JP6547799B2 - Imaging unit and imaging apparatus - Google Patents

Description

  The present invention relates to an imaging unit and an imaging device.

A digital camera is known in which the upper end surface of a ceramic package having a solid-state imaging device is attached to a printed circuit board of a camera module.
[Prior art document]
[Patent Document]
[Patent Document 1] Japanese Patent Application Publication No. 2007-019243

  Depending on the position where the mounting portion for mounting the structure is provided in the imaging unit, the internal space of the imaging device may not be effectively used.

  In the first aspect of the present invention, an imaging unit includes an imaging chip, a first substrate on which the imaging chip is mounted, and an enclosing member provided on the first substrate and surrounding the imaging chip. The surrounding member is located at a position outside the first substrate in a short side direction of the imaging chip from a side of the first substrate along a first long side of the imaging chip, It has an attaching part for attaching an enclosure member.

  In a second aspect of the present invention, an imaging device includes the imaging unit described above.

  Note that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a subcombination of these feature groups can also be an invention.

FIG. 6 is a cross-sectional view schematically showing an imaging unit 40 and a body portion 60 of the single-lens reflex camera. The enlarged view of the A section of FIG. 1 is shown. The front view which looked at the imaging unit 40 from the z-axis plus direction is shown. The front view which looked at the imaging unit 40 from the z-axis minus direction is shown. The perspective view of imaging unit 40 is shown. FIG. 7 shows an exploded perspective view of the imaging unit 40. It is a rear elevation view at the time of seeing imaging unit 40 and body part 60 from a position of the direction of the z-axis minus. An example of the relationship between area ratio R and the temperature of the imaging chip 100 is shown. An example of a board | substrate structure of the mounted substrate 120 is shown typically. Another example of the board | substrate structure of the mounted substrate 120 is shown typically. The imaging unit 1032 as a modification of the imaging unit 40 is shown. The top view which looked at the imaging unit 1032 from the position of z axial plus direction, and a sectional view showing AA section of imaging unit 1032 are shown. The top view which looked at the attachment member 1010 and the surrounding member 1040 from the position of the z-axis plus direction is shown. An arrangement example of the heat sinks 1050 and 1060 is shown. An example of the surrounding member 1440 as a modification of the surrounding member 1040 is shown. An example of the surrounding member 1540 as a modification of the surrounding member 1440 is shown. An example of the surrounding member 1640 as a modification of the surrounding member 1040 is shown. An example of the surrounding member 1740 as a modification of the surrounding member 1640 is shown. An example of the surrounding member 1840 as a modification of the surrounding member 1040 is shown. FIG. 20 is a cross-sectional view schematically showing an imaging unit 2040 and a body 60 of another form. FIG. 16 shows a perspective view of an imaging unit 2040.

  Hereinafter, the present invention will be described through the embodiments of the invention, but the following embodiments do not limit the invention according to the claims. Moreover, not all combinations of features described in the embodiments are essential to the solution of the invention.

  FIG. 1 is a cross-sectional view schematically showing an imaging unit 40 and a body portion 60 of a single-lens reflex camera which is an example of the imaging device according to the present embodiment. FIG. 2 shows an enlarged view of a part A of FIG.

  The body unit 60 is an example of a structure in a single-lens reflex camera. The body portion 60 has a body side mount 26 on which the lens unit is mounted. The lens unit is an interchangeable lens and is attachable to and detachable from the body side mount 26. When the lens unit is mounted on the body side mount 26, the subject light flux enters the imaging unit 40 through the optical system arranged in the lens unit.

  In the present embodiment, the direction along the optical axis AX of the optical system arranged in the lens unit is defined as the z-axis direction. That is, the direction in which the subject luminous flux is incident on the imaging chip 100 of the imaging unit 40 is defined as the z-axis direction. Specifically, the direction in which the subject light flux is incident is defined as the z-axis minus direction, and the opposite direction is defined as the z-axis plus direction. The longitudinal direction of the imaging chip 100 is defined as the x-axis direction. The lateral direction of the imaging chip 100 is defined as the y-axis direction. Specifically, the x-axis direction and the y-axis direction are determined in the directions illustrated in FIG. The x-axis, y-axis, and z-axis are right-handed orthogonal coordinate systems. For convenience of explanation, the z-axis plus direction may be referred to as the front, the front, or the like. Also, the z-axis minus direction may be referred to as rear, rear side or the like. Also, the y-axis plus direction may be referred to as upper, upper, upper, etc. The y-axis minus direction may be called the lower side, the lower side, the lower side or the like.

  The body portion 60 has a mirror unit 31 at a position in the negative z-axis direction from the body side mount 26. The mirror unit 31 is supported by the body portion 60. The mirror unit 31 includes a main mirror 32 and a sub mirror 33. The main mirror 32 is rotatably supported between a position where the subject light flux emitted by the lens unit has entered into the light path of the subject light flux and a position where it is retracted from the light path of the subject light flux. The sub mirror 33 is rotatably supported with respect to the main mirror 32. The sub mirror 33 enters the entry position with the main mirror 32 and retracts with the main mirror 32 to the retracted position. As described above, the mirror unit 31 assumes an entering state in which the subject light flux has entered the light path, and a retracted state in which the subject light flux is retracted.

  When the mirror unit 31 is in the entering state, part of the subject light flux incident on the main mirror 32 is reflected by the main mirror 32 and is guided to a pentaprism 82 described later. The pentaprism 82 is provided at the position of the body portion 60 in the y-axis plus direction. The subject light flux guided to the pentaprism 82 is observed from a finder window 86 described later through a finder optical system in a finder barrel 84 described later.

  When the mirror unit 31 is in the retracted state, light fluxes other than the subject light flux reflected by the main mirror 32 among the subject light fluxes incident on the main mirror 32 are incident on the sub mirror 33. Specifically, the main mirror 32 has a half mirror area, and the subject light flux transmitted through the half mirror area of the main mirror 32 enters the sub mirror 33. The sub mirror 33 reflects the light beam incident from the half mirror region toward the focus detection unit 70. The focus detection unit 70 has a focus detection sensor for receiving an incident light beam and detecting a focus state. The signal output from the focus detection sensor is output to the MPU provided on the main substrate 180 of the imaging unit 40. The MPU detects the focus state based on the input signal.

  The shutter unit 38 and the imaging unit 40 are attached to the body portion 60. The shutter unit 38 is located in the negative z-axis direction from the mirror unit 31. The imaging unit 40 is located in the negative z-axis direction from the shutter unit 38. When the mirror unit 31 is in the retracted state and the shutter unit 38 is in the open state, the subject light flux reaches the imaging surface of the imaging chip 100 of the imaging unit 40.

  The imaging unit 40 is configured to include the imaging chip 100, the mounting substrate 120, the surrounding member 140, and the cover glass 160.

  The imaging chip 100 is a CMOS image sensor or a CCD image sensor. The imaging chip 100 is configured to include an imaging area formed in a central portion of the imaging chip 100 and an area located around the imaging area. In the imaging area of the imaging chip 100, an imaging surface is formed by a plurality of photoelectric conversion elements that photoelectrically convert object light. The peripheral region of the imaging chip 100 includes a processing circuit that performs signal processing on pixel signals obtained by photoelectric conversion in the photoelectric conversion element. The processing circuit includes an AD conversion circuit that converts an input pixel signal into a digital signal.

  The imaging chip 100 is mounted on the mounting substrate 120. The mounting substrate 120 has a mounting substrate side first main surface 621 and a mounting substrate side second main surface 622 opposite to the mounting substrate side first main surface 621. The mounting substrate side first main surface 621 is located in the z-axis plus direction from the mounting substrate side second main surface 622. The imaging chip 100 is mounted on the mounting substrate side first main surface 621 of the mounting substrate 120.

  The imaging chip 100 is mounted on a mounting substrate 120 by COB (Chip On Board). The imaging chip 100 is electrically connected to the mounting substrate 120 by, for example, wire bonding. The pixel signal converted into the digital signal by the AD conversion circuit of the imaging chip 100 is output to the mounting substrate 120 via, for example, a wire. The imaging chip 100 is bonded to the mounting substrate 120 with an adhesive, for example. Specifically, the imaging chip 100 is bonded to the mounting substrate side first main surface 621 of the mounting substrate 120 by, for example, a thermosetting adhesive. The imaging chip 100 may be mounted on the mounting substrate 120 by flip chip mounting. The imaging chip 100 is electrically connected to the mounting substrate 120 by, for example, a bump.

  The surrounding member 140 is disposed on the mounting substrate 120. The surrounding member 140 surrounds the imaging chip 100. The surrounding member 140 is disposed on the mounting substrate side first main surface 621 of the mounting substrate 120. The surrounding member 140 is fixed to the mounting substrate 120. The surrounding member 140 is bonded to the mounting substrate 120 with an adhesive, for example. Specifically, the surrounding member 140 is adhered to the mounting substrate side first main surface 621 of the mounting substrate 120 by, for example, a thermosetting adhesive. The surrounding member 140 has an opening 148. The imaging chip 100 is accommodated in the opening 148. The opening 148 is formed in the central portion of the surrounding member 140 in the xy plane.

  The cover glass 160 is disposed on the surrounding member 140. The cover glass 160 is provided on the surrounding member side first surface 641 of the surrounding member 140. The cover glass 160 is bonded to the surrounding member 140 with an adhesive. Specifically, the cover glass 160 is adhered to the surrounding member side first surface 641 of the surrounding member 140 by, for example, a thermosetting adhesive.

  The surrounding member 140 is attached to the bracket 150 by a plurality of screws including a screw 241 and a screw 242. The bracket 150 is attached to the body portion 60 by a plurality of screws including a screw 251 and a screw 252.

  FIG. 3 is a front view of the imaging unit 40 fixed to the bracket 150 as viewed from the z-axis positive direction toward the z-axis negative direction. FIG. 4 shows a front view of the imaging unit 40 fixed to the bracket 150 as viewed from the z-axis negative direction. FIG. 5 shows a perspective view of the imaging unit 40 fixed to the bracket 150. As shown in FIG. FIG. 6 shows an exploded perspective view of the imaging unit 40 and the bracket 150. FIG. 7 is a rear view of the imaging unit 40 and the body 60 as viewed from the position in the negative z-axis direction.

  The imaging chip 100 has a rectangular shape in the xy plane. The imaging chip 100 has a first short side 401 and a second short side 402, and a first long side 403 and a second long side 404. The first short side 401 is located in the negative x-axis direction from the second short side 402. The first long side 403 is located in the y-axis plus direction from the second long side 404.

  The mounting substrate 120 has a rectangular shape in the xy plane. The mounting substrate 120 includes a mounting substrate side first side 421 along the first short side 401 of the imaging chip 100, a mounting substrate side second side 422 along the second short side 402 of the imaging chip 100, and a second side 422 of the imaging chip 100. A mounting substrate side third side 423 along the one long side 403 and a mounting substrate side fourth side 424 along the second long side 404 of the imaging chip 100 are provided. The mounting substrate side first side 421 is substantially parallel to the first short side 401 of the imaging chip 100. The mounting substrate side second side 422 is substantially parallel to the second short side 402 of the imaging chip 100. The mounting substrate side third side 423 is substantially parallel to the first long side 403 of the imaging chip 100. The mounting substrate side fourth side 424 is substantially parallel to the second long side 404 of the imaging chip 100. The mounting substrate side first side 421 is located in the x axis negative direction from the mounting substrate side second side 422. The mounting substrate side third side 423 is located in the y-axis plus direction from the mounting substrate side fourth side 424.

  The surrounding member 140 includes the surrounding member side first surface 641, the surrounding member side second surface 642, the surrounding member side third surface 643, the surrounding member side fourth surface 644, and the surrounding member side. It has a fifth surface 645 and a surrounding member side sixth surface 646. The surrounding member side sixth surface 646 forms an opening 148. The imaging chip 100 is encircled by the encircling member side sixth surface 646. The surrounding member side sixth surface 646 has a surface substantially parallel to the yz plane and a surface substantially parallel to the xz plane.

  The surrounding member side first surface 641 is a surface to which the cover glass 160 is adhered. The end of the surrounding member side first surface 641 is in contact with the end of the surrounding member side sixth surface 646. The surrounding member first surface 641 is formed along the outer edge of the surrounding member side sixth surface 646. The surrounding member side first surface 641 is substantially parallel to the xy plane.

  The end of the surrounding member side second surface 642 is in contact with the end of the surrounding member side first surface 641. The surrounding member side second surface 642 is formed along the outer edge of the surrounding member side first surface 641. The surrounding member side second surface 642 has a surface substantially parallel to the xz plane.

  The end of the surrounding member side third surface 643 is in contact with the end of the surrounding member side second surface 642. The surrounding member side third surface 643 is substantially parallel to the xy plane, and substantially parallel to the surrounding member side first surface 641.

  The end of the surrounding member side fourth surface 644 is in contact with the end of the surrounding member side third surface 643. The surrounding member side fourth surface 644 is formed along the outer edge of the surrounding member side third surface 643. The surrounding member side fourth surface 644 has a surface parallel to the xz plane.

  The end of the surrounding member side fifth surface 645 is in contact with the end of the surrounding member side fourth surface 644. The surrounding member side fifth surface 645 is a surface formed along the outer edge of the surrounding member side fourth surface 644. The surrounding member side fifth surface 645 is a surface substantially parallel to the xy plane. The surrounding member side fifth surface 645 is a surface substantially parallel to the surrounding member side first surface 641 and the surrounding member side third surface 643. The surrounding member side fifth surface 645 is a surface adhered to the mounting substrate side first main surface 621 of the mounting substrate 120. The end of the surrounding member side fifth surface 645 is in contact with the end of the surrounding member side sixth surface 646. The surrounding member side fifth surface 645 is a surface formed along the outer edge of the surrounding member side sixth surface 646.

  The imaging unit 40 is attached to the body 60 via the surrounding member 140. Specifically, the imaging unit 40 is attached to the body 60 by attaching the surrounding member 140 to the bracket 150 attached to the body 60.

  The surrounding member 140 has a mounting hole 141, a mounting hole 142, and a mounting hole 143 as a mounting portion. The three mounting holes 141, the mounting holes 142, and the mounting holes 143 are holes penetrating from the surrounding member side third surface 643 to the surrounding member side fifth surface 645, respectively. The mounting hole 141, the mounting hole 142 and the mounting hole 143 are all used to mount the surrounding member 140 on the bracket 150. The surrounding member 140 is fixed to the bracket 150 by being screwed through the mounting hole 141, the mounting hole 142 and the mounting hole 143. The surrounding member 140 is fixed so that a part of the third surrounding surface 643 of the surrounding member 140 is in contact with the bracket 150.

  The mounting hole 141 is formed in the y-axis minus direction side from the position corresponding to the mounting substrate side fourth side 424 in the surrounding member 140. The mounting hole 142 and the mounting hole 143 are formed in the surrounding member 140 on the side of the mounting substrate side third side 423 in the y-axis plus direction. The mounting hole 142 and the mounting hole 143 are formed along the x-axis direction. The mounting hole 142 and the mounting hole 143 are formed at the same position in the y-axis direction. In other words, the mounting holes 141, the mounting holes 142, and the mounting holes 143 are not formed between the position corresponding to the third mounting board side 423 in the y-axis direction and the position corresponding to the fourth mounting board side 424 .

  Furthermore, the mounting holes 141, the mounting holes 142, and the mounting holes 143 are formed between the position corresponding to the mounting substrate side first side 421 in the x-axis direction and the position corresponding to the mounting substrate side second side 422. That is, the mounting hole 141, the mounting hole 142, and the mounting hole 143 are not formed on the x-axis minus direction side from the position corresponding to the mounting substrate side first side 421, but from the position corresponding to the mounting substrate side second side 422 It is not formed on the x-axis plus direction side. As described above, the mounting substrate 120 is located between the mounting hole 141 and the mounting hole 142 in the y-axis direction, and is located between the mounting hole 141 and the mounting hole 143 in the y-axis direction.

  The surrounding member 140 has a positioning hole 145 and a positioning hole 146. Each of the positioning hole 145 and the positioning hole 146 is a hole that passes from the surrounding member side third surface 643 to the surrounding member side fifth surface 645. The positioning holes 145 and the positioning holes 146 are both used to position the surrounding member 140 with respect to the bracket 150. The positioning hole 146 is formed by a fitting hole. The positioning hole 145 is formed by an elongated hole so that the position can be finely adjusted at the time of assembly.

  The surrounding member 140 is positioned on the bracket 150 using the positioning holes 145 and the positioning holes 146. For example, the positioning pin provided on the bracket 150 is inserted into the positioning hole 145, and the positioning pin provided on the bracket 150 is fitted to the positioning hole 146, whereby the surrounding member 140 and the bracket 150 are positioned.

  The surrounding member 140 is fixed by screws in a state of being positioned with respect to the bracket 150. Specifically, the surrounding member 140 and the bracket 150 are fastened by inserting the screw 241 from the z-axis negative direction toward the z-axis positive direction into the mounting hole 141 and the mounting hole 351.

  The surrounding member 140 and the bracket 150 are fastened by inserting the screw 242 from the z-axis minus direction toward the z-axis plus direction through the mounting hole 142 and the mounting hole 352. The surrounding member 140 and the bracket 150 are fastened by inserting the screw 243 from the z-axis minus direction toward the z-axis plus direction through the mounting hole 143 and the mounting hole 353. Thus, the surrounding member 140 is fixed to the bracket 150 by the three screws 241, the screws 242 and the screws 243. As will be described later, the bracket 150 is fixed to the body portion 60 in a positioned state. Thus, the imaging unit 40 is positioned on the body portion 60 via the bracket 150.

  The bracket 150 has a first major surface 651 and a second major surface 652 opposite to the first major surface 651. As a bracket side attachment part, it has an attachment hole 151, an attachment hole 152, and an attachment hole 153. The mounting hole 151, the mounting hole 152, and the mounting hole 153 are all holes penetrating from the first main surface 651 to the second main surface 652 of the bracket 150. The mounting holes 151, 152 and 153 are all used to mount the bracket 150 on the body 60. The bracket 150 is attached to the body portion 60 by being screwed through the attachment hole 151, the attachment hole 152 and the attachment hole 153. The bracket 150 is fixed such that a portion of the first major surface 651 of the bracket 150 is in contact with the body portion 60.

  The bracket 150 has positioning holes 155 and positioning holes 156. Each of the positioning holes 155 and the positioning holes 156 is a hole penetrating from the first major surface 651 to the second major surface 652. Positioning holes 155 and positioning holes 156 are both utilized to position bracket 150 relative to body portion 60. The positioning hole 156 is formed by a fitting hole. The positioning hole 155 is formed by a long hole so that the position can be finely adjusted at the time of assembly.

  The bracket 150 is positioned on the body portion 60 using the positioning holes 155 and the positioning holes 156. For example, a positioning pin provided on the body portion 60 is inserted into the positioning hole 155 and fitted in the positioning hole 156 provided on the body portion 60, whereby the bracket 150 and the body portion 60 are positioned.

  The bracket 150 is fixed by screws in a state of being positioned with respect to the body portion 60. Specifically, the bracket 150 and the body portion 60 are fastened by inserting the screw 251 from the z-axis minus direction toward the z-axis plus direction into the attachment hole 151 and the attachment hole 61. The bracket 150 and the body portion 60 are fastened by inserting the screw 252 from the z-axis minus direction toward the z-axis plus direction through the mounting hole 152 and the mounting hole 62. The bracket 150 and the body portion 60 are fastened by inserting the screw into the mounting hole 143 and the mounting hole 63 from the z-axis minus direction toward the z-axis plus direction. Thus, the bracket 150 is attached to the body 60 by three screws.

  The spring 68 is provided between the body portion 60 and the first major surface 651 with the screw 251 inserted therethrough. The imaging unit 40 is biased in the z-axis negative direction with respect to the body portion 60. Therefore, by adjusting the tightening amount of the screw 251, the flange back which is the distance from the contact surface where the body side mount 26 and the lens unit contact to the imaging surface of the imaging chip 100 is adjusted.

  The cover glass 160 is used to seal the imaging chip 100. The cover glass 160 is bonded to the surrounding member 140 so as to cover the opening 148 of the surrounding member 140. The cover glass 160 forms a sealed space together with the surrounding member 140 and the mounting substrate 120. As a material of the cover glass 160, borosilicate glass, quartz glass, non-alkali glass, heat-resistant glass etc. can be used, for example. The thickness of the cover glass 160 is, for example, 0.5 mm to 0.8 mm. The cover glass 160 is an example of a translucent member having translucency. Besides the glass, quartz or the like can be applied as the translucent member.

  Thus, a sealed space is formed by the mounting substrate 120, the surrounding member 140, and the cover glass 160. The imaging chip 100 is disposed in a sealed space formed by the mounting substrate 120, the surrounding member 140, and the cover glass 160. This makes the imaging chip 100 less susceptible to the external environment. For example, the imaging chip 100 is less susceptible to the moisture present outside the sealed space. Therefore, deterioration of the imaging chip 100 can be prevented.

  The thickness of the surrounding member 140 will be described. The thickness of the surrounding member 140 is designed from various viewpoints such as the viewpoint of securing the distance between the imaging surface of the imaging chip 100 and the cover glass 160, the viewpoint of the rigidity of the surrounding member 140, and the like. The amount of reflection on an image caused by foreign matter or the like adhering to the cover glass 160 can be reduced as the cover glass 160 moves away from the imaging surface of the imaging chip 100. The distance between the imaging surface of the imaging chip 100 and the cover glass 160 is preferably long from the viewpoint of reducing the influence of the reflection. Therefore, it is preferable that the thickness of the surrounding member 140 be larger. Reflection is also affected by the size of the imaging chip 100. For example, since the depth of field is deeper as the size of the imaging chip 100 is smaller, the effect is likely to appear when the distance between the imaging surface of the imaging chip 100 and the cover glass 160 is short. Therefore, it is preferable that the thickness of the surrounding member 140 be larger.

  The surrounding member 140 is a third surrounding surface 643 located on the surrounding member side first surface 641, the surrounding member side second surface 642, and the surrounding member side first surface 641 in the z-axis negative direction. And have a step formed by The surrounding member 140 is attached to the bracket 150 on the third surrounding surface 643 of the surrounding member 140. Without changing the flange back which is the distance from the contact surface where the body side mount 26 contacts the lens unit to the imaging surface of the imaging chip 100, the space for providing the spring 68 for flange back adjustment described above is a bracket 150 and the body It can be secured between itself and the part 60. Furthermore, an appropriate distance can be secured between the imaging surface of the imaging chip 100 and the cover glass 160.

  A penta prism is provided at a position in the y-axis plus direction of the body portion 60. The finder barrel 84 is positioned relative to the pentaprism. The finder barrel 84 has a finder optical system provided at a position in the negative z-axis direction of the pentaprism. The subject light flux guided to the pentaprism is observed as a subject image from the finder window 86 through the finder optical system in the finder barrel unit 84. An accessory shoe 89 is provided at the position of the finder barrel 84 in the positive y-axis direction. The accessory shoe 89 is mounted with an external device such as a light emitting device separate from the imaging device, a sound collecting device separate from the imaging device, and a finder device separate from the imaging device. The finder barrel 84 and the accessory shoe 89 are located in the y-axis plus direction from the imaging unit 40.

  The mounting hole 62 is located on the side of the finder barrel 84 in the negative x-axis direction. The mounting hole 63 is located on the side of the finder barrel 84 in the positive x-axis direction. The mounting hole 152 and the mounting hole 153 of the bracket 150 are located on the y-axis positive direction side of the opening 350. The bracket 150 has a recess 358 between the mounting hole 152 and the mounting hole 153. Therefore, the bracket 150 can be attached to the body 60 so that the finder barrel 84 does not interfere with the bracket 150. The mounting hole 61 is located on the side of the opening 350 in the negative y-axis direction. The mounting hole 61 is located between the mounting hole 62 and the mounting hole 63 in the x-axis direction. Specifically, the mounting hole 61 is located midway between the mounting hole 62 and the mounting hole 63 in the x-axis direction. Therefore, the angle of the imaging unit 40 with respect to the optical axis AX can be adjusted so that the imaging surface of the imaging chip 100 is perpendicular to the optical axis AX.

  The main substrate 180 is provided on the side of the mounting substrate 120 in the negative z-axis direction. The main substrate 180 has a mounting hole 181, a mounting hole 182, a mounting hole 183 and a mounting hole 184 as a mounting portion for mounting the main substrate 180 to a single-lens reflex camera.

  The attachment holes 181 and the attachment holes 182 are used to attach the main substrate 180 to a terminal cover member that covers an external input / output terminal such as a USB terminal. The main substrate 180 is screwed to the terminal cover member using the mounting holes 181 and the mounting holes 182. The mounting hole 183 and the mounting hole 184 are used to mount the main substrate 180 to a battery housing member for housing a battery for supplying power supplied to the imaging chip 100 or the like. Main substrate 180 is screwed to the battery housing member using mounting holes 183 and mounting holes 184. The battery housing member is located on the side of the mounting substrate 120 in the positive x-axis direction. The terminal cover member is located closer to the x-axis in the negative direction than the mounting substrate 120.

  The flexible printed circuit 23 is connected to the mounting substrate 120 and the main substrate 180. The flexible printed circuit 23 transmits a signal between the imaging chip 100 and the main substrate 180. For example, the flexible printed circuit 23 transmits an image signal output from the imaging chip 100 from the mounting substrate 120 to the main substrate 180. The flexible printed board 23 transmits a control signal for controlling the driving of the imaging chip 100 from the main board 180 to the mounting board 120.

  The mounting substrate 120 is provided with a mounting substrate connector 21 to which one end of the flexible printed substrate 23 is connected. The mounting substrate side connector 21 is provided on the mounting substrate side second main surface 622.

  The main board 180 is provided with a main board connector 22 to which the other end of the flexible printed board 23 is connected. The main substrate 180 has a first major surface 681 and a second major surface 682 opposite to the first major surface 681. The second major surface 682 is located on the z-axis negative direction side. The main substrate connector 22 is provided on the second main surface 682 of the main substrate 180.

  The main substrate 180 is provided with an AISC 52. The AISC 52 is provided on the second major surface 682. A signal from the imaging chip 100 is output to the ASIC 52 via the flexible printed circuit board 23. The ASIC 52 processes a signal acquired from the imaging chip 100. The ASIC 52 is an example of an electronic circuit that acquires a signal generated by the imaging chip 100 from the mounting substrate 120 and processes the signal.

  The ASIC 52 generates image data for display and image data for recording based on the signal acquired from the imaging chip 100. The image data for recording generated by the ASIC 52 is recorded on a recording medium attached to the single-lens reflex camera. The recording medium is configured to be removable from the camera body 30. The main substrate 180 is provided with a slot 59 for mounting a recording medium. The slot 59 may be a memory card slot for mounting a memory card as an example of a recording medium for recording image data. The slot 59 is provided on the first major surface 681. The ASIC 52 and the slot 59 are located on the side of the mounting substrate 120 in the positive x-axis direction. In addition to the main substrate connector 22 and the ASIC 52, electronic circuits such as an MPU for controlling the entire single-lens reflex camera are mounted on the second main surface 682 of the main substrate 180.

  The main substrate 180 has a terminal attachment portion for fixing the above-described external input / output terminal. The terminal attachment portion is provided on the first main surface 681 of the main substrate 180. The terminal mounting portion is located on the side of the mounting substrate 120 in the negative x-axis direction. Therefore, the external input / output terminal is located on the side of the mounting substrate 120 in the negative x-axis direction.

  The main substrate 180 follows the main substrate side first side 481 along the mounting substrate side first side 421, the main substrate side second side 482 along the mounting substrate side second side 422, and the mounting substrate side fourth side 424. The main substrate side third side 483 and the main substrate side fourth side 484 are provided. The main substrate side first side 481 is substantially parallel to the mounting substrate side first side 421. The main substrate side first side 481 is located near the mounting substrate side first side 421. The main substrate side second side 482 is substantially parallel to the mounting substrate side second side 422. The main substrate side second side 482 is located near the mounting substrate side second side 422. The main substrate side third side 483 and the main substrate side fourth side 484 are substantially parallel to the mounting substrate side fourth side 424.

  The main substrate side first side 481 is located on the x axis negative direction side of the mounting substrate side first side 421. The main substrate side second side 482 is located on the x-axis plus direction side with respect to the mounting substrate side second side 422. The main substrate side third side 483 and the main substrate side fourth side 484 are located on the y axis minus direction side with respect to the mounting substrate side fourth side 424. The position of the main substrate side third side 483 in the y-axis direction substantially coincides with the position of the main substrate side fourth side 484 in the y-axis direction.

  The main substrate side third side 483 extends in the x axis negative direction from the end portion on the y axis negative direction side of the main substrate side first side 481. The end portion on the x-axis plus direction side in the main substrate side third side 483 is located in the x-axis minus direction from the screw 241.

  The main substrate 180 extends from the end on the main substrate side third side 483 in the x-axis positive direction to the main substrate side fifth side 485 extending in the y-axis negative direction, and from the main substrate side fifth side 485 to the x-axis positive direction And a main substrate side seventh side 487 extending in the y-axis plus direction from an end on the x-axis plus direction side in the main substrate side sixth side 486. The end portion on the x-axis plus direction side in the main substrate side sixth side 486 is located in the x-axis plus direction from the positioning hole 145. The end portion on the x-axis plus direction side in the main substrate side sixth side 486 is located on the x-axis minus direction side with respect to the mounting substrate side second side 422.

  The main substrate side fourth side 484 extends in the x-axis positive direction from an end portion on the y-axis positive direction side of the main substrate side seventh side 487. The main substrate side second side 482 extends in the y-axis positive direction from an end portion on the x-axis positive direction side of the main substrate side fourth side 484.

  Main substrate 180 extends from the end of main substrate side first side 481 in the y-axis positive direction to the main substrate side eighth side 488 extending in the x-axis negative direction and the y-axis positive direction at main substrate side second side 482 It further has a main substrate side ninth side 489 extending from the side end in the x-axis plus direction. Among the sides of the main substrate 180, the main substrate side eighth side 488 and the main substrate side ninth side 489 are located on the most positive direction side in the y-axis direction.

  In the mounting substrate 120, the mounting substrate side connector 21 has a long side along the mounting substrate side first side 421. The long side of the mounting board connector 21 may be parallel to the mounting board first side 421. The mounting substrate connector 21 is located on the x-axis minus direction side of the first short side 401 of the imaging chip 100. The mounting substrate side connector 21 is provided in the vicinity of the mounting substrate side first side 421.

  In the main substrate 180, the main substrate connector 22 has a long side along the main substrate side first edge 481. The long side of the main substrate connector 22 may be parallel to the main substrate side first edge 481. The main substrate connector 22 is provided in the vicinity of the main substrate side first side 481. The main substrate connector 22 is provided at a position facing the mounting substrate connector 21. The mounting substrate side connector 21 is provided on the mounting substrate 120 so that the insertion port of the mounting substrate side connector 21 and the insertion port of the main substrate side connector 22 face each other, and the main substrate side connector 22 is provided on the main substrate 180. One end of the flexible printed board 23 is inserted into the insertion port of the mounting board connector 21. The other end of the flexible printed circuit 23 is inserted into the insertion port of the main substrate connector 22. The first main surface 681 and the second main surface 682 of the main substrate 180 have sides substantially parallel to the mounting substrate side first main surface 621 and the mounting substrate side first side 421.

  The mounting hole 141 is formed in the y-axis minus direction side from the position corresponding to the mounting substrate side fourth side 424 in the surrounding member 140. The mounting hole 142 and the mounting hole 143 are formed in the surrounding member 140 on the side of the mounting substrate side third side 423 in the y-axis plus direction. The mounting holes 141, the mounting holes 142, and the mounting holes 143 are formed between the position corresponding to the mounting substrate side first side 421 and the position corresponding to the mounting substrate side second side 422 in the x-axis direction. Therefore, the main substrate side first side 481 can be extended to the vicinity of the mounting substrate side first side 421. Since the main board side first side 481 can be positioned in the vicinity of the mounting board side first side 421, the main board side connector 22 can be provided in the vicinity of the mounting board side connector 21. Therefore, the length of the transmission path of the signal between the imaging chip 100 and the ASIC 52 can be shortened.

  In the imaging unit 40, the first main surface 681 and the second main surface 682 of the main substrate 180 are located on the side of the mounting substrate side second main surface 622 in the negative z-axis direction. However, at least one of the first main surface 681 and the second main surface 682 of the main substrate 180 may be located in the z-axis plus direction from the mounting substrate side second main surface 622. That is, at least one of the first main surface 681 and the second main surface 682 of the main substrate 180 may be located closer to the imaging chip 100 than the mounting substrate side second main surface 622. Thus, the length in the z-axis direction when the imaging unit 40 and the main substrate 180 are incorporated into the imaging device can be shortened. Moreover, the length of the transmission path of the signal between the imaging chip 100 and the ASIC 52 can be further shortened.

  The mounting substrate 120 and the surrounding member 140 overlap by a distance (d1) × 2 in the x-axis direction. The mounting substrate 120 and the surrounding member 140 overlap each other by a distance (d1) × 2 in the y-axis direction. From the viewpoint of heat dissipation, the distance d1 is preferably longer. That is, it is preferable that the area S1 where the mounting substrate 120 and the surrounding member 140 overlap is larger. On the other hand, when the distance d1 is short, the imaging unit 40 can be reduced in weight. That is, the smaller the area S1, the lighter the imaging unit 40 can be. Therefore, it is desirable to design the area S1 in consideration of heat dissipation. Furthermore, it is preferable to design an area ratio R1, which is a ratio of the area S1 to the total area of the mounting substrate 120, in consideration of heat dissipation.

FIG. 8 shows an example of the relationship between the area ratio R and the temperature of the imaging chip 100. Here, assuming that the lengths of the mounting board side first side 421 and the mounting board side second side 422 are Y, and the lengths of the mounting board side third side 423 and the mounting board side fourth side 424 be X, the area S1 is , Is expressed by the following equation 1.
(Formula 1) S1 = (X · d1) · 2 + {(Y−2d1) · d1} · 2
The area ratio R1 is expressed by the following equation 2.
(Expression 2) R1 = S1 / (X · Y)

FIG. 8 shows simulation results showing the temperature difference ΔT of the imaging chip 100 in the cases of the area ratio R1 of 0.23, 0.33 and 0.43, respectively. The data in FIG. 8 indicates a simulation result assuming the temperature of the imaging chip 100 after the imaging unit 40 is incorporated in a camera and a moving image is captured for a predetermined time. Specifically, for each of the area ratios R, a specific temperature was given to the imaging chip 100 for a predetermined time, and the temperature when the thermal equilibrium state was reached was calculated to calculate the temperature difference ΔT.
The temperature difference ΔT indicates the difference with respect to the temperature when the area ratio R1 is 0.43. The temperature of the imaging chip 100 when the area ratio R1 is 0.33 is 0.8 ° C. higher than the temperature of the imaging chip 100 when the area ratio R1 is 0.43. The temperature of the imaging chip 100 when the area ratio R1 is 0.23 is 2.1 ° C. higher than the temperature of the imaging chip 100 when the area ratio R1 is 0.43.

  When the imaging chip 100 generates heat locally, the distance d1 of the side close to the heat generating portion of the imaging chip 100 may be increased. For example, when a heat generating portion such as an AD conversion portion is provided along the first long side 403 of the imaging chip 100, the distance d1 from the first long side 403 may be larger than the distance d1 from the other side. When a heat generating portion such as an AD conversion portion is provided along the second long side 404 of the imaging chip 100, the distance d1 from the second long side 404 may be larger than the distance d1 from the other side.

  As shown in FIG. 2, the imaging unit 40 has a portion where the mounting substrate 120, the surrounding member 140 and the bracket 150 overlap in the z-axis direction. The mounting substrate 120, the surrounding member 140, and the bracket 150 overlap in the y-axis direction by a distance (d2) × 2. Thus, the surrounding member 140 has a portion which is sandwiched between the mounting substrate 120 and the bracket 150 and comes into contact with the mounting substrate 120 and the bracket 150. Therefore, the thermal resistance from the mounting substrate 120 to the bracket 150 can be reduced as compared with the case where the mounting substrate 120, the surrounding member 140, and the bracket 150 do not overlap in the z-axis direction. Therefore, the heat generated by the heat source such as the imaging chip 100 can be efficiently released from the mounting substrate 120 to the body portion 60 via the bracket 150. Therefore, the temperature rise of the imaging chip 100 can be suppressed.

  From the viewpoint of heat dissipation, the distance d2 is preferably longer. That is, it is preferable that the area S2 where the mounting substrate 120, the surrounding member 140, and the bracket 150 overlap is larger. On the other hand, the shorter the distance d2, the lighter the imaging unit 40 can be. That is, the smaller the area S2, the weight of the imaging unit 40 can be reduced. Therefore, it is desirable to design the area S2 in consideration of heat dissipation. Furthermore, it is preferable to design an area ratio R2, which is a ratio of the area S2 to the total area of the mounting substrate 120, in consideration of heat dissipation.

  FIG. 9 schematically shows an example of the substrate configuration of the mounting substrate 120. As shown in FIG. The mounting substrate 120 is a multilayer core substrate. The mounting substrate 120 includes a first layer 851, a core layer 807, and a second layer 852.

  The first layer 851 includes a solder resist layer 801, a wiring layer 802, an insulating layer 803, a wiring layer 804, an insulating layer 805, and a wiring layer 806. The second layer 852 includes a wiring layer 808, an insulating layer 809, a wiring layer 810, an insulating layer 811, a wiring layer 812, and a solder resist layer 813. The mounting substrate 120 is a multilayer core substrate having a core layer 807 as a core layer.

  In the mounting substrate 120, the solder resist layer 801, the wiring layer 802, the insulating layer 803, the wiring layer 804, the insulating layer 805, the wiring layer 806, the core layer 807, the wiring layer 808, the insulating layer 809, the wiring layer in the z axis negative direction. An insulating layer 811, a wiring layer 812, and a solder resist layer 813 are disposed in this order.

  The insulating layer 803, the insulating layer 805, the insulating layer 809, and the insulating layer 811 are, for example, resin layers. The insulating layer 803, the insulating layer 805, the insulating layer 809, and the insulating layer 811 are resins filled with a filler. The insulating layer 803, the insulating layer 805, the insulating layer 809, and the insulating layer 811 have three or more layers, as compared to the thermal conductivity of a substrate formed of an ordinary resin material is about 0.3 to 0.8 W / mK. It has a thermal conductivity of about 5 W / mK. Therefore, the thermal conductivity of the mounting substrate 120 can be increased. The thickness of each of the insulating layer 803, the insulating layer 805, the insulating layer 809, and the insulating layer 811 is 30 μm to 40 μm. The thickness is the length in the z-axis direction.

  The wiring layer 802, the wiring layer 804, the wiring layer 806, the wiring layer 808, the wiring layer 810, and the wiring layer 812 include a wiring pattern. As a material of the wiring layer 802, the wiring layer 804, the wiring layer 806, the wiring layer 808, the wiring layer 810, and the wiring layer 812, an alloy of nickel and iron (for example, 42 alloy, 56 alloy), copper, aluminum, or the like can be used. The thickness of each of the wiring patterns of the wiring layer 802, the wiring layer 804, the wiring layer 806, the wiring layer 808, the wiring layer 810, and the wiring layer 812 is approximately 10 μm to 30 μm. Thus, the first layer 851 includes a three-layer wiring pattern. The second layer 852 includes a wiring pattern of three layers.

  The core layer 807 is formed of a resin. The material of the core layer 807 may be FR4. The thickness of the core layer 807 is thicker than any thickness of the insulating layer of the mounting substrate 120. The thickness of the core layer 807 is thicker than any thickness of the wiring layer of the mounting substrate 120. The core layer 807 is about 100 μm to 400 μm. The rigidity of the core layer 807 is higher than any rigidity of the wiring of the mounting substrate 120. The rigidity of the core layer 807 may be higher than the rigidity of the first layer 851 and the second layer 852. The thickness of the solder resist layer 801 and the solder resist layer 813 is about 20 μm.

  As described above, while the Young's modulus of a normal resin material is about 30 [GPa], the Young's modulus of the insulating layer 803, the insulating layer 805, the insulating layer 809, and the insulating layer 811 is 46 to 60 [GPa] It is. Thus, the insulating layer 803, the insulating layer 805, the insulating layer 809, and the insulating layer 811 have relatively high Young's modulus. Therefore, the core layer 807 can be formed of resin instead of metal. Therefore, the cost of the mounting substrate 120 can be reduced. In addition, the shape stability at high temperature can be enhanced. In addition, the thickness of the mounting substrate 120 can be reduced. In addition, the rigidity of the mounting substrate 120 can be enhanced.

  The imaging chip 100 is mounted on the solder resist layer 801. At least a portion of the wiring layer 802 is used for a wiring pattern that receives a signal output from the imaging chip 100 via a bonding wire. A part of the wiring pattern of another wiring layer may be used as a ground line or a power supply line.

  The wiring layers of the mounting substrate 120 may be electrically connected to each other by vias. The pixel signal output from the imaging chip 100 is transmitted from the uppermost wiring layer 802 to the lowermost wiring layer 812 via a via. The mounting substrate side connector 21 is connected to the wiring layer 812. A signal output from the imaging chip 100 is transmitted to the main substrate 180 via the bonding wire, the wiring layer and via of the mounting substrate 120, the mounting substrate connector 21, and the flexible printed substrate 23. The solder resist layer 813 is provided with electronic components such as a capacitor, a resistor, and a resistor. These electronic components constitute a power supply circuit or the like that supplies power to the circuit in the imaging chip 100.

  FIG. 10 schematically shows another example of the substrate configuration of the mounting substrate 120. As shown in FIG. The mounting substrate 120 is a multilayer core substrate. The mounting substrate 120 includes a first layer 951, a core layer 907, a second layer 952, a core layer 911, and a third layer 953.

  The first layer 951 includes a solder resist layer 901, a wiring layer 902, an insulating layer 903, a wiring layer 904, an insulating layer 905, and a wiring layer 906. The second layer 952 includes a wiring layer 908, an insulating layer 909 and a wiring layer 910. The third layer 953 includes a wiring layer 912, an insulating layer 913, a wiring layer 914, an insulating layer 915, a wiring layer 916, and a solder resist layer 917. The mounting substrate 120 is a multilayer core substrate having a core layer 907 and a core layer 911 as a core layer.

  In the mounting substrate 120, the solder resist layer 901, the wiring layer 902, the insulating layer 903, the wiring layer 904, the insulating layer 905, the wiring layer 906, the core layer 907, the wiring layer 908, the insulating layer 909, the wiring layer A core layer 911, a wiring layer 912, an insulating layer 913, a wiring layer 914, an insulating layer 915, a wiring layer 916 and a solder resist layer 917 are disposed in this order.

  The insulating layer 903, the insulating layer 905, the insulating layer 909, the insulating layer 913, and the insulating layer 915 have the same structure as the insulating layer 803, the insulating layer 805, the insulating layer 809, and the insulating layer 811. A wiring layer 902, a wiring layer 904, a wiring layer 906, a wiring layer 908, a wiring layer 910, a wiring layer 912, a wiring layer 914, and a wiring layer 916 are a wiring layer 802, a wiring layer 804, a wiring layer 806, a wiring layer 808, a wiring The structure is similar to that of the layer 810 and the wiring layer 812.

  The core layer 907 and the core layer 911 have the same configuration as the core layer 807. It is formed of resin. The core layer 807 is about 100 μm to 300 μm. The thickness of the solder resist layer 901 and the solder resist layer 917 is about 20 μm.

  The thickness of the mounting substrate 120 exemplified in FIGS. 9 and 10 may be in the range of 0.3 mm to 1.0 mm as a whole. The mounting substrate 120 illustrated in FIG. 10 includes a large number of resin layers as compared to the mounting substrate 120 illustrated in FIG. Thus, the heat transferability in the xy plane of the mounting substrate 120 can be enhanced. The insulating layer of the mounting substrate 120 may be thicker than 40 μm. For example, the thickness of the insulating layer of the mounting substrate 120 may be 100 μm. By thickening the insulating layer of the mounting substrate 120, the heat transferability in the xy plane can be further enhanced.

  FIG. 11 shows an imaging unit 1032 as a modification of the imaging unit 40. In the imaging unit 1032 illustrated in FIG. 11, members having the same configuration as each part of the imaging unit 40 may be assigned the same reference numerals and descriptions thereof may be omitted. The imaging unit 1032 has a surrounding member 1040 as a modification of the surrounding member 140.

  FIG. 11 shows a plan view of the imaging unit 1032 as viewed from the position in the z-axis plus direction, and a cross-sectional view showing the AA section of the imaging unit 1032. FIG. 12 shows a plan view of the imaging unit 1032 as viewed from the position in the z-axis negative direction, a sectional view showing a BB section of the imaging unit 1032, and a sectional view showing a CC section of the imaging unit 1032. FIG. 13 shows a plan view of the mounting member 1010 and the surrounding member 1040 as viewed from the position in the z-axis plus direction.

  The surrounding member 1040 has a mounting member 1010 and a frame member 1020. The mounting member 1010 is formed of a material having a thermal conductivity higher than that of the frame member 1020. The attachment member 1010 is formed of, for example, a metal such as 42 alloy. The frame member 1020 is formed of resin. The surrounding member 1040 is made of a composite of metal and resin. The attachment member 1010 may be formed by outsert molding or adhesion to the frame member 1020.

  The mounting member 1010 is provided on the mounting substrate 120. The attachment member 1010 has a first major surface 1011 and a second major surface 1012 opposite to the first major surface 1011. The second main surface 1012 of the mounting member 1010 is provided in contact with the mounting substrate side first main surface 621 of the mounting substrate 120.

  The frame member 1020 is provided in contact with the mounting substrate 120 and the mounting member 1010. The frame member 1020 includes a first surface 1021 providing the surrounding member side first surface 641, a second surface 1022 providing the surrounding member side second surface 642, and an edge of the second surface 1022 in the x-axis direction. From the edge of the third surface 1023 to the z-axis minus direction, and from the edge of the fourth surface 1024 to the xy plane substantially parallel to the third surface 1023 extending substantially parallel to the xy plane A fifth surface 1025 to be stretched and a sixth surface 1026 to extend in the z-axis direction from the edge of the fifth surface 1025 to provide a sixth surface 646 on the surrounding member side.

  The third surface 1023 and the fifth surface 1025 of the frame member 1020 are surfaces opposite to the first surface 1021. The third surface 1023 and the fourth surface 1024 contact the mounting member 1010. The third surface 1023 contacts an inner portion of the first major surface 1011 of the mounting member 1010.

  An outer portion of the first major surface 1011 of the mounting member 1010 provides a surrounding member side third surface 643. The first side surface 1013 between the first major surface 1011 and the second major surface 1012 of the mounting member 1010 provides a surrounding member side fourth surface 644. The second side surface 1014 between the first main surface 1011 and the second main surface 1012 of the mounting member 1010 is a side surface outside the first side surface 1013. The second side surface 1014 of the mounting member 1010 contacts the fourth surface 1024 of the frame member 1020. The second major surface 1012 of the mounting member 1010 and the fifth surface 1025 of the frame member 1020 provide a surrounding member side fifth surface 645.

  According to the imaging unit 1032, a part of the attachment member 1010 of the surrounding member 140 is formed of metal, so that the thermal resistance can be reduced. In addition, the strength of the portion attached to the bracket 150 can be increased. Therefore, the thickness of the mounting member 1010 can be reduced. Further, the weight can be reduced as compared with the case where the surrounding member 140 is entirely made of metal. In addition, since the surrounding member side sixth surface 646 is provided with resin, internal reflection of subject light on the surrounding member side sixth surface 646 can be reduced. Therefore, it is possible to reduce the influence of the internally reflected light on the surrounding member side sixth surface 646 on the image obtained by the imaging operation of the imaging chip 100.

  According to the surrounding member 1040, the mounting member 1010 has a shape surrounding the imaging chip 100. Therefore, the positioning accuracy of the positioning holes 145 and the positioning holes 146 provided in the mounting member 1010 can be enhanced. Thereby, the positioning accuracy in the case of attaching the attachment member 1010 to the bracket 150 can be enhanced.

  The heat dissipating material 1050 and the heat dissipating material 1060 described later are provided on the surrounding member side third surface 643. The heat dissipating material 1050 is provided between the bracket 150 and the surrounding member side third surface 643. The heat dissipating material 1050 and the heat dissipating material 1060 contact the bracket 150 and the surrounding member side third surface 643.

  FIG. 14 shows an arrangement example of the heat sinks 1050 and 1060. FIG. 14 is a plan view of the surrounding member 140 viewed from the position in the z-axis plus direction. The heat dissipating material 1050 is provided on the surface of the surrounding member side third surface 643 in the negative y-axis direction. The heat dissipation material 1060 is provided on the surface in the y-axis plus direction on the third surface 643 on the surrounding member side.

  The heat dissipating material 1050 has a through hole 1051 at a position corresponding to the mounting hole 141. The screw 241 is inserted into the mounting hole 141 and the through hole 1051. The heat dissipating material 1050 has a through hole 1055 in which a positioning pin is inserted at a position corresponding to the positioning hole 145.

  The heat dissipating material 1060 has through holes 1062 at positions corresponding to the mounting holes 142. The heat dissipating material 1060 has through holes 1063 at positions corresponding to the mounting holes 143. The heat dissipating material 1060 has a through hole 1066 in which the positioning pin is inserted at a position corresponding to the positioning hole 146.

  The heat dissipation material 1050 and the heat dissipation material 1060 can reduce the thermal resistance between the mounting member 1010 and the bracket 150. Therefore, the heat generated by the imaging chip 100 can be efficiently transmitted to the bracket 150. As the heat dissipating material 1050 and the heat dissipating material 1060, a heat dissipating sheet, a thermally conductive adhesive material, and the like can be exemplified.

  The heat dissipating material 1050 may be provided on all the surfaces in the y-axis minus direction of the surrounding member side third surface 643 as illustrated in FIG. 14. However, the heat dissipating material 1060 may be provided only around the mounting hole 141 among the surfaces in the negative y-axis direction of the third surface 643 on the surrounding member side. The heat dissipating material 1060 may also be provided on all the surfaces in the y-axis plus direction of the surrounding member side third surface 643 as illustrated in FIG. 14. However, the heat dissipating material 1060 may be provided only around the mounting hole 142 and around the mounting hole 143 among the surfaces in the y-axis plus direction of the surrounding member side third surface 643.

  FIG. 15 shows an example of the surrounding member 1440 as a modification of the surrounding member 1040. As shown in FIG. The surrounding member 1440 has a mounting member 1410 and a frame member 1420. The mounting member 1410 has a first mounting member 1411 and a second mounting member 1412 different from the first mounting member 1411. The first mounting member 1411 has a mounting hole 141 and a positioning hole 145. The second mounting member 1412 has a mounting hole 142, a mounting hole 143 and a positioning hole 146. FIG. 15 shows a plan view of the mounting member 1410 and the surrounding member 1440 as viewed from the position in the z-axis plus direction.

  The first mounting member 1411 and the second mounting member 1412 are provided separately in the y-axis direction. The first mounting member 1411 has a mounting hole 141 and a positioning hole 145. The second mounting member 1412 has a mounting hole 142, a mounting hole 141 and a positioning hole 146. The frame member 1020 is provided in contact with the mounting substrate 120 in a region between the first mounting member 1411 and the first mounting member 1411.

  According to the surrounding member 1440, the first mounting member 1411 and the second mounting member 1412 can be disposed mainly in the vicinity of the portion attached to the mounting portion with the bracket 150. Therefore, the weight of the surrounding member 1440 can be reduced.

  FIG. 16 shows an example of the surrounding member 1540 as a modification of the surrounding member 1440. In the surrounding member 1540, the second mounting member 1412 has a third mounting member 1413 and a fourth mounting member 1414 different from the third mounting member 1413. The third mounting member 1413 has a mounting hole 142. The fourth mounting member 1414 has a mounting hole 143 and a positioning hole 146. FIG. 16 shows a plan view of the mounting member 1410 and the surrounding member 1440 as viewed from the position in the z-axis plus direction.

  The third mounting member 1413 and the fourth mounting member 1414 are provided separately in the x-axis direction. The frame member 1020 is provided in contact with the mounting substrate 120 in the region between the third mounting member 1413 and the fourth mounting member 1414.

  According to the surrounding member 1540, the third attachment member 1413 and the fourth attachment member 1414 can be provided mainly in the immediate vicinity of the portion attached to the attachment portion with the bracket 150. Therefore, the weight of the surrounding member 1540 can be further reduced.

  FIG. 17 shows an example of the surrounding member 1640 as a modification of the surrounding member 1040. As shown in FIG. The surrounding member 1640 has a mounting member 1610 as a modification of the mounting member 1010 and a frame member 1620 as a modification of the frame member 1020. The mounting member 1610 is formed of a material having a thermal conductivity higher than that of the frame member 1620. The attachment member 1610 is formed of, for example, a metal such as 42 alloy. The frame member 1620 is formed of resin. The surrounding member 1040 is made of a composite of metal and resin.

  The frame member 1620 is not in contact with the mounting substrate 120. The frame member 1620 is provided on the first major surface 1011 of the mounting member 1610. The first side surface 1013 of the mounting member 1610 and the sixth surface 1026 of the frame member 1620 provide a surrounding member side sixth surface 646. Further, the second major surface 1012 of the mounting member 1610 provides a surrounding member side fifth surface 645.

  According to the surrounding member 1640, the frame member 1620 is not in contact with the mounting substrate 120, and the contact surface between the surrounding member 1640 and the mounting substrate 120 is provided by the second major surface 1012 of the mounting member 1610. . Therefore, it is not necessary to bond a plurality of types of members to the mounting substrate 120. Also, the shape of the frame member 1620 can be simplified. When the influence of the reflection of the subject light flux on the first side surface 1013 of the mounting member 1610 is small, even if the first side surface 1013 of the mounting member 1610 forms a part of the surrounding member side sixth surface 646 as shown in FIG. Good.

  FIG. 18 shows an example of the surrounding member 1740 as a modification of the surrounding member 1640. As shown in FIG. The surrounding member 1740 has a mounting member 1710 as a modification of the mounting member 1610 and a frame member 1720 as a modification of the frame member 1620. The mounting member 1710 is formed of a material having a thermal conductivity higher than that of the frame member 1720. The attachment member 1710 is formed of, for example, a metal such as 42 alloy. The frame member 1720 is formed of resin. The surrounding member 1740 is made of a composite of metal and resin.

  The mounting member 1710 has, on the first major surface 1011, a convex portion 1711 that protrudes in the z-axis plus direction. The frame member 1720 has a recess 1721 in the z-axis plus direction on the third surface 1023. The convex portion 1711 of the mounting member 1710 fits in the concave portion 1721 of the frame member 1720. Thereby, the adhesion between the mounting member 1710 and the frame member 1720 can be enhanced.

  The mounting member 1710 has a recess 1712 in the z-axis plus direction on the second major surface 1012. The mounting substrate 120 has a protrusion 1722 protruding in the z-axis plus direction on the mounting substrate side first main surface 621. The convex portion 1722 of the mounting substrate 120 fits into the concave portion 1712 of the mounting member 1710. Thereby, the adhesion between the mounting member 1710 and the mounting substrate 120 can be enhanced. The convex portion 1711, the concave portion 1721, the concave portion 1712, and the convex portion 1722 may be provided at the same position in the xy plane.

  FIG. 19 shows an example of the surrounding member 1840 as a modification of the surrounding member 1040. The surrounding member 1840 has a mounting member 1810 as a modification of the mounting member 1010 and a frame member 1820 as a modification of the frame member 1020. The mounting member 1010 is formed of a material having a thermal conductivity higher than that of the frame member 1820. The attachment member 1810 is formed of, for example, a metal such as 42 alloy. The frame member 1820 is formed of resin. The surrounding member 1840 is made of a composite of metal and resin.

  The attachment member 1810 is a flat plate-shaped first flat plate portion 1831 having a main surface substantially parallel to the xy plane, and a flat plate positioned in the z-axis plus direction from the first flat plate portion 1831 and having a main surface substantially parallel to the xy plane And a connecting portion 1833 for connecting the first flat portion 1831 and the second flat portion 1832. The first flat plate portion 1831 has a surface 1817 in contact with the mounting substrate side first main surface 621 of the mounting substrate 120. The second flat plate portion 1832 is not in contact with the mounting substrate 120. The attachment member 1810 may be formed on the frame member 1820 by insert molding.

  According to the surrounding member 1840, the bonding surface between the mounting substrate 120 formed of resin and the frame member 1820 formed of resin can be widely secured. Therefore, the adhesive strength between the mounting substrate 120 and the surrounding member 1840 can be increased. In addition, the adhesion between the mounting member 1810 and the frame member 1820 can also be enhanced by providing the second flat plate portion 1832 located in the z-axis positive direction with respect to the first flat plate portion 1831.

  The first flat plate portion 1831 has a convex portion projecting in the z-axis positive direction from the main surface 1841 on the z-axis positive direction side of the first flat plate portion 1831 similarly to the convex portion 1711 described in FIG. Good. The second flat plate portion 1832 may have a convex portion that protrudes in the z-axis positive direction from the main surface 1851 on the z-axis positive direction side of the second flat plate portion 1832 similarly to the convex portion 1711 described in FIG. In addition, the second flat plate portion 1832 has a convex portion projecting in the z-axis negative direction from the main surface 1852 in the z-axis negative direction side of the second flat plate portion 1832 similarly to the convex portion 1711 described in FIG. Good. Thereby, the adhesion between the frame member 1820 and the mounting member 1810 can be enhanced.

  FIG. 20 is a cross-sectional view schematically showing an imaging unit 2040 and a body 60 of another form. FIG. 21 shows a perspective view of the imaging unit 2040. The imaging unit 2040 differs from the imaging unit 40 mainly in that the bracket 150 is not provided.

  The surrounding member 2140 has a mounting hole 2141 corresponding to the mounting hole 151. The surrounding member 2140 has a mounting hole 2142 corresponding to the mounting hole 152. The surrounding member 2140 has a mounting hole 2143 corresponding to the mounting hole 153. The surrounding member 2140 has positioning holes 2145 corresponding to the positioning holes 155 and positioning holes 2146 corresponding to the positioning holes 156.

  In the surrounding member 2140, the screw 2251 is inserted into the mounting hole 2141 and the mounting hole 61 from the z-axis negative direction. Similarly, in the surrounding member 2140, a screw is inserted into the mounting hole 2142 and the mounting hole 62 from the z-axis negative direction. Further, the surrounding member 2140 is screwed by inserting a screw into the mounting hole 2143 and the mounting hole 63 from the z-axis negative direction. Similar to the imaging unit 40, the imaging unit 2040 is screwed to the body portion 60 by three screws.

  According to the imaging unit 2040, the imaging unit 2040 can be fixed to the body portion 60 without the bracket 150. For example, the surrounding member 2140 can be screwed directly to the body portion 60. Therefore, the positioning accuracy of the imaging chip 100 can be enhanced. Moreover, it becomes possible to adjust flange back largely. Further, the imaging unit 40 can be reduced in weight. Further, the heat capacity of the surrounding member 2140 itself can be increased, so that the mounting substrate 120 can be prevented from having a high temperature.

  In the examples of FIGS. 20 and 21, the surrounding member 2140 has mounting holes at positions corresponding to the mounting holes of the bracket 150. However, the position of the mounting hole 2142 of the surrounding member 2140 in the x direction is at a position in the x axis plus direction from the mounting board side first side 421 and at a position in the x axis minus direction from the mounting board side second side 422 Good. In addition, the position of the mounting hole 2143 of the surrounding member 2140 in the x direction is also the position in the x-axis plus direction from the mounting substrate side first side 421 and the position in the x-axis minus direction from the mounting substrate side second side 422 Good. Thereby, the mounting substrate 120 and the main substrate 180 can be closely connected.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It is apparent to those skilled in the art that various changes or modifications can be added to the above embodiment. It is also apparent from the scope of the claims that the embodiments added with such alterations or improvements can be included in the technical scope of the present invention.

  The execution order of each process such as operations, procedures, steps, and steps in the apparatuses, systems, programs, and methods shown in the claims, the specification, and the drawings is particularly “before”, “preceding” It is to be noted that “it is not explicitly stated as“ etc. ”and can be realized in any order as long as the output of the previous process is not used in the later process. With regard to the operation flow in the claims, the specification, and the drawings, even if it is described using “first,” “next,” etc. for convenience, it means that it is essential to carry out in this order. It is not a thing.

21 mounting board connector 22 main board connector 23 flexible printed board 26 body side mount 30 camera body 31 mirror unit 32 main mirror 33 sub mirror 38 shutter unit 40 imaging unit 52 AISC
59 slot 60 body 61 mounting hole 62 mounting hole 63 mounting hole 68 spring 70 focus detection unit 82 penta prism 84 finder barrel 86 finder window 89 accessory shoe 100 imaging chip 120 mounting board 140 surrounding member 141 mounting hole 142 mounting hole 143 mounting holes 145 positioning holes 146 positioning holes 148 openings 150 brackets 151 mounting holes 152 mounting holes 153 mounting holes 155 holes 156 cover holes 180 cover glass 180 mounting holes 182 mounting holes 183 mounting holes 184 mounting holes 241 screws 242 screws 243 Screw 251 Screw 252 Screw 350 Opening 351 Mounting hole 352 Mounting hole 353 Mounting hole 358 Recess 401 Short side 402 Short side 403 Long side 404 Long side 421 Mounting board side 1st side 422 Mounting board side 2nd side 423 Mounting board Side third side 424 Mounting board side Fourth side 481 Main board side First side 482 Main board side Second side 483 Main board side Third side 484 Main board side Fourth side 485 Main board side Fifth side 486 Main board side 6th side 487 main substrate side seventh side 488 main substrate side eighth side 489 main substrate side ninth side 621 mounting substrate side first main surface 622 mounting substrate side second main surface 641 first surface 642 second surface 643 second surface Three faces 644 Fourth face 645 Fifth face 651 First main surface 652 Second main surface 681 First main surface 682 Second main surface 801 Solder resist layer 802 Wiring layer 803 Insulating layer 804 Wiring layer 805 Insulating layer 806 wiring layer 807 core layer 808 wiring layer 809 insulating layer 810 wiring layer 811 insulating layer 812 wiring layer 813 solder resist layer 851 first layer 852 second layer 901 solder resist 902 wiring layer 903 insulating layer 904 wiring layer 905 wiring layer 907 core layer 908 wiring layer 909 insulating layer 910 wiring layer 911 core layer 912 wiring layer 913 insulating layer 914 wiring layer 915 insulating layer 916 wiring layer 917 solder resist layer 951 First layer 952 Second layer 953 Third layer 1010 Attachment member 1011 First principal surface 1012 Second principal surface 1013 First side surface 1014 Second side surface 1020 Frame member 1021 First surface 1022 Second surface 1023 Third surface 1024 Fourth surface Surface 1025 Fifth surface 1026 Sixth surface 1032 Imaging unit 1040 Enclosure member 1050 Heat dissipation material 1051 Through hole 1055 Through hole 1060 Heat dissipation material 1062 Through hole 1063 Through hole 1066 Through hole 1410 Mounting member 1411 First mounting member 1412 Second mounting member 1413 third mounting member 1414 Fourth mounting member 1420 frame member 1440 surrounding member 1540 surrounding member 1610 mounting member 1620 frame member 1640 surrounding member 1710 mounting member 1711 convex portion 1712 concave portion 1720 frame member 1721 concave portion 1722 convex portion 1740 surrounding member 1810 mounting member 1817 surface 1820 frame member 1831 first flat plate portion 1832 second flat plate portion 1833 connecting portion 1840 surrounding member 1841 main surface 1851 main surface 1852 main surface 2040 imaging unit 2140 surrounding member 2141 mounting hole 2142 mounting hole 2143 mounting hole 2143 mounting hole 2145 positioning hole 2146 positioning Hole 2251 screw

Claims (12)

An imaging chip for imaging an object;
A substrate on which the imaging chip is disposed;
And a member disposed in an area outside the area where the imaging chip is disposed on the substrate and having a first attachment portion and a second attachment portion to be attached to another structure.
The member includes a frame member made of resin, and a mounting member made of metal and having the first mounting portion and the second mounting portion.
An imaging unit in which the first attachment portion and the second attachment portion are formed in a region in which the attachment member extends outward beyond the substrate in a direction along the short side of the imaging chip;   The imaging unit according to claim 1, wherein the frame member has a thickness greater than that of the attachment member in a direction perpendicular to the imaging surface of the imaging chip.   The imaging unit according to claim 1, wherein the mounting member is formed by outsert molding the member on the frame member. The imaging unit according to any one of claims 1 to 3 .
The imaging chip has a first long side and a second long side that form an outer edge of the imaging chip with the short side,
The first attachment portion is formed on the first long side of the imaging chip in the attachment member,
An imaging unit formed on the second long side of the imaging chip at the attachment member; An imaging unit according to any one of claims 1 to 4,
An electronic component for driving the imaging chip;
The imaging unit wherein the electronic component is disposed on the substrate. In the imaging unit according to claim 5 ,
An imaging unit in which the electronic component is disposed on a second surface of the substrate opposite to the first surface on which the imaging chip is disposed; In the imaging unit according to claim 6 ,
The imaging unit wherein the electronic component is disposed in an area of the second surface opposite to the area where the imaging chip is disposed on the first surface. The imaging unit according to any one of claims 5 to 7 ,
An imaging unit including the active element driving the imaging chip; In the imaging unit according to claim 8 ,
The imaging unit, wherein the active element constitutes at least a part of a power supply circuit that supplies power to the imaging chip. An imaging device comprising the imaging unit according to any one of claims 1 to 9 . In the imaging device according to claim 10 ,
An imaging device comprising a signal processing circuit that processes a signal from the imaging chip. In the imaging device according to claim 11 ,
An imaging device in which the signal processing circuit is disposed on a substrate different from the substrate;