CN201060866Y - Panel structure for producing plate type LED substrates - Google Patents

Panel structure for producing plate type LED substrates Download PDF

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Publication number
CN201060866Y
CN201060866Y CNU2007200528747U CN200720052874U CN201060866Y CN 201060866 Y CN201060866 Y CN 201060866Y CN U2007200528747 U CNU2007200528747 U CN U2007200528747U CN 200720052874 U CN200720052874 U CN 200720052874U CN 201060866 Y CN201060866 Y CN 201060866Y
Authority
CN
China
Prior art keywords
type led
preparing
flat type
construction
plate face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNU2007200528747U
Other languages
Chinese (zh)
Inventor
夏勋力
李军政
潘利兵
李绪锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foshan NationStar Optoelectronics Co Ltd
Original Assignee
Foshan NationStar Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foshan NationStar Optoelectronics Co Ltd filed Critical Foshan NationStar Optoelectronics Co Ltd
Priority to CNU2007200528747U priority Critical patent/CN201060866Y/en
Application granted granted Critical
Publication of CN201060866Y publication Critical patent/CN201060866Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model discloses a plate surface structure for preparing a base plate. The plate surface structure is technically characterized in that the structure comprises a whole metal plate, a plurality of structural units are arrayed on the whole metal plate, the structural units have electrode extending structures with concave and convex matched and mutually spaced, connecting bars are arranged between two adjacent structural units, and a connecting frame is arranged on the periphery of a plurality of structural units. The utility model has the advantages of high production efficiency, good heat radiation effect, high light extraction efficiency, and convenient application, thereby being especially suitable for the mass production of sheet type light emitting diodes.

Description

A kind of plate face structure for preparing the flat type LED substrate
Technical field
The utility model relates to the light-emitting diode field, more particularly relates to a kind of substrate of flat type LED and prepares the plate face structure of this substrate.
Background technology
Along with improving constantly of LED production technology, the LED range of application constantly enlarges, and makes the brightness of LED and photoelectricity stability characteristic (quality) require constantly to promote.The flat type LED production technology is quite ripe at present, as Chinese patent application number is 01131330.7, the applying date is on 04 10th, 2002, denomination of invention is flat type LED and manufacture method thereof, comprise the base that possesses face one side that is installed in main printed circuit board, extend and connect the body part that is arranged on the hole on the main printed circuit board and disposes from above-mentioned base, be arranged on this body part and at the luminous luminous component of another face one side of main printed circuit board, be provided with to be connected with the pair of outer of luminous component electrical connection on base and use electrode, luminous component is with resin-sealed sealing.When base being installed to the back side one side of main printed circuit board, the configuration luminous component make be configured in main printed circuit board on liquid crystal to carry on the back the light conducting direction of irradiation consistent.The manufacture method of flat type LED is to form a plurality of flat type LEDs through a plurality of operations on a slice aggregate circuit substrate, cuts apart the feasible flat type LED one by one of making of aggregate circuit substrate in final operation.
The loading plate face that is adopted in the substrate of above-mentioned light-emitting diode and the production process all adopts the PCB circuit substrate, and its heat dispersion is poor, the production cost height; The method that is adopted when need improve brightness can only be to change LED core and add the big light-emitting diodes input current, increased production cost, and the heat dissipation problem of light-emitting diode does not have effective solution route, can not tackle the problem at its root.
Summary of the invention
The purpose of this utility model is exactly that provide for the deficiency that solves prior art a kind of is applicable to that reliability height, production efficiency height, good heat dissipation effect, light extraction efficiency height, the application of production in enormous quantities prepare the plate face structure of flat type LED substrate easily.
The utility model is to adopt following technical solution to realize above-mentioned purpose: a kind of plate face structure for preparing the flat type LED substrate, it is characterized in that: it is to be made of the whole piece metallic plate, on this full wafer metallic plate, be arranged with several construction units, this construction unit is the electrode extended structure of concavo-convex cooperation and space, be provided with dowel between adjacent two construction units, several construction unit peripheries are connecting frame.
As further specifying of such scheme, described some construction units are arranged as the construction unit array of the capable N of well-regulated M row, M 〉=1 wherein, N 〉=1.
Described dowel is shaped as rectangle or parallelogram between cellular construction.
Described connecting frame is provided with the calibration hole location, and four jiaos of the single structure unit have through hole.
The material of described metallic plate is copper or aluminium or zinc.
The beneficial effect that the utility model adopts above-mentioned technical solution to reach is: the utility model adopts the full wafer metallic plate to be divided into several construction units, being provided with dowel between adjacent two construction units connects, its periphery is provided with connecting frame, on the one hand, the production efficiency height, be fit to produce in enormous quantities, on the other hand, whenever do a construction unit and all possess independent structures, adopt dowel to connect between the construction unit, the metal that reduces between the cellular construction connects, and improves in the cellular construction separation process and too much causes burr phenomena because of metal connects, two cut-off rules are provided simultaneously, improve the precision in the construction unit separation process.
Description of drawings
Fig. 1 is the single structure cellular construction schematic diagram of this substrate.
Fig. 2 is the metallic plate plate face structural representation of the preparation substrate of utility model.
Description of reference numerals: 1, calibration hole 2, peripheral connecting frame 3, dowel 4, construction unit 5, electrode 6, chip bearing face 7, electrode extended structure 8, through hole
Embodiment
As Fig. 1, shown in Figure 2, a kind of plate face structure for preparing the flat type LED substrate of the utility model, it is to be made of the whole piece metallic plate, the material of metallic plate is copper or aluminium or zinc, on this full wafer metallic plate, be arranged with several construction units 4, some construction units 4 are arranged as the construction unit array of the capable N row of well-regulated M, M 〉=1 wherein, N 〉=1, be provided with dowel 3 between adjacent two construction units 4, dowel 3 is between construction unit, be shaped as rectangle or parallelogram, the periphery of several construction units 4 is provided with connecting frame 2, and this framework 2 is provided with calibration hole 1 location, effectively improve the accuracy in the construction unit separation process, deviation when reducing the construction unit separation.
In the use, metallic plate shown in Figure 1 is split the single structure unit 4 that promptly forms substrate shown in Figure 2, it constitutes two electrodes 5 by two parts metal substrate of mutually insulated and constitutes, be that concavo-convex cooperation and space form electrode extended structure 7 between two metal substrates of mutually insulated, the projected electrode of metal substrate is provided with the chip bearing face 6 of light-emitting diode, and four jiaos of single structure unit 4 have through hole 8.
The utility model is not limited to the foregoing description, and the shape of described dowel can be made amendment as required, and those skilled in the art also can do numerous modifications and variations, under the spirit that does not break away from utility model, all in the claimed scope of the utility model.

Claims (5)

1. plate face structure for preparing the flat type LED substrate, it is characterized in that: it is to be made of the whole piece metallic plate, on this full wafer metallic plate, be arranged with several construction units, this construction unit is the electrode extended structure of concavo-convex cooperation and space, be provided with dowel between adjacent two construction units, several construction unit peripheries are connecting frame.
2. a kind of plate face structure for preparing the flat type LED substrate according to claim 1 is characterized in that: described some construction units are arranged as the construction unit array of the capable N of well-regulated M row, M 〉=1 wherein, N 〉=1.
3. a kind of plate face structure for preparing the flat type LED substrate according to claim 1, it is characterized in that: described dowel is shaped as rectangle or parallelogram between cellular construction.
4. a kind of plate face structure for preparing the flat type LED substrate according to claim 1 is characterized in that: described connecting frame is provided with the calibration hole location, and four jiaos of the single structure unit have through hole.
5. a kind of plate face structure for preparing the flat type LED substrate according to claim 1, it is characterized in that: the material of described metallic plate is copper or aluminium or zinc.
CNU2007200528747U 2007-06-18 2007-06-18 Panel structure for producing plate type LED substrates Expired - Lifetime CN201060866Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2007200528747U CN201060866Y (en) 2007-06-18 2007-06-18 Panel structure for producing plate type LED substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2007200528747U CN201060866Y (en) 2007-06-18 2007-06-18 Panel structure for producing plate type LED substrates

Publications (1)

Publication Number Publication Date
CN201060866Y true CN201060866Y (en) 2008-05-14

Family

ID=39409355

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2007200528747U Expired - Lifetime CN201060866Y (en) 2007-06-18 2007-06-18 Panel structure for producing plate type LED substrates

Country Status (1)

Country Link
CN (1) CN201060866Y (en)

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GR01 Patent grant
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20080514