CN204615765U - A kind of highly reliable cermet package casing - Google Patents
A kind of highly reliable cermet package casing Download PDFInfo
- Publication number
- CN204615765U CN204615765U CN201520447734.4U CN201520447734U CN204615765U CN 204615765 U CN204615765 U CN 204615765U CN 201520447734 U CN201520447734 U CN 201520447734U CN 204615765 U CN204615765 U CN 204615765U
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- bottom board
- ceramic bottom
- fairlead
- becket frame
- cover plate
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Abstract
The utility model provides a kind of highly reliable cermet package casing; comprise ceramic bottom board, becket frame and cover plate; described ceramic bottom board offers fairlead; this fairlead is embedded in pin; described ceramic bottom board and becket frame and fairlead and pin all pass through sealed with brazing; described becket frame and described cover plate parallel seam welding, described ceramic bottom board, becket frame and cover plate form the cavity for the protection of circuit.The utility model meets the reliability requirement of isolated amplifier to shell, meet isolated amplifier circuit to sealing and high dielectric withstanding voltage requirement, and structure is simple.
Description
Technical field
The utility model relates to the package casing technical field of isolated amplifier, is specifically related to a kind of highly reliable high pressure resistant cermet package casing.
Background technology
At present; conventional isolated amplifier adopts ceramic bonding to form package casing, protection internal circuit, but there is poor sealing performance, is subject to the impact of ambient external physical environment and chemical environment change; poor reliability, is difficult to meet that electronic device is highly reliable, the requirement of long-life steady operation.
Utility model content
In order to overcome the non-tight of available circuit package casing, the problem of poor reliability, the utility model provides a kind of highly reliable cermet package casing, meets the requirement of device to body seal, highly reliable, lightweight and high dielectric withstanding voltage.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of highly reliable cermet package casing; comprise ceramic bottom board, becket frame and cover plate; described ceramic bottom board offers fairlead; this fairlead is embedded in pin; described ceramic bottom board and becket frame and fairlead and pin all pass through sealed with brazing; described becket frame and described cover plate parallel seam welding, described ceramic bottom board, becket frame and cover plate form the cavity for the protection of circuit.
Further, described pin and fairlead braze surface metallize, and form metallized area one, described becket frame and ceramic bottom board braze surface metallize, form metallized area two, described metallized area one and the creepage distance of described metallized area two meet the creepage requirement of high dielectric withstanding voltage.
Preferably, described becket frame is rectangular thin walled structures.
From above technical scheme, the utility model meets the reliability requirement of isolated amplifier to shell, meet isolated amplifier circuit to sealing and high dielectric withstanding voltage requirement, and structure is simple.
Accompanying drawing explanation
Fig. 1 is decomposing schematic representation of the present utility model;
Fig. 2 is side sectional view of the present utility model;
Fig. 3 is the structural representation after the utility model removes cover plate.
In figure: 1, ceramic bottom board, 2, becket frame, 3, cover plate, 4, fairlead, 5, pin, 6, metallized area one, 7, metallized area two.
Embodiment
Below in conjunction with accompanying drawing, a kind of preferred implementation of the present utility model is described in detail.
As shown in Figure 1, described cermet package casing comprises ceramic bottom board 1, becket frame 2 and cover plate 3.
Described ceramic bottom board 1 self is the ceramic material of insulator, provides mechanical support and realize insulation, sealing for internal circuit.Described ceramic bottom board 1 offers fairlead 4, and this fairlead is embedded in pin 5, and pin provides the signal of telecommunication to connect for external circuit in packaging.Described ceramic bottom board 1 and becket frame 2 are by sealed with brazing, and described fairlead 4 also passes through sealed with brazing with pin 5.Described becket frame 2 and cover plate 3 parallel seam welding, described ceramic bottom board 1, becket frame 2 and cover plate 3 form the cavity for the protection of circuit, and metal shell can isolate electromagnetic signal to a certain extent, avoids electromagnetic interference.Described becket frame 2 is rectangular thin walled structures, and wall thickness meets shell and supports to the sealing of circuit row seam weldering requirement of will demanding for peace, and lighter in weight.
As shown in Figure 2, described pin 5 metallizes with fairlead 4 braze surface, form metallized area 1, described becket frame 2 metallizes with ceramic bottom board 1 braze surface, form metallized area 27, described metallized area one and the creepage distance of described metallized area two meet the creepage requirement of 3500VDC height dielectric withstanding voltage, ensure insulation property and the dielectric withstanding voltage performance of shell.
As shown in Figure 3, the surface area of the surface area ratio becket frame 2 of ceramic bottom board 1 is large, and fairlead 4 is positioned at becket frame 2 regions, and ceramic bottom board 1 metallizes and do not exceed ceramic outer edge, meets the highly reliable requirement of cermet soldering.
The above execution mode is only be described preferred implementation of the present utility model; not scope of the present utility model is limited; under the prerequisite not departing from the utility model design spirit; the various distortion that those of ordinary skill in the art make the technical solution of the utility model and improvement, all should fall in protection range that claims of the present utility model determine.
Claims (3)
1. a highly reliable cermet package casing, it is characterized in that, comprise ceramic bottom board (1), becket frame (2) and cover plate (3), described ceramic bottom board (1) offers fairlead (4), this fairlead is embedded in pin (5), described ceramic bottom board (1) all passes through sealed with brazing with becket frame (2) and fairlead (4) with pin (5), described becket frame (2) and described cover plate (3) parallel seam welding, described ceramic bottom board (1), becket frame (2) and cover plate (3) form the cavity for the protection of circuit.
2. highly reliable cermet package casing according to claim 1, it is characterized in that, described pin (5) and fairlead (4) braze surface metallize, form metallized area one (6), described becket frame (2) and ceramic bottom board (1) braze surface metallize, form metallized area two (7), described metallized area one and the creepage distance of described metallized area two meet the creepage requirement of high dielectric withstanding voltage.
3. highly reliable cermet package casing according to claim 1, is characterized in that, described becket frame (2) is rectangular thin walled structures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520447734.4U CN204615765U (en) | 2015-06-28 | 2015-06-28 | A kind of highly reliable cermet package casing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520447734.4U CN204615765U (en) | 2015-06-28 | 2015-06-28 | A kind of highly reliable cermet package casing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204615765U true CN204615765U (en) | 2015-09-02 |
Family
ID=53968287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520447734.4U Active CN204615765U (en) | 2015-06-28 | 2015-06-28 | A kind of highly reliable cermet package casing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204615765U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106409773A (en) * | 2016-12-01 | 2017-02-15 | 中国电子科技集团公司第四十研究所 | Lightweight, multi-cavity, multi-line hybrid IC metal package tube casing |
-
2015
- 2015-06-28 CN CN201520447734.4U patent/CN204615765U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106409773A (en) * | 2016-12-01 | 2017-02-15 | 中国电子科技集团公司第四十研究所 | Lightweight, multi-cavity, multi-line hybrid IC metal package tube casing |
| CN106409773B (en) * | 2016-12-01 | 2019-01-18 | 中国电子科技集团公司第四十研究所 | A kind of light-duty, multi-cavity, multi-thread Mixed LB films Metal Packaging shell |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170511 Address after: Acacia road 230088 Hefei city high tech Zone Anhui province No. 19 Patentee after: Hefei Shengda Electronic Technology Industrial Co. Ltd. Address before: Acacia road 230088 Hefei city high tech Zone Anhui province No. 19 Patentee before: No. 43 Research Institute of China Electronics Technology Group Corporation |
|
| TR01 | Transfer of patent right |