CN203260630U - COB packaged by using glass lens - Google Patents
COB packaged by using glass lens Download PDFInfo
- Publication number
- CN203260630U CN203260630U CN 201320288367 CN201320288367U CN203260630U CN 203260630 U CN203260630 U CN 203260630U CN 201320288367 CN201320288367 CN 201320288367 CN 201320288367 U CN201320288367 U CN 201320288367U CN 203260630 U CN203260630 U CN 203260630U
- Authority
- CN
- China
- Prior art keywords
- cob
- glass lens
- substrate
- chip
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a COB (CHIP ON BOARD, chip packaged on substrate) packaged by using a glass lens. The COB packaged by using the glass lens comprises a COB substrate, an LED chip, a gold thread, fluorescent powder, and a glass lens, wherein the LED chip is die-bonded on the COB substrate in matrix through silver glue, the electrode of the LED chip is connected with the electrode of the substrate through the gold thread, the fluorescent powder is coated on the chip, and the glass lens is adhered onto the COB substrate, thereby the COB is packaged by using the lens.
Description
Technical field
The utility model relates to a kind of COB that utilizes lens packages.
Background technology
Present COB (CHIP ON BOARD, chip package on the substrate) packaging technology has two kinds, a kind of is planar package, another kind is the mode by the mould top, in COB surface lens of silica gel moulding, this complex process, pattern top equipment need have high input, produce dumb, different COB substrate and need open different moulds, cost is high.
The utility model content
A kind of COB with the glass lens encapsulation that the utility model relates to comprises: COB substrate, led chip, gold thread, fluorescent material, glass lens; Led chip is arranged die bond by elargol on the COB substrate by matrix form, with gold thread the electrode on the led chip and electrode structure of base plate is linked together; Fluorescent powder coating on chip, is bonded to glass lens on the COB substrate at last.Thereby COB lens packages.
Fine this problem that solved only needs lens are bonded at the COB surface with process, has like this both realized installing additional lens, and is simple again, and flexibly, as long as light-emitting area place shape size is the same, different substrates can use equally, in addition, the glass lens good stability can xanthochromia.
Description of drawings
Fig. 1 is end view of the present utility model.
Embodiment
COB substrate (2), led chip (4), gold thread, fluorescent material (3), glass lens (1).Led chip (4) is arranged die bond by elargol on COB substrate (2) by matrix form, with gold thread electrode and electrode structure of base plate on the led chip (4) is linked together.Fluorescent material (3) is coated on the chip, glass lens is bonded on the COB substrate (2) at last, thus the COB lens packages.
Claims (1)
1. the COB with the glass lens encapsulation is characterized in that COB comprises COB substrate, led chip, gold thread, fluorescent material, glass lens; Led chip is arranged die bond by elargol on the COB substrate by matrix form, with gold thread the electrode on the led chip and electrode structure of base plate is linked together, and fluorescent powder coating on chip, is bonded to glass lens on the COB substrate at last.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320288367 CN203260630U (en) | 2013-05-15 | 2013-05-15 | COB packaged by using glass lens |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320288367 CN203260630U (en) | 2013-05-15 | 2013-05-15 | COB packaged by using glass lens |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203260630U true CN203260630U (en) | 2013-10-30 |
Family
ID=49473171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320288367 Expired - Fee Related CN203260630U (en) | 2013-05-15 | 2013-05-15 | COB packaged by using glass lens |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203260630U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104037272A (en) * | 2014-03-26 | 2014-09-10 | 深圳市格天光电有限公司 | High-integration flip chip COB (Chip On Board) light source with temperature feedback function, and manufacturing method of COB light source |
| US10545286B2 (en) | 2015-12-28 | 2020-01-28 | Huawei Technologies Co., Ltd. | Housing for packaging optical transmitter module and optical transmitter module |
-
2013
- 2013-05-15 CN CN 201320288367 patent/CN203260630U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104037272A (en) * | 2014-03-26 | 2014-09-10 | 深圳市格天光电有限公司 | High-integration flip chip COB (Chip On Board) light source with temperature feedback function, and manufacturing method of COB light source |
| US10545286B2 (en) | 2015-12-28 | 2020-01-28 | Huawei Technologies Co., Ltd. | Housing for packaging optical transmitter module and optical transmitter module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131030 Termination date: 20150515 |
|
| EXPY | Termination of patent right or utility model |