CN106409773A - Lightweight, multi-cavity, multi-line hybrid IC metal package tube casing - Google Patents
Lightweight, multi-cavity, multi-line hybrid IC metal package tube casing Download PDFInfo
- Publication number
- CN106409773A CN106409773A CN201611091444.6A CN201611091444A CN106409773A CN 106409773 A CN106409773 A CN 106409773A CN 201611091444 A CN201611091444 A CN 201611091444A CN 106409773 A CN106409773 A CN 106409773A
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- Prior art keywords
- base plate
- thickness
- block
- lead
- chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
Abstract
The invention provides a lightweight, multi-cavity, multi-line hybrid IC metal package tube casing which comprises a base and a cap, wherein the base and the cap are matched. The base consists of a horizontally arranged bottom plate, a number of vertical glass blanks and a number of vertical leads. The cap is horizontally arranged, and the opening is downward. A number of through holes of the same size are equidistantly and circumferentially arranged in the bottom plate. A glass blank which seals a through hole is arranged in each through hole. A lead is arranged at the center of each glass blank. The thickness of the bottom plate is 1.2+/-0.05mm. The thickness of the cap is 0.25mm. A number of concave chambers of the same size are arranged on the upper side of the bottom plate. The depth of each chamber is 0.7mm. The chambers are symmetrically arranged on both sides of the center line of the bottom plate in the width direction. The chambers which are arranged on each side of the center line of the bottom plate in the width direction are arranged at equal intervals. According to the invention, the weight of the hybrid IC metal package tube is reduced, and a larger installation space is provided for the placement of hybrid ICs, a module circuit and a device.
Description
Technical field
The present invention relates to a kind of light-duty, multi-cavity, multi-thread Mixed LB films Metal Packaging shell.
Background technology
Hydrid integrated circuit is widely used in the fields such as communication, electronics, Aeronautics and Astronautics, weapons equipment, in weapons equipment
It is mainly used in the various weaponry such as ground force, air force, naval, People's Armed Police and electronics, the control system of instrument and meter, be new
Type weaponry one of Primary Component.Metal Packaging shell is one of key component of integrated circuit, hydrid integrated circuit, its
Quality and performance will directly affect hydrid integrated circuit product quality and performances.Because modern weapons equipment is big to integrated circuit
Scale is integrated, light weight, multilead and large-sized needs, to the light weight of Metal Packaging shell, multilead, multi-cavity and big chi
Very little, large space it is also proposed higher requirement.High insulation, salt spray resistance and good also will be met on the basis of meeting above-mentioned new demand
The requirement of the properties such as good solderability, the design structure of such shell is also related to part material simultaneously and processing, sealing are burnt
Multiple key technologies such as tie, be heat-treated and electroplate, develop and processing difficulties are restricted so as to use.This kind domestic at present
Light weight, multi-cavity, multilead and large scale, the Metal Packaging shell of large space integrated circuit or blank.
With the development of new hybrid integrated circuit device and Advanced Packaging both at home and abroad, to light weight, multi-cavity, draw more
Line and the requirement also more and more higher of large scale hydrid integrated circuit Metal Packaging shell.And with integrated device constantly send out
Exhibition, the resistance to environmental adaptability to this light weight, multi-cavity, multilead and large scale hydrid integrated circuit Metal Packaging shell
Increasingly harsher, air-tightness, reliability and requirement on electric performance more and more higher.
Metal Packaging shell is one of key component of integrated circuit, hydrid integrated circuit, and its quality and performance are by direct shadow
Ring hydrid integrated circuit product quality and performances.Being related to the performance of the weaponrys such as aircraft, guided missile, once losing efficacy, will lead to
The damage of whole system, it is necessary to assure its light weight, reliability, stability.Simultaneously with the reach of science, many weaponrys
Require as the integrated as possible height of Metal Packaging shell, lightness, multi-functional.
Mainly from the aspect of three, one is the encapsulation conjunction of integrated circuit package device product to the structure design of encapsulating package
Rationality, meets the design requirement of packaging structure；Two is that the structure of product can meet and bears various environmental conditions, electrical property
Require；Three is that the manufacturability processed is excellent, is suitable for large-scale production.
According to weaponry, hydrid integrated circuit applied environment light weight, multi-cavity, multi-thread, large scale etc. are required, therefore
Requirement is proposed to the weight of Metal Packaging shell, element precision is high, the processing and manufacturing difficulty of shell is very big.
According to the design of this size shell normal, general base plate thickness is essentially 1.3mm～1.5mm, and centre is entity knot
Structure, the thickness of block is 0.5mm.This encapsulating package inside configuration space is little, and weight weight is not suitable for present hydrid integrated circuit
The needs of product particular development.
Content of the invention
The technical problem to be solved is to provide a kind of light-duty, multi-cavity, multi-thread Mixed LB films Metal Packaging shell, its
Alleviate the weight of hydrid integrated circuit Metal Packaging shell, provide for hydrid integrated circuit, modular circuit and device bigger
Installing space.
For solving above-mentioned technical problem, the invention provides a kind of light-duty, multi-cavity, multi-thread Mixed LB films Metal Packaging shell,
Including the base being adapted, block, base is by the horizontally disposed rectangle base plate, gob of some vertical arrangements, some perpendicular
The lead composition of straight arrangement, block is horizontally disposed and Open Side Down, and the open side of block has the horizontal bottom face of a round, base plate
The circumferentially equidistant manhole being provided with some same sizes running through it, gob, lead, through hole quantity identical, each
It is equipped with a gob being sealed against, the central area of each gob is provided with a lead, the thickness of base plate in through hole
For 1.2 ± 0.05mm, the thickness of block is 0.25mm, and the flatness of the downside of base plate and the bottom face of block is 0.1mm,
The upside of base plate is provided with the identical and recessed chamber of some specifications, chamber be shaped as rectangle, the downside of chamber is horizontal, chamber
The depth of room is 0.7mm, is located at the both sides of the width center line of base plate symmetry, and is located at the width of base plate
The chamber of the every side of center line is 2.54 along the length direction equi-spaced apart arrangement of base plate, the spacing at the center of two neighboring through hole
±0.03mm.
For the sake of simple declaration problem, below by light-duty for one kind provided by the present invention, multi-cavity, multi-thread Mixed LB films metal
Encapsulating package is referred to as this encapsulating package.
The advantage of this encapsulating package：This encapsulating package is lightweight to be only the 60%～80% of normal shell weight.For increasing
The installing space of device, ensures that base is indeformable during high temperature sintering and following process, use, and back-plane design is simultaneously
Recessed cavity shape structure, the base plate of the interval between two adjacent cavitys plays the effect of reinforcement it is ensured that base
Anti- deformation requirement；The flatness of the bottom face of base and block is 0.1mm it is ensured that the sealing by fusing of packaging requires；Will
The wall thickness of block is designed as 0.25mm, to reach the demand mitigating weight.
For reaching the more preferable using effect of this encapsulating package, the preferred version of this encapsulating package is：
As preferred, described base plate is provided with nickel dam, and the thickness of nickel dam is 1.3 μm；Set successively from inside to outside on lead
There are nickel dam, layer gold, the thickness of nickel dam is 3 μm -5 μm, the thickness of layer gold is 1.3 μm -5 μm；Block is provided with nickel dam, the thickness of nickel dam
Spend for 5 μm -8.9 μm.
By above-mentioned rational metal-coated structure, enhance the overall salt fog resistance performance of this encapsulating package, experiment card
Bright encapsulating package you can reach the requirement of salt fog resistance 24h it is ensured that its corrosion resistance and environmental suitability.
As preferred, described base plate, lead and block all using 4J29 kovar alloy material, gob adopts
DM305 type glass material.
Above-mentioned 4J29 kovar alloy material and DM305 type glass material disclose in patent CN 102832140 B.
Brief description
Fig. 1 is the top view of this encapsulating package base.
Fig. 2 is the A-A sectional view of Fig. 1.
Fig. 3 is the top view of this encapsulating package block.
Fig. 4 is the B-B sectional view of Fig. 3.
Specific embodiment
As Figure 1-4, a kind of light-duty, multi-cavity, multi-thread Mixed LB films Metal Packaging shell, including the base being adapted, lid
Cap 4,2 groups of the lead that the gob 3,96 that base is vertically arranged by horizontally disposed rectangle base plate 1,96 is vertically arranged
Become, block 4 is horizontally disposed and Open Side Down, the open side of block 4 has a horizontal bottom face of a round, base plate 1 circumferentially equidistant
It is provided with the manhole 1b of some same sizes running through it, the spacing (i) at the center of two neighboring through hole 1b is 2.54mm,
Through hole 1b diameter (q) is 1.5mm, and the edge of the through hole 1b of base plate 1 width side and base plate 1 this side of width is in base plate
Distance (g) on width is 1.35mm, the through hole 1b of base plate 1 length direction side and base plate 1 this side of length direction
The distance (r) on floor length direction at edge is 1.35mm, is equipped with a glass being sealed against in each through hole 1b
Glass base 3, the central area of each gob 3 is provided with a lead 2, and the diameter (f) of lead 2 is 0.5mm, and lead 2 upper end exceeds
The length (d) of base plate 1 is 6mm, and the length (e) that lead 2 lower end exceeds base plate 1 is 5mm, the length (a) of base plate 1 is 80.4mm,
Width (b) is 49.9mm, thickness (c) is 1.2mm, and the height (o) of block 4 is 11.3mm, thickness (p) is 0.25mm, base plate 1
The flatness of the bottom face of downside and block 4 is 0.1mm, and the upside of base plate 1 is provided with the identical and recessed chamber of some specifications
Room 1a, chamber 1a are shaped as rectangle, and the downside of chamber 1a is horizontal, and the depth of chamber 1a is 0.7mm, and chamber 1a is symmetrically
Be located at the both sides of the width center line of base plate 1, and be located at base plate 1 the every side of width center line chamber 1a along base plate
1 length direction equi-spaced apart arrangement, along two adjacent chamber 1a of base plate 1 width, the spacing on base plate 1 width
N () is 2.0mm, the chamber 1a adjacent with the edge of base plate 1 width side, its side with this side of width of base plate 1
Distance (m) on base plate 1 width for the edge is 5.6mm, along two chamber 1a of base plate 1 length direction arbitrary neighborhood, in base plate 1
Spacing (j) on length direction is 1.2mm, the chamber 1a adjacent with the edge of base plate 1 length direction side, itself and base plate 1
Distance (k) on base plate 1 length direction for the edge of this side of length direction is 5.6mm.
Described base plate 1 is provided with nickel dam, and the thickness of nickel dam is 1.3 μm (Ep Ni1.3)；On lead 2 from inside to outside successively
It is provided with nickel dam, layer gold, 3 μm of the thickness of nickel dam, 1.3 μm of the thickness (Ep Ni3Au1.3) of layer gold；Block 4 is provided with nickel dam, nickel
The thickness of layer is 5 μm (Ap Ni5).Each coating structure is all not shown in figure.
, all using 4J29 kovar alloy material, gob 3 adopts DM305 type glass for described base plate 1, lead 2 and block 4
Material.Above-mentioned 4J29 kovar alloy material and DM305 type glass material disclose in patent CN 102832140 B.
The advantage of this encapsulating package：This encapsulating package is lightweight to be only the 60%～80% of normal shell weight.For increasing
The installing space of device, ensures that base is indeformable during high temperature sintering and following process, use, and base plate 1 is designed simultaneously
For recessed cavity shape structure, the base plate 1 of the interval between two adjacent cavitys plays the effect of reinforcement it is ensured that bottom
The requirement of the anti-deformation of seat；The flatness of the bottom face of base and block 4 is 0.1mm it is ensured that the sealing by fusing of packaging requires；
The wall thickness of block 4 is designed as 0.25mm, to reach the demand mitigating weight.
By above-mentioned rational metal-coated structure, enhance the overall salt fog resistance performance of this encapsulating package, experiment card
Bright encapsulating package you can reach the requirement of salt fog resistance 24h it is ensured that its corrosion resistance and environmental suitability.
The foregoing is only the preferred embodiments of the present invention, not thereby limit the scope of the claims of the present invention, every utilization
The equivalent structure transformation that description of the invention and accompanying drawing content are made, and directly or indirectly it is used in other related technology necks
Domain, is included within the scope of the present invention.
Claims (3)
1. a kind of light-duty, multi-cavity, multi-thread Mixed LB films Metal Packaging shell, including the base being adapted, block, base is by horizontal cloth
The rectangle base plate put, the gob of some vertical arrangements, the lead composition of some vertical arrangements, block is horizontally disposed and opening
Downwards, the open side of block has the horizontal bottom face of a round, and the circumferentially equidistant of base plate is provided with some same sizes running through it
Manhole, gob, lead, through hole quantity identical, be equipped with a gob being sealed against in each through hole, often
The central area of individual gob be provided with a lead it is characterised in that：The thickness of base plate is 1.2 ± 0.05mm, the thickness of block
For 0.25mm, the flatness of the downside of base plate and the bottom face of block is 0.1mm, and the upside of base plate is provided with some specification phases
With and recessed chamber, chamber be shaped as rectangle, the downside of chamber is horizontal, and the depth of chamber is 0.7mm, symmetry
Be located at base plate width center line both sides, and be located at base plate the every side of width center line chamber along base plate
Length direction equi-spaced apart is arranged, the spacing at the center of two neighboring through hole is 2.54 ± 0.03mm.
2. one kind according to claim 1 is light-duty, multi-cavity, multi-thread Mixed LB films Metal Packaging shell it is characterised in that：Described
Base plate is provided with nickel dam, and the thickness of nickel dam is 1.3 μm；Nickel dam, layer gold are sequentially provided with lead, the thickness of nickel dam is from inside to outside
3 μm -5 μm, the thickness of layer gold be 1.3 μm -5 μm；Block is provided with nickel dam, and the thickness of nickel dam is 5 μm -8.9 μm.
3. one kind according to claim 1 is light-duty, multi-cavity, multi-thread Mixed LB films Metal Packaging shell it is characterised in that：Described
Base plate, lead and block all using 4J29 kovar alloy material, gob adopts DM305 type glass material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611091444.6A CN106409773B (en) | 2016-12-01 | 2016-12-01 | A kind of light-duty, multi-cavity, multi-thread Mixed LB films Metal Packaging shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611091444.6A CN106409773B (en) | 2016-12-01 | 2016-12-01 | A kind of light-duty, multi-cavity, multi-thread Mixed LB films Metal Packaging shell |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106409773A true CN106409773A (en) | 2017-02-15 |
| CN106409773B CN106409773B (en) | 2019-01-18 |
Family
ID=58083955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611091444.6A Active CN106409773B (en) | 2016-12-01 | 2016-12-01 | A kind of light-duty, multi-cavity, multi-thread Mixed LB films Metal Packaging shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106409773B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6351027B1 (en) * | 2000-02-29 | 2002-02-26 | Agilent Technologies, Inc. | Chip-mounted enclosure |
| CN201478288U (en) * | 2009-03-31 | 2010-05-19 | 福建闽航电子有限公司 | Pin grid array encapsulating shell |
| CN201773836U (en) * | 2010-07-15 | 2011-03-23 | 蚌埠富源电子科技有限责任公司 | Package lead of integrated circuit device |
| JP4878230B2 (en) * | 2006-06-30 | 2012-02-15 | 京セラキンセキ株式会社 | Crystal resonator and manufacturing method thereof, |
| CN102832140A (en) * | 2012-08-31 | 2012-12-19 | 中国电子科技集团公司第四十研究所 | Machining method of metal packaging shell of large-scale and large-power integrated circuit |
| CN204145913U (en) * | 2014-09-01 | 2015-02-04 | 无锡华测电子系统有限公司 | A kind of chip microwave components structure |
| CN204615765U (en) * | 2015-06-28 | 2015-09-02 | 中国电子科技集团公司第四十三研究所 | A kind of highly reliable cermet package casing |
| TW201628146A (en) * | 2015-01-30 | 2016-08-01 | 矽品精密工業股份有限公司 | Whole layout structure of package substrate |
| CN206210770U (en) * | 2016-12-01 | 2017-05-31 | 中国电子科技集团公司第四十研究所 | A kind of light-duty, multi-cavity, multi-thread Mixed LB films Metal Packaging shell |
-
2016
- 2016-12-01 CN CN201611091444.6A patent/CN106409773B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6351027B1 (en) * | 2000-02-29 | 2002-02-26 | Agilent Technologies, Inc. | Chip-mounted enclosure |
| JP4878230B2 (en) * | 2006-06-30 | 2012-02-15 | 京セラキンセキ株式会社 | Crystal resonator and manufacturing method thereof, |
| CN201478288U (en) * | 2009-03-31 | 2010-05-19 | 福建闽航电子有限公司 | Pin grid array encapsulating shell |
| CN201773836U (en) * | 2010-07-15 | 2011-03-23 | 蚌埠富源电子科技有限责任公司 | Package lead of integrated circuit device |
| CN102832140A (en) * | 2012-08-31 | 2012-12-19 | 中国电子科技集团公司第四十研究所 | Machining method of metal packaging shell of large-scale and large-power integrated circuit |
| CN204145913U (en) * | 2014-09-01 | 2015-02-04 | 无锡华测电子系统有限公司 | A kind of chip microwave components structure |
| TW201628146A (en) * | 2015-01-30 | 2016-08-01 | 矽品精密工業股份有限公司 | Whole layout structure of package substrate |
| CN204615765U (en) * | 2015-06-28 | 2015-09-02 | 中国电子科技集团公司第四十三研究所 | A kind of highly reliable cermet package casing |
| CN206210770U (en) * | 2016-12-01 | 2017-05-31 | 中国电子科技集团公司第四十研究所 | A kind of light-duty, multi-cavity, multi-thread Mixed LB films Metal Packaging shell |
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| CN106409773B (en) | 2019-01-18 |
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