CN205985003U - Working voltage electric current protection device's anti stress diode - Google Patents
Working voltage electric current protection device's anti stress diode Download PDFInfo
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- CN205985003U CN205985003U CN201620870095.7U CN201620870095U CN205985003U CN 205985003 U CN205985003 U CN 205985003U CN 201620870095 U CN201620870095 U CN 201620870095U CN 205985003 U CN205985003 U CN 205985003U
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Abstract
The utility model discloses a working voltage electric current protection device's anti stress diode, including packaging body and diode body, diode body arranges in inside the packaging body, diode body includes the chip, metal contact and lead wire, the left and right sides at the chip upper surface is established to the metal contact, the chip bottom left and right sides is equipped with positive pole pin and negative pole pin respectively, the left side metal contact of chip is through lead wire and positive pole pin electric connection, the right side metal contact of chip is through lead wire and negative pole pin electric connection, the pin free end extends to the outside of packaging body, the positive pole pin is equipped with voltage electric current protection device in the outside one end of packaging body. The beneficial effects of the utility model are that: add voltage electric current protection device, avoid that the diode voltage electric current is too high to be burnt out, the pin increases the pier nose, avoids diode internal chip to pull and go between and fracture, not hard up appears, on packaging body surface interpolation cooling layer, avoid the diode high temperature to lead to damaging.
Description
Technical field
This utility model is related to diode technologies field, and the anti-of more particularly to a kind of use voltage x current protection device should
Power diode.
Background technology
Diode has a wide range of applications in electronic applications as the simplest semiconductor device of structure.Make with diode
More and more wider with occasion, to diode stability requirement more and more higher.Due to diode operation environment voltage x current often
Unstable, long-term work is easy to damage diode in such a case.And, when on welding diode to circuit board, need
By wire kink, thus easily cause and fracture occurs inside lead, loosens so that product loses electrical connection properties and becomes useless
Product.Even and if employ pier nose structure, also due to pier nose thickness low LCL causes pier nose resistance to stress scarce capacity, lead to stress conduct
To the direct contact surface of lead and chip, chip is caused to pull.
Content of the invention
In order to solve the problems, such as above-mentioned prior art, the purpose of this utility model is to provide one kind using voltage electricity
The resistance to stress diode of stream protection device, by adding voltage x current protection device in negative electrode pin, it is to avoid diode due to
Voltage x current is too high to be burned；Pin increased pier nose, increases the resistance to stress ability of pin, it is to avoid stress is directly transferred to and draws
Line and the direct contact surface of chip, prevent diode inside chip from pulling and fracture, loosen with lead；Add on packaging body surface
Plus cooling layer, it is to avoid diode leads to because temperature is too high damage in working long hours.
The technical solution adopted in the utility model is：A kind of resistance to stress diode of use voltage x current protection device, bag
Include packaging body and diode body, described diode body is placed in package interior, and described diode body includes chip, metal
Contact and lead, described hard contact is located at the left and right sides of chip upper surface, and described chip bottom is respectively arranged on the left side and the right side
Negative electrode pin and negative electrode pin, the left side hard contact of described chip is passed through lead and is electrically connected with negative electrode pin, described chip
Right side hard contact pass through lead and negative electrode pin and be electrically connected with, described pin free end extends to the outside of packaging body, institute
State negative electrode pin and be provided with voltage x current protection device in the outside one end of packaging body.
It is preferred that, the lower surface of described chip is provided with DAF film, and described negative electrode pin and negative electrode pin are passed through
DAF film is fixed on the lower surface of chip.
It is preferred that, described negative electrode pin is identical with the structure of negative electrode pin, and described negative electrode pin includes being placed in envelope
Fill the first pier nose and second pier nose in internal portion, described first pier nose is contacted with chip.
It is preferred that, it is provided with overload protective device and micro voltage stabilizing device inside described voltage x current protection device, described
Negative electrode pin is electrically connected with overload protective device and micro voltage stabilizing device successively.
It is preferred that, described DAF film is set to high-temperature insulation film, and its thickness is set to no more than 25 μm..
It is preferred that, described first pier nose is set to cone-shaped nib shape, and the thickness of the second pier nose is set to 0.15mm-
1mm.
Described encapsulation external surface is provided with cooling layer, and its thickness is not more than 1mm.
The beneficial effects of the utility model are：
1st, positive pole pin adds the voltage x current protection device being made up of micro voltage stabilizing device and overload protective device, it is to avoid two
Pole pipe is burned because voltage x current is too high；
2nd, the pin of chip increases pier nose, due to the presence of pier nose and the thickening of size in welding, increases the anti-of pin
Stress ability, is prevented from the direct contact surface that stress is directly transferred to lead and chip, prevents diode inside chip from pulling
Fracture occurs, loosens with lead；
3rd, add cooling layer on packaging body surface, it is to avoid diode leads to because temperature is too high damage in working long hours
Bad.
Brief description
Fig. 1 is structural representation of the present utility model.
Wherein：
Packaging body -1 diode body -2 chip -3
Hard contact -4 negative electrode pin -5 negative electrode pin -6
Lead -7 DAF-8 the first pier nose -9
Second pier nose -10 voltage x current protection device -11 overload protective device -12
Micro voltage stabilizing device -13 cooling layer -14
Specific embodiment
With embodiment, the technical solution of the utility model is illustrated below in conjunction with the accompanying drawings.
With reference to shown in Fig. 1, a kind of resistance to stress diode of use voltage x current protection device, including packaging body 1 and two poles
Tube body 2, described diode body 2 is placed in inside packaging body 1, and described diode body 2 includes chip 3, hard contact 4 and draws
Line 7, described hard contact 4 is located at the left and right sides of chip 3 upper surface, and described chip 3 bottom is respectively arranged on the left side and the right side anode
Pin 5 and negative electrode pin 6, the left side hard contact 4 of described chip 3 is electrically connected with negative electrode pin 5 by lead 7, described core
The right side hard contact 4 of piece 3 is electrically connected with negative electrode pin 6 by lead 7, and described pin free end extends to packaging body 1
Outside, described negative electrode pin 5 is provided with voltage x current protection device 11 in the outside one end of packaging body 1.
The lower surface of described chip 3 is provided with DAF film 8, and described negative electrode pin 5 and negative electrode pin 6 are passed through DAF film 8 and fixed
Lower surface in chip 3.
Described negative electrode pin 5 is identical with the structure of negative electrode pin 6, and described negative electrode pin 5 includes being placed within packaging body 1
First pier nose 9 and the second pier nose 10, described first pier nose 9 is contacted with chip 3.
It is provided with overload protective device 12 and micro voltage stabilizing device 13, described negative electrode pin inside described voltage x current protection device 11
5 are electrically connected with overload protective device 12 and micro voltage stabilizing device 13 successively.
Described DAF film 8 is set to high-temperature insulation film, and its thickness is set to no more than 25 μm.
Described first pier nose 9 is set to cone-shaped nib shape, and the thickness of the second pier nose 10 is set to 0.15mm-1mm.
Described packaging body 1 outer surface is provided with cooling layer 14, and its thickness is not more than 1mm.
This utility model passes through to arrange the first pier nose 9, the second pier nose 10 in pin (5,6), increases the anti-of pin (5,6)
Stress ability, is prevented from the direct contact surface that stress is directly transferred to lead 7 and chip 3, prevents diode body 2 inner core
Piece 3 is pulled fracture, loosens with lead 7, and arranges voltage x current protection device 11 in negative electrode pin 5, enhances two
The job stability of pole pipe body, it is to avoid diode body 2 is burned because voltage x current is too high.Further, outer in packaging body 1
Surface increased cooling layer 14, can effectively reduce temperature during diode body 2 work, the reliability of lifting diode body 2
Property.
Above-described embodiment is only that of the present utility model ultimate principle, principal character and advantage have been shown and described.The industry
Technical staff it should be appreciated that this utility model is not restricted to the described embodiments, described in above-described embodiment and description
Principle of the present utility model is simply described, on the premise of without departing from this utility model spirit and scope, this utility model also can
There are various changes and modifications, these changes and improvements both fall within the range of claimed this utility model.
Claims (9)
1. a kind of resistance to stress diode of use voltage x current protection device it is characterised in that：Including packaging body (1) and diode
Body (2), described diode body (2) is placed in packaging body (1) inside, and described diode body (2) includes chip (3), metal
Contact (4) and lead (7), described hard contact (4) is located at the left and right sides of chip (3) upper surface, and described chip (3) bottom is left
The right side is respectively provided on two sides with negative electrode pin (5) and negative electrode pin (6), and the left side hard contact (4) of described chip (3) passes through lead
(7) it is electrically connected with negative electrode pin (5), the right side hard contact (4) of described chip (3) passes through lead (7) and negative electrode pin (6)
It is electrically connected with, described pin free end extends to the outside of packaging body (1), described negative electrode pin (5) is in packaging body (1) outside
End is provided with voltage x current protection device (11).
2. a kind of use voltage x current protection device according to claim 1 resistance to stress diode it is characterised in that：Institute
The lower surface stating chip (3) is provided with DAF film (8), and described negative electrode pin (5) and negative electrode pin (6) are passed through DAF film (8) and fixed
Lower surface in chip (3).
3. a kind of use voltage x current protection device according to claim 1 resistance to stress diode it is characterised in that：Institute
State that negative electrode pin (5) is identical with the structure of negative electrode pin (6), described negative electrode pin (5) includes being placed in internal the of packaging body (1)
One pier nose (9) and the second pier nose (10), described first pier nose (9) is contacted with chip (3).
4. a kind of use voltage x current protection device according to claim 1 resistance to stress diode it is characterised in that：Institute
State and be provided with overload protective device (12) and micro voltage stabilizing device (13), described negative electrode pin (5) inside voltage x current protection device (11)
It is electrically connected with overload protective device (12) and micro voltage stabilizing device (13) successively.
5. a kind of use voltage x current protection device according to claim 2 resistance to stress diode it is characterised in that：Institute
State DAF film (8) and be set to high-temperature insulation film.
6. a kind of use voltage x current protection device according to claim 2 resistance to stress diode it is characterised in that：Institute
The thickness stating DAF film (8) is set to no more than 25 μm.
7. a kind of use voltage x current protection device according to claim 3 resistance to stress diode it is characterised in that：Institute
State the first pier nose (9) and be set to cone-shaped nib shape.
8. a kind of use voltage x current protection device according to claim 3 resistance to stress diode it is characterised in that：Institute
The thickness stating the second pier nose (10) is set to 0.15mm-1mm.
9. a kind of use voltage x current protection device according to claim 1 resistance to stress diode it is characterised in that：Institute
State packaging body (1) outer surface and be provided with cooling layer (14), its thickness is not more than 1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620870095.7U CN205985003U (en) | 2016-08-11 | 2016-08-11 | Working voltage electric current protection device's anti stress diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620870095.7U CN205985003U (en) | 2016-08-11 | 2016-08-11 | Working voltage electric current protection device's anti stress diode |
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| Publication Number | Publication Date |
|---|---|
| CN205985003U true CN205985003U (en) | 2017-02-22 |
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ID=59977656
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| Application Number | Title | Priority Date | Filing Date |
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| CN201620870095.7U Active CN205985003U (en) | 2016-08-11 | 2016-08-11 | Working voltage electric current protection device's anti stress diode |
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| Country | Link |
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| CN (1) | CN205985003U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107195592A (en) * | 2017-07-06 | 2017-09-22 | 如皋市大昌电子有限公司 | A kind of fast recovery high-voltage tube |
-
2016
- 2016-08-11 CN CN201620870095.7U patent/CN205985003U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107195592A (en) * | 2017-07-06 | 2017-09-22 | 如皋市大昌电子有限公司 | A kind of fast recovery high-voltage tube |
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