technical scheme With reference to occur it is conflicting or when can not realize it will be understood that the combination of this technical scheme is not present, also not in the utility model It is required that protection domain within.

The utility model proposes a kind of LED encapsulation structure 100, the structure design can prevent packing colloid from departing from chip.

Refer to Fig. 1 to Fig. 4, in the embodiment of the utility model one, the LED encapsulation structure 100 include packing colloid 10, The sheet metal 30 of chip 20 and at least two in the packing colloid 10 is packaged in, each sheet metal 30 connects with the chip 20 Connect.

Specifically, chip 20 is flip-chip, flip-chip (Flip chip) is a kind of without pin configuration, is typically contained Circuit unit, is mainly used in by an appropriate number of tin ball (conductive adhesive is covered) on its face, electrically Mechanically it is connected to circuit.Packing colloid 10 is transparent configuration, and the light for chip 20 to be sent is exported, and sheet metal 30 is not The bonding strength for strengthening chip 20 and packing colloid 10 is only played, reflection light and conductive effect, sheet metal 30 is additionally aided Can be electric conductivity strong copper foil or aluminium foil.

The utility model LED encapsulation structure 100 has greatly reinforced core by setting up sheet metal 30 inside packing colloid 10 The adhesion of piece 20 and packing colloid 10, both are not easily disconnected from.

Further, LED encapsulation structure 100 also includes positive electrode 40 and negative electrode 50, is provided with the side of chip 20 Positive electrode 40 and negative electrode 50, side of the positive electrode 40 away from the chip 20 are connected with a sheet metal 30, the negative electricity Side of the pole 50 away from the chip 20 is connected with another sheet metal 30.Positive electrode 40 and negative electrode 50 electrically connect with sheet metal 30 Connect.

Further, accommodating chamber 33, the chip 20, the positive electrode 40 are collectively forming between at least two sheet metals 30 The accommodating chamber 33 is contained in the negative electrode 50, and the sheet metal 30 includes bottom plate 31 and is connected with the bottom plate 31 Support member 32, the bottom plate 31 is connected with a surface of the positive electrode 40 back to the chip 20, or the bottom plate 31 and institute Negative electrode 50 is stated to connect back to a surface of the chip 20.Preferred sheet metal 30 has two, chip 20, positive electricity in the present embodiment Pole 40 and negative electrode 50 are contained in accommodating chamber 33, can effectively protect chip 20 to exempt from external interference and be not easy to be damaged. Overall structure is simple, and connectivity robustness is strong.

Fig. 1 is refer to, support member 32 includes first connecting portion 320, and the first connecting portion 320 is by the one of the bottom plate 31 Hold along the direction bending extension away from chip 20 and formed.Wherein, first connecting portion 320 strengthens chip 20 and packing colloid 10 Bonding strength, while also functioning to the effect of reflection light.

Fig. 2 is refer to, support member 32 includes second connecting portion 321, and the second connecting portion 321 is by the one of the bottom plate 31 Hold along close to the bending extension of the direction of chip 20 and formed.Wherein, second connecting portion 321 strengthens chip 20 and packing colloid 10 Bonding strength.

Fig. 3 is refer to, support member 32 includes the 3rd connecting portion 322 and bend to extend by the 3rd connecting portion 322 to be formed Kink 323, the 3rd connecting portion 322 by one end of the bottom plate 31 along away from chip 20 direction bending extension shape Into.Wherein, the 3rd connecting portion 322 strengthens the bonding strength of chip 20 and packing colloid 10, while also functioning to reflection light Effect.

Further, support member 32 includes the 3rd connecting portion 322 and bends what extension was formed by the 3rd connecting portion 322 Kink 323, the 3rd connecting portion 322 is formed by one end of the bottom plate 31 along close to the bending extension of the direction of chip 20. Wherein, the 3rd connecting portion 322 strengthens the bonding strength of chip 20 and packing colloid 10.

Fig. 4 is refer to, support member 32 includes the 3rd connecting portion 322 and bend to extend by the 3rd connecting portion 322 to be formed Kink 323, at right angles set between the 3rd connecting portion 322 and the bottom plate 31, the 3rd connecting portion 322 and institute State and at right angles set between kink 323.Wherein, the 3rd connecting portion 322 strengthen chip 20 and packing colloid 10 connection it is strong Degree, chip 20 is not readily disengaged from packing colloid 10.

The utility model LED encapsulation structure increases sheet metal, and sheet metal has the design of chamfering bending, strengthens chip and envelope Fill the inlay resultant force of colloid.

Preferred embodiment of the present utility model is the foregoing is only, the scope of the claims of the present utility model is not thereby limited, It is every utility model of the present utility model design under, the equivalent structure made using the utility model specification and accompanying drawing content Conversion, or directly/be used in other related technical fields indirectly and be included in scope of patent protection of the present utility model.

Claims

1. a kind of LED encapsulation structure, it is characterised in that including packing colloid, the chip being packaged in the packing colloid and extremely Few two sheet metals, each sheet metal is connected with the chip.

2. LED encapsulation structure as claimed in claim 1, it is characterised in that the LED encapsulation structure also includes positive electrode and negative Electrode, positive electrode and negative electrode, side of the positive electrode away from the chip and a sheet metal are provided with the side of chip Connection, side of the negative electrode away from the chip is connected with another sheet metal.

3. LED encapsulation structure as claimed in claim 2, it is characterised in that receiving is collectively forming between at least two sheet metals Chamber, the chip, the positive electrode and the negative electrode are contained in the accommodating chamber, the sheet metal include bottom plate and with institute The support member of bottom plate connection is stated, the bottom plate is connected with the one side of the positive electrode back to the chip, or the bottom plate and institute The one side for stating negative electrode back to the chip is connected.

4. LED encapsulation structure as claimed in claim 3, it is characterised in that the support member includes first connecting portion, described the One connecting portion is formed by one end of the bottom plate along the direction bending extension away from chip.

5. LED encapsulation structure as claimed in claim 3, it is characterised in that the support member includes second connecting portion, described the Two connecting portions are formed by one end of the bottom plate along close to the bending extension of the direction of chip.

6. LED encapsulation structure as claimed in claim 3, it is characterised in that the support member includes the 3rd connecting portion and by institute The kink that the bending extension of the 3rd connecting portion is formed is stated, the 3rd connecting portion is by one end of the bottom plate along the side away from chip Formed to bending extension.

7. LED encapsulation structure as claimed in claim 3, it is characterised in that the support member includes the 3rd connecting portion and by institute The kink that the bending extension of the 3rd connecting portion is formed is stated, the 3rd connecting portion is by one end of the bottom plate along the side close to chip Formed to bending extension.

8. LED encapsulation structure as claimed in claim 3, it is characterised in that the support member includes the 3rd connecting portion and by institute The kink that the bending extension of the 3rd connecting portion is formed is stated, is at right angles set between the 3rd connecting portion and the bottom plate, it is described At right angles set between 3rd connecting portion and the kink.

9. LED encapsulation structure as claimed in claim 1, it is characterised in that the chip is flip-chip.

10. the LED encapsulation structure as described in any one of claim 1 to 9, it is characterised in that the packing colloid is transparent knot Structure.