CN105185749A - Double-sided encapsulation shell for parallel seam welding - Google Patents
Double-sided encapsulation shell for parallel seam welding Download PDFInfo
- Publication number
- CN105185749A CN105185749A CN201510365912.3A CN201510365912A CN105185749A CN 105185749 A CN105185749 A CN 105185749A CN 201510365912 A CN201510365912 A CN 201510365912A CN 105185749 A CN105185749 A CN 105185749A
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- Prior art keywords
- box
- seam welding
- parallel seam
- double
- stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- Casings For Electric Apparatus (AREA)
- Packages (AREA)
Abstract
The invention relates to a double-sided encapsulation shell for parallel seam welding. The double-sided encapsulation shell is characterized in that the shell comprises a metal sealing box (1), a partition board (1a) is arranged inside the sealing box (1), the partition board (1a) divides the sealing box (1) into an upper box cavity and a lower box cavity, and a metal box cover (1b) seal-welded to the sealing box (1) through parallel seam welding is arranged on each box cavity; the upper and lower surfaces of the partition board (1a) are respectively in insulation connection with upper and lower substrates (7a, 7b), the upper and lower substrates (7a, 7b) are electrically connected by a conductive medium, and circuit devices (8) are connected to the upper and lower substrates (7a, 7b); and a group of flat I/O pins (3) are led out from the side wall of the sealing box (1), each I/O pin (3) is in fixed insulation connection with the sealing box (1), and each I/O pin (3) is electrically connected with the upper substrate (7a) or the lower substrate (7b). By adopting the technical scheme, high-reliability double-sided parallel seam welding air-tight encapsulation can be realized, the length and width of encapsulation are reduced, and the encapsulation density is improved.
Description
Technical field
The present invention relates to technical field of semiconductor encapsulation, particularly a kind of double-faced packaging of thick film hybrid integrated circuit.
Background technology
The encapsulation of metal shell is the high accuracy encapsulation technology in a kind of microelectronics Packaging, have excellent electric property, and air-tightness is good, is not subject to the impact of outside environmental elements, therefore extensively adopts in thick film hybrid integrated circuit industry.Parallel seam welding encapsulation is a kind of important process mode realizing packed by metal casing.Different according to pin lead-out mode, the common metal shell encapsulation being applicable to parallel seam welding at present mainly contains two kinds, and one is pin bottom surface extraction, namely goes between from housing bottom surface and draws, the pin installed generally adopts dual-in-line or four sides straight cutting, is suitable for plug-in type and installs; One is pin side extraction, and namely go between from housing side wall and draw, bottom surface is metal flat, is used for improving shell efficiently radiates heat area, is generally used for power shell.
The first shell is drawn from bottom surface due to pin above, and parallel seam welding is roll welding, in welding process, stitch welding electrode will to roll holddown plate and metal shell always, to form fine and close welding bead, therefore under the stop of lead-in wire exit, parallel seam welding can only realize single-sided welding, even if require under special circumstances to use two-sided welding, also can only adopt and use the sealing-in of parallel seam welding technique in the one side stopped that do not go between, and another side adopts laser welding to carry out sealing-in.But, should match each other based on metal shell material and the ceramic substrate coefficient of expansion and be beneficial to meet harsh thermocycling requirement, the metal material the most generally adopted in thick film metal package casing is kovar (4J29) or cold-rolled steel (10#), and it is large for the laser welding process difficulty of this type of material, technology controlling and process level is not high, particularly after laser welding, sealing property is generally poor, much can not meet the general seal request of national military standard defined, in addition, compare with parallel seam welding welding bead, laser welding bead appearance quality is also obviously poor.
The second shell pin is drawn from the side, bottom surface for ease of heat radiation, employing be the metal bottom surface of whole, not needing soldering and sealing, is not therefore dual-surface stereo encapsulating structure.
Summary of the invention
The object of the invention is to solve because pin stops and make parallel seam welding can not be applied to the technical problem of integrated circuit double-faced packaging, and then propose a kind of double-faced packaging shell for parallel seam welding.
For reaching above-mentioned purpose, the present invention adopts following technical proposals:
A kind of double-faced packaging shell for parallel seam welding, it is characterized in that: comprise metal sealing box, arrange dividing plate in seal box, seal box is divided into upper and lower two-layer box chamber by dividing plate, every layer of box chamber is all arranged through the metal box-lid of parallel seam welding and seal box seal welding;
Insulate respectively and connect upper and lower substrate in the upper and lower surface of dividing plate, upper and lower substrate, by conducting medium phase electric communication, upper and lower substrate connects various circuit devcie;
Seal box sidewall draws one group of straight I/O stitch, and each I/O stitch and seal box insulate affixed, each I/O stitch and upper substrate or infrabasal plate electric communication.
According to technique scheme, there is following further technical scheme:
Barrier insulation connects one group of guide pillar, guide pillar one end in box chamber, upper strata; The counter electrode electric communication of each guide pillar one end and upper substrate, and the counter electrode electric communication of the other end and infrabasal plate.
Each I/O stitch carries out direct insertion or mounted type bending installation shaping.
After adopting technique scheme, metal sealing box is two-sided cavity body structure, can realize highly reliable two-sided parallel seam welding air-tight packaging, increases packaging height to reduce encapsulation length and width size, improves packaging density.Further, upper and lower substrate is the assembling of substrate solid respectively, reduces assembling area.
Accompanying drawing explanation
Fig. 1 is complete section front view of the present invention;
Fig. 2 is the vertical view after the cover plate of box chamber, dismounting upper strata of the present invention;
Fig. 3 is left view of the present invention;
Fig. 4 is parallel seam welding welded cover plate schematic diagram of the present invention;
Fig. 5 is direct insertion I/O diagrams illustrating stitches of the present invention;
Fig. 6 is mounted type I/O diagrams illustrating stitches of the present invention.
Embodiment
In order to explain technical scheme of the present invention further, be described in detail below by specific embodiment.
For a double-faced packaging shell for parallel seam welding, as shown in Figure 1, seal box 1 is comprised, dividing plate 1a is set in seal box 1, seal box 1 is divided into upper and lower two-layer box chamber by dividing plate 1a, and every layer of box chamber all arranges lid 1b, and each lid 1b is by parallel seam welding and seal box 1 seal welding.Described seal box 1 and lid 1b all adopt metal to make.Dividing plate 1a two ends connect one group of guide pillar 5 respectively, and each guide pillar 5 is encapsulated with dividing plate 1a by glass insulator 4 and is connected.Each guide pillar 5 one end is in box chamber, upper strata, and the other end is in lower floor's box chamber.
Dividing plate 1a upper surface connects upper substrate 7a by bonding or welding procedure, and upper substrate 7a is the ic substrate of one piece of ceramic material; Dividing plate 1a lower surface connects infrabasal plate 7b by bonding or welding procedure, and infrabasal plate 7b is the ic substrate of one piece of ceramic material; Upper substrate 7a with infrabasal plate 7b is connected respectively thick film packaging technology various circuit devcie 8 is installed.The each electrode of upper substrate 7a is connected with corresponding guide pillar 5 one end respectively by bonding line 6, and each electrode of infrabasal plate 7a is connected with corresponding guide pillar 5 other end respectively by bonding line 6.
The both sides sidewall of lower floor's box chamber 1a respectively draws the straight I/O stitch 3 of connection one group, and arranges glass insulator 4 between each I/O stitch 3 and seal box 1 and insulate.Each I/O stitch 3 is by bonding line 6 and the counter electrode electric communication on infrabasal plate 7b.Each I/O stitch 3 carries out bending shaping by pin shaping equipment or pin shaping instrument, to adapt to dual inline type or surface-adhered type installation.
For a double-faced packaging shell for parallel seam welding, as shown in Figures 1 and 2, principle summary is as follows.
Required all kinds of circuit devcies 8 are installed on upper substrate 7a and infrabasal plate 7b, and upper substrate 7a is communicated with by bonding line 6 and guide pillar 5 with infrabasal plate 7b.
Complete internal electrical device install after, as shown in Figure 4, in a nitrogen environment, by parallel seam welding by two cover plate 1b respectively with upper and lower layer box chamber seal welding.
After parallel seam welding completes, as shown in Figure 4, device is placed on pin shaping equipment or pin shaping instrument, a bending is carried out to each I/O stitch 3, makes it meet dual inline type installation requirement.As shown in Figure 5, device is placed on pin shaping equipment or pin shaping instrument, twice bending is carried out to each I/O stitch 3, makes it meet surface-adhered type installation requirement.
Claims (3)
1., for a double-faced packaging shell for parallel seam welding, it is characterized in that:
Comprise metal sealing box (1), arrange dividing plate (1a) in seal box (1), seal box (1) is divided into upper and lower two-layer box chamber by dividing plate (1a), every layer of box chamber is all arranged through the metal box-lid (1b) of parallel seam welding and seal box (1) seal welding;
Insulate respectively and connect upper and lower substrate (7a, 7b) in dividing plate (1a) upper and lower surface, upper and lower substrate (7a, 7b) is by conducting medium phase electric communication, and upper and lower substrate (7a, 7b) is upper connects various circuit devcie (8);
Seal box (1) sidewall draws one group of straight I/O stitch (3), and each I/O stitch (3) and seal box (1) insulate affixed, each I/O stitch (3) and upper substrate (7a) or infrabasal plate (7b) electric communication.
2. according to claim 1, it is characterized in that:
Dividing plate (1a) insulate connection one group of guide pillar (5), guide pillar (5) one end in box chamber, upper strata; The counter electrode electric communication of each guide pillar (5) one end and upper substrate (7a), and the counter electrode electric communication of the other end and infrabasal plate (7a).
3. according to claim 1, it is characterized in that:
Each I/O stitch (3) carries out direct insertion or mounted type bending installation shaping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510365912.3A CN105185749B (en) | 2015-06-29 | 2015-06-29 | A kind of double-faced packaging shell for parallel seam welding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510365912.3A CN105185749B (en) | 2015-06-29 | 2015-06-29 | A kind of double-faced packaging shell for parallel seam welding |
Publications (2)
| Publication Number | Publication Date |
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| CN105185749A true CN105185749A (en) | 2015-12-23 |
| CN105185749B CN105185749B (en) | 2018-02-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510365912.3A Active CN105185749B (en) | 2015-06-29 | 2015-06-29 | A kind of double-faced packaging shell for parallel seam welding |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428957A (en) * | 2015-12-29 | 2016-03-23 | 泰州市航宇电器有限公司 | Manufacturing method of weldable mixed metal packaging shell |
| CN105470705A (en) * | 2015-12-28 | 2016-04-06 | 泰州市航宇电器有限公司 | Weldable mixed metal package housing used for quick plugging |
| CN109686732A (en) * | 2018-11-28 | 2019-04-26 | 中国电子科技集团公司第五十八研究所 | A kind of miniaturization SIP based on hair button |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2077591A1 (en) * | 2004-07-21 | 2009-07-08 | Seiko Instruments Inc. | Electrochemical cell |
| CN102163594A (en) * | 2010-02-22 | 2011-08-24 | 三菱电机株式会社 | Resin-sealed electronic control device and method of fabricating the same |
| CN203288586U (en) * | 2013-05-06 | 2013-11-13 | 北京七星华创电子股份有限公司 | Double-layer shallow cavity type circuit package casing |
| CN103839931A (en) * | 2012-11-26 | 2014-06-04 | 西安威正电子科技有限公司 | Double-faced packaging structure of double chips |
-
2015
- 2015-06-29 CN CN201510365912.3A patent/CN105185749B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2077591A1 (en) * | 2004-07-21 | 2009-07-08 | Seiko Instruments Inc. | Electrochemical cell |
| CN102163594A (en) * | 2010-02-22 | 2011-08-24 | 三菱电机株式会社 | Resin-sealed electronic control device and method of fabricating the same |
| CN103839931A (en) * | 2012-11-26 | 2014-06-04 | 西安威正电子科技有限公司 | Double-faced packaging structure of double chips |
| CN203288586U (en) * | 2013-05-06 | 2013-11-13 | 北京七星华创电子股份有限公司 | Double-layer shallow cavity type circuit package casing |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105470705A (en) * | 2015-12-28 | 2016-04-06 | 泰州市航宇电器有限公司 | Weldable mixed metal package housing used for quick plugging |
| CN105470705B (en) * | 2015-12-28 | 2018-02-23 | 泰州市航宇电器有限公司 | A kind of solderable hybrid metal package casing for fast insert-pull |
| CN105428957A (en) * | 2015-12-29 | 2016-03-23 | 泰州市航宇电器有限公司 | Manufacturing method of weldable mixed metal packaging shell |
| CN105428957B (en) * | 2015-12-29 | 2018-06-26 | 泰州市航宇电器有限公司 | A kind of production method of solderable mixed metal package casing |
| CN109686732A (en) * | 2018-11-28 | 2019-04-26 | 中国电子科技集团公司第五十八研究所 | A kind of miniaturization SIP based on hair button |
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| Publication number | Publication date |
|---|---|
| CN105185749B (en) | 2018-02-27 |
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