JP6107373B2 - Imaging device and imaging unit - Google Patents

Description

  The present invention relates to an imaging device and an imaging unit used in the imaging device.

  In Patent Document 1 below, an optical member that transmits imaging light, a flexible printed board in which a connection pattern is provided on one surface, and the surface of the optical member is fixed to the other surface, and the imaging surface are the above-described ones. An image sensor electrically connected to the connection pattern on the one surface of the flexible printed circuit board via a bump so as to face the optical member, and a plate shape fixed to the back surface of the image sensor surface of the image sensor An image pickup apparatus having a support member is disclosed.

JP 2006-332894 A

  However, since the conventional imaging device requires the support member, the number of parts increases correspondingly, and an increase in cost cannot be avoided.

  The present invention has been made in view of such circumstances, and an imaging apparatus that can reduce the number of parts and can reduce the cost, and an imaging unit that can be used in such an imaging apparatus or the like. The purpose is to provide.

  The following aspects are presented as means for solving the problems. An image pickup apparatus according to a first aspect includes a lens mount for holding a photographic lens in a replaceable manner, a mount base to which the lens mount is attached, a semiconductor chip having an image pickup region, and a bump bond to the semiconductor chip, and a support member. And a rigid printed circuit board attached to the mount base without any intervention.

  An imaging unit according to a second aspect includes a rigid having a semiconductor chip having an imaging region, an opening in a region including the region facing the imaging region, and bump bonding to a surface of the semiconductor chip on the imaging region side A printed circuit board, and a light-transmitting plate bonded to the surface of the rigid printed circuit board opposite to the semiconductor chip so as to close the opening, and an uneven portion is provided on an end surface of the opening. It is a thing.

  An imaging unit according to a third aspect includes a semiconductor chip having an imaging area, a rigid having an opening in an area including an area facing the imaging area, and bump-bonded to a surface of the semiconductor chip on the imaging area side A printed circuit board; and a light-transmitting plate adhered to the surface of the rigid printed circuit board opposite to the semiconductor chip so as to close the opening, and an antireflection coating is applied to an end surface of the opening. It has been done.

  An imaging unit according to a fourth aspect includes a semiconductor chip having an imaging area, a rigid having an opening in an area including an area facing the imaging area, and bump-bonded to a surface of the semiconductor chip on the imaging area side An opposing surface that includes a printed circuit board and a light-transmitting plate that is bonded to the surface of the rigid printed circuit board opposite to the semiconductor chip so as to close the opening, and that faces the outer peripheral end surface of the semiconductor chip A seal portion is provided on the rigid printed circuit board, and seals between the semiconductor chip and the rigid printed circuit board between an outer peripheral end surface of the semiconductor chip and the opposing surface of the bank structure. A material is provided.

  An imaging apparatus according to a fifth aspect is the imaging apparatus according to the first aspect, provided between the mount base and the rigid printed board, and an elastic body that urges the rigid printed board in a direction in which an interval between both is widened. A screw for defining the interval against the urging force of the elastic body.

  In the imaging device according to a sixth aspect, in the first or fifth aspect, the rigid printed circuit board is bump-bonded to a surface of the semiconductor chip on the imaging area side, and the rigid printed circuit board is connected to the imaging area. An opening is provided in a region including the opposing region, and a translucent plate adhered to the surface of the rigid printed board opposite to the semiconductor chip so as to close the opening.

  In the imaging device according to a seventh aspect, in the sixth aspect, an uneven portion is provided on an end surface of the opening.

  In the imaging device according to an eighth aspect, in the seventh aspect, the concavo-convex portion has a cross-sectional step shape in which the area of the opening narrows toward the rear side in the optical axis direction, or a cross-sectional saw blade shape. It is what makes.

  In the imaging device according to a ninth aspect, in any one of the sixth to eighth aspects, an antireflection coating is applied to the end face of the opening.

  In the imaging device according to a tenth aspect, in any of the first and fifth to seventh aspects, a bank portion having a facing surface facing the outer peripheral end surface of the semiconductor chip is provided on the rigid printed circuit board, A sealing material for sealing between the semiconductor chip and the rigid printed circuit board is provided between an outer peripheral end surface of the semiconductor chip and the facing surface of the bank portion.

  In the imaging device according to an eleventh aspect according to any one of the seventh to tenth aspects, the rigid printed circuit board is a multilayer printed circuit board, and the uneven portion and / or the bank portion constitutes the multilayer printed circuit board. It is comprised using the layer to do.

  According to the present invention, it is possible to reduce the number of components, reduce the thickness in the thickness direction, and further reduce costs, and can be used in such an imaging device. An imaging unit can be provided.

It is a schematic sectional drawing which shows typically the electronic camera by the 1st Embodiment of this invention. It is a schematic sectional drawing which shows typically the imaging unit in FIG. FIG. 2 is a schematic exploded perspective view showing main components in FIG. 1. It is a schematic perspective view which shows the main components in FIG. It is the schematic sectional drawing which shows the attachment structure with respect to the mount base of an imaging unit, and its exploded view. It is a schematic sectional drawing which shows typically the electronic camera by 2nd Embodiment. It is a schematic sectional drawing which shows typically the imaging unit of the electronic camera by the 3rd Embodiment of this invention. It is a schematic sectional drawing which shows typically the imaging unit of the electronic camera by the 4th Embodiment of this invention.

  Hereinafter, an imaging unit and an imaging apparatus according to the present invention will be described with reference to the drawings.

[First Embodiment]
FIG. 1 is a schematic cross-sectional view schematically showing an electronic camera 1 as an imaging apparatus according to the first embodiment of the present invention. As shown in FIG. 1, an X axis, a Y axis, and a Z axis that are orthogonal to each other are defined. Of the X axis directions, the direction of the arrow is called the + X direction or the + X side, and the opposite direction is called the -X direction or the -X side, and the same applies to the Y axis direction and the Z axis direction. The Z-axis coincides with the direction of the optical axis O of the photographing lens 3 of the electronic camera 1, the X-axis coincides with the left-right direction (horizontal direction) of the electronic camera 1, and the Y-axis coincides with the up-down direction (vertical direction) of the electronic camera 1. Is consistent with The −Z side is called the front side on the subject side, and the + Z side is called the rear side. These points are the same for the drawings described later.

  The electronic camera 1 according to the present embodiment is configured as a single-lens reflex digital camera. However, the imaging apparatus according to the present invention is not limited to this, and is applied to an imaging lens exchangeable imaging apparatus such as a mirrorless camera. Can do.

  The electronic camera 1 according to the present embodiment includes a camera body 2 and a photographing lens 3 that is exchangeably held by the camera body 2. In FIG. 1, the photographing lens 3 is indicated by an imaginary line.

  The camera body 2 includes a lens mount (body-side mount) 11 that holds the photographing lens 3 in an exchangeable manner, a mount base 12 to which the lens mount 11 is attached, and an outer housing 13 that accommodates these and components to be described later. And have. The mount base 12 has a central opening 12a along the optical axis O, and the lens mount 11 is attached to the front side thereof. The camera body 2 includes a quick return mirror 14, a focal plane shutter 15, and an imaging unit 16 as members disposed along the optical axis O in the central opening 12 a of the mount base 12. Further, the camera body 2 includes a focusing screen 17, a pentaprism 18, and an eyepiece 19 as members that are fixedly supported on the upper side of the mount base 12 and constitute a finder device. A finder observation window 20 is provided at a position facing the eyepiece 19 in the outer housing 13.

  The subject light that has passed through the photographic lens 3 is reflected upward by the quick return mirror 14 and forms an image on the focusing screen 17. The subject image formed on the focusing screen 17 is observed from the finder observation window 20 through the eyepiece 19 through the pentaprism 18. The quick return mirror 14 jumps upward when a release button (not shown) is fully pressed, and the subject image from the photographing lens 3 enters the imaging unit 16.

  A liquid crystal display device 21 is provided on the back surface of the outer casing 13 of the camera body 2. Between the imaging unit 16 and the liquid crystal display device 21, a circuit board 22 on which a predetermined circuit (for example, a control circuit for controlling the entire camera) is mounted is supported and arranged by a member (not shown).

  FIG. 2 is a schematic cross-sectional view schematically showing the imaging unit 16 in FIG. FIG. 3 is a schematic exploded perspective view showing the lens mount 11, the mount base 12, and the imaging unit 16 in FIG. FIG. 4 is a schematic perspective view showing the lens mount 11, the mount base 12, the imaging unit 16, the circuit board 22, and the flexible printed board 23 in FIG. FIG. 4 shows a state in which the lens mount 11 and the imaging unit 16 are attached to the mount base 12, and shows a state before the flexible printed circuit board 23 is connected to the rigid printed circuit board 32 and the circuit board 22. 4 shows most of the mounting components 71 mounted on the circuit board 22, but only a part of the mounting components 48 mounted on the rigid printed circuit board 32 is shown. In FIG. 3, the mounting component 48 mounted on the rigid printed board 32 is not shown.

  In the present embodiment, the imaging unit 16 includes a semiconductor chip 31 having an imaging region (light receiving region) 31a on the front surface (-Z side surface), a rigid printed board 32, and glass as a first light-transmitting plate. A plate 33, a frame-shaped rubber member 34, an optical low-pass filter 35 as a second light-transmitting plate, and a frame-shaped pressing member 36 are provided.

  In the present embodiment, the semiconductor chip 31 is an image sensor such as a CMOS or CCD configured as a chip, and a plurality of pixels (not shown) are two-dimensionally arranged in the imaging region 31a. The semiconductor chip 31 photoelectrically converts incident light that has entered the imaging region 31a via the glass plate 33, and outputs an image signal. For example, a read circuit (not shown) that reads out an image signal by driving the pixels and a processing circuit (for example, an AD conversion circuit) that processes an output signal may be mounted on the semiconductor chip 31.

  The rigid printed circuit board 32 constitutes a circuit board on which a predetermined circuit (for example, a circuit for controlling an image sensor mounted on the semiconductor chip 31) is mounted, and is an area facing the imaging area 31a of the semiconductor chip 31. There is an opening 32a formed in a region including. The rigid printed circuit board 32 is connected to the circuit board 22 by the flexible printed circuit board 23. Note that, for example, only the relay wiring for relaying the electrical connection between the semiconductor chip 31 and the circuit board 22 may be mounted on the rigid printed circuit board 32. Further, depending on the degree of integration of the rigid printed circuit board 32, the circuit mounted on the circuit board 22 may be mounted on the rigid printed circuit board 32 without providing the circuit board 22.

  Electrode pads (not shown) are formed on the front surface (the surface on the −Z side) near the outer periphery of the semiconductor chip 31, and the electrode pads 50 are formed on the rear surface (the surface on the + Z side) around the opening 32 a in the rigid printed circuit board 32. They are formed and joined by bumps 51 between them. An adhesive 52 as a sealing material is formed between the outer peripheral end surface of the semiconductor chip 31 and a bank portion 45 described later around the opening 32 a in the rigid printed circuit board 32. Thereby, the space between the semiconductor chip 31 and the rigid printed circuit board 32 is sealed so that the airtightness of the space between the imaging region 31a and the glass plate 33 is maintained. In addition, about the part which mounts the semiconductor chip 31 in the rigid printed circuit board 32, it is preferable to improve the flatness by manufacturing the rigid printed circuit board 32 with the manufacturing method which improves flatness, or grind | polishing.

  The glass plate 33 is bonded to the front surface of the rigid printed circuit board 32 (the surface on the −Z side and the surface opposite to the semiconductor chip 31) so as to close the opening 32a. In the present embodiment, the outer peripheral side portion of the rear surface (+ Z side surface) of the glass plate 33 is brought into close contact with the peripheral portion of the opening 32 a on the front surface (−Z side surface) of the rigid printed circuit board 32. The outer peripheral end surface and the front surface of the rigid printed circuit board 32 are bonded with an adhesive 53. Thereby, the space between the glass plate 33 and the rigid printed circuit board 32 is sealed so that the airtightness of the space between the imaging region 31a and the glass plate 33 is maintained. Instead of bonding the glass plate 33 and the rigid printed circuit board 32 with the adhesive 53 disposed on the outer peripheral end surface of the glass plate 33, the outer peripheral side portion and the rigid portion on the rear surface (+ Z side surface) of the glass plate 33 are used. You may adhere | attach between the glass plate 33 and the rigid printed circuit board 32 with the adhesive agent arrange | positioned between the peripheral part of the opening part 32a in the front surface (-Z side surface) of the printed circuit board 32. FIG.

  When glass plates having different linear expansion coefficients are used, in order to absorb a change in stress due to the difference in linear expansion coefficients between the rigid printed circuit board 32 and the glass plate 33, a soft (flexible) adhesive is used as the adhesive 53. It is preferable to use an agent (for example, an acrylic adhesive).

  In addition, as a 1st translucent board, it replaces with the glass plate 33 and you may use other translucent boards, such as a transparent resin board and an optical low-pass filter.

  In the present embodiment, the rigid printed board 32 is a five-layer laminated printed board having insulating layers 41 to 45 laminated in order from the −Z side to the + Z side. Conductive patterns 46 constituting wirings and the like are formed between the insulating layers 43 and 44, on the + Z side of the insulating layer 43 and on the −Z side of the insulating layer 44, and through vias 47 are formed in the insulating layers 43 and 44. The portions of the rigid printed board 32 other than the insulating layers 41, 42, 45 are configured in the same manner as a general two-layer laminated printed board. A mounting component 48 is mounted on the surface on the −Z side of the insulating layer 43 where the insulating layers 41 and 42 are not formed and the surface on the + Z side of the insulating layer 44 where the insulating layer 45 is not formed.

  By the way, when the distance d between the imaging region 31a of the semiconductor chip 31 and the glass plate 33 is narrow, a defect such as a foreign matter or a scratch on the glass plate 33 is projected on the surface of the imaging region 31a with high contrast, and the captured image is displayed. It will be reflected in. However, widening the interval d blurs the image of defects such as foreign matters and scratches, lowers the contrast, and makes it difficult to capture in the captured image, so that the standard of allowable defects is relaxed and the yield of the imaging unit 16 is improved. Thus, cost reduction can be achieved. Therefore, it is preferable that the distance d is wide, and the distance d is preferably set to 1 mm or more, for example. In the present embodiment, the insulating layers 41 and 42 are provided as spacers for increasing the distance d. By using the insulating layers 41 and 42 constituting the multilayer printed board as the spacer, the spacer can be easily formed. However, in the present invention, the spacer does not necessarily need to be formed of the insulating layer of the multilayer printed board, and the interval d may be narrowed without providing the spacer.

  In the present embodiment, the insulating layer 45 is provided as a bank portion having a facing surface that faces the outer peripheral end surface of the semiconductor chip 31. An adhesive 52 as a sealing material for sealing between the semiconductor chip 31 and the rigid printed board 32 is provided between the facing surface of the bank portion 45 and the outer peripheral end surface of the semiconductor chip 31. In the present embodiment, the bank portion 45 can restrict the adhesive 52 to be provided only where necessary, and can avoid a situation where the adhesive 52 protrudes to the + Z side. In the present embodiment, the bank portion 45 can be easily formed by using the insulating layer 45 constituting the multilayer printed circuit board as the bank portion 45. However, in the present invention, the bank portion does not necessarily need to be formed of the insulating layer of the multilayer printed board, and the bank portion may not be provided.

  In the present invention, a single-layer printed board may be used as the rigid printed board 32 instead of the laminated printed board.

In order to relieve the deformation stress between the semiconductor chip 31 and the rigid printed circuit board 32 due to heat, prevent the separation of the bumps 51 and ensure the mounting quality of the bumps 51, the material of the semiconductor chip 31 is used as the material of the rigid printed circuit board 32. It is preferable to use a material having a linear expansion coefficient close to the linear expansion coefficient. For example, since the material of the semiconductor chip 31 is usually silicon (its linear expansion coefficient is 3 × 10 ⁻⁶ / K), the linear expansion coefficient is 3 as the material of the rigid printed circuit board 32 (particularly, the material of the insulating layer). It is preferable to use a material of 10 × 10 ⁻⁶ / K or more and 9 × 10 ⁻⁶ / K or less, specifically, Pyrex (registered trademark) glass (its linear expansion coefficient is 3.2 × 10 ⁻⁶ / K). ) and, LTCC (low temperature co-fired ceramic. coefficient of linear expansion ^{10 -6 /K~8.5×10} -6 / K) and 3.5 ×, AIN (aluminum nitride. its linear expansion coefficient of 5 × 10 ⁻⁶ / K) or the like is preferably used. When the rigid printed circuit board 32 is a single-layer printed circuit board, it is also preferable to use glass having a linear expansion coefficient close to that of silicon as the material of the rigid printed circuit board 32.

  In the present embodiment, the area of the opening 32a (area of the plane parallel to the XY plane) is directed to the + Z direction (rearward in the direction of the optical axis O) on the end surface of the opening 32a of the rigid printed circuit board 32. B) Concave and convex portions having a stepped cross-sectional shape are provided. In the present embodiment, the concavo-convex portion having the stepped cross section uses the layers 41 to 44 constituting the multilayer printed board by sequentially reducing the sizes of the openings of the layers 41 to 44 constituting the multilayer printed board. Configured. Therefore, in the present embodiment, the uneven portion on the end face of the opening 32a can be easily formed.

  The rigid printed circuit board 32 has three ear portions 32c having attachment holes 32b. One ear 32c is arranged to protrude to the + Y side on the -X side, the other ear 32c is arranged to protrude to the + Y side on the + X side, and the remaining one ear 32c is arranged to the + X side It is arranged so as to protrude to the −Y side at the side. The mount base 12 has an imaging unit mounting portion 12b that protrudes rearward (to the + Z side) at a position corresponding to each ear portion 32c on the rear surface side. The rigid printed circuit board 32 is attached to the imaging unit attachment portion 12b of the mount base 12 without using a plate-like support member by the attachment structure shown in FIG.

  FIG. 5A is a schematic sectional view showing a mounting structure of the imaging unit 16 (particularly, the rigid printed circuit board 32) to the mount base 12, and FIG. 5B is an exploded view thereof.

  Each imaging unit mounting portion 12b of the mount base 12 is formed with a screw hole 12c into which the screw 61 is screwed and a receiving groove 12d around which the spring 63 is received. A part of the spring 63 is inserted into the receiving groove 12d of each imaging unit mounting portion 12b, a collar 62 made of resin or aluminum is inserted into the mounting hole 32b of each ear portion 32c of the rigid printed circuit board 32, and the screw 61 is colored. 62 and the spring 63 are inserted and screwed into the screw holes 12c of the imaging unit mounting portions 12b. At this time, the spring 63 is pressed and contracted between the imaging unit mounting portion 12b and the ear portion 32c of the rigid printed circuit board 32, and urges the rigid printed circuit board 32 in a direction in which the interval between them is increased. The screw 61 determines the distance between the imaging unit mounting portion 12 b and the ear portion 32 c of the rigid printed circuit board 32 against the urging force of the spring 63. By adjusting the screwing amount of each screw 61, the position of each ear portion 32c of the rigid printed board 32 with respect to each imaging unit mounting portion 12b of the mount base 12 can be adjusted. The position or tilt of the semiconductor chip 31) in the Z-axis direction can be adjusted.

  In the present embodiment, the spring 63 is used as an elastic body that is provided between the mount base 12 and the rigid printed circuit board 32 and biases the rigid printed circuit board 32 in the direction in which the distance between the two is increased. In the invention, another elastic body may be used instead of the spring 63.

  According to the present embodiment, since the rigid printed circuit board 32 is attached to the mount base 12 without using a plate-like support member, the image pickup unit 16 is formed in a plate-like manner as in the second embodiment to be described later. Compared with the case of attaching to the mount base 12 via the support member, the number of parts can be reduced by the amount of the plate-like support member, so that the cost can be reduced and the electronic camera 1 can be made thinner and lighter. it can.

  Further, according to the present embodiment, since the uneven portion is provided on the end face of the opening 32 a of the rigid printed circuit board 32, the reflected light from the end face of the opening 32 a is incident on the imaging region 31 a of the semiconductor chip 31. It becomes difficult to improve the image quality of the captured image. In addition, since the area of the opening 32a expands in the −Z direction, the amount of incident light that is effectively received by the imaging region 31a can be increased.

[Second Embodiment]
FIG. 6 is a schematic sectional view schematically showing an electronic camera according to the second embodiment, and corresponds to FIG. In FIG. 6, the same or corresponding elements as those in FIG. 1 are denoted by the same reference numerals, and redundant description thereof is omitted. This embodiment is different from the first embodiment in the points described below.

  In the present embodiment, instead of the rigid printed board 32 in the first embodiment, a rigid printed board 132 corresponding to a structure obtained by removing the ear portion 32c from the rigid printed board 32 is used. In this embodiment, a plate-like support member 133 having the same shape as that of the rigid printed circuit board 32 in the first embodiment is used. The rigid printed circuit board 132 is attached to the support member 133. The ears 132 c of the support member 133 correspond to the ears 32 c of the rigid printed circuit board 32, and the support member 133 is attached to the imaging unit attaching part 12 b of the mount base 12, similarly to the rigid printed circuit board 32.

  As described above, in the present embodiment, the rigid printed circuit board 132 is attached to the mount base 12 via the plate-like support member.

  Therefore, according to the present embodiment, unlike the first embodiment, the number of components cannot be reduced, and the electronic camera 1 cannot be reduced in thickness and weight.

  However, also in the present embodiment, as in the first embodiment, since the uneven portion is provided on the end face of the opening 32a of the rigid printed circuit board 32, the reflected light at the end face of the opening 32a is a semiconductor. It becomes difficult to enter the imaging region 31a of the chip 31, and the image quality of the captured image is improved. Also in the present embodiment, as in the first embodiment, since the area of the opening 32a is narrowed toward the + Z direction, the amount of incident light that is effectively received by the imaging region 31a is increased. Can be made.

[Third Embodiment]
FIG. 7 is a schematic cross-sectional view schematically showing the imaging unit 216 of the electronic camera according to the third embodiment of the present invention, and corresponds to FIG. In FIG. 7, the same or corresponding elements as those in FIG. 2 are denoted by the same reference numerals, and redundant description thereof is omitted.

  This embodiment differs from the first embodiment in this embodiment in that the end face of the opening 32a of the rigid printed circuit board 32 has a cross-sectional saw-blade shape instead of an uneven portion having a cross-sectional step shape. It is only a point where the uneven | corrugated | grooved part which makes is provided.

  In the present embodiment, the layers 41 to 44 constituting the multilayer printed board are configured to use the layers 41 to 44 constituting the multilayer printed board by inclining the end surfaces of the layers 41 to 44, respectively. Therefore, in the present embodiment, the uneven portion on the end face of the opening 32a can be easily formed.

  Also in this embodiment, the same advantages as those in the first embodiment can be obtained.

[Fourth Embodiment]
FIG. 8 is a schematic sectional view schematically showing the imaging unit 316 of the electronic camera according to the embodiment of the present invention, and corresponds to FIG. In FIG. 7, the same or corresponding elements as those in FIG. 2 are denoted by the same reference numerals, and redundant description thereof is omitted.

  The difference between the present embodiment and the first embodiment is that, in the present embodiment, no irregularities are provided on the end face of the opening 32a of the rigid printed circuit board 32, and the antireflection coating 81 is provided on the end face. It is only the point where is given. As the antireflection coating 81, for example, matte black paint or the like can be used.

  Also in this embodiment, the same advantages as those in the first embodiment can be obtained.

  In the first to third embodiments, an antireflection coating may be applied to the end face of the opening 32a of the rigid printed board 32.

  Although the embodiments of the present invention have been described above, the present invention is not limited to these embodiments.

  For example, the end face of the opening 32a of the rigid printed circuit board 32 is not limited to an uneven portion having a stepped cross section or an uneven portion having a sawtooth shape in cross section, and may be provided with other uneven portions.

  In the present invention, in the first embodiment, it is not necessary to provide an uneven portion or an antireflection coating on the end face of the opening 32a of the rigid printed board 32.

DESCRIPTION OF SYMBOLS 1 Electronic camera 3 Shooting lens 11 Lens mount 12 Mount base 16,216,316 Imaging unit 31 Semiconductor chip 31a Imaging area 32 Rigid printed circuit board 32
32a Opening 33 Glass plate (first translucent plate)

Claims (13)

A lens mount that holds the taking lens interchangeably;
A mount base to which the lens mount is attached;
A semiconductor chip having an imaging region;
A rigid printed circuit board bonded to the semiconductor chip and attached to the mount base without a support member;
Imaging device provided with a. An imaging unit mounted on a mount base of an electronic camera,
A semiconductor chip having an imaging region;
A rigid printed circuit board having an opening in a region including the region facing the imaging region, and bonded to a surface of the semiconductor chip on the imaging region side;
A translucent plate bonded to the surface of the rigid printed circuit board opposite to the semiconductor chip so as to close the opening;
With
The end surface of the opening is provided with an uneven part having a stepped cross-sectional shape in which the area of the opening narrows toward the rear side in the optical axis direction, or an uneven part having a saw-toothed cross section, and is supported by the mount base An imaging unit that can be attached without a member . Imaging unit before Symbol claim 2, wherein the anti-reflective coating is applied to the end surface of the opening. Bank portion having an outer peripheral end surface and the facing opposing surface of the front Symbol semiconductor chip is provided on the rigid printed circuit board,
The imaging unit according to claim 2 , wherein a sealing material that seals between the semiconductor chip and the rigid printed board is provided between an outer peripheral end surface of the semiconductor chip and the facing surface of the bank portion. . An elastic body that is provided between the mount base and the rigid printed circuit board and urges the rigid printed circuit board in a direction in which a gap between the both extends;
A screw for defining the interval against the urging force of the elastic body;
Imaging device 請 Motomeko 1, further comprising a. The rigid printed circuit board is bonded to the surface of the semiconductor chip on the imaging region side,
The rigid printed circuit board has an opening in a region including a region facing the imaging region,
Wherein the surface opposite to the semiconductor chip of the rigid printed circuit board, the imaging apparatus 請 Motomeko 1 or 5, wherein with a glued translucent plate so as to close the opening. Imaging device 請 Motomeko 6, wherein the uneven portion is provided on an end surface of the opening. The uneven portion may either form a cross-section stepped area of the opening is narrowed toward the rear side in the optical axis direction, or cross sawtooth an a to請 Motomeko 7 imaging device according. The rigid printed circuit board is a laminated printed circuit board,
The imaging device according to claim 7 , wherein the uneven portion is configured using a layer constituting the multilayer printed board. 6. Symbol mounting the imaging device antireflective coating is applied on the end surface of the opening. The imaging device according to claim 7, wherein an antireflection coating is applied to the end face of the opening. A bank portion having a facing surface facing the outer peripheral end surface of the semiconductor chip is provided on the rigid printed circuit board,
The outer peripheral end face of the semiconductor chip and between the opposing surfaces of the bank portion, the semiconductor chip and of the rigid printed circuit board and to 請 Motomeko 1 and 5 sealing material is provided for sealing between the 11 The imaging device according to any one of the above. The rigid printed circuit board is a laminated printed circuit board,
The imaging device according to claim 12, wherein the bank portion is configured using a layer constituting the multilayer printed board.

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