CN103746048A - Production technology of LED nixie tube connecting board - Google Patents
Production technology of LED nixie tube connecting board Download PDFInfo
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- CN103746048A CN103746048A CN201310731595.3A CN201310731595A CN103746048A CN 103746048 A CN103746048 A CN 103746048A CN 201310731595 A CN201310731595 A CN 201310731595A CN 103746048 A CN103746048 A CN 103746048A
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- connecting plate
- pcb board
- connecting board
- pin
- production technology
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
Abstract
The invention relates to the technical field of LED nixie tube production technology, particularly to production technology of an LED nixie tube connecting board. The technical defects that single board die bonding, wire welding, and test operation are low in efficiency and high in reject radio are overcome. The production technology comprises the following steps: A. an early stage step: after PIN jumping and PIN pressing of a connecting board PCB, a tin dipped clamp is mounted on the connecting board PCB; B. a die bonding step: bonding an LED chip in a designated area of the connecting board PCB; C. a wire welding step: circuit connection between the LED chip and the connecting board PCB is established through a wire welding machine; D. an early stage detection step: defective positions on the connecting board are marked by a white oily pen; and E. a board division step: LED nixie tube lamp panel units on the connecting board PCB are separated and output. Compared with an original single board operating mode, 80% of bad circumstances of deformation of PIN needles, chip erasion, wire collapse and the like are reduced, and the production efficiency is improved by three to four times.
Description
Technical field
The present invention relates to LED charactron technical field of producing.
Background technology
LED digital product is nearly all veneer die bond, bonding wire, test jobs at present, and not only efficiency is very low, and the fraction defective of each operation is also higher.During front procedures, very easily cause the flexural deformation of PIN pin, and cleaning efficiency is low; During die bond operation, pick and place material and easily cause the distortion of PIN pin and pcb board charging out-of-flatness, material overturning causes the wafer of erasing, and operating efficiency is lower; During bonding wire operation, pick and place material efficiency low, easily cause material overturning and the line that collapses bad; During before measurement operation, the single material that picks and places, very easily knocks material over and touches the aluminum steel that collapses.
Summary of the invention
In sum, the efficiency that the object of the invention is to solve veneer die bond, bonding wire, test jobs is low, the technical deficiency that fraction defective is high, and a kind of LED charactron connecting plate production technology proposing.
For solving technical problem proposed by the invention, the technical scheme of employing is: LED charactron connecting plate production technology, is characterized in that described production technology includes following steps:
A, prior step: at connecting plate pcb board, jump PIN, press after PIN, directly connecting plate pcb board is loaded onto to wicking fixture, with the automatic wicking of wave-soldering, wicking connecting plate pcb board later, need not divide plate, directly with cleaning in basket immigration ultrasonic cleaning apparatus, clean, after having cleaned, toast;
B, die bond step: first adjust die bond fixture good, in die bond fixture, fix more than two connecting plate PCB, then according to parameter preset, carry out die bond Job Operations by die bond machine, LED chip is bonded in to the appointed area of connecting plate pcb board;
C, bonding wire step: by bonding equipment, set up LED chip and be connected with the circuit between connecting plate pcb board;
D, early stage detecting step: connecting plate pcb board is fixed in the test fixture of testboard, according to default test program, tests 1 connecting plate at every turn, in test process, if any monolithic defective products, with white oil pen, on plate, bad position is being identified out in flakes, by rear operation, concentrate and reprocess;
E, minute plate step: the connecting plate pcb board of test non-defective unit is put into board separator and cut apart, the separated output in each LED charactron lamp plate unit on connecting plate pcb board.
Beneficial effect of the present invention is: technique of the present invention is to divide plate after formerly completing die bond, bonding wire, test jobs again, compare original veneer operating type, can make operation in early stage, die bond operation, bonding wire operation and early stage detect in operation process, reduce the bad item of the distortion of PIN pin, the wafer of erasing, the line that collapses etc. 80%, and each procedures is more optimized, operator operation is simplified more flexibly, and production efficiency has improved 3-4 times.
Embodiment
Technique of the present invention is from jumping PIN → pressure PIN → wicking → cleaning → die bond → bonding wire → test, all adopt connecting plate operation, on the one hand make each operation improving productivity, make on the other hand the distortion of PIN pin, the wafer of erasing, touch the bad problems such as aluminum steel of collapsing and effectively improved.
LED charactron connecting plate production technology, is characterized in that described production technology includes following steps:
A, prior step: at connecting plate pcb board, jump PIN, press after PIN, directly connecting plate pcb board is loaded onto to wicking fixture, with the automatic wicking of wave-soldering, wicking connecting plate pcb board later, need not divide plate, directly with cleaning in basket immigration ultrasonic cleaning apparatus, clean, after having cleaned, toast; Whole plate is jumped PIN, takes conveniently, and efficiency is high, can not cause PIN; Whole plate is pressed PIN, takes conveniently, and efficiency is high, can not cause the distortion of PIN pin; Existing manual wicking, troublesome poeration, efficiency is low, poor stability, the smell is awful for wicking, and wave-soldering wicking of the present invention is simple to operate, and efficiency is high, good stability, and wicking smell is little.Existing monolithic cleans, and needs breaking board, and efficiency is low, easily causes the distortion of PIN pin; And the whole plate of the present invention cleans, to take conveniently, efficiency is high, and PIN pin is neat.
B, die bond step: first adjust die bond fixture good, in die bond fixture, fix more than two connecting plate PCB, then according to parameter preset, carry out die bond Job Operations by die bond machine, LED chip is bonded in to the appointed area of connecting plate pcb board.Existing monolithic die bond, feeding, discharge speed is slow, easily causes the distortion of PIN pin, the wafer of erasing; And the whole plate die bond of the present invention, feeding, discharge is easy and simple to handle, and PIN pin is neat, is difficult for overturning material.
C, bonding wire step: by bonding equipment, set up LED chip and be connected with the circuit between connecting plate pcb board; Existing monolithic bonding wire, feeding, discharge speed is slow, easily causes the distortion of PIN pin, touches the aluminum steel that collapses; Whole plate bonding wire of the present invention, feeding, discharge is easy and simple to handle, and PIN pin is neat, can not touch the aluminum steel that collapses.
D, early stage detecting step: connecting plate pcb board is fixed in the test fixture of testboard, according to default test program, tests 1 connecting plate at every turn, in test process, if any monolithic defective products, with white oil pen, on plate, bad position is being identified out in flakes, by rear operation, concentrate and reprocess; Existing monolithic test, feeding, discharge speed is slow, easily knocks material over and cause the line that collapses while taking; And whole board test of the present invention, feeding, discharge is easy and simple to handle, and efficiency is high, can not touch the aluminum steel that collapses.
E, minute plate step: the connecting plate pcb board of test non-defective unit is put into board separator and cut apart, the separated output in each LED charactron lamp plate unit on connecting plate pcb board; Whole plate divides plate, and machine divides plate automatically, good stability, and efficiency is high, can not touch the aluminum steel that collapses.
New old technology production capacity and fraction defective contrast table are as follows:
Illustrate: production capacity is to calculate by the production capacity of single unit.
2. new old technology each side cost and benefit explanation:
As calculated: the input before input ratio approximately has more 10.1 ten thousand now, as produces large batch of product (more than 100kpcs), production cycle and cost of labor that every list has at least been saved 3 days can be returned this after 1 year.
Claims (1)
1.LED charactron connecting plate production technology, is characterized in that described production technology includes following steps:
A, prior step: at connecting plate pcb board, jump PIN, press after PIN, directly connecting plate pcb board is loaded onto to wicking fixture, with the automatic wicking of wave-soldering, wicking connecting plate pcb board later, need not divide plate, directly with cleaning in basket immigration ultrasonic cleaning apparatus, clean, after having cleaned, toast;
B, die bond step: first adjust die bond fixture good, in die bond fixture, fix more than two connecting plate PCB, then according to parameter preset, carry out die bond Job Operations by die bond machine, LED chip is bonded in to the appointed area of connecting plate pcb board;
C, bonding wire step: by bonding equipment, set up LED chip and be connected with the circuit between connecting plate pcb board;
D, early stage detecting step: connecting plate pcb board is fixed in the test fixture of testboard, according to default test program, tests 1 connecting plate at every turn, in test process, if any monolithic defective products, with white oil pen, on plate, bad position is being identified out in flakes, by rear operation, concentrate and reprocess;
E, minute plate step: the connecting plate pcb board of test non-defective unit is put into board separator and cut apart, the separated output in each LED charactron lamp plate unit on connecting plate pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310731595.3A CN103746048A (en) | 2013-12-26 | 2013-12-26 | Production technology of LED nixie tube connecting board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310731595.3A CN103746048A (en) | 2013-12-26 | 2013-12-26 | Production technology of LED nixie tube connecting board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103746048A true CN103746048A (en) | 2014-04-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310731595.3A Pending CN103746048A (en) | 2013-12-26 | 2013-12-26 | Production technology of LED nixie tube connecting board |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104411111A (en) * | 2014-12-17 | 2015-03-11 | 江苏稳润光电有限公司 | Packaging process for LED nixie tubes |
| CN105578788A (en) * | 2015-12-31 | 2016-05-11 | 江西凯强实业有限公司 | Manufacturing method for backlight flexible printed board |
| CN105899062A (en) * | 2016-05-19 | 2016-08-24 | 东莞市冠佳电子设备有限公司 | Automatic production technology with wired charger |
| CN109119516A (en) * | 2018-09-11 | 2019-01-01 | 台山鸿隆光电科技有限公司 | A kind of LED light vermicelli production technique |
| CN110087396A (en) * | 2019-05-27 | 2019-08-02 | 江西景旺精密电路有限公司 | A kind of method of the processing and forming and on off test of small size PCB |
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| CN1867228A (en) * | 2005-12-20 | 2006-11-22 | 华为技术有限公司 | Circuit board element welding method |
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| CN102062323A (en) * | 2010-11-05 | 2011-05-18 | 深圳市聚飞光电股份有限公司 | Method for manufacturing LED lamp bar and LED lamp |
| CN102237481A (en) * | 2010-05-07 | 2011-11-09 | 佛山市国星光电股份有限公司 | Surface mounted type power light-emitting diode (LED) bracket manufacturing method and product manufactured thereby |
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Patent Citations (5)
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| CN1431691A (en) * | 2002-01-10 | 2003-07-23 | 矽品精密工业股份有限公司 | Throwing method and system used for mfg. capsulation parts of semi-conductor |
| CN1867228A (en) * | 2005-12-20 | 2006-11-22 | 华为技术有限公司 | Circuit board element welding method |
| CN102011952A (en) * | 2009-09-04 | 2011-04-13 | 佛山市国星光电股份有限公司 | Method for making LED (Light Emitting Diode) light resource module and product made by the method |
| CN102237481A (en) * | 2010-05-07 | 2011-11-09 | 佛山市国星光电股份有限公司 | Surface mounted type power light-emitting diode (LED) bracket manufacturing method and product manufactured thereby |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104411111A (en) * | 2014-12-17 | 2015-03-11 | 江苏稳润光电有限公司 | Packaging process for LED nixie tubes |
| CN105578788A (en) * | 2015-12-31 | 2016-05-11 | 江西凯强实业有限公司 | Manufacturing method for backlight flexible printed board |
| CN105899062A (en) * | 2016-05-19 | 2016-08-24 | 东莞市冠佳电子设备有限公司 | Automatic production technology with wired charger |
| CN105899062B (en) * | 2016-05-19 | 2019-05-14 | 东莞市冠佳电子设备有限公司 | A kind of band line charge electrical automation production technology |
| CN109119516A (en) * | 2018-09-11 | 2019-01-01 | 台山鸿隆光电科技有限公司 | A kind of LED light vermicelli production technique |
| CN110087396A (en) * | 2019-05-27 | 2019-08-02 | 江西景旺精密电路有限公司 | A kind of method of the processing and forming and on off test of small size PCB |
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Application publication date: 20140423 |