CN207542240U - Stable type stamp-mounting-paper diode - Google Patents
Stable type stamp-mounting-paper diode Download PDFInfo
- Publication number
- CN207542240U CN207542240U CN201721202933.4U CN201721202933U CN207542240U CN 207542240 U CN207542240 U CN 207542240U CN 201721202933 U CN201721202933 U CN 201721202933U CN 207542240 U CN207542240 U CN 207542240U
- Authority
- CN
- China
- Prior art keywords
- pin
- welding section
- chip
- encapsulating structure
- subsegment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003466 welding Methods 0.000 claims abstract description 75
- 229910000679 solder Inorganic materials 0.000 claims description 24
- 239000000919 ceramic Substances 0.000 claims description 17
- 238000005538 encapsulation Methods 0.000 claims description 13
- 239000004593 Epoxy Substances 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 230000006641 stabilisation Effects 0.000 abstract description 3
- 238000011105 stabilization Methods 0.000 abstract description 3
- 238000009434 installation Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005336 cracking Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 1
- 240000002853 Nelumbo nucifera Species 0.000 description 1
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002463 transducing effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Ignition Installations For Internal Combustion Engines (AREA)
Abstract
The utility model is related to diode fields, more particularly to stable type stamp-mounting-paper diode, including chip, the first pin and second pin positioned at chip both ends, further include the encapsulating structure being packaged in outside chip, the first pin and second pin, one end of first pin and second pin is stretched out outside encapsulating structure；First pin includes the first welding section and first end subsegment, and first end subsegment is equipped with the first welded plate away from the end of the first welding section side, and first end subsegment is stretched out outside encapsulating structure；The second pin includes the second welding section and second end subsegment, and second end subsegment is equipped with the second welded plate away from the end of the second welding section side, and second end subsegment is stretched out outside encapsulating structure.The utility model pin is stablized with chip welding, encapsulating structure is stablized with external world's stable connection, pin with extraneous welding, using effect stabilization.
Description
Technical field
The utility model is related to diode field, more particularly to stable type stamp-mounting-paper diode.
Background technology
Stamp-mounting-paper diode is also known as crystal diode, abbreviation diode (diode), in addition, the also vacuum electronic two of early stage
Pole pipe；It is a kind of electronic device with unidirectional conduction electric current.There are one two leads of chip inside semiconductor diode
Terminal, this electronic device have the transducing of unidirectional current according to the direction of applied voltage.In general, surface mounting crystal two
Pole pipe is one and the p-n junction interface formed is sintered by p-type semiconductor and n-type semiconductor.Space electricity is formed in the both sides at its interface
Lotus layer, forms built-in field.When applied voltage is equal to zero, since the concentration difference of p-n junction both sides carrier causes dissufion current
It is equal with the drift current as caused by built-in field and in electric equilibrium state, this is also the diode characteristic under normality.
The stamp-mounting-paper diode of the prior art, on the one hand, due to welding together between chip and pin, bend pin repeatedly
Easily occurs weld fracture in the process, connection is unstable；Second aspect when diode is connected to external circuitry, is answered masterpiece
With, pin will appear loosening, packaging body also due to pin loosening and that entire diode is caused to be connect with external circuitry is unstable,
Influence the using effect of diode.
Utility model content
To solve the above problems, the utility model provides a kind of pin and chip welding is stablized, encapsulating structure connects with extraneous
Connect stable, pin and the extraneous stable type stamp-mounting-paper diode for welding stable using effect stabilization.
Technical solution is used by the utility model：Stable type stamp-mounting-paper diode, including chip, positioned at chip both ends
First pin and second pin, further include the encapsulating structure being packaged in outside chip, the first pin and second pin, and described first
One end of pin and second pin is stretched out outside encapsulating structure；First pin includes the first welding section and first terminal
Section, first end subsegment are equipped with the first welded plate away from the end of the first welding section side, and first end subsegment is stretched out outside encapsulating structure
Portion；The second pin includes the second welding section and second end subsegment, and second end subsegment deviates from the end of the second welding section side
Equipped with the second welded plate, second end subsegment is stretched out outside encapsulating structure；First welding section passes through the first layer of solder paste and chip
Connection, the second welding section are connect by the second layer of solder paste with chip, and the center of first welding section and the second welding section is all provided with
There is raised line；The encapsulating structure includes being packaged in the epoxy encapsulation layer outside chip, the first welding section and the second welding section,
Further include the ceramic shell outside epoxy encapsulation layer.
To being further improved as the ceramic shell is corresponded at first end subsegment and second end subsegment for above-mentioned technical proposal
Two sides be equipped with mounting hole.
To being further improved as the mounting hole is counter sink for above-mentioned technical proposal.
To being further improved as the raised line is vertical with the first welding section and the second welding section respectively for above-mentioned technical proposal
Setting.
To being further improved as first welded plate and the second welded plate are in fan shape for above-mentioned technical proposal；
To being further improved as first welding section is with the first layer of solder paste junction in flat for above-mentioned technical proposal
Shape, the second welding section is with the second layer of solder paste junction in flat.
The beneficial effects of the utility model are：
1st, on the one hand, the end of the first pin is equipped with the first welded plate, and the end of second pin is equipped with the second welded plate, leads to
It crosses the first welded plate and the second welded plate to weld with external circuitry, increases reliability and stabilization that diode is connect with the external world
Property；Second aspect, the first welding section and the second welding section pass through the first layer of solder paste and the both ends of the second layer of solder paste and chip respectively
Welding so that the stable connection of the first pin and second pin and chip is reliable, is not easy to loosen, and it is new to further increase this practicality
The stability of type.The center of the third aspect, the first welding section and the second welding section is equipped with raised line, prevents the first pin, second
The junction of pin and encapsulating structure encapsulation cracking so that the first pin, second pin can be firmly packaged in encapsulating structure
Portion further increases the stability of the utility model.Fourth aspect, encapsulating structure is by internal epoxy encapsulation layer and outside
The ceramic shell in portion is formed, and ceramic shell has the advantages that high temperature resistant, conductivity of heat and electrical insulating property are good, epoxy encapsulation layer energy
Quickly the heat that internal work generates is conducted to ceramic shell, then conduct to outside, prevents encapsulating structure internal temperature excessively high
And damage, further increase the stability of the utility model.
2nd, the two sides that ceramic shell is corresponded at first end subsegment and second end subsegment are equipped with mounting hole so that installation letter
Just, and enhance diode and external circuit electric contact connective stability, further increase the stability of the utility model.
3rd, mounting hole is counter sink, easy to connect, can fix ceramic shell using sunk screw, further increases
The stability of the utility model.
4th, raised line is vertically arranged respectively with the first welding section and the second welding section, and the length of the raised line is more than first terminal
The length of section and second end subsegment prevents the first pin and second pin from being loosened when being connect with the external world due to stress so that
The pin of diode connect more secured with chip, further increases the stability of the utility model.
5th, the first welded plate and the second welded plate increase bonding area in fan shape, convenient for the first welded plate and the
Two welded plates and extraneous welding so that diode can firmly access external circuitry, further increase the utility model
Stability.
6th, the first welding section and the first layer of solder paste junction are in flat, and the second welding section is in the second layer of solder paste junction
It is flat, the contact area between the first welding section and the first layer of solder paste, between the second welding section and the second layer of solder paste is increased,
Convenient for welding, and welding is more secured, further increases the stability of the utility model.
Description of the drawings
Fig. 1 is the structure diagram of the utility model.
Specific embodiment
The utility model is further described below in conjunction with attached drawing.
As shown in Figure 1, the structure diagram for the utility model.
Stable type stamp-mounting-paper diode 100 including chip 110, draws positioned at first pin 120 at 110 both ends of chip and second
Foot 130, further includes the encapsulating structure 140 being packaged in outside chip 110, the first pin 120 and second pin 130, and described first
One end of pin 120 and second pin 130 is stretched out outside encapsulating structure 140；First pin 120 includes the first welding section
121 and first end subsegment 122, first end subsegment 122 is equipped with the first welded plate 123 away from the end of 121 side of the first welding section,
First end subsegment 122 is stretched out outside encapsulating structure 140；The second pin 130 includes the second welding section 131 and second end subsegment
132, second end subsegment 132 is equipped with the second welded plate 133 away from the end of 131 side of the second welding section, and second end subsegment 132 is stretched
Go out outside encapsulating structure 140；First welding section 121 is connect by the first layer of solder paste 150 with chip 110, the second welding section
131 are connect by the second layer of solder paste 160 with chip 110, and the center of 121 and second welding section 131 of the first welding section is all provided with
There is raised line 170；The encapsulating structure 140 includes being packaged in outside chip 110, the first welding section 121 and the second welding section 131
Epoxy encapsulation layer 141 further includes the ceramic shell 142 outside epoxy encapsulation layer 141.
The two sides that ceramic shell 142 corresponds at first end subsegment 122 and second end subsegment 132 are equipped with mounting hole 143,
Cause simple installation, and enhance diode 100 and external circuit electric contact connective stability, further increase the utility model
Stability.
Mounting hole 143 is counter sink, easy to connect, can be fixed ceramic shell 142 using sunk screw, is further increased
The stability of the utility model is added.
Raised line 170 is vertically arranged respectively with the first welding section 121 and the second welding section 131, and the length of the raised line 170 is big
In first end subsegment 122 and the length of second end subsegment 132, prevent the first pin 120 and second pin 130 from being connect with the external world
When loosened due to stress so that the pin of diode 100 connect more secured with chip, further increases the utility model
Stability.
First welded plate 123 and the second welded plate 133 increase bonding area, convenient for the first welded plate in fan shape
123 and second welded plate 133 and extraneous welding so that diode 100 can firmly access external circuitry, further increase
The stability of the utility model.
First welding section 121 is in flat, the second welding section 131 and the second layer of solder paste with 150 junction of the first layer of solder paste
160 junctions are in flat, are increased between the first welding section 121 and the first layer of solder paste 150, the second welding section 131 and second
Contact area between layer of solder paste 160, convenient for welding, and welding is more secured, further increases the stability of the utility model.
On the one hand, the end of the first pin 120 is equipped with the first welded plate 123, and the end of second pin 130 is equipped with the second weldering
Fishplate bar 133 is welded with external circuitry by the first welded plate 123 and the second welded plate 133, increases diode 100 and the external world
The reliability and stability of connection；Second aspect, the first welding section 121 and the second welding section 131 pass through the first layer of solder paste respectively
150 and second the both ends of layer of solder paste 160 and chip 110 weld so that the first pin 120 and second pin 130 and chip 110
Stable connection is reliable, is not easy to loosen, and further increases the stability of the utility model.The third aspect, 121 He of the first welding section
The center of second welding section 131 is equipped with raised line 170, prevents the first pin 120, second pin 130 and the company of encapsulating structure 140
Connect place's encapsulation cracking so that the first pin 120, second pin 130 can be firmly packaged in inside encapsulating structure 140, further
Increase the stability of the utility model.Fourth aspect, encapsulating structure 140 is by internal epoxy encapsulation layer 141 and outside
Ceramic shell 142 form, ceramic shell 142 has the advantages that high temperature resistant, conductivity of heat and electrical insulating property are good, epoxy encapsulation
Layer 141 can quickly conduct the heat that internal work generates to ceramic shell 142, then conduct to outside, prevent encapsulating structure 140
Internal temperature is excessively high and damages, and further increases the stability of the utility model.
The operation principle of the utility model is：
It first passes through the first layer of solder paste 150 and the second layer of solder paste 160 allows the first pin 120 and second pin 130 to be respectively welded
With the input and output side of chip 110, then encapsulated epoxy resin, forms epoxy encapsulation layer 141, then seal in epoxy resin
141 outside installation ceramic shell 142 of layer is filled, counter sink is opened at the both ends of ceramic shell 142, encapsulation knot is realized by sunk screw
Structure 140 and extraneous connection, the first pin 120 and second pin are realized by the first welded plate 123 and the second welded plate 133
130 with the connection of external circuitry, be all connected with stablizing between entire 100 internal structure of diode and diode 100 and external circuitry,
Securely.
Embodiment described above only expresses the several embodiments of the utility model, and description is more specific and detailed,
But it should not be interpreted as limiting the scope of the present invention.It should be pointed out that for the common of this field
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (3)
1. stable type stamp-mounting-paper diode, it is characterised in that：Including chip, the first pin and second pin positioned at chip both ends,
Further include the encapsulating structure being packaged in outside chip, the first pin and second pin, the one of first pin and second pin
End is stretched out outside encapsulating structure；First pin includes the first welding section and first end subsegment, and first end subsegment is away from the
The end of one welding section side is equipped with the first welded plate, and first end subsegment is stretched out outside encapsulating structure；The second pin includes
Second welding section and second end subsegment, second end subsegment away from the second welding section side end be equipped with the second welded plate, second
Terminal section is stretched out outside encapsulating structure；First welding section is connect by the first layer of solder paste with chip, and the second welding section passes through
Second layer of solder paste is connect with chip, and the center of first welding section and the second welding section is equipped with raised line；The encapsulating structure
Including the epoxy encapsulation layer being packaged in outside chip, the first welding section and the second welding section, further include positioned at epoxy resin
Ceramic shell outside encapsulated layer；The two sides that the ceramic shell corresponds at first end subsegment and second end subsegment are equipped with peace
Fill hole；The mounting hole is counter sink；First welding section and the first layer of solder paste junction in flat, the second welding section with
Second layer of solder paste junction is in flat.
2. stable type stamp-mounting-paper diode according to claim 1, it is characterised in that：The raised line respectively with the first welding section
It is vertically arranged with the second welding section.
3. stable type stamp-mounting-paper diode according to claim 2, it is characterised in that：First welded plate and the second welding
Plate is in fan shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721202933.4U CN207542240U (en) | 2017-09-18 | 2017-09-18 | Stable type stamp-mounting-paper diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721202933.4U CN207542240U (en) | 2017-09-18 | 2017-09-18 | Stable type stamp-mounting-paper diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207542240U true CN207542240U (en) | 2018-06-26 |
Family
ID=62608036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721202933.4U Expired - Fee Related CN207542240U (en) | 2017-09-18 | 2017-09-18 | Stable type stamp-mounting-paper diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207542240U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112885787A (en) * | 2021-01-25 | 2021-06-01 | 互创(东莞)电子科技有限公司 | Surface mount diode and packaging forming process thereof |
-
2017
- 2017-09-18 CN CN201721202933.4U patent/CN207542240U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112885787A (en) * | 2021-01-25 | 2021-06-01 | 互创(东莞)电子科技有限公司 | Surface mount diode and packaging forming process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180626 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |