JP5332622B2 - Imaging device - Google Patents

Description

  The present invention relates to an imaging apparatus.

  In an optical device such as a single-lens reflex camera, dust may enter the camera body when the lens barrel is replaced. In addition, dust may be generated from a drive unit such as a shutter inside the camera, and such dust may adhere to the light-transmitting member on the front surface of the image sensor, and the dust may appear in the photographing result.

  In order to solve such a problem, a technique for preventing intrusion of dust by making a structure in which an optical path space between a shutter frame and an optical low-pass filter is sealed is known (see Patent Document 1). According to Patent Document 1, an expandable member is narrowed between a shutter frame and an optical low-pass filter to form a sealed space that surrounds the image sensor. Further, it is disclosed that dust is prevented from entering by narrowing the interval between the shutter frame and the optical low-pass filter.

  However, in the conventional technique, dust generated from a drive unit such as a shutter may adhere to the surface of the optical low-pass filter, and may adversely affect the photographing result. In addition, when dust adheres to the surface of the optical low-pass filter, it is difficult to secure a space for mounting a mechanism that sifts off dust due to vibration of the optical low-pass filter.

JP 2004-88593 A

  The present invention has been made in view of such a situation, and an object of the present invention is to provide an imaging apparatus capable of suitable photographing.

In order to achieve the above object, a camera body (100) according to the present invention includes:
A shutter portion (45) having a shutter substrate (43) in which an opening (73) is formed and a shutter blade (44) that blocks light passing through the opening (73);
An imaging unit (4) that captures an image of light passing through the opening (73);
A light transmission member (30) provided between the shutter substrate (43) and the imaging unit (4) and configured to transmit light that has passed through the opening (73);
A vibration section (20) provided in the light transmission member (30) for vibrating the light transmission member (30);
A connection part (14) for connecting the shutter substrate (43) and the imaging part (4) so as to seal the light transmission member (30) and the vibration part (20).

  By connecting the shutter substrate and the imaging unit with the connecting unit, it is possible to improve the airtightness of the space surrounded by the shutter substrate, the imaging unit, and the connecting unit. Furthermore, the space for having the said vibration part can be easily ensured in the sealed space. As a result, not only dust can be prevented from entering through the gap between the shutter substrate and the imaging unit, but also dust generated from the shutter substrate can be removed, and dust is reflected in the photographing result. Can be prevented.

  The light transmission member (30) may be connected to the shutter substrate (43) through the vibration part (20).

  The vibrating portion is provided between the light transmitting member and the shutter substrate, whereby the vibrating portion is fixed to the shutter substrate. Therefore, vibration can be reliably generated in the light transmitting member with relatively small energy.

  The camera body (100) is provided at a portion of the connecting portion (14) facing the light transmitting member (30), and has a dust holding portion (16) for holding dust removed from the light transmitting member (30). You may have.

  By providing the dust holding portion in the connecting portion, dust that has been peeled off due to vibration of the light transmitting member or dust generated from the shutter substrate, shutter blades, etc. is adsorbed, and the dust adheres to the light transmitting member. Can be prevented.

  The vibrating portion (20) may be provided on the outer peripheral side of a region facing the opening (73) of the light transmitting member (30).

  The imaging unit (4) is provided between the imaging element (12) that converts a captured image into an electrical signal, the light transmission member (30), and the imaging element (12), and the light transmission member (30). ) And a connecting portion (14) that connects the transmitting portion (18) and the shutter substrate (43).

  By making the size larger than that of the transmissive portion and the light transmissive member, it becomes easy to connect the shutter substrate and the transmissive portion by the connecting portion. Further, a sealed space surrounding the light transmitting member can be ensured.

  The camera body (100) includes a sealing member (19) that seals the transmission part (18) and the light transmission member (30), and the vibration part (20) includes the shutter substrate (43). And the light transmission member (30). The light transmission member (30) may be at least a part of an optical low-pass filter.

  In the above description, in order to explain the present invention in an easy-to-understand manner, the description is made in association with the reference numerals of the drawings showing the embodiments. However, the present invention is not limited to this. The configuration of the embodiment described later may be improved as appropriate, or at least a part of the configuration may be replaced with another component. Further, the configuration requirements that are not particularly limited with respect to the arrangement are not limited to the arrangement disclosed in the embodiment, and can be arranged at a position where the function can be achieved.

FIG. 1 is a block diagram of a single-lens reflex camera according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of a single-lens reflex camera according to an embodiment of the present invention. FIG. 3 is a partial cross-sectional view showing the configuration of the main part of FIG. 4A is a side view of the optical low-pass filter according to FIG. 3, FIG. 4B is a front view showing the surface of the optical low-pass filter according to FIG. 3, and FIG. 4C is an optical view of FIG. It is a front view which shows the back surface of a low-pass filter. FIG. 5 is a partial cross-sectional view showing a configuration of a main part according to another embodiment of the present invention. 6A is a side view of the optical low-pass filter according to FIG. 5, FIG. 6B is a front view showing the surface of the optical low-pass filter according to FIG. 5, and FIG. 6C is an optical view of FIG. It is a front view which shows the back surface of a low-pass filter. FIG. 7 is a partial cross-sectional view showing a configuration of a main part according to another embodiment of the present invention. 8A is a side view of the optical low-pass filter according to FIG. 7, FIG. 8B is a front view showing the surface of the optical low-pass filter according to FIG. 7, and FIG. 8C is an optical view of FIG. It is a front view which shows the back surface of a low-pass filter.

First Embodiment As shown in FIG. 1, a lens barrel 42 is detachably attached to a camera body 40 of a single-lens reflex camera 100 as a photographing apparatus according to the present embodiment. The camera body 40 includes an image sensor unit 4 that generates image information by photoelectric conversion. An optical low-pass filter 30, a shutter unit 45, a mirror 46, a diaphragm unit 47, and an optical lens group 48 are arranged in front of the image sensor unit 4 in the optical axis Z direction. The optical low-pass filter 30 as a substrate that transmits light is provided to remove a so-called moire phenomenon.

  The camera body 40 is provided with a body CPU 50, and can communicate with a lens CPU 58 provided in the lens barrel 42 via a lens contact 54. The lens contact 54 electrically connects the body CPU 50 and the lens CPU 58 by connecting the lens barrel 42 to the camera body 40. A power source 52 is connected to the body CPU 50. The power source 52 is built in the camera body 40.

  A focal length encoder 66, a distance encoder 64, an aperture drive unit (for example, STM) 68, and the like are connected to the lens CPU 58 in the lens barrel 42. The focal length is input from the focal length encoder 66 to the lens CPU 58 and the focal length information is output to the body CPU 50. The distance encoder 64 detects the extension position of a part of the focusing mechanism of the optical lens group 48. The diaphragm drive unit 68 is controlled by the lens CPU 58 so that the diaphragm 47 is narrowed down. Each member of the lens barrel 42 is supplied with a voltage from a power source 52 of the camera body 40 through a part of the lens contact 54.

  The body CPU 50 in the camera body 40 includes a release switch 51, a strobe 53, a display unit 55, a gyro sensor 70, an EEPROM (memory) 60, an anti-vibration switch 62, a dust-proof filter drive circuit 56, an image processing controller 59, and an AF sensor 72. Etc. are connected. The image processing controller 59 is connected to the image sensor 12 of the image sensor unit 4 via the interface circuit 57, and can control image processing of an image captured by the image sensor.

  The display unit 55 has a function of performing various settings by menu display and displaying a captured image, and is configured by a liquid crystal monitor, for example. The gyro sensor 70 detects an angular velocity caused by camera shake or the like, calculates a shake angle by integrating the detection signal, and uses the output signal for vibration isolation (cancelling shake).

  A signal is input from the body CPU 50 to the dustproof filter driving circuit 56 at ON / OFF of the power supply 52 or at an arbitrary timing, and the dustproof filter is driven at a predetermined frequency in response to an output signal from the dustproof filter driving circuit 56. Perform dustproof operation.

  The mirror 46 on the optical path reflects the light beam incident from the direction of the optical axis Z and guides the image to a finder (not shown), and the sub mirror 46a reflects the light beam transmitted through the mirror 46 to reflect the AF sensor ( For example, it is led to a CCD sensor) 72. The mirror 46 and the sub-mirror 46a are driven by a mirror driving unit (not shown) (for example, a DC motor) and retract from the optical path during exposure.

  The release switch 51 is a switch for operating the shutter drive timing. When the release switch 51 is pressed halfway, the AE, AF, anti-vibration drive, and the like are performed. When the release switch 51 is fully pressed, mirror up, shutter drive, and the like are performed. At this time, the shutter unit 45 is driven by a shutter driving unit (not shown) (for example, a DC motor), and the image sensor 12 receives light.

  The captured image signal photoelectrically converted by the image sensor 12 is input to the body CPU 50 via the interface circuit 57 and the image processing controller 59 and stored in the EEPROM 60. The captured image is displayed on the display unit 55.

  The dustproof filter driving circuit 56 is connected to the piezoelectric element, drives the piezoelectric element by a predetermined input signal, vibrates the optical low-pass filter 30, and removes dust adhering to the surface of the optical low-pass filter 30. I do.

  As shown in FIG. 2, the camera body 40 of the single-lens reflex camera 100 as the imaging apparatus according to the present embodiment has a fixing unit 71 that determines the arrangement of various components. The material of the fixing portion 71 is not particularly limited, but various alloys and highly rigid resins are preferable. The substrate 10 of the imaging unit 4 is fixed to the fixing unit 71 with screws or the like. The imaging unit 4 includes an imaging element 12.

  A shutter unit 45 is disposed in front of the imaging unit 4 in the optical axis Z direction. The shutter unit 45 has shutter blades 44 made of a plurality of light shielding members (focal plane shutter). The shutter unit 45 has an opening 73. A shutter blade 44 is disposed in the opening 73 and is developed so as to block a light beam incident from the optical axis Z direction. Then, while the photographer presses the release switch 51 shown in FIG. 1 and photographing is performed, the shutter blades 44 are temporarily superimposed at a predetermined shutter speed, and the image sensor 12 is exposed for a predetermined time. After a predetermined time elapses (for example, 1/1000 second), the shutter blades 44 are developed again, and the light path is interrupted to complete the exposure.

  As described above, in photographing using a general focal plane shutter, since the shutter blades 44 are repeatedly superimposed and deployed at a very high speed, parts constituting the shutter unit 45 are worn and dust is easily generated. The dust easily adheres to a transparent member (in this embodiment, the optical low-pass filter 30) covering the surface of the imaging unit 4.

  As shown in FIG. 3, the image sensor unit 4 according to the present embodiment includes a substrate 10. An imaging element 12 is fixed in front of the central portion of the substrate 10 in the optical axis Z direction so as to face the transmission glass 18. A case 17 is disposed around the image pickup device 12, and the case 17 is fixed to the surface of the substrate 10 in a detachable or non-detachable manner.

  The case 17 is made of, for example, an insulator such as synthetic resin or ceramic. The transparent glass mounting surface 17a of the case 17 is attached to the inner surface of the transparent glass 18 having optical transparency through an airtight seal member (not shown) having elasticity. In addition, if it is a structure which seals the space which has the image pick-up element 12, an airtight seal member does not necessarily need to intervene.

  An optical low-pass filter 30 that is a light transmission member is attached to the front surface of the transmission glass 18 in the optical axis Z direction via an elastic body 19 that is a sealing member. The elastic body 19 is disposed between the transmission glass 18 and the optical low-pass filter 30, thereby ensuring airtightness between the transmission glass 18 and the optical low-pass filter 30.

  The piezoelectric element 20 is fixed to the front surface of the optical low-pass filter 30 in the optical axis Z direction by bonding or the like. The piezoelectric element 20 is provided on the outer peripheral side of the region facing the opening 73 of the shutter unit 45 of the optical low-pass filter 30. The piezoelectric element 20 and the elastic body 19 are arranged with respect to the optical low-pass filter 30 so as to be along the sides of the optical low-pass filter 30 as shown in FIG. The piezoelectric element 20 is provided on the surface of the optical low-pass filter 30 on the shutter member 45 side. Furthermore, the piezoelectric element 20 is disposed along the long side 30a of the optical low-pass filter 30 as shown in FIG. The elastic body 19 has a frame shape and is provided on the surface of the optical low-pass filter 30 on the image sensor unit 4 side. As shown in FIG. 4C, the elastic body 19 is disposed so as to be sandwiched between the transmission glass 18 and the optical low-pass filter 30, so that dust can enter between the transmission glass 18 and the optical low-pass filter 30. The sealing is ensured so that there is no.

  In the present embodiment, as shown in FIG. 4B, the example in which the two piezoelectric elements 20 are arranged along both long sides 30a of the optical low-pass filter 30 has been described. 30 may be disposed only on one of the long sides 30a. Two piezoelectric elements 20 may be arranged along both short sides 30 b of the optical low-pass filter 30. The piezoelectric element 20 may be disposed only on one short side 30 b of the optical low-pass filter 30. Further, the length of the piezoelectric element 20 is not particularly limited.

  The piezoelectric element 20 is driven by a dustproof filter driving circuit 56 shown in FIG. The body CPU 50 sends a signal to the dust filter driving circuit 56 shown in FIG. 1 to control the driving of the piezoelectric element 20. The dustproof filter driving circuit 56 applies a voltage such as a periodic rectangular wave or sine wave to the piezoelectric element 20. When a voltage having a predetermined frequency is applied to the piezoelectric element 20, the optical low-pass filter 30 vibrates. As a result, when the inertial force received from the surface of the optical low-pass filter 30 exceeds the adhesion force of dust, the dust is separated from the surface of the optical low-pass filter 30 and can be removed.

  As shown in FIG. 3, a shutter unit 45 is disposed in front of the optical low-pass filter 30 in the optical axis Z direction. The shutter unit 45 includes a shutter substrate 43 and shutter blades 44. Between the shutter substrate 43 and the transmission glass 18, a seal member 14 that is a connecting portion is provided so as to connect the shutter substrate 43 and the transmission glass 18. The seal member 14 is disposed so as to seal a gap between the shutter substrate 43 and the transmission glass 18. The seal member 14 is made of, for example, an insulator such as synthetic resin or ceramic. The seal member 14 may also be a flexible resin.

  By connecting the shutter substrate 43 and the transmissive glass 18 with the seal member 14, it is possible to improve the hermeticity of the space 75 surrounded by the shutter portion 45, the transmissive glass 18, and the seal member 14. Furthermore, a space for having the piezoelectric element 20 can be easily secured in the sealed space 75. As a result, not only dust can be prevented from entering through the gap between the shutter substrate 43 and the transmission glass 18, but also dust generated from the shutter substrate 43, the shutter blades 44, etc. can be removed. Can be prevented from being reflected.

  Further, as shown in FIG. 3, the adhesive sheet 16 is provided in a portion of the seal member 14 that faces the optical low-pass filter 30. By providing the adhesive sheet 16 on the seal member 14, dust that has been peeled off due to vibration of the optical low-pass filter 30 or dust generated from the shutter substrate 43, the shutter blade 44, etc. is adsorbed, and the dust adheres to the optical low-pass filter 30. Can be prevented. In this embodiment, although the adhesive sheet 16 showed the example arrange | positioned below the X-axis with respect to the optical low-pass filter 30, it is not limited to this, The adhesive sheet 16 is arrange | positioned in any direction of an X-axis and a Y-axis. It may be provided.

Furthermore, in this embodiment, the area of the transmission glass 18 is made larger than the area of the optical low-pass filter 30. Thereby, it becomes easy to connect the shutter substrate 43 and the transmission glass 18.
Second embodiment

  As shown in FIG. 5, the camera of the second embodiment is the same as the camera 100 according to the first embodiment shown in FIGS. 1 to 3 except that the arrangement of the piezoelectric elements 20 with respect to the optical low-pass filter 30 is different. A duplicate description is omitted.

  In the present embodiment, as shown in FIG. 5, the piezoelectric element 20 is disposed on the image sensor 12 side of the optical low-pass filter 30. The piezoelectric element 20 is fixed to the transmission glass 18 and the optical low-pass filter 30 by adhesion or the like. The piezoelectric element 20 is disposed with respect to the optical low-pass filter 30 along the side 30a of the optical low-pass filter 30, as shown in FIGS. 6 (A) and 6 (C). Moreover, the piezoelectric element 20 is provided on the outer peripheral side of the region 80 facing the opening 73 of the shutter 45 of the optical low-pass filter 30. Thereby, since the light beam that has passed through the opening 73 is not blocked by the piezoelectric element 20, an effective area of the imaging element 12 can be ensured. Since the piezoelectric element 20 is disposed on the image sensor 12 side of the optical low-pass filter 30, the piezoelectric element 20 is not disposed on the surface of the optical low-pass filter 30 on the shutter member 45 side, as shown in FIG.

  Furthermore, as shown in FIG. 6C, two optical elements along the side 30b of the optical low-pass filter 30 are connected to the surface of the optical low-pass filter 30 on the image sensor 12 side so that two piezoelectric elements 20 are connected. An elastic body 19a is provided. The elastic body 19a is fixed to the optical low-pass filter 30 by adhesion or the like.

  That is, the two piezoelectric elements 20 and the two elastic bodies 19a are arranged in a frame shape on the optical low-pass filter 30 as shown in FIG. Moreover, since the piezoelectric element 20 and the elastic body 19a are disposed so as to be sandwiched between the transmission glass 18 and the optical low-pass filter 30, dust does not enter between the transmission glass 18 and the optical low-pass filter 30. In addition, hermeticity is ensured.

Further, as shown in FIG. 5, the optical low-pass filter 30 is fixed to the transparent glass 18 by fixing the piezoelectric element 20 and the like to the transmissive glass 18 by adhesion or the like. The transmission glass 18 is a member constituting the image sensor unit 4, and the substrate 10 constituting the image sensor unit 4 is fixed to a fixing portion 71 as shown in FIG. 2. Therefore, in this embodiment, since the optical low-pass filter 30 is fixed to the imaging element unit 4 via the piezoelectric element 20, the driving energy of the piezoelectric element 20 can be efficiently transmitted to the optical low-pass filter 30. Therefore, the dust removal effect can be enhanced by applying a relatively strong vibration to the optical low-pass filter 30. In addition, since the piezoelectric element 20 is disposed on the image sensor 12 side of the optical low-pass filter 30, the distance from the shutter substrate 43 to the image sensor unit 4 can be reduced.
Third embodiment

  As shown in FIG. 7, the camera of the third embodiment is similar to the first embodiment shown in FIGS. 1 to 3 except that the optical low-pass filter 30 is connected to the shutter substrate 43 via the piezoelectric element 20. This is the same as the camera 100, and redundant description is omitted.

  In the present embodiment, as shown in FIG. 7, the piezoelectric element 20 is disposed on the shutter portion 45 side of the optical low-pass filter 30. Moreover, one end 20a of the piezoelectric element 20 is fixed to the optical low-pass filter 30 by bonding or the like. Further, the other end 20 b of the piezoelectric element 20 is fixed to the shutter substrate 43 by adhesion or the like.

  In the present embodiment, the piezoelectric element 20 includes first to fourth piezoelectric elements 201 to 204 as shown in FIGS. 8A and 8B. Further, the first to fourth piezoelectric elements 201 to 204 are arranged with respect to the optical low-pass filter 30 in the vicinity of the corner of the optical low-pass filter 30. The first to fourth piezoelectric elements 201 to 204 are provided on the surface of the optical low-pass filter 30 on the shutter member 45 side. The elastic body 19 has a frame shape and is provided on the surface of the optical low-pass filter 30 on the image sensor unit 4 side. As shown in FIG. 8C, the elastic body 19 is disposed so as to be sandwiched between the transmission glass 18 and the optical low-pass filter 30, so that dust can enter between the transmission glass 18 and the optical low-pass filter 30. The sealing is ensured so that there is no.

  As described above, in this embodiment, the optical low-pass filter 30 is connected to the shutter substrate 43 via the piezoelectric elements 201 to 204. The shutter substrate 43 is fixed to the fixing portion 71. Therefore, the driving energy of the piezoelectric element 20 can be efficiently transmitted to the optical low-pass filter 30. Therefore, vibration can be reliably generated in the optical low-pass filter 30 with relatively small energy.

  In the above-described embodiment, it has been described that the piezoelectric elements 201 to 204 are provided in the vicinity of the corners of the optical low-pass filter 30, but the present invention is not limited to this. That is, the number of piezoelectric elements may be one, and two or more piezoelectric elements may be arranged.

  Further, the optical low-pass filter 30 according to the first to third embodiments has been described by taking a rectangular filter as an example, but it may be circular. Further, as shown in FIGS. 3, 5, and 7, in the first to third embodiments, the transmission glass 18 has been described as another component that does not constitute the optical low-pass filter 30. However, the present invention is not limited to this, and the transmission glass 18 (for example, a quartz plate) may be part of the optical low-pass filter 30.

  The imaging device according to the present invention includes, for example, a camera body, a still camera, a video camera, a mobile phone with a built-in camera, and the like.

DESCRIPTION OF SYMBOLS 4 ... Image sensor unit 12 ... Image sensor 14 ... Sealing member 16 ... Adhesive sheet 19 ... Elastic body 20,201,202,203,204 ... Piezoelectric element 30 ... Optical low-pass filter 50 ... Body CPU
45 ... Shutter unit 43 ... Shutter substrate 44 ... Shutter blade

Claims (6)

A shutter unit having a shutter substrate in which an opening is formed; and a shutter blade that blocks light passing through the opening;
An imaging unit that captures an image of light passing through the opening;
A light transmissive member provided between the shutter substrate and the imaging unit and transmitting light that has passed through the opening;
A vibrating portion provided in the light transmitting member for vibrating the light transmitting member;
A connecting part for connecting the shutter substrate and the imaging part so as to seal the light transmitting member and the vibrating part ;
A sealing member provided between the light transmission member and the imaging unit and sealing a space between the light transmission member and the imaging unit;
The light-transmitting member has an object-side surface connected to the shutter substrate via the vibrating portion, and an image-plane side surface connected to the imaging portion via the sealing member. Imaging device. The imaging apparatus according to claim 1,
An imaging apparatus, comprising: a dust holding portion that is provided in a portion of the coupling portion facing the light transmitting member and holds dust removed from the light transmitting member. The imaging apparatus according to claim 1 or 2,
The image pickup apparatus, wherein the vibration unit is provided on an outer peripheral side of a region facing the opening of the light transmission member. An imaging apparatus according to any one of claims 1 to 3, wherein
The imaging unit includes an imaging element that converts a captured image into an electrical signal, and a transmission part that is provided between the light transmission member and the imaging element and has a larger area than the light transmission member.
The image pickup apparatus, wherein the connecting portion connects the transmitting portion and the shutter substrate. An imaging apparatus according to claim 4, wherein
The image pickup apparatus , wherein the sealing member seals between the transmission part and the light transmission member. An imaging apparatus according to any one of claims 1 to 5, wherein
The imaging apparatus, wherein the light transmission member is at least a part of an optical low-pass filter.

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