CN111867253A - Soft board miniLED backlight source process - Google Patents

Soft board miniLED backlight source process Download PDF

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Publication number
CN111867253A
CN111867253A CN202010506788.9A CN202010506788A CN111867253A CN 111867253 A CN111867253 A CN 111867253A CN 202010506788 A CN202010506788 A CN 202010506788A CN 111867253 A CN111867253 A CN 111867253A
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CN
China
Prior art keywords
soft board
designing
board
back plate
backlight source
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Application number
CN202010506788.9A
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Chinese (zh)
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CN111867253B (en
Inventor
查显超
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Shenzhen Longli Technology Co Ltd
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Shenzhen Longli Technology Co Ltd
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Priority to CN202010506788.9A priority Critical patent/CN111867253B/en
Publication of CN111867253A publication Critical patent/CN111867253A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494Heating methods for reflowing of solder

Abstract

The invention discloses a miniLED backlight source process for a flexible printed circuit board, which belongs to the technical field of miniLED flexible printed circuit board processing and comprises the following steps: firstly, designing and producing a soft board: designing and producing a soft board; secondly, designing and customizing a steel mesh: designing and customizing a steel mesh; thirdly, back plate forming: designing and producing a back plate; fourthly, adhering the lamp panel glue: coating lamp panel glue on the back plate; fifthly, adhering a soft board: the soft board is adhered to the back board through the lamp board glue; sixthly, solder paste printing, chip binding, nitrogen furnace welding, spray cleaning, fluorescent powder spraying, IC binding, reflow soldering and film material assembling: and finishing the residual process steps of the backlight source, and finally assembling and molding.

Description

Soft board miniLED backlight source process
Technical Field
The invention relates to the technical field of miniLED flexible board processing, in particular to a flexible board miniLED backlight source process.
Background
At present, miniLED display is one of the future development trends of the existing flat panel display, and is strongly supported by various large module manufacturers. Based on the requirement for thinning the miniLED backlight source, the hard board (PCB) miniLED backlight source is difficult to be suitable for handheld equipment due to overlarge thickness; the development work of a Flexible Printed Circuit (FPC) miniLED backlight source is rapidly promoted, but the problem of the production yield of the Flexible Printed Circuit (FPC) miniLED is always puzzled to various manufacturers.
In the prior art, reference may be made to chinese patent application publication No. CN108535917A, which discloses a method for designing an LED backlight and an LED screen, where the method for designing an LED backlight includes the steps of: dividing a backlight area of the LED screen into a plurality of LED units with equal areas which are connected in parallel according to a preset LED screen shape, so that each LED unit corresponds to a plurality of uniformly arranged LED lamps connected in series; and integrally arranging each LED unit on the first flexible substrate, determining routing according to the shape of the LED screen and each LED unit, and cutting the first flexible substrate to obtain the LED integrated module.
The prior art can refer to Chinese invention patent with application publication number CN109732701A, which discloses a narrow-edge FPC punching die and a punching process, and comprises the following steps: A. conveying the FPC soft board welded with the LED lamp beads to a position between an upper template and a lower template of a punching die, and enabling the LED lamp beads to face the lower template; B. positioning the FPC soft board through a positioning column arranged on the lower template; C. placing the FPC soft board on the lower template, and placing the LED lamp beads in the avoiding grooves of the lower template; D. the servo motor drives the upper template to move downwards, so that a punch arranged on the upper template and the lower template are extruded for punching; E. resetting the upper template and finishing punching; F. the lower template removes materials from the FPC soft board; G. taking out the finished product material and placing the finished product material in the blanking area.
The above prior art solutions have the following drawbacks: after the Flexible Printed Circuit (FPC) miniLED lamp panel is cured by dispensing, the lamp panel is seriously warped due to the difference of thermal expansion coefficients of the glue and the FPC, so that the LED on the lamp panel has poor contact, and the product rejection rate is higher.
Disclosure of Invention
The invention aims to provide a soft plate miniLED backlight source process which can avoid the problem of poor products caused by warping of a soft plate.
The technical purpose of the invention is realized by the following technical scheme:
a soft board miniLED backlight source process is characterized by comprising the following steps:
firstly, designing and producing a soft board: designing and producing a soft board;
secondly, designing and customizing a steel mesh: designing and customizing a steel mesh;
thirdly, back plate forming: designing and producing a back plate;
fourthly, adhering the lamp panel glue: coating lamp panel glue on the back plate;
fifthly, adhering a soft board: the soft board is adhered to the back board through the lamp board glue;
sixthly, solder paste printing, chip binding, nitrogen furnace welding, spray cleaning, fluorescent powder spraying, IC binding, reflow soldering and film material assembling: and finishing the residual process steps of the backlight source, and finally assembling and molding.
Through adopting above-mentioned scheme, glue the soft board on the backplate in advance for hardness is equivalent with ordinary hardboard after soft board and backplate adhesion, can avoid the product that the soft board warpage leads to bad. Simultaneously because the soft board carries out the adhesion through lamp plate glue and backplate, so the adhesion mode of soft board and backplate does not need to use the carrier for disposable firm adhesion, has saved the cost of carrier. The product produced by the process has the production yield improved by about 7 percent compared with the product produced by the normal process, and meanwhile, the production cost is effectively reduced.
The invention is further configured to: the first step further comprises the following steps: the soft board is designed without a technical edge.
By adopting the scheme, the process does not need to cut the soft board, so that the process edge does not need to be considered during the design of the soft board, and the cost can be further reduced.
The invention is further configured to: the fourth step also comprises: the lamp panel glue adopts high temperature resistant double faced adhesive tape.
By adopting the scheme, the bonding process of the soft board and the back board in the process is mentioned before high-temperature baking, so the lamp panel glue needs to use the high-temperature-resistant double-sided adhesive tape to prevent the lamp panel glue from losing the bonding effect at high temperature.
The invention is further configured to: a plurality of exhaust holes are formed in the lamp glue, the aperture of each exhaust hole is 1mm to 3mm, and the pitch of the exhaust holes is 6mm to 15 mm.
Through adopting above-mentioned scheme, exhaust hole aperture and interval on the lamp plate glue need can guarantee the zonulae occludens with the backplate for enough little, and exhaust hole aperture and interval on the lamp plate glue can enough guarantee in this within range that the lamp plate glue can glue the jail backplate, can not lead to being difficult to the preparation because aperture and interval are too little again.
The invention is further configured to: step six also includes: the printing mould during the solder paste printing adopts a soft board.
By adopting the scheme, the soft board can be embedded into the back board, if the hard board is used, the shape of the hard board must be matched with the back board, each batch of workpieces needs to be customized with the printing board separately, and the soft board can effectively save cost.
The invention is further configured to: step six also includes: and performing SPI detection after solder paste printing, performing electrical detection after nitrogen furnace welding, performing electrical detection after reflow welding, then performing drive electrical detection, and performing backlight source test after film material assembly.
By adopting the scheme, the product quality can be effectively guaranteed through multiple detection, and defective products are prevented from flowing into the market.
The invention is further configured to: step six also includes: the spraying cleaning adopts water base to clean the workpiece.
By adopting the scheme, the water-based separation capacity is strong, the surface smoothness is better, no pollution is caused, and no harm is caused to human bodies.
The invention is further configured to: the third step is specifically set as follows: designing and producing the back plate integrally formed by the rubber and the iron.
By adopting the scheme, the back plate can be directly produced into the rubber strips to be integrally formed, and the connecting steps are reduced.
The invention is further configured to: and the back plate structure is adopted for positioning during adhesion.
By adopting the scheme, the positioning is more accurate.
In conclusion, the invention has the following beneficial effects:
1. according to the invention, the soft board is adhered to the back plate in advance, so that the hardness of the adhered soft board and back plate is equivalent to that of a common hard board, the product defect caused by the warping of the soft board can be avoided, meanwhile, a carrier is not needed, the cost of the carrier is saved, the production yield of the product generated by the process is improved by about 7% compared with that of a normal process, and meanwhile, the production cost is effectively reduced.
2. Exhaust hole aperture and interval on the lamp plate is glued can enough guarantee that the lamp plate glue can glue the firm backplate at this within range, can not lead to being difficult to the preparation because aperture and interval are too little again.
3. The soft board can be embedded into the back board, so that the flexible printed circuit board is suitable for different back boards, and the cost is effectively saved.
Drawings
Fig. 1 is an overall flowchart of the embodiment.
Detailed Description
Example (b): a soft board miniLED backlight source process comprises the following specific steps:
step one, designing and producing a soft board: the flexible board is designed and produced according to the order requirement, and the flexible board is designed without a technical edge. The process does not need to cut the soft board, so the process edge does not need to be considered when the soft board is designed, and the cost can be further reduced.
Step two, designing and customizing a steel mesh: and designing and customizing a steel net according to the order requirement.
Step three, integrally molding the rubber iron: designing and producing a rubber-iron integrated back plate according to the order requirement;
step four, adhering the lamp panel glue: the lamp panel glue is coated on the back plate, a plurality of exhaust holes are formed in the lamp panel glue, the aperture of each exhaust hole is 1mm, and the hole pitch is 6 mm. The lamp panel glue adopts high temperature resistant double faced adhesive tape.
Step five, soft board adhesion: and the flexible board is adhered to the back board through the lamp board glue, and is positioned by adopting a back board structure positioning mode. The adhesion is ensured to be tight without gaps, and the next step is carried out after the soft board is completely fixed on the back board.
Step six, solder paste printing: and designing a printing template according to the order requirement, wherein the printing template adopts a soft board. After the printing stencil is mounted on the printer, the flexible board is printed by using the printer.
Step seven, SPI detection: and detecting the quality of the serial peripheral interface.
Step eight, chip binding: and binding original parts such as a photonic circuit and the like on the flexible board.
Step nine, welding in a nitrogen furnace: and filling nitrogen into the reflow soldering furnace for nitrogen reflow soldering.
Step ten, electrical property detection: and detecting and analyzing the electrical defects of the workpieces, and screening out unqualified workpieces.
Eleven, spraying and cleaning: and cleaning the workpiece by adopting a water base. The water base has strong separating ability, better surface smoothness, no pollution and no harm to human body.
Step twelve, fluorescent powder spraying: and spraying fluorescent powder on the surface of the workpiece.
Step thirteen, IC binding: the IC chip is bonded to the workpiece using a bonding machine.
Step fourteen, reflow soldering: and re-using the reflow oven to perform reflow soldering on the workpiece.
Step fifteen, electrical property detection: and detecting and analyzing the electrical defects of the workpieces, and screening out unqualified workpieces. .
Sixthly, driving the electrical property detection.
Seventhly, assembling membrane materials: and assembling all parts to finish the production of the miniLED backlight source.
Eighteen, testing a backlight source: and finally, carrying out total test on the backlight source, and leaving the factory after the test is qualified.
According to the invention, the soft board is adhered to the back plate in advance, so that the hardness of the adhered soft board and back plate is equivalent to that of a common hard board, the product defect caused by the warping of the soft board can be avoided, meanwhile, a carrier is not needed, the cost of the carrier is saved, the production yield of the product generated by the process is improved by about 7% compared with that of a normal process, and meanwhile, the production cost is effectively reduced.
The embodiments of the present invention are preferred embodiments of the present invention, and the scope of the present invention is not limited by these embodiments, so: all equivalent changes made according to the structure, shape and principle of the invention are covered by the protection scope of the invention.

Claims (9)

1. A soft board miniLED backlight source process is characterized by comprising the following steps:
firstly, designing and producing a soft board: designing and producing a soft board;
secondly, designing and customizing a steel mesh: designing and customizing a steel mesh;
thirdly, back plate forming: designing and producing a back plate;
fourthly, adhering the lamp panel glue: coating lamp panel glue on the back plate;
fifthly, adhering a soft board: the soft board is adhered to the back board through the lamp board glue;
sixthly, solder paste printing, chip binding, nitrogen furnace welding, spray cleaning, fluorescent powder spraying, IC binding, reflow soldering and film material assembling: and finishing the residual process steps of the backlight source, and finally assembling and molding.
2. The process of claim 1, wherein the first step further comprises: the soft board is designed without a technical edge.
3. The process of claim 1, wherein the fourth step further comprises: the lamp panel glue adopts high temperature resistant double faced adhesive tape.
4. The process of claim 3, wherein the fourth step further comprises: a plurality of exhaust holes are formed in the lamp glue, the aperture of each exhaust hole is 1mm to 3mm, and the pitch of the exhaust holes is 6mm to 15 mm.
5. The process of claim 1, wherein the sixth step further comprises: the printing mould during the solder paste printing adopts a soft board.
6. The process of claim 1, wherein the sixth step further comprises: and performing SPI detection after solder paste printing, performing electrical detection after nitrogen furnace welding, performing electrical detection after reflow welding, then performing drive electrical detection, and performing backlight source test after film material assembly.
7. The process of claim 1, wherein the sixth step further comprises: the spraying cleaning adopts water base to clean the workpiece.
8. The process for manufacturing a soft plate miniLED backlight source as claimed in claim 1, wherein the third step is specifically configured as follows: designing and producing the back plate integrally formed by the rubber and the iron.
9. The process of claim 1, wherein the step five further comprises: and the back plate structure is adopted for positioning during adhesion.
CN202010506788.9A 2020-06-05 2020-06-05 Soft board miniLED backlight source process Active CN111867253B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113437204A (en) * 2021-05-18 2021-09-24 深圳市隆利科技股份有限公司 Lamp panel preparation method

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Publication number Priority date Publication date Assignee Title
CN102878495A (en) * 2012-10-12 2013-01-16 北京京东方光电科技有限公司 Backlight and manufacturing method and display device for backlight
WO2014180667A1 (en) * 2013-05-07 2014-11-13 Osram Gmbh Flexible printed circuit board
CN105578788A (en) * 2015-12-31 2016-05-11 江西凯强实业有限公司 Manufacturing method for backlight flexible printed board
CN105578728A (en) * 2016-01-29 2016-05-11 上海温良昌平电器科技股份有限公司 One-piece aluminum flexible circuit board with support layer switching function and preparation technology
CN206380189U (en) * 2016-12-30 2017-08-04 湖南省方正达电子科技有限公司 A kind of production system of the LED flexible single-sided wiring board of random length
CN109445181A (en) * 2018-12-14 2019-03-08 深圳创维-Rgb电子有限公司 A kind of packaging technology of display module
CN110061116A (en) * 2019-04-29 2019-07-26 惠州市华星光电技术有限公司 Mini-LED backlight and preparation method thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102878495A (en) * 2012-10-12 2013-01-16 北京京东方光电科技有限公司 Backlight and manufacturing method and display device for backlight
WO2014180667A1 (en) * 2013-05-07 2014-11-13 Osram Gmbh Flexible printed circuit board
CN105578788A (en) * 2015-12-31 2016-05-11 江西凯强实业有限公司 Manufacturing method for backlight flexible printed board
CN105578728A (en) * 2016-01-29 2016-05-11 上海温良昌平电器科技股份有限公司 One-piece aluminum flexible circuit board with support layer switching function and preparation technology
CN206380189U (en) * 2016-12-30 2017-08-04 湖南省方正达电子科技有限公司 A kind of production system of the LED flexible single-sided wiring board of random length
CN109445181A (en) * 2018-12-14 2019-03-08 深圳创维-Rgb电子有限公司 A kind of packaging technology of display module
CN110061116A (en) * 2019-04-29 2019-07-26 惠州市华星光电技术有限公司 Mini-LED backlight and preparation method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113437204A (en) * 2021-05-18 2021-09-24 深圳市隆利科技股份有限公司 Lamp panel preparation method

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