CN203456447U - Large-power integrated circuit lead frame resistant to layer separation and water vapor entering - Google Patents
Large-power integrated circuit lead frame resistant to layer separation and water vapor entering Download PDFInfo
- Publication number
- CN203456447U CN203456447U CN201320600037.9U CN201320600037U CN203456447U CN 203456447 U CN203456447 U CN 203456447U CN 201320600037 U CN201320600037 U CN 201320600037U CN 203456447 U CN203456447 U CN 203456447U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- ground connection
- integrated circuit
- power integrated
- circuit lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a large-power integrated circuit lead frame resistant to layer separation and water vapor entering. The lead frame comprises a chip holder, soldering pins, a ground pin and a radiating fin. A ground soldering platform for increasing area for a ground solder wire is connected to the soldering pins and arranged at one side of the soldering pins, and at the same side, the ground soldering platform is connected to the chip holder into one piece by a bent section. The ground soldering platform has a spongy surface. After plastic packaging, the lead frame is combined with a plastic body more closely, and a corrugated surface is especially good in adsorption effect. Thus layer separation is avoided, vapor is prevented from entering, and the service life of the product is improved.
Description
Technical field
The utility model relates to high-power integrated circuit lead frame, especially the pin configuration of high-power integrated circuit lead frame.
Background technology
Circuit lead frame is the core of modern electronic technology, its application has been penetrated into the every field of human society, development to electronics industry and even national economy is producing tremendous influence, in the world also with one of its technical merit and economic important symbol of weighing a national overall national strength.The feature of high-power integrated circuit lead frame is on grounding pin, to have a ground connection jig that is connected with grounding pin, is used for increasing chip ground connection position of bonding wire.Owing to having increased ground connection jig, make ground connection bonding wire have enough welding spaces, do not need to increase the area of slide holder, thereby solved the contradiction between number of chips and packaging body volume.But because the company's muscle plane domain between grounding pin and grounding pin bending section is wider, in the encapsulation of chip, easily occur that afterwards lamination appears in plastic-sealed body and grounding pin, cause steam and enter chip internal, cause chip to burn.
Utility model content
The purpose of this utility model easily occurs that lamination appears in plastic-sealed body and grounding pin after solving exactly high-power integrated circuit lead frame encapsulation, causes steam and enters chip internal, the problem that causes chip to burn.
For addressing the above problem, the technical solution adopted in the utility model is: the high-power integrated circuit lead frame that anti-layering and steam enter, comprise slide holder, welding pin, grounding pin and fin, described grounding pin one side is provided with the ground connection jig being connected with grounding pin, be used for increasing chip ground connection position of bonding wire, described ground connection jig homonymy one end and slide holder are integrated by bending disconnection, it is characterized in that described ground connection jig surface is pitted skin.
Above-mentioned ground connection jig surface pitted skin is that ripple pitted skin has better effect.Ground connection jig and welding pin are in the same plane.
In sum, the utility model beneficial effect is: because ground connection jig adopts pitted skin, be combined tightr after plastic packaging with plastic body, especially ripple pitted skin has better adhesion effect, thereby prevention layering, reaches and stops entering of steam, the useful life of improving product.
Accompanying drawing explanation
Fig. 1 is the utility model schematic diagram.
Fig. 2 is that the A-A of Fig. 1 is to cutaway view.
Fig. 3 is the B portion enlarged drawing of Fig. 2.
In figure, 1, fin, 3, slide holder, 4, welding pin, 5, ground connection jig, 6, grounding pin, 7, cross and connect muscle, 8, bending is disconnected.
Embodiment
As shown in Figure 1 and Figure 2, the high-power integrated circuit lead frame that anti-layering and steam enter, comprise slide holder 3, welding pin 4, grounding pin 6 and fin 1, grounding pin 6 one sides are provided with the ground connection jig 5 being connected with grounding pin, be used for increasing chip ground connection position of bonding wire, ground connection jig 5 homonymy one end and slide holder 3 are broken and 8 are connected as a single entity by bending, ground connection jig 5 surfaces are pitted skin, can increase adhesive force like this, various pitted skins can both effectively achieve the above object.Optimal way is that the surperficial pitted skin of ground connection jig 5 is ripple pitted skin, as shown in Figure 3.Ground connection jig 5 is in the same plane with welding pin 4.
The utility model by ground connection jig 5 surface for pitted skin realize be combined with plastic body after plastic packaging tightr, especially ripple pitted skin has better adhesion effect, thereby prevention layering, reaches and stops entering of steam, has improved widely the useful life of high-power integrated circuit lead frame.
Claims (3)
1. the high-power integrated circuit lead frame that anti-layering and steam enter, comprise slide holder (3), welding pin (4), grounding pin (6) and fin (1), described grounding pin (6) one sides are provided with the ground connection jig (5) being connected with grounding pin, be used for increasing chip ground connection position of bonding wire, described ground connection jig (5) homonymy one end and slide holder (3) by bending break (8) be connected as a single entity, it is characterized in that described ground connection jig (5) surface is for pitted skin.
2. the high-power integrated circuit lead frame that anti-layering according to claim 1 and steam enter, is characterized in that the surperficial pitted skin of described ground connection jig (5) is ripple pitted skin.
3. the high-power integrated circuit lead frame that anti-layering according to claim 1 and steam enter, is characterized in that described ground connection jig (5) and welding pin (4) are in the same plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320600037.9U CN203456447U (en) | 2013-09-27 | 2013-09-27 | Large-power integrated circuit lead frame resistant to layer separation and water vapor entering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320600037.9U CN203456447U (en) | 2013-09-27 | 2013-09-27 | Large-power integrated circuit lead frame resistant to layer separation and water vapor entering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203456447U true CN203456447U (en) | 2014-02-26 |
Family
ID=50136304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320600037.9U Expired - Fee Related CN203456447U (en) | 2013-09-27 | 2013-09-27 | Large-power integrated circuit lead frame resistant to layer separation and water vapor entering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203456447U (en) |
-
2013
- 2013-09-27 CN CN201320600037.9U patent/CN203456447U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140226 Termination date: 20140927 |
|
| EXPY | Termination of patent right or utility model |