CN113451485A - Molding device for packaging adhesive for preventing LED display from light crosstalk - Google Patents
Molding device for packaging adhesive for preventing LED display from light crosstalk Download PDFInfo
- Publication number
- CN113451485A CN113451485A CN202110725829.8A CN202110725829A CN113451485A CN 113451485 A CN113451485 A CN 113451485A CN 202110725829 A CN202110725829 A CN 202110725829A CN 113451485 A CN113451485 A CN 113451485A
- Authority
- CN
- China
- Prior art keywords
- led display
- negative pressure
- packaged
- packaging adhesive
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
Abstract
The invention discloses a molding device of packaging adhesive for preventing light crosstalk of an LED display. When the LED display packaging device is used, the LED display to be packaged is adsorbed by the negative pressure adsorption device, the first molding assembly is moved to a target position through the switching device, the LED display to be packaged is subjected to compression molding packaging through the first molding assembly, and a transparent packaging adhesive layer is formed on the surface of the LED display to be packaged; and then the switching device moves the second molding assembly to a target position, the LED display packaged with the transparent packaging adhesive layer is subjected to compression molding packaging again through the second molding assembly, and a crosstalk prevention stop block is formed on the transparent packaging adhesive layer of the LED display so as to prevent crosstalk between adjacent pixels in the LED display.
Description
Technical Field
The invention relates to the technical field of display packaging, in particular to a molding device for packaging glue for preventing light crosstalk of an LED display.
Background
In the packaging process of the LED display, a glue filling packaging mode is adopted in the industry, namely mixed glue is directly filled and sealed on one surface of the circuit board, which is provided with the LED chip, so that the LED is packaged and protected. The prepared epoxy resin is poured into one surface of the circuit board, which is welded with the LED light-emitting chip, and then baking, curing and packaging are carried out. The method is simple and easy to realize, but the consistency of the product is difficult to ensure and the batch use is difficult.
In addition, when the LED display is used as a full-color display, if the LED display is packaged by only the transparent packaging adhesive layer, crosstalk between adjacent pixels is easily generated, which affects the display effect.
Disclosure of Invention
The invention aims to provide a molding device of packaging adhesive for preventing LED display from light crosstalk, which can improve the problems.
The embodiment of the invention is realized by the following steps:
the invention provides a molding device of packaging adhesive for preventing LED display from light crosstalk, comprising: the device comprises a first molding assembly, a second molding assembly, a switching device, a negative pressure adsorption device and an electric control telescopic rod;
the negative pressure adsorption device is used for adsorbing the LED display to be packaged, one surface, provided with the LED, of the LED display to be packaged deviates from the negative pressure adsorption device, and at least one electric control telescopic rod is fixed on one side, deviating from the LED display to be packaged, of the negative pressure adsorption device;
the first molding assembly is used for forming a packaging adhesive layer for the LED display to be packaged, and the second molding assembly is used for forming a crosstalk prevention stop block for the LED display to be packaged; the switching device is used for moving the first molding assembly or the second molding assembly to a target position corresponding to the LED display to be packaged adsorbed by the negative pressure adsorption device.
It can be understood that the invention discloses a molding device of packaging adhesive for preventing LED display from light crosstalk. When the LED display packaging device is used, the LED display to be packaged is adsorbed by the negative pressure adsorption device, the first molding assembly is moved to a target position through the switching device, the LED display to be packaged is subjected to compression molding packaging through the first molding assembly, and a transparent packaging adhesive layer is formed on the surface of the LED display to be packaged; and then the switching device moves the second molding assembly to a target position, the LED display packaged with the transparent packaging adhesive layer is subjected to compression molding packaging again through the second molding assembly, and a crosstalk prevention stop block is formed on the transparent packaging adhesive layer of the LED display so as to prevent crosstalk between adjacent pixels in the LED display.
In an alternative embodiment of the present invention, the first molding assembly includes a first electric heating device, a first mold carrying stage, and a first mold; the first die carrier is placed on the first electric heating device, and the first die is placed on the first die carrier; a first accommodating groove is formed in the surface, away from the first mould carrying platform, of the first mould, and a plurality of protruding structures are arranged on the first bottom surface of the first accommodating groove; under the condition that the switching device moves the first molding assembly to the target position, the projection structure is just between two adjacent LEDs in the orthographic projection area of the circuit board of the LED display to be packaged.
During the use, adsorb through negative pressure adsorption equipment and live and wait to encapsulate the LED display, place the encapsulation rubber cake in to first mould, will wait to encapsulate the LED display and press to the mould gradually through the motion of automatically controlled telescopic link, start first electric heating device, heating temperature makes the encapsulation rubber cake melt between 140 ℃ to 150 ℃, after heating a period, after cooling a period waits to encapsulate gluey resolidification again, the automatically controlled telescopic link of secondary control pulls up the LED display that encapsulates, form transparent encapsulation glue film on the one side that LED was installed to the circuit board promptly.
Wherein the packaging adhesive cake comprises 30-70% of organic silicon resin, 15-40% of fluorescent powder, 0.5-20% of electrodeless transparent powder and 0.5-5% of tackifier. The adhesion promoter is silane or siloxane oligomer containing alkoxy and hydrosilyl. The TG point (glass transition point) of the packaging rubber cake is 80-130 ℃, and the thermal expansion coefficient is 25-50 mu m/m.
The manufacturing steps of the packaging rubber cake are as follows: adding the raw materials of all the components into a pre-mixer for uniform mixing to form a silica gel mixture; extruding the silica gel mixture from a slit of an extrusion molding machine to form a silica gel mold; and drying the extruded silica gel film in a drying channel to obtain a packaging rubber cake, wherein the drying temperature is 150-160 ℃.
It can be understood that, because the plurality of protruding structures are arranged on the first bottom surface of the first accommodating groove, a plurality of corresponding grooves are also arranged on the light-emitting surface of the transparent packaging adhesive layer of the LED display packaged by the first molding assembly, and the grooves exist between two adjacent LEDs.
In an alternative embodiment of the invention, the sum of the LED height and the circuit board height is the display height; the depth of the first accommodating groove is larger than the height of the display.
It can be understood that the difference between the depth of the first accommodating groove and the height of the display is the thickness of the transparent packaging adhesive layer exceeding the LED portion.
In an alternative embodiment of the present invention, the second mold assembly includes a second electric heating device, a second mold stage, and a second mold; the second die carrying table is placed on the second electric heating device, and the second die is placed on the second die carrying table; and a second accommodating groove is formed in the surface of the second mold, which is far away from the second mold carrying platform, and the depth of the second accommodating groove is equal to that of the first accommodating groove.
During the use, adsorb through negative pressure adsorption equipment and live the LED display of waiting to encapsulate, place the black rubber cake in to the second mould, will wait to encapsulate the LED display and press to the second mould gradually through the motion of automatically controlled telescopic link, start second electric heating device, heating temperature makes the black rubber cake melt between 140 ℃ to 150 ℃, after heating a period, after cooling a period again waits for the black rubber resolidification back, the automatically controlled telescopic link of controling once more pulls up the LED display that encapsulates, will fill above-mentioned black rubber in the recess on transparent encapsulation glue film surface, in order to play the effect that prevents the crosstalk between the adjacent pixel.
Wherein, the black glue adopts epoxy resin, and a certain amount of melanin is proportioned in the black glue.
In an alternative embodiment of the invention, the switching device comprises a motor and a rotary platform; the rotary rod of motor is fixed in on the rotary platform, first electric heater unit with the second electric heater unit all is fixed in rotary platform deviates from the one side of motor.
It will be appreciated that the rotary platform will rotate about the rotary rod under the drive of the motor to move either the first molding assembly or the second molding assembly to the target position.
In an alternative embodiment of the invention, the notch of the first accommodating groove is consistent with the outline shape of the circuit board; the notch of the first accommodating groove is consistent with the outline size of the circuit board. The notch of the second accommodating groove is consistent with the outline shape of the circuit board; the notch of the second accommodating groove is consistent with the outline size of the circuit board.
It can be understood that, in the process of pressing the mold, the first accommodating groove and the second accommodating groove can both just wrap the circuit board of the whole LED display, so that the LEDs on the circuit board are completely encapsulated in place.
In an alternative embodiment of the present invention, the negative pressure adsorption device comprises a negative pressure pipeline, a negative pressure cavity and a porous material layer; the negative pressure pipeline is communicated with the air port on the first surface of the negative pressure cavity; a plurality of air holes are distributed on a second surface of the negative pressure cavity opposite to the first surface; the porous material layer is fixed on the second surface.
It can be understood that the other end of the negative pressure pipeline is communicated with a negative pressure generating device such as an air pump, and negative pressure is formed in the whole negative pressure cavity of the negative pressure pipeline, so that each air hole has air flow, and the adsorbability is formed on the second surface. The provision of a porous layer of material on the second surface may make the adsorption force more uniform.
Wherein the porous material layer is composed of a substance containing a large number of through holes therein. The through holes can be classified into micro pores having a diameter of 2nm or less, meso pores having a diameter of 2nm to 50nm, and macro pores having a diameter of 50nm or more, depending on the size thereof. The porous material layer may be classified into organic ceramics, inorganic ceramics, metals, and mixed type porous materials according to its constituent components. The porous material layer may be in the form of powder, a coating film, or a block, and the powder may be in various forms such as a sphere, a hollow sphere, a fiber, or a tube, and the powder may be used as it is, but the powder may be used as a starting material in the form of a coating film or a block.
In an alternative embodiment of the invention, the area of the layer of porous material is smaller than the area of the second surface.
Has the advantages that:
the invention discloses a molding device of packaging adhesive for preventing light crosstalk of an LED display. When the LED display packaging device is used, the LED display to be packaged is adsorbed by the negative pressure adsorption device, the first molding assembly is moved to a target position through the switching device, the LED display to be packaged is subjected to compression molding packaging through the first molding assembly, and a transparent packaging adhesive layer is formed on the surface of the LED display to be packaged; and then the switching device moves the second molding assembly to a target position, the LED display packaged with the transparent packaging adhesive layer is subjected to compression molding packaging again through the second molding assembly, and a crosstalk prevention stop block is formed on the transparent packaging adhesive layer of the LED display so as to prevent crosstalk between adjacent pixels in the LED display.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 to fig. 3 are schematic diagrams illustrating a flow of a first molding assembly of a molding apparatus for an encapsulation adhesive for preventing light crosstalk of an LED display according to the present invention;
fig. 4 to fig. 6 are schematic diagrams illustrating a flow of a second molding assembly of the molding apparatus for an encapsulation adhesive for preventing light crosstalk of an LED display according to the present invention;
fig. 7 is a schematic diagram of an LED display packaged by a molding device of a packaging adhesive for preventing light crosstalk of the LED display according to the present invention.
Reference numerals:
the LED display device comprises an LED display device 100 to be packaged, a transparent packaging adhesive layer 110, an anti-light-crosstalk blocking block 120, a circuit board 130, an LED140, a first molding assembly 10, a first electric heating device 11, a first mold carrying platform 12, a first mold 13, a first accommodating groove 14, a protruding structure 15, a second molding assembly 20, a second electric heating device 21, a second mold carrying platform 22, a second mold 23, a second accommodating groove 24, a switching device 30, a motor 31, a rotary platform 32, a negative pressure adsorption device 40, a negative pressure pipeline 41, a negative pressure cavity 42, a porous material layer 43, an air hole 44, an electric control telescopic rod 50, a packaging adhesive cake 60 and a black adhesive cake 70.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
As shown in fig. 1 to 6, the present invention provides a molding apparatus for an encapsulant for preventing crosstalk of an LED display, comprising: the device comprises a first molding assembly 10, a second molding assembly 20, a switching device 30, a negative pressure adsorption device 40 and an electric control telescopic rod 50.
The negative pressure adsorption device 40 is used for adsorbing the LED display 100 to be packaged, one surface of the LED display 100 to be packaged, which is provided with the LED140, deviates from the negative pressure adsorption device 40, and at least one electric control telescopic rod 50 is fixed on one side of the negative pressure adsorption device 40 deviating from the LED display 100 to be packaged.
The first mold assembly 10 is used for forming a transparent packaging adhesive layer 110 for the LED display 100 to be packaged, and the second mold assembly 20 is used for forming a crosstalk prevention block 120 for the LED display 100 to be packaged; the switching device 30 is used to move the first mold assembly 10 or the second mold assembly 20 to a target position corresponding to the LED display 100 to be packaged absorbed by the negative pressure absorbing device 40.
It can be understood that the invention discloses a molding device of packaging adhesive for preventing LED display from light crosstalk. When the LED display to be packaged is used, as shown in fig. 1 to fig. 3, the LED display 100 to be packaged is adsorbed by the negative pressure adsorption device 40, the first molding assembly 10 is moved to a target position by the switching device 30, the LED display 100 to be packaged is subjected to die-molding packaging by the first molding assembly 10, and the transparent packaging adhesive layer 110 is formed on the surface of the LED display 100 to be packaged. As shown in fig. 4 to fig. 6, the switching device 30 moves the second mold assembly 20 to the target position, and the LED display packaged with the transparent packaging adhesive layer 110 is again subjected to die-casting by the second mold assembly 20, and then the anti-crosstalk stopper 120 is formed on the transparent packaging adhesive layer 110 of the LED display to prevent crosstalk between adjacent pixels in the LED display.
In an alternative embodiment of the present invention, as shown in fig. 1 to 3, the first molding assembly 10 includes a first electric heating device 11, a first mold stage 12, and a first mold 13; a first mold carrying table 12 is placed on the first electric heating device 11, and a first mold 13 is placed on the first mold carrying table 12; a first accommodating groove 14 is formed in the surface, away from the first mold carrying table 12, of the first mold 13, and a plurality of protruding structures 15 are arranged on the first bottom surface of the first accommodating groove 14; in the case where the switching device 30 moves the first mold assembly 10 to the target position, the projection structure 15 is just between two adjacent LEDs in the forward projection area of the circuit board 130 of the LED display 100 to be packaged.
When the LED packaging device is used, the LED display 100 to be packaged is adsorbed by the negative pressure adsorption device 40, the packaging rubber cake 60 is placed in the first mold 13, the LED display 100 to be packaged is gradually pressed to the mold through the movement of the electric control telescopic rod 50, the first electric heating device 11 is started, the packaging rubber cake 60 is melted at the heating temperature of 140-150 ℃, after the packaging rubber is heated for a period of time and cooled for a period of time again, the packaged LED display is pulled up by controlling the electric control telescopic rod 50 again, and the transparent packaging rubber layer 110 is formed on the surface, on which the LED is mounted, of the circuit board 130.
Wherein the packaging adhesive cake 60 comprises 30-70% of organic silicon resin, 15-40% of fluorescent powder, 0.5-20% of electrodeless transparent powder and 0.5-5% of tackifier. The adhesion promoter is silane or siloxane oligomer containing alkoxy and hydrosilyl. The TG point (glass transition point) of the packaging rubber cake 60 is 80-130 ℃, and the thermal expansion coefficient is 25-50 mu m/m.
The manufacturing steps of the packaging rubber cake 60 are as follows: adding the raw materials of all the components into a pre-mixer for uniform mixing to form a silica gel mixture; extruding the silica gel mixture from a slit of an extrusion molding machine to form a silica gel mold; and drying the extruded silica gel film in a drying channel to obtain a packaging rubber cake 60, wherein the drying temperature is 150-160 ℃.
It can be understood that, since the plurality of protrusion structures 15 are arranged on the first bottom surface of the first receiving groove 14, a plurality of corresponding grooves are also arranged on the light-emitting surface of the transparent encapsulating adhesive layer 110 of the LED display encapsulated by the first molding compound 10, and the grooves exist between two adjacent LEDs.
In an alternative embodiment of the invention, the sum of the height of the LED140 and the height of the circuit board 130 is the display height; the depth of the first receiving groove 14 is greater than the height of the display.
It can be understood that the difference between the depth of the first receiving cavity 14 and the height of the display is the thickness of the transparent encapsulating adhesive layer 110 exceeding the LED portion.
In an alternative embodiment of the present invention, as shown in fig. 4 to 6, the second mold assembly 20 includes a second electric heating device 21, a second mold stage 22, a second mold 23; a second mold stage 22 is placed on the second electric heating device 21, and a second mold 23 is placed on the second mold stage 22; the surface of the second mold 23 facing away from the second mold stage 22 is provided with a second accommodating recess 24, and the depth of the second accommodating recess 24 is equal to the depth of the first accommodating recess 14.
When the LED display is used, the LED display 100 to be packaged is adsorbed by the negative pressure adsorption device 40, the black rubber cake 70 is placed in the second mold 23, the LED display 100 to be packaged is gradually pressed towards the second mold 23 through the movement of the electric control telescopic rod 50, the second electric heating device 21 is started, the heating temperature is 140-150 ℃, the black rubber cake 70 is melted, after the black rubber is heated for a period of time and cooled for a period of time again, the packaged LED display is pulled up by controlling the electric control telescopic rod 50 again after the black rubber is cured again, and the grooves in the surface of the transparent packaging rubber layer 110 are filled with the black rubber, as shown in fig. 7, so that the effect of preventing crosstalk between adjacent pixels is achieved.
Wherein, the black glue adopts epoxy resin, and a certain amount of melanin is proportioned in the black glue.
As shown in fig. 1, in an alternative embodiment of the invention, the switching device 30 comprises a motor 31 and a rotating platform 32; the rotating rod of the motor 31 is fixed on the rotating platform 32, and the first electric heating device 11 and the second electric heating device 21 are both fixed on the surface of the rotating platform 32, which is far away from the motor 31.
It will be appreciated that the rotary platform 32 will rotate about the rotary rod under the drive of the motor 31, thereby moving either the first molding assembly 10 or the second molding assembly 20 to the target position.
In an alternative embodiment of the present invention, the notch of the first receiving groove 14 conforms to the contour shape of the circuit board 130; the notch of the first receiving groove 14 is also the same as the contour size of the circuit board 130. The notch of the second accommodating groove 24 is in accordance with the outline shape of the circuit board 130; the slot of the second receiving groove 24 is also the same as the contour of the circuit board 130.
It is understood that, during the process of pressing the mold, the first receiving groove 14 and the second receiving groove 24 can both just wrap the circuit board 130 of the LED display, so that the LEDs on the circuit board 130 are completely encapsulated in place.
In an alternative embodiment of the present invention, the negative pressure adsorption device 40 includes a negative pressure conduit 41, a negative pressure chamber 42, and a porous material layer 43; the negative pressure conduit 41 communicates with an air port on a first surface of the negative pressure chamber 42; a second surface of the negative pressure chamber 42 opposite to the first surface is arranged with a plurality of air holes 44; a layer of porous material 43 is secured to the second surface.
It can be understood that the other end of the negative pressure pipeline 41 is communicated with a negative pressure generating device such as an air pump, and a negative pressure is formed in the whole negative pressure cavity 42 through the negative pressure pipeline 41, so that each air hole 44 has an air flow, thereby forming the adsorbability on the second surface. The provision of a porous layer of material on the second surface may make the adsorption force more uniform.
The porous material layer 43 is made of a material having a large number of through holes therein. The through holes can be classified into micro pores 44 having a diameter of 2nm or less, middle pores 44 having a diameter of 2nm to 50nm, and macro pores 44 having a diameter of 50nm or more according to their sizes. The porous material layer 43 may be classified into organic ceramics, inorganic ceramics, metals, and mixed type porous materials according to its constituent components. The porous material layer 43 may be in the form of powder, a coating film, or a block, and the powder may be in various forms such as a sphere, a hollow sphere, a fiber, or a tube, and the powder may be used as it is, but it may be used as a starting material in the form of a coating film or a block.
In an alternative embodiment of the invention, the area of the layer of porous material 43 is smaller than the area of the second surface.
Has the advantages that:
the invention discloses a molding device of packaging adhesive for preventing light crosstalk of an LED display. When the packaging device is used, the LED display 100 to be packaged is adsorbed by the negative pressure adsorption device 40, the first molding assembly 10 is moved to a target position through the switching device 30, the LED display 100 to be packaged is subjected to compression molding packaging through the first molding assembly 10, and a transparent packaging adhesive layer 110 is formed on the surface of the LED display 100 to be packaged; then the switching device 30 moves the second mold assembly 20 to the target position, and the LED display packaged with the transparent packaging adhesive layer 110 is subjected to mold packaging again through the second mold assembly 20, and then the crosstalk prevention stopper 120 is formed on the transparent packaging adhesive layer 110 of the LED display, so as to prevent crosstalk between adjacent pixels in the LED display.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A molding device for packaging adhesive for preventing LED display crosstalk comprises:
the device comprises a first molding assembly, a second molding assembly, a switching device, a negative pressure adsorption device and an electric control telescopic rod;
the negative pressure adsorption device is used for adsorbing the LED display to be packaged, one surface, provided with the LED, of the LED display to be packaged deviates from the negative pressure adsorption device, and at least one electric control telescopic rod is fixed on one side, deviating from the LED display to be packaged, of the negative pressure adsorption device;
the first molding assembly is used for forming a transparent packaging adhesive layer for the LED display to be packaged, and the second molding assembly is used for forming a crosstalk prevention stop block for the LED display to be packaged; the switching device is used for moving the first molding assembly or the second molding assembly to a target position corresponding to the LED display to be packaged adsorbed by the negative pressure adsorption device.
2. The molding apparatus of packaging adhesive for preventing LED display from light crosstalk according to claim 1,
the first molding assembly comprises a first electric heating device, a first mold carrying platform and a first mold;
the first die carrier is placed on the first electric heating device, and the first die is placed on the first die carrier;
a first accommodating groove is formed in the surface, away from the first mould carrying platform, of the first mould, and a plurality of protruding structures are arranged on the first bottom surface of the first accommodating groove;
under the condition that the switching device moves the first molding assembly to the target position, the projection structure is just between two adjacent LEDs in the orthographic projection area of the circuit board of the LED display to be packaged.
3. The molding apparatus of packaging adhesive for preventing LED display from light crosstalk according to claim 2,
the sum of the LED height and the circuit board height is the display height;
the depth of the first accommodating groove is larger than the height of the display.
4. The molding apparatus of packaging adhesive for preventing LED display from light crosstalk according to claim 3,
the second molding assembly comprises a second electric heating device, a second mold carrying platform and a second mold;
the second die carrying table is placed on the second electric heating device, and the second die is placed on the second die carrying table;
and a second accommodating groove is formed in the surface of the second mold, which is far away from the second mold carrying platform, and the depth of the second accommodating groove is equal to that of the first accommodating groove.
5. The molding apparatus of packaging adhesive for preventing LED display from light crosstalk according to claim 4,
the switching device comprises a motor and a rotating platform;
the rotary rod of motor is fixed in on the rotary platform, first electric heater unit with the second electric heater unit all is fixed in rotary platform deviates from the one side of motor.
6. The molding apparatus of packaging adhesive for preventing LED display from light crosstalk according to any one of claims 1 to 5,
the notch of the first accommodating groove is consistent with the outline shape of the circuit board; the notch of the first accommodating groove is consistent with the outline size of the circuit board;
the notch of the second accommodating groove is consistent with the outline shape of the circuit board; the notch of the second accommodating groove is consistent with the outline size of the circuit board.
7. The molding apparatus of packaging adhesive for preventing LED display from light crosstalk according to claim 1,
the negative pressure adsorption device comprises a negative pressure pipeline, a negative pressure cavity and a porous material layer;
the negative pressure pipeline is communicated with the air port on the first surface of the negative pressure cavity; a plurality of air holes are distributed on a second surface of the negative pressure cavity opposite to the first surface;
the porous material layer is fixed on the second surface.
8. The molding apparatus of packaging adhesive for preventing LED display from light crosstalk according to claim 7,
the porous material layer has an area smaller than an area of the second surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110725829.8A CN113451485A (en) | 2021-06-29 | 2021-06-29 | Molding device for packaging adhesive for preventing LED display from light crosstalk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110725829.8A CN113451485A (en) | 2021-06-29 | 2021-06-29 | Molding device for packaging adhesive for preventing LED display from light crosstalk |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113451485A true CN113451485A (en) | 2021-09-28 |
Family
ID=77813771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110725829.8A Withdrawn CN113451485A (en) | 2021-06-29 | 2021-06-29 | Molding device for packaging adhesive for preventing LED display from light crosstalk |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113451485A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102347244A (en) * | 2010-07-29 | 2012-02-08 | 东和株式会社 | Resin sealing device and manufacturing method for resin sealing electronic component |
| CN107146789A (en) * | 2017-05-27 | 2017-09-08 | 惠州雷曼光电科技有限公司 | LED encapsulation method and LED display |
| CN110459481A (en) * | 2018-05-07 | 2019-11-15 | 昱鑫制造股份有限公司 | The packaging method of semiconductor element and its to position mould |
-
2021
- 2021-06-29 CN CN202110725829.8A patent/CN113451485A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102347244A (en) * | 2010-07-29 | 2012-02-08 | 东和株式会社 | Resin sealing device and manufacturing method for resin sealing electronic component |
| CN107146789A (en) * | 2017-05-27 | 2017-09-08 | 惠州雷曼光电科技有限公司 | LED encapsulation method and LED display |
| CN110459481A (en) * | 2018-05-07 | 2019-11-15 | 昱鑫制造股份有限公司 | The packaging method of semiconductor element and its to position mould |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102071463B1 (en) | Led with high thermal conductivity particles in phosphor conversion layer and the method of fabricating the same | |
| JP5917739B2 (en) | Method for producing phosphor-containing encapsulant | |
| US10801716B1 (en) | Apparatus and method for making encapsulated linear lighting with opaque ends | |
| JP2010027974A (en) | Method of manufacturing light-emitting device | |
| JP5422599B2 (en) | Light emitting diode package structure and manufacturing method thereof | |
| TWI519571B (en) | Process for producing phosphor-containing sealant, phosphor-containing sealant, method for manufacturing light-emitting device, and dispenser | |
| CN104183785A (en) | OLED device packaging method, OLED display panel and OLED display device | |
| CN107248546B (en) | The consistent integration packaging display module of surfacing and its manufacturing method | |
| CN101246938A (en) | Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices | |
| KR20110037913A (en) | Optical-semiconductor encapsulating material | |
| JP2006302965A (en) | Semiconductor light-emitting device and manufacturing method thereof | |
| CN101826590A (en) | LED lamp with lens injected with fluorescent glue and packaging method thereof | |
| CN107146789A (en) | LED encapsulation method and LED display | |
| CN103730565A (en) | Aluminum nitride Chip On Board (COB) light-emitting diode (LED) light source and packaging method thereof | |
| CN103700654A (en) | LED (Light-Emitting Diode) based on COB (Chip On Board) package and manufacturing method thereof | |
| CN108807649A (en) | A kind of LED light source plastic package method | |
| CN106058013A (en) | Chip level LED packaging technology | |
| CN113451485A (en) | Molding device for packaging adhesive for preventing LED display from light crosstalk | |
| CN103254889A (en) | Manufacturing method of phosphor film, packaging method of corresponding light emitting diode | |
| CN104112812A (en) | Ceramic fluorescent body capable of effectively eliminating edge aberration effect in white light LED light source packaging and preparation method thereof | |
| KR101845800B1 (en) | Method for manufacturing led reflector | |
| CN106898679A (en) | A kind of quantum dot LED-backlit device and preparation method thereof | |
| US20150024525A1 (en) | Led lighting apparatus and method for fabricating wavelength conversion member for use in the same | |
| CN113442361A (en) | Improve moulding device that encapsulation of LED display concatenation effect was glued | |
| CN113394326A (en) | Molding device for waterproof LED water inlet packaging adhesive |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20210928 |
|
| WW01 | Invention patent application withdrawn after publication |