JP2015046435A - Solid-state imaging device and electronic camera - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a packageless solid-state imaging device that can control and set an interval between an imaging region of a chip and a translucent member covering the imaging region to a desired value with ease.SOLUTION: A solid-state imaging device 1 comprises: a semiconductor chip 2 having an imaging region 2a; a translucent member 3 covering the imaging region 2a and installed at an interval d from the imaging region 2a; and a spacer 4 fixing the translucent member 3 to a fixed part. The spacer 4 has a plurality of spacer members 5a and 5b laminated between the translucent member 3 and the fixed part.

Description

  The present invention relates to a solid-state imaging device and an electronic camera using the same.

  Patent Document 1 below discloses a solid-state imaging device having a so-called COB (Chip on board) structure in which a solid-state imaging device chip is directly mounted on a circuit board as a conventional packageless solid-state imaging device. ing.

  In this conventional solid-state imaging device, a translucent member such as a glass plate is bonded to the solid-state imaging element chip with a single layer of adhesive so as to cover the imaging area (light-receiving area) of the solid-state imaging element chip. This one-layer adhesive is applied around the imaging region of the solid-state imaging device chip, and a translucent member is adhered thereon. As this one-layer adhesive, an ultraviolet curable resin is used.

JP 2002-16194 A

  However, in the conventional solid-state imaging device, the interval between the imaging region of the solid-state imaging element chip and the translucent member is determined by the height of the one-layer adhesive, and the interval is controlled to a desired value. It was difficult to set up.

  The present invention has been made in view of such circumstances, and although it is a packageless solid-state imaging device, the distance between the imaging region of the chip and the translucent member covering it can be easily set to a desired value. An object of the present invention is to provide a solid-state imaging device that can be controlled and set to a value, and an electronic camera using the same.

  The following aspects are presented as means for solving the problems. A solid-state imaging device according to a first aspect includes a semiconductor chip having an imaging region, a translucent member that covers the imaging region and is spaced from the imaging region, and the translucent member and the fixed member A plurality of spacer members stacked between the first and second portions, and a spacer for fixing the translucent member to the fixed portion.

  The solid-state imaging device according to a second aspect is the solid-state imaging device according to the first aspect, wherein the spacer is between one spacer member of the plurality of spacer members and the fixed portion, of the plurality of spacer members. It has the adhesive agent which adhere | attaches between one other spacer member and the said translucent member, and between these spacer members.

  The solid-state imaging device according to a third aspect is the solid-state imaging device according to the first or second aspect, wherein the fixed portion is the semiconductor chip, and the spacer is a region outside the imaging region in the semiconductor chip and the light transmitting device. It is provided between the sex members.

  The solid-state imaging device according to a fourth aspect is the solid-state imaging device according to the third aspect, wherein a surface of the semiconductor chip opposite to the imaging region is disposed on a rigid printed board, and the semiconductor chip and the rigid printed board are The space is electrically connected by a bonding wire or a ball grid array.

  The solid-state imaging device according to a fifth aspect is the solid-state imaging device according to the first or second aspect, wherein a flexible printed board having an opening at least in a region corresponding to the imaging region is bonded to the surface of the semiconductor chip on the imaging region side. The fixed portion is the flexible printed circuit board, and the spacer is provided between the periphery of the opening in the flexible printed circuit board and the translucent member.

  In the solid-state imaging device according to a sixth aspect, in any one of the second to fifth aspects, the thermal expansion coefficient of each spacer member is the thermal expansion coefficient of a main constituent material of the semiconductor chip and the translucent member. The thermal expansion coefficient of each spacer member is approximately equal to the thermal expansion coefficient of the spacer member laminated at a position closer to the semiconductor chip, and the heat of the main constituent material of the semiconductor chip. The value is close to the expansion coefficient.

  In addition, in this specification, a thermal expansion coefficient shall mean a linear expansion coefficient.

  In a solid-state imaging device according to a seventh aspect, in the first or second aspect, a rigid printed circuit board having an opening at least in a region corresponding to the imaging region is bonded to a surface of the semiconductor chip on the imaging region side. The fixed portion is the rigid printed board, and the spacer is provided between the periphery of the opening in the rigid printed board and the translucent member.

  A solid-state imaging device according to an eighth aspect includes the semiconductor chip according to any one of the first to third aspects, which is joined to the semiconductor chip.

  An electronic camera according to a ninth aspect includes any one of the first to eighth solid-state imaging devices.

  ADVANTAGE OF THE INVENTION According to this invention, although it is a packageless solid-state imaging device, the space | interval between the imaging region of a chip | tip and the translucent member which covers this can be easily controlled and set to a desired value. A solid-state imaging device and an electronic camera using the same can be provided.

1 is a schematic plan view schematically showing a solid-state imaging device according to a first embodiment of the present invention. FIG. 2 is a schematic cross-sectional view schematically showing the solid-state imaging device shown in FIG. 1. It is a schematic sectional drawing which shows typically the electronic camera by the 2nd Embodiment of this invention. It is a schematic plan view which shows typically the solid-state imaging device by the 3rd Embodiment of this invention. FIG. 5 is a schematic cross-sectional view schematically showing the solid-state imaging device shown in FIG. 4. It is a schematic plan view which shows typically the solid-state imaging device by the 4th Embodiment of this invention. FIG. 7 is a schematic cross-sectional view schematically showing the solid-state imaging device shown in FIG. 6. It is a schematic cross-sectional view which shows typically the solid-state imaging device by the 5th Embodiment of this invention. It is a schematic plan view which shows typically the solid-state imaging device by the 6th Embodiment of this invention. FIG. 10 is a schematic cross-sectional view schematically showing the solid-state imaging device shown in FIG. 9.

  Hereinafter, a solid-state imaging device and an electronic camera according to the present invention will be described with reference to the drawings.

[First Embodiment]
FIG. 1 is a schematic plan view schematically showing the solid-state imaging device 1 according to the first embodiment of the present invention. FIG. 2 is a schematic cross-sectional view schematically showing the solid-state imaging device 1 shown in FIG.

  A solid-state imaging device 1 according to the present embodiment is a packageless bare chip mounting type solid-state imaging device, and covers a semiconductor chip 2 having an imaging region (light-receiving region) 2a, an imaging region 2a, and a distance d from the imaging region 2a. And a spacer 4 for fixing the light transmissive member 3 to the semiconductor chip 2 as a fixed portion.

  In the present embodiment, the spacer 4 includes a plurality of spacer members 5a and 5b stacked between the translucent member 3 and the semiconductor chip 2 as the fixed portion, and a plurality of spacer members 5a and 5b. Between one spacer member 5a and the semiconductor chip 2, between one other spacer member 5b and the translucent member 3 among the plurality of spacer members 5a and 5b, and between the plurality of spacer members 5a and 5b. Adhesives 6a, 6b, and 6c.

  In the present embodiment, the semiconductor chip 2 is an image sensor such as a CMOS or CCD configured as a chip, and a plurality of pixels (not shown) are two-dimensionally arranged in the imaging region 2a. The semiconductor chip 2 photoelectrically converts incident light that has entered the imaging region 2a via the translucent member 3 and outputs an image signal. In the present embodiment, the semiconductor chip 2 is also equipped with a readout circuit (not shown) that drives the pixels and reads out image signals. However, a part of the readout circuit or the like may be mounted on the rigid printed circuit board 7 described later. These points are the same for the embodiments described later.

  The translucent member 3 may be a glass plate, a crystal plate, a transparent resin plate, or the like. The translucent member 3 is not limited to a simple transparent plate, but may be a low-pass filter or an infrared cut filter. These points are the same for the embodiments described later.

  In the present embodiment, the spacer 4 is provided between the region outside the imaging region 2 a in the semiconductor chip 2 and the translucent member 3. In the present embodiment, two frame (two layers) spacer members 5a and 5b and three layers of adhesives 6a, 6c, and 6b are alternately arranged between the semiconductor chip 2 and the translucent member 3. The spacers 4 are formed by stacking them. Thereby, the translucent member 3 is fixed to the semiconductor chip 2 by the spacer 4 so that the translucent member 3 covers the imaging area 2a of the semiconductor chip 2 and is spaced from the imaging area 2a. Has been. The spacer 4 is provided in a frame shape over the entire circumference of the imaging region 2 a in the semiconductor chip 2, and seals the space between the imaging region 2 a and the translucent member 3.

  The material of the spacer members 5a and 5b is not particularly limited, and may be ceramic, metal, resin, or the like, for example. Moreover, the material of each spacer member 5a, 5b may be the same, and may differ. However, in order to further reduce the warpage of the semiconductor chip 2 due to changes in the environmental temperature, the thermal expansion coefficient (linear expansion coefficient) of each spacer member 5a, 5b is the main constituent material of the semiconductor chip 2 (for example, silicon). It is desirable that the thermal expansion coefficient is an intermediate value between the thermal expansion coefficient and the thermal expansion coefficient of the translucent member 3. In this case, in order to further reduce the warpage of the semiconductor chip 2 due to the change of the environmental temperature, the thermal expansion coefficient of each spacer member 5a, 5b is set to be close to that of the semiconductor chip 2. It is desirable that the coefficient of thermal expansion be closer to the coefficient of thermal expansion of the main constituent material of the semiconductor chip 2. In the present embodiment, the number of spacer members 5a and 5b is two, but the number may be three or more. These points are the same for the embodiments described later.

  The material of the adhesives 6a, 6b, 6c is not particularly limited, and may be an ultraviolet curable resin or a thermosetting resin. Specifically, the material of the adhesives 6a, 6b, 6c may be, for example, an epoxy adhesive, an acrylic adhesive, a silicon adhesive, or the like. In addition, the materials of the adhesives 6a, 6b, and 6c in each layer may be the same or different. In order to reduce the warp of the semiconductor chip 2 due to a change in the environmental temperature, the material of the adhesives 6a, 6b, 6c is preferably a low hardness (soft) material, for example, a material having a Young's modulus of 100 MPa or less. It is desirable that there be a material having a Young's modulus of 10 MPa or less, and it is even more desirable that there be a material having a Young's modulus of 1 MPa or less. These points are the same for the embodiments described later.

  The surface opposite to the imaging region 2a in the semiconductor chip 2 (the lower surface in FIG. 1) is installed on a rigid printed circuit board 7 that forms a circuit board. In the present embodiment, the lower surface of the semiconductor chip 2 is bonded to the upper surface of the rigid printed board 7 with an adhesive (not shown), a die attach film (not shown), or the like.

  An electrode pad 8 (not shown in FIG. 2) as an input / output terminal is formed further on the peripheral side than the spacer 4 on the upper surface of the semiconductor chip 2. Further, electrode pads 9 (not shown in FIG. 2) for electrical connection with the semiconductor chip 2 are formed on the upper surface of the rigid printed circuit board 7. An image signal obtained by the semiconductor chip 2 is taken out via the electrode pad 8. The electrode pads 8 of the semiconductor chip 2 and the electrode pads 9 on the rigid printed circuit board 7 are electrically connected by bonding wires 10.

  According to the present embodiment, the spacer 4 has a structure in which two layers of spacer members 5a, 5b and three layers of adhesives 6a, 6c, 6b are alternately stacked. By adjusting the thickness 5b, the thickness of the spacer 4 (and hence the distance d) can be easily controlled and set to a desired value.

  By the way, if the distance d between the surface of the imaging region 2a and the translucent member 3 is narrow, foreign matters and scratches on the translucent member 3 are projected on the surface of the imaging region 2a with high contrast and appear in the captured image. End up. However, widening the distance d blurs the image of foreign matter or scratches, lowers the contrast, and makes it difficult to appear in the captured image. Therefore, it is preferable to widen the distance between the surface of the imaging region 2a and the translucent member 3.

  On the other hand, the distance between the semiconductor chip 2 and the photographic lens (not shown) is determined by the lens design. For example, a camera member such as a shutter, a mirror, or an infrared cut glass needs to be disposed therebetween, so that the imaging region 2a. Even if the distance d between the surface and the translucent member is increased, there is a limit (maximum allowable distance).

  For this reason, it is desirable that the distance d between the imaging region 2a of the semiconductor chip 2 and the translucent member 3 be as wide as possible within the range of the maximum allowable distance or less.

  However, unlike the present embodiment, if the translucent member 3 is fixed to the semiconductor chip 2 with only one layer of adhesive instead of the spacers 4, the distance d between the imaging region 2a and the translucent member 3 is as follows. Since it is determined by the height of the one-layer adhesive, it is difficult to set the distance d by controlling it to a desired value. Therefore, if the translucent member 3 is fixed to the semiconductor chip 2 with only one layer of adhesive, the interval d cannot be set to a value close to the maximum allowable interval and is considerably narrower than the maximum allowable interval. I have to. For this reason, if the translucent member 3 is fixed to the semiconductor chip 2 with only one layer of adhesive, the influence of foreign matter and scratches on the translucent member 3 becomes large, and the allowable foreign matter and scratches are increased. As a result of the severe standards, the yield of the solid-state imaging device is reduced, and an increase in cost is inevitable.

  On the other hand, according to the present embodiment, as described above, the height of the spacer 4 (and hence the distance d) can be easily controlled and set to a desired value. The distance d with respect to the optical member 3 can be set to a value close to the maximum allowable distance. For this reason, according to the present embodiment, the influence of foreign matters and scratches on the translucent member 3 is reduced, and the allowable foreign matter and scratch standards are relaxed. As a result, the yield of the solid-state imaging device 1 is improved. Thus, cost reduction can be achieved.

  By the way, when the environmental temperature changes, the semiconductor chip 2 tends to warp due to the bimetal effect resulting from the difference between the thermal expansion coefficient of the semiconductor chip 2 and the thermal expansion coefficient of the translucent member 3. When the image pickup surface of the semiconductor chip 2 is warped, a focus shift occurs at the time of shooting, and an acquired image is deteriorated, and the image pickup performance is deteriorated. However, if an adhesive is interposed between the semiconductor chip 2 and the translucent member 3, the adhesive is softer than the semiconductor chip 2 or the translucent member 3, so that the stress due to the bimetal effect is relieved to some extent, The warp of the semiconductor chip 2 is reduced to some extent.

  However, unlike the present embodiment, when the translucent member 3 is fixed to the semiconductor chip 2 with only one layer of adhesive instead of the spacer 4, the spacer 4 is composed of one layer of spacer member and one layer on both sides thereof. In the case where the adhesive is composed only of each adhesive, the number of adhesive layers interposed between the semiconductor chip 2 and the translucent member 3 is limited to one layer or two layers, so that the total thickness of the adhesive Thus, the warp of the semiconductor chip 2 due to the change in the environmental temperature cannot be reduced so much.

  On the other hand, according to the present embodiment, the spacer 4 has a structure in which two layers of spacer members 5a and 5b and three layers of adhesives 6a, 6c, and 6b are alternately stacked. The number of layers of the adhesives 6a, 6c, and 6b interposed between the semiconductor chip 2 and the translucent member 3 is increased, and the total thickness of the adhesives 6a, 6c, and 6b can be increased. Therefore, according to the present embodiment, the semiconductor due to a change in environmental temperature is compared with the case where the number of layers of the adhesive interposed between the semiconductor chip 2 and the translucent member 3 is limited to one or two layers. The warp of the chip 2 can be reduced, and the imaging performance can be improved.

  Furthermore, the thermal expansion coefficient of each spacer member 5a, 5b is set to an intermediate value between the thermal expansion coefficient of the main constituent material of the semiconductor chip 2 and the thermal expansion coefficient of the translucent member 3, and with respect to the semiconductor chip 2. If the coefficient of thermal expansion of the spacer members stacked at a closer position is set to a value closer to the coefficient of thermal expansion of the main constituent material of the semiconductor chip 2, the difference between expansion and contraction due to heat between bonded substances can be reduced. Further, it is possible to further reduce the warp of the semiconductor chip 2 due to a change in the environmental temperature.

  As described above, according to the present embodiment, it is possible to reduce the warping of the semiconductor chip 2 due to the change of the environmental temperature while reducing the cost by reducing the influence of foreign matters and scratches on the translucent member 3. Imaging performance can be improved.

[Second Embodiment]
FIG. 3 is a schematic cross-sectional view schematically showing an electronic camera 100 according to the second embodiment of the present invention.

  The solid-state imaging device 1 according to the first embodiment is incorporated in the body 101 of the electronic camera 100 according to the present embodiment. The electronic camera 100 according to the present embodiment is configured as a single-lens reflex type electronic still camera. However, the solid-state imaging device 1 according to the first embodiment is different from other electronic still cameras, video cameras, and mobile phones. You may incorporate in various electronic cameras, such as a camera mounted in.

  In electronic camera 100 according to the present embodiment, body 101 is provided with interchangeable photographic lens 102. The subject light that has passed through the photographing lens 102 is reflected upward by the quick return mirror 103 and forms an image on the screen 104. The subject image formed on the screen 104 is observed from the finder observation window 107 through the eyepiece lens 106 from the penta roof prism 105. When the release button (not shown) is fully pressed, the quick return mirror 103 jumps upward, and the subject image from the photographing lens 102 enters the solid-state imaging device 1 described above.

  The solid-state imaging device 1 is positioned and fixed in the body 101 by being attached to the body 101 via a bracket (not shown) and a position adjusting mechanism (not shown).

  According to the present embodiment, since the solid-state imaging device 1 according to the first embodiment is used, the cost can be reduced and the image quality can be improved.

[Third Embodiment]
FIG. 4 is a schematic plan view schematically showing a solid-state imaging device 21 according to the third embodiment of the present invention, and corresponds to FIG. FIG. 5 is a schematic cross-sectional view schematically showing the solid-state imaging device 21 shown in FIG. 4 and corresponds to FIG. 4 and 5, elements that are the same as or correspond to those in FIGS. 1 and 2 are given the same reference numerals, and redundant descriptions thereof are omitted.

  The solid-state imaging device 21 according to the present embodiment is different from the solid-state imaging device 1 according to the first embodiment in the structure relating to the input / output unit of the semiconductor chip 2. That is, in the present embodiment, unlike the first embodiment, a ball grid connected to the back surface of the semiconductor chip 2 opposite to the imaging region 2a from the front surface via a via hole (not shown). An array (BGA) 22 is provided, and the ball grid array 22 is electrically connected to an electrode pad (not shown) on the rigid printed circuit board 7.

  Also in this embodiment, the same advantages as those in the first embodiment can be obtained. Further, according to the present embodiment, since the ball grid array 22 on the back surface of the semiconductor chip 2 is used as the input / output terminal of the semiconductor chip 2, the size can be reduced as compared with the first embodiment.

  The solid-state imaging device 21 according to the present embodiment can be used in place of the solid-state imaging device 1 in the electronic camera 100 according to the second embodiment. This is the same for each solid-state imaging device described later.

[Fourth Embodiment]
FIG. 6 is a schematic plan view schematically showing a solid-state imaging device 31 according to the fourth embodiment of the present invention, and corresponds to FIG. FIG. 7 is a schematic cross-sectional view schematically showing the solid-state imaging device 31 shown in FIG. 6 and corresponds to FIG. 6 and 7, the same or corresponding elements as those in FIGS. 1 and 2 are denoted by the same reference numerals, and redundant description thereof is omitted.

  The solid-state imaging device 31 according to the present embodiment is different from the solid-state imaging device 1 according to the first embodiment in the structure relating to the input / output unit of the semiconductor chip 2, and the image signal is transmitted via the flexible printed circuit board 32. It is a point to take out.

  The solid-state imaging device 31 according to the present embodiment includes a semiconductor chip 2 having an imaging region 2a, a translucent member 3 installed so as to cover the imaging region 2a and be spaced from the imaging region 2a, and a translucency The spacer 4 is provided between the member 3 and the flexible printed circuit board 32 as the fixed portion, and fixes the translucent member 3 to the flexible printed circuit board 32.

  In the present embodiment, the flexible printed circuit board 32 is used as a wiring member that relays electrical connection between a predetermined circuit board (not shown) and the semiconductor chip 2. The flexible printed circuit board 32 has an opening 32 a at least in a region facing the imaging region 2 a of the semiconductor chip 2.

  Electrode pads (not shown) are formed on the upper surface near the outer periphery of the semiconductor chip 2, and electrode pads (not shown) are formed on the lower surface around the opening 32 a in the flexible printed circuit board 32, and metal bumps are formed between them. 33 is joined. Although not shown in the drawing, an adhesive (not shown) is formed between the vicinity of the outer periphery of the semiconductor chip 2 and the periphery of the opening 32a in the flexible printed circuit board 32 (including the vicinity of the metal bumps 33). Thereby, the airtightness of the space between the imaging region 2a and the translucent member 3 is maintained.

  In the present embodiment, the spacer 4 is provided between the upper surface around the opening 32 a in the flexible printed board 32 and the translucent member 3. The spacer 4 in the present embodiment is configured in the same manner as the spacer 4 in the first embodiment. Thereby, the translucent member 3 is fixed to the flexible printed circuit board 32 by the spacer 4 so that the translucent member 3 covers the imaging area 2a of the semiconductor chip 2 and is spaced from the imaging area 2a. is set up. The spacer 4 is provided over the entire circumference of the opening 32a in the flexible printed board 32, and the airtightness of the space between the imaging region 2a and the translucent member 3 is maintained.

  The surface of the semiconductor chip 2 opposite to the imaging region 2a (the lower surface in FIG. 7) may be installed on a support substrate (not shown) as necessary. In this case, for example, the lower surface of the semiconductor chip 2 can be bonded to the upper surface of the support substrate with an adhesive or a die attach film. The support substrate may be a plate made of an arbitrary material such as a metal plate or a ceramic plate, or may be a rigid printed substrate forming a circuit board.

  Also in this embodiment, the same advantages as those in the first embodiment can be obtained. In addition, according to the present embodiment, the flexible printed circuit board 32 is mainly made of resin and has a stress relaxation effect, so that the warpage of the semiconductor chip 2 due to a change in environmental temperature can be further reduced. it can.

[Fifth Embodiment]
FIG. 8 is a schematic cross-sectional view schematically showing a solid-state imaging device 41 according to the fifth embodiment of the present invention, and corresponds to FIG. 8, elements that are the same as or correspond to those in FIG. 7 are given the same reference numerals, and redundant descriptions thereof are omitted.

  The solid-state imaging device 41 according to the present embodiment is different from the solid-state imaging device 41 according to the fourth embodiment in that a rigid printed circuit board 42 is provided instead of the flexible printed circuit board 32.

  The solid-state imaging device 41 according to the present embodiment includes a semiconductor chip 2 having an imaging region 2a, a translucent member 3 that covers the imaging region 2a and is spaced from the imaging region 2a, and a translucency A spacer 4 is provided between the member 3 and a rigid printed circuit board 42 as a fixed portion, and fixes the translucent member 3 to the rigid printed circuit board 42.

  In the present embodiment, the rigid printed circuit board 42 constitutes a circuit board on which a predetermined circuit is mounted, and has an opening 42 a at least in a region facing the imaging region 2 a of the semiconductor chip 2. The material of the rigid printed circuit board 42 is not limited to these as long as it can retain its shape, such as resin, ceramic, glass, and the like.

  Electrode pads (not shown) are formed on the upper surface in the vicinity of the outer periphery of the semiconductor chip 2, and electrode pads (not shown) are formed on the lower surface around the opening 42 a in the rigid printed board 42. 43 are joined. Although not shown in the drawing, an adhesive (not shown) is formed between the vicinity of the outer periphery of the semiconductor chip 2 and the periphery of the opening 42a in the rigid printed circuit board 42 (including the vicinity of the metal bump 43). Thereby, the airtightness of the space between the imaging region 2a and the translucent member 3 is maintained.

  In the present embodiment, the spacer 4 is provided between the upper surface around the opening 42 a in the rigid printed board 42 and the translucent member 3. The spacer 4 in the present embodiment is configured in the same manner as the spacer 4 in the first embodiment. Thereby, the translucent member 3 is fixed to the rigid printed circuit board 42 by the spacer 4, so that the translucent member 3 covers the imaging region 2 a of the semiconductor chip 2 and is spaced from the imaging region 2 a. is set up. The spacer 4 is provided over the entire circumference of the opening 42a in the rigid printed circuit board 42, and the airtightness of the space between the imaging region 2a and the translucent member 3 is maintained.

  According to the present embodiment, as in the first and fourth embodiments, the interval d between the imaging region 2a and the translucent member 3 is set to a value close to the maximum allowable interval. As a result, the influence of foreign matter and scratches on the translucent member 3 is reduced, and the standards for allowable foreign matter and scratches are relaxed. As a result, the yield of the solid-state imaging device 41 is improved and the cost is reduced. Can be planned.

[Sixth Embodiment]
FIG. 9 is a schematic plan view schematically showing a solid-state imaging device 51 according to the sixth embodiment of the present invention, and corresponds to FIG. FIG. 10 is a schematic cross-sectional view schematically showing the solid-state imaging device 51 shown in FIG. 9, and corresponds to FIG. 9 and 10, the same or corresponding elements as those in FIGS. 1 and 2 are denoted by the same reference numerals, and redundant description thereof is omitted.

  The solid-state imaging device 51 according to the present embodiment is different from the solid-state imaging device 1 according to the first embodiment in the structure relating to the input / output unit of the semiconductor chip 2. That is, in this embodiment, unlike the first embodiment, the image signal obtained by the semiconductor chip 2 passes through two semiconductor chips 52 and two flexible printed boards 53 different from the semiconductor chip 2. And then taken out.

  The semiconductor chip 2 and the two semiconductor chips 52 are connected by metal bumps 54, and each semiconductor chip 52 and each flexible printed circuit board 53 are connected by metal bumps 55.

  In the present embodiment, for example, the semiconductor chip 2 includes a plurality of pixels and a readout circuit that drives the pixels and reads out an image signal, and one semiconductor chip 52 outputs one signal output from the semiconductor chip 2. A processing circuit for performing processing such as AD conversion on the image signal of the part is mounted, and processing for performing processing such as AD conversion on the remaining image signal output from the semiconductor chip 2 is mounted on the other semiconductor chip 52. A circuit is installed. The output signal output from each semiconductor chip 52 is output to the outside via each flexible printed circuit board 53.

  According to the present embodiment, the same advantages as those of the first embodiment can be obtained. In the present embodiment, the imaging performance can be improved (high speed and low power consumption) by using the semiconductor chip 52 designed and manufactured under optimum conditions, separately from the semiconductor chip 2.

  Although the embodiments of the present invention have been described above, the present invention is not limited to these embodiments.

1, 21, 31, 41, 51 Solid-state imaging device 2 Semiconductor chip 2a Imaging area 3 Translucent member 4 Spacer 5a, 5b Spacer member 6a, 6b, 6c Adhesive 32 Flexible printed circuit board 42 Rigid printed circuit board 52 Semiconductor chip 100 Electronic camera

Claims (9)

A semiconductor chip having an imaging region;
A translucent member installed to cover the imaging area and to be spaced from the imaging area;
A plurality of spacer members stacked between the translucent member and the fixed portion; a spacer for fixing the translucent member to the fixed portion;
A solid-state imaging device comprising:   The spacer is between one spacer member of the plurality of spacer members and the fixed part, between one other spacer member of the plurality of spacer members and the translucent member, and The solid-state imaging device according to claim 1, further comprising an adhesive that bonds each of the plurality of spacer members. The fixed part is the semiconductor chip,
The spacer is provided between a region outside the imaging region in the semiconductor chip and the translucent member.
The solid-state imaging device according to claim 1, wherein the solid-state imaging device is provided. The surface of the semiconductor chip opposite to the imaging region is installed on a rigid printed board,
The semiconductor chip and the rigid printed circuit board are electrically connected by bonding wires or a ball grid array,
The solid-state imaging device according to claim 3. A flexible printed circuit board having an opening in at least a region corresponding to the imaging region is bonded to the surface of the semiconductor chip on the imaging region side,
The fixed part is the flexible printed circuit board,
The spacer is provided between the translucent member and the periphery of the opening in the flexible printed circuit board.
The solid-state imaging device according to claim 1, wherein the solid-state imaging device is provided. The thermal expansion coefficient of each spacer member is an intermediate value between the thermal expansion coefficient of the main constituent material of the semiconductor chip and the thermal expansion coefficient of the translucent member,
The thermal expansion coefficient of each spacer member is closer to the thermal expansion coefficient of the main constituent material of the semiconductor chip as the thermal expansion coefficient of the spacer member stacked closer to the semiconductor chip. The solid-state imaging device according to claim 2. A rigid printed circuit board having an opening in at least a region corresponding to the imaging region is bonded to a surface of the semiconductor chip on the imaging region side,
The fixed part is the rigid printed circuit board,
The spacer is provided between the transparent member and the periphery of the opening in the rigid printed circuit board.
The solid-state imaging device according to claim 1, wherein the solid-state imaging device is provided.   The solid-state imaging device according to claim 1, further comprising another semiconductor chip bonded to the semiconductor chip.   An electronic camera comprising the solid-state imaging device according to claim 1.

Images