CN105578788A - Manufacturing method for backlight flexible printed board - Google Patents

Manufacturing method for backlight flexible printed board Download PDF

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Publication number
CN105578788A
CN105578788A CN201511016052.9A CN201511016052A CN105578788A CN 105578788 A CN105578788 A CN 105578788A CN 201511016052 A CN201511016052 A CN 201511016052A CN 105578788 A CN105578788 A CN 105578788A
Authority
CN
China
Prior art keywords
led
flakes
flexible printed
led lamps
printed board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201511016052.9A
Other languages
Chinese (zh)
Inventor
吴斌
官章青
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangxi Kaiqiang Industrial Co Ltd
Original Assignee
Jiangxi Kaiqiang Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangxi Kaiqiang Industrial Co Ltd filed Critical Jiangxi Kaiqiang Industrial Co Ltd
Priority to CN201511016052.9A priority Critical patent/CN105578788A/en
Publication of CN105578788A publication Critical patent/CN105578788A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/162Testing a finished product, e.g. heat cycle testing of solder joints

Abstract

The invention discloses a manufacturing method for a backlight flexible printed board. The manufacturing method comprises the working procedures of sticking LED lamps by adopting an SMT manner, performing a light-up test for the LED lamps that are laminated into a whole piece, sticking black-white adhesive tapes in a whole-piece laminating manner, performing appearance shaping, and the like, wherein the LED lamps are adhered by adopting the SMT patch manner into a whole piece; then the light-up test for the LED lamps that are laminated into the whole piece is carried out to eliminate a condition that the LED lamps in the whole piece are not switched on; the black-white adhesive tapes are glued by adopting the whole-piece laminating manner for fixing the LED lamps; the printed boards of the LED lamps are stamped and glued by dies; and the regions, provided with the LED lamps, of the dies required in the stamping process are hollow-out in the design and manufacture so as to ensure that the LED lamps are not in contact with a knife edge and a guide column. The manufacturing method for the backlight flexible printed board has the characteristics of high production efficiency, high assembling precision and high product consistency.

Description

A kind of manufacture method of backlight flexible printed board
Technical field
The present invention relates to wiring board processing technique field, be specially a kind of manufacture method of backlight flexible printed board.
Background technology
Backlight is positioned at liquid crystal display a kind of light source behind, and its illumination effect will directly have influence on LCD MODULE visual effect.Liquid crystal display itself is not luminous, and its display graphics or character are the results that it is modulated light.
Backlight is primarily of backlight flexible printed board, LED, black and white glue three part composition; In industry, common way provides backlight flexible printed board by wiring board producer, and by backlight producer SMT mounted LED lamp, more single LED product pastes black and white glue and test.
In the concrete division of labor, the master operation of wiring board producer is: blanking → baking → boring → heavy copper → copper facing → pad pasting → exposure → video picture → etching → stripping → cleaning → lamination → lamination → turmeric → character → baking → electrical measurement → profile is shaped.The master operation of backlight producer is: SMT pastes LED → mono-LED assembling black and white glue → mono-LED test.In shape molding operation, normally product is washed into monolithic product, relies on tie point and plate body to link together.The evenness in plate face is poor, is easy to occur deviation when pasting LED.In the process of single LED assembling black and white glue, each backlight flex circuit application is wanted artificial separately and is pasted black and white glue, there is the defect of the low precision of laminating.Adopt with upper type, need to consume a large amount of manpowers, in today that human resources are day by day in short supply, greatly improve cost of labor and had a strong impact on production efficiency.
Summary of the invention
The object of this invention is to provide a kind of manufacture method of backlight flexible printed board, have that production efficiency is high, assembly precision is high and the feature of good product consistency.
The present invention can be achieved through the following technical solutions:
The invention discloses a kind of manufacture method of backlight flexible printed board, comprise the following steps:
A, SMT paste LED: the mode of SMT paster is whole in flakes puts up LED being adopted by wiring board after electric performance test, makes LED in flakes form linear, each in flakes on comprise some LED;
B, in flakes LED light test: on the wiring board after completing SMT subsides LED, LED lights test in flakes, gets rid of the situation that LED lamp does not in flakes work.
C, in flakes assembling paste black and white glue: test LED on rear board and adopt the mode of fitting in flakes to stick black and white glue, fixed L ED lamp in flakes being lighted by LED in flakes;
D, profile are shaped: will being washed into adopting mould punching to become LED product completing the wiring board after assembling black and white glue in flakes, and requiring that the mould of use guarantees to have the edge of a knife and guide pillar to encounter LED when Design of Dies makes there being the region of LED to empty when punching press.
The described LED mounted in flakes spacing is each other greater than 3mm.
Described LED is in flakes lighted test and is adopted p-wire subtest, the width of described p-wire is 0.15mm, be provided with p-wire between the lines that described LED is in flakes adjacent and hold district, it is parallel that described p-wire accommodation district and described LED in flakes form lines, and the width that described p-wire holds district is 2.0mm.
Described wiring board is provided with two p-wires and holds district.
Described SMT also comprises front operation before pasting LED, and described front operation mainly comprises: blanking → baking → boring → heavy copper → copper facing → pad pasting → exposure → video picture → etching → stripping → cleaning → lamination → lamination → turmeric → character → baking → electric performance test.
The manufacture method of a kind of backlight flexible printed board of the present invention, has following beneficial effect:
The first, production efficiency is high, by traditional single LED mounting operation all having been transferred to whole paster operation in flakes, adopt the mode of pasting black and white glue in flakes, compare single LED and paste the efficiency that black and white glue improves laminating, and overcome the shortcoming of contraposition difficulty when single LED is pasted; Adopt the mode of testing LED in flakes, compare single LED test production efficiency and greatly promote, improve labor productivity widely.
Second step, assembly precision are high, during subsides LED, product is that whole plate mounts in flakes, avoid the defect that the assembling of single LED needs independent process and assemble space, precision when pasting LED is more secure, the off normal of LED can control at ± 0.1mm, it also avoid conventional method product when pasting LED to have rushed profile and cause the problem that the evenness of product can be poor, relative to traditional handicraft precision controlling be confined to ± 0.15mm has remarkable lifting; Adopt the mode of pasting black and white glue in flakes, compare single LED and paste the shortcoming that black and white glue overcomes contraposition difficulty when single LED is pasted, improve the precision of laminating.
Three, good product consistency, profile mould of the present invention needs to take " design of stepping down ", when Design of Dies there being the place of LED to empty, guarantees to have the edge of a knife and guide pillar to encounter LED, avoids damaging LED during punch extermal form.
Accompanying drawing explanation
Accompanying drawing 1 is the structure chart of the printed board that the manufacture method of a kind of backlight flexible printed board of the present invention prepares.
Embodiment
In order to make those skilled in the art person understand technical scheme of the present invention better, be described in further detail below in conjunction with embodiment and to product of the present invention.
The invention discloses a kind of manufacture method of backlight flexible printed board, comprise the following steps:
A, SMT paste LED: before adopting, operation processing obtains the qualified wiring board of electric performance test, being adopted by the wiring board after electric performance test, the mode of SMT paster is whole in flakes puts up LED, make LED in flakes form linear, each in flakes on comprise some LED.In the LED process mounted in flakes, control LED spacing each other and be greater than 3mm.Described front operation mainly comprises: blanking → baking → boring → heavy copper → copper facing → pad pasting → exposure → video picture → etching → stripping → cleaning → lamination → lamination → turmeric → character → baking → electric performance test.
B, in flakes LED light test: on the wiring board after completing SMT subsides LED, LED lights test in flakes, gets rid of the situation that LED lamp does not in flakes work.During the course, every single sided board product only once need all can detect whether can light, testing efficiency is high.
C, in flakes assembling paste black and white glue: test LED on rear board and adopt the mode of fitting in flakes to stick black and white glue, fixed L ED lamp in flakes being lighted by LED in flakes.Assembling in the process of pasting black and white glue in flakes, only once can need all post black and white glue, the precision of laminating is high.
D, profile are shaped: will being washed into adopting mould to be washed into LED product completing the wiring board after assembling black and white glue in flakes, and requiring that the mould of use guarantees to have the edge of a knife and guide pillar to encounter LED when Design of Dies makes there being the region of LED to empty when punching press.Described LED is in flakes lighted test and is adopted p-wire subtest, the width of described p-wire is 0.15mm, be provided with p-wire between the lines that described LED is in flakes adjacent and hold district, it is parallel that described p-wire accommodation district and described LED in flakes form lines, and the width that described p-wire holds district is 2.0mm.Described wiring board is provided with two p-wires and holds district.
As shown in Figure 1, Fig. 1 is the structure chart of the printed board that the manufacture method of a kind of backlight flexible printed board of the present invention prepares, in FIG, black and white glue 2 is mounted on wiring board 1 in flakes, LED 3 is passed through black and white glue 2 in flakes and is fixed on wiring board 1, is surrounded with p-wire 4. p-wire 4 and LED 3 electric connection around wiring board 1.
The above, be only preferred embodiment of the present invention, not does any pro forma restriction to the present invention; The those of ordinary skill of all industry all can shown in by specification and the above and implement the present invention swimmingly; But all those skilled in the art are not departing within the scope of technical solution of the present invention, disclosed above technology contents can be utilized and make a little change, modify with differentiation equivalent variations, be Equivalent embodiments of the present invention; Meanwhile, all according to substantial technological of the present invention to the change of any equivalent variations that above embodiment is done, modify and differentiation etc., within the protection range all still belonging to technical scheme of the present invention.

Claims (5)

1. a manufacture method for backlight flexible printed board, is characterized in that comprising the following steps:
A, SMT paste LED: the mode of SMT paster is whole in flakes puts up LED being adopted by wiring board after electric performance test, makes LED in flakes form linear, each in flakes on comprise some LED;
B, in flakes LED light test: on the wiring board after completing SMT subsides LED, LED lights test in flakes, gets rid of the situation that LED does not in flakes work
C, in flakes assembling paste black and white glue: test LED on rear board and adopt the mode of fitting in flakes to stick black and white glue, fixed L ED lamp in flakes being lighted by LED in flakes;
D, profile are shaped: adopting mould to be die-cut into single LED product completing the wiring board after assembling black and white glue in flakes, requiring that the mould used guarantees to have the edge of a knife and guide pillar to encounter LED when Design of Dies makes there being the region of LED to empty when punching press.
2. the manufacture method of backlight flexible printed board according to claim 1, is characterized in that: the described LED mounted in flakes spacing is each other greater than 3mm.
3. the manufacture method of backlight flexible printed board according to claim 2, it is characterized in that: described LED is in flakes lighted test and adopted p-wire subtest, the width of described p-wire is 0.15mm, be provided with p-wire between the lines that described LED is in flakes adjacent and hold district, it is parallel that described p-wire accommodation district and described LED in flakes form lines, and the width that described p-wire holds district is 2.0mm.
4. the manufacture method of backlight flexible printed board according to claim 3, is characterized in that: described wiring board is provided with two p-wires and holds districts.
5. the manufacture method of backlight flexible printed board according to claim 4, it is characterized in that: described SMT also comprises front operation before pasting LED, and described front operation mainly comprises: blanking → baking → boring → heavy copper → copper facing → pad pasting → exposure → video picture → etching → stripping → cleaning → lamination → lamination → turmeric → character → baking → electric performance test.
CN201511016052.9A 2015-12-31 2015-12-31 Manufacturing method for backlight flexible printed board Pending CN105578788A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201511016052.9A CN105578788A (en) 2015-12-31 2015-12-31 Manufacturing method for backlight flexible printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201511016052.9A CN105578788A (en) 2015-12-31 2015-12-31 Manufacturing method for backlight flexible printed board

Publications (1)

Publication Number Publication Date
CN105578788A true CN105578788A (en) 2016-05-11

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111867253A (en) * 2020-06-05 2020-10-30 深圳市隆利科技股份有限公司 Soft board miniLED backlight source process

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200846250A (en) * 2007-05-18 2008-12-01 Pyroswift Folding Co Ltd Manufacture method of tag-typed integrated soft circuit board and a structure thereof
WO2010060744A1 (en) * 2008-11-03 2010-06-03 Osram Gesellschaft mit beschränkter Haftung Method for producing a flexible light strip
CN101793356A (en) * 2010-01-12 2010-08-04 广州南科集成电子有限公司 LED lamp circuit board for integrating light source and power supply and manufacture method thereof
CN102724812A (en) * 2012-06-08 2012-10-10 王定锋 Exposed character manufactured by directly welding LEDs on flexible circuit board and method
US20130107526A1 (en) * 2011-10-31 2013-05-02 Atex Co., Ltd. Led mounting circuit board, belt-like flexible led light and led illuminating device using the same
CN103746048A (en) * 2013-12-26 2014-04-23 深圳市国冶星光电子有限公司 Production technology of LED nixie tube connecting board
CN103994348A (en) * 2014-04-26 2014-08-20 王定锋 Slitting injection molding LED identification module and method
CN203868764U (en) * 2014-04-26 2014-10-08 王定锋 Light emitting diode (LED) identification module made from circuit board whole board continuous glue board

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200846250A (en) * 2007-05-18 2008-12-01 Pyroswift Folding Co Ltd Manufacture method of tag-typed integrated soft circuit board and a structure thereof
WO2010060744A1 (en) * 2008-11-03 2010-06-03 Osram Gesellschaft mit beschränkter Haftung Method for producing a flexible light strip
CN101793356A (en) * 2010-01-12 2010-08-04 广州南科集成电子有限公司 LED lamp circuit board for integrating light source and power supply and manufacture method thereof
US20130107526A1 (en) * 2011-10-31 2013-05-02 Atex Co., Ltd. Led mounting circuit board, belt-like flexible led light and led illuminating device using the same
CN102724812A (en) * 2012-06-08 2012-10-10 王定锋 Exposed character manufactured by directly welding LEDs on flexible circuit board and method
CN103746048A (en) * 2013-12-26 2014-04-23 深圳市国冶星光电子有限公司 Production technology of LED nixie tube connecting board
CN103994348A (en) * 2014-04-26 2014-08-20 王定锋 Slitting injection molding LED identification module and method
CN203868764U (en) * 2014-04-26 2014-10-08 王定锋 Light emitting diode (LED) identification module made from circuit board whole board continuous glue board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111867253A (en) * 2020-06-05 2020-10-30 深圳市隆利科技股份有限公司 Soft board miniLED backlight source process

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Effective date of abandoning: 20190215

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