CN209133498U - A kind of ultra-thin IGBT module encapsulating structure - Google Patents
A kind of ultra-thin IGBT module encapsulating structure Download PDFInfo
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- CN209133498U CN209133498U CN201821890925.8U CN201821890925U CN209133498U CN 209133498 U CN209133498 U CN 209133498U CN 201821890925 U CN201821890925 U CN 201821890925U CN 209133498 U CN209133498 U CN 209133498U
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Abstract
A kind of ultra-thin IGBT module encapsulating structure, including；Module board, the module board are equipped with electrode plate A, electrode plate B, electrode plate C;The electrode plate A, electrode plate B, electrode plate C are using bonding connection；It is connected on electrode plate A, the electrode plate A and meets block A；Described connect is connected with connection sheet A on block A；It is connected with connecting bridge on the electrode plate A, connection sheet B is connected in the connecting bridge；It is connected on electrode plate B, the electrode plate B and meets block B, described connect is connected with connection sheet C on block B；Direct piece is connected on electrode plate C, the electrode plate C；It is connected using bonding, improves the stability of module encapsulation, reliability；The volume of module encapsulation is reduced, while eliminating the processes such as manual welding and coiling, to improve working efficiency.
Description
Technical field
The utility model relates to module packaging technique field more particularly to a kind of ultra-thin IGBT module encapsulating structures.
Background technique
Traditional module encapsulation, the connection of inside modules electrode slice is the thin wire silver-plated by copper, and connection so needs
The processes such as manual welding, coiling are carried out, so that working efficiency is low；And the module packaged stability of manufacture, reliability are lower；Together
When also need to install plastic stent, and the thin wire connection for using copper silver-plated also may require that certain space, so that volume
Greatly, more heavy.
Utility model content
(1) technical problems to be solved
In view of the above, the purpose of this utility model is to provide a kind of ultra-thin IGBT module encapsulating structures, have body
The characteristics of product is small, stability, high reliablity, while the processes such as manual welding and coiling are also eliminated, to improve working efficiency.
(2) technical solution
A kind of ultra-thin IGBT module encapsulating structure, including；
Module board, the module board are equipped with electrode plate A, electrode plate B, electrode plate C;
The electrode plate A, electrode plate B, electrode plate C are using bonding connection；
It is connected on electrode plate A, the electrode plate A and meets block A；Described connect is connected with connection sheet A on block A；The electrode plate A
On be connected with connecting bridge, connection sheet B is connected in the connecting bridge；
It is connected on electrode plate B, the electrode plate B and meets block B, described connect is connected with connection sheet C on block B；
Direct piece is connected on electrode plate C, the electrode plate C.
A kind of ultra-thin IGBT module encapsulating structure provided by the utility model can further be set as the electrode plate A,
Electrode plate B, electrode plate C are made of electrode slice.
A kind of ultra-thin IGBT module encapsulating structure provided by the utility model can further be set as the electrode slice A with
It meets block A to be connected and fixed using soldering, the electrode slice A and connecting bridge are connected and fixed using soldering；Electrode plate B is used with block B is met
Soldering is connected and fixed；The electrode slice C is connected and fixed with direct piece using soldering.
A kind of ultra-thin IGBT module encapsulating structure provided by the utility model can further be set as described and meet block A and company
Contact pin A is connected using screw；The connecting bridge is connect with connection sheet B using screw；Block B and the connection sheet C of connecing is using screw
Connection.
A kind of ultra-thin IGBT module encapsulating structure provided by the utility model can further be set as the connecting bridge bottom
Face is equipped with square groove, is adhesive with electro-insulating rubber in the groove；The connecting bridge upper surface is equipped with square protruding A.
A kind of ultra-thin IGBT module encapsulating structure provided by the utility model can further be set as described and meet block A and connect
Block B is equipped with square protruding A；The connection sheet A, connection sheet B, the two sides connection sheet C are designed with square protruding B.
A kind of ultra-thin IGBT module encapsulating structure provided by the utility model can be further set as on the module board
It is fixed with protective shell；The square hole passed through for connection sheet A, connection sheet B, connection sheet C, direct piece is offered on the protective shell.
A kind of ultra-thin IGBT module encapsulating structure provided by the utility model can be further set as on the module board
Equipped with card slot, the protective shell is equipped with card slot, and the module board is caught in card slot with protective shell use and is connected and fixed.
A kind of ultra-thin IGBT module encapsulating structure provided by the utility model can be further set as on the module board
Two dowel holes for fixing are offered, described two dowel holes are located at module board ends and are mutually perpendicular to.
(3) beneficial effect
1, it is connected using bonding, improves the stability of module encapsulation, reliability；The volume of module encapsulation is reduced, simultaneously
The processes such as manual welding and coiling are eliminated, to improve working efficiency.
2, connection sheet is all connected using screw, can increase module encapsulation with dismounting and change when connection sheet breakage with this
Service life.
3, using two vertical dowel holes, so that the fixation of module encapsulation is more flexible.
Detailed description of the invention
Fig. 1 is IGBT module package structure diagram；
Fig. 2 is connecting bridge structural schematic diagram；
Fig. 3 is to connect block A structural schematic diagram；
Fig. 4 is connection sheet A structural schematic diagram；
Fig. 5 is module board schematic view of the front view；
Fig. 6 is protective shell structural schematic diagram；
Fig. 7 is module board overlooking structure diagram.
Specific embodiment
1-5 and embodiment with reference to the accompanying drawing, are described in further detail specific embodiment of the present utility model；With
Lower embodiment is used for the explanation to the utility model, but is not intended to limit the scope of the present invention；
A kind of ultra-thin IGBT module encapsulating structure；Including module board 1, module board 1 be equipped with electrode plate A2, electrode plate B3,
Electrode plate C4；Electrode plate A2, electrode plate B3, electrode plate C4 are to have electrode slice composition；Electrode plate A2, electrode plate B3, electrode plate
Using bonding connection between C4；Using bonding, the stability of module encapsulation, reliability are improved；The volume of module encapsulation is reduced,
The processes such as manual welding and coiling are eliminated simultaneously, to improve working efficiency.
It is welded and connected on electrode plate A2 and meets block A5 and connecting bridge 6, met block A5 equipped with square protruding A14, it is logical to meet block A5
It crosses square protruding A14 and is connected with connection sheet A8 using screw；6 bottom surface of connecting bridge is equipped with square groove 12, in square groove 12
It is adhesive with electro-insulating rubber 13, connecting bridge 6 is equipped with square protruding A14, and connecting bridge 6 is connected by square protruding A14 using screw
There is connection sheet B9；Being adhesive with electro-insulating rubber 13 is generation short-circuit in order to prevent.
It is welded and connected on electrode plate B3 and meets block B7, met block B7 equipped with square protruding A14, meet block B7 and pass through square protruding
A14 is connected with connection sheet C10 using screw.Connection sheet A8, connection sheet B9, connection sheet are made using this screw connecting mode
C10 has removable unloading functions.
Direct piece 11 is welded on electrode plate C4；Direct piece 11 and connection sheet A8, connection sheet B9, connection sheet C10 are
Interior electrode plate A2, electrode plate B3, electrode plate C4 and extraneous connection are encapsulated for module.
Two dowel holes 19 for fixing are offered on module board 1, described two dowel holes 19 are located at 1 both ends of module board
And it is mutually perpendicular to.It is more flexible and convenient when making module board 1 fixed using this structure.
There is card slot 16 on module board 1, there is buckle 17 on protective shell 20, protective shell 20 is caught on module board 1 by buckle 17
Card slot 16 in so that protective shell 20 is fixed on module board 1；Offered on protective shell 20 for connection sheet A8, connection sheet B9,
Connection sheet C10 and direct piece 11 pass through square hole 18；Connection sheet A8, connection sheet B9, connection sheet C10, two sides are designed with square protruding
B15, when screw connection fluffs, prevents connection sheet A8, connection sheet B9, connection sheet C10 from moving for being close to 20 inner wall of protective shell
Dynamic function.
Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention, it is not limited to this
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic
It is equivalently replaced, within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on,
It should be included within the scope of protection of this utility model.
Claims (9)
1. a kind of ultra-thin IGBT module encapsulating structure, which is characterized in that including；
Module board, the module board are equipped with electrode plate A, electrode plate B, electrode plate C;
The electrode plate A, electrode plate B, electrode plate C are using bonding connection；
It is connected on electrode plate A, the electrode plate A and meets block A；Described connect is connected with connection sheet A on block A；It is solid on the electrode plate A
It is connected to connecting bridge, connection sheet B is connected in the connecting bridge；
It is connected on electrode plate B, the electrode plate B and meets block B, described connect is connected with connection sheet C on block B；
Direct piece is connected on electrode plate C, the electrode plate C.
2. a kind of ultra-thin IGBT module encapsulating structure according to claim 1, which is characterized in that the electrode plate A, electrode
Plate B, electrode plate C are made of electrode slice.
3. a kind of ultra-thin IGBT module encapsulating structure according to claim 1, which is characterized in that the electrode slice A with connect
Block A is connected and fixed using soldering, and the electrode plate A and connecting bridge are connected and fixed using soldering；Electrode plate B uses tin with block B is met
Weldering is connected and fixed；The electrode plate C is connected and fixed with direct piece using soldering.
4. a kind of ultra-thin IGBT module encapsulating structure according to claim 1, which is characterized in that it is described connect block A with connect
Piece A is connected using screw；The connecting bridge is connect with connection sheet B using screw；Block B and the connection sheet C of connecing is connected using screw
It connects.
5. a kind of ultra-thin IGBT module encapsulating structure according to claim 4, which is characterized in that the connecting bridge bottom surface is set
There is square groove, is adhesive with electro-insulating rubber in the groove；The connecting bridge upper surface is equipped with square protruding A.
6. a kind of ultra-thin IGBT module encapsulating structure according to claim 4, which is characterized in that described to meet block A and meet block B
It is equipped with square protruding A；The connection sheet A, connection sheet B, the two sides connection sheet C are designed with square protruding B.
7. a kind of ultra-thin IGBT module encapsulating structure according to claim 6, which is characterized in that fixed on the module board
There is protective shell；The square hole passed through for connection sheet A, connection sheet B, connection sheet C, direct piece is offered on the protective shell.
8. a kind of ultra-thin IGBT module encapsulating structure according to claim 7, which is characterized in that the module board is equipped with
Card slot, the protective shell are equipped with card slot, and the module board is caught in card slot with protective shell use and is connected and fixed.
9. a kind of ultra-thin IGBT module encapsulating structure according to claim 1, which is characterized in that opened up on the module board
There are two dowel holes for fixing, described two dowel holes are located at module board ends and are mutually perpendicular to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821890925.8U CN209133498U (en) | 2018-11-16 | 2018-11-16 | A kind of ultra-thin IGBT module encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821890925.8U CN209133498U (en) | 2018-11-16 | 2018-11-16 | A kind of ultra-thin IGBT module encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209133498U true CN209133498U (en) | 2019-07-19 |
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ID=67245450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821890925.8U Active CN209133498U (en) | 2018-11-16 | 2018-11-16 | A kind of ultra-thin IGBT module encapsulating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209133498U (en) |
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2018
- 2018-11-16 CN CN201821890925.8U patent/CN209133498U/en active Active
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