JP5233586B2 - Imaging apparatus, optical apparatus, and manufacturing method of imaging apparatus - Google Patents

Description

  The present invention relates to an imaging apparatus, an optical apparatus, and a method for manufacturing an imaging apparatus.

  In recent years, in an interchangeable lens digital camera or the like, there is a problem that dust adheres to the filter surface of the image sensor and the dust is reflected in the photographed image. In order to solve such problems, a dust-proof member is disposed between the image pickup device and the optical system, and the dust-proof member such as the image pickup device and the filter is protected and dust attached to the dust-proof member is removed by vibration. Has been developed (see Patent Document 1).

  However, in the conventional system, since the dust-proof member is circular, a large dust-proof member is necessary to cover the image pickup element, which is against the request for downsizing the image pickup apparatus.

In the conventional system, a piezoelectric element that vibrates the dustproof member is attached to the surface of the dustproof member on the image sensor side. For this reason, there is a concern that the dust generated when the piezoelectric element itself generates dust adheres to an optical filter or the like disposed between the dust-proof member and the imaging element and it is difficult to remove the dust. .
JP 2003-338916 A

  The present invention has been made in view of such a situation, and an object of the present invention is to provide an imaging device with excellent dust removal capability that can remove dust and the like, an optical device having the imaging device, and a method of manufacturing the imaging device. is there.

In order to achieve the above object, an imaging apparatus according to the first aspect of the present invention provides:
Is provided to face the image pickup device (12) that captures an image formed by the optical system (48), and a second shaft is an electric axis orthogonal to the first axis and the first axis is a crystal growth axes A quartz plate (18) comprising a quartz crystal of crystal structure;
Provided on a surface intersecting the optical axis of the optical system in the crystal plate (18), and a vibration member which bending vibration of the crystal plate (18),
The surface of the crystal plate (18) that intersects the optical axis of the optical system (48) rotates about +45 degrees counterclockwise from the first axis about the second axis as seen from the second axis. The angle is

  In the imaging device according to the first aspect of the present invention, the crystal plate (18) can be used as a part of the optical filter, and does not require a new member for dust prevention, and the number of parts can be reduced. Contributes to reduction and downsizing of equipment.

  Compared to a quartz plate having a surface that is at an angle of about -45 degrees to the first axis, the quartz plate (18) having a surface that is at an angle of about +45 degrees to the first axis has a modulus of elasticity. In contrast, the bending stiffness is low and the resonance frequency is, for example, about 20% lower. Therefore, the quartz plate (18) of the present invention is likely to be bent and has a high dust removal capability.

  For example, it is also preferable that the quartz plate (18) is rectangular. In this case, since the image pickup surface of the image pickup element (12) is rectangular, the space occupied by the crystal plate (18) for dust prevention is less than that in the case of circular glass, which contributes to downsizing of the apparatus.

The second imaging device according to the present invention is:
An optical system including lithium niobate provided opposite to an imaging device that captures an image by an optical system and having a first axis that is a crystal growth axis and a second axis that is an electric axis perpendicular to the first axis Members,
A vibration member that is provided on a surface that intersects the optical axis of the optical system in the optical member, and that flexibly vibrates the optical member ;
The surface of the optical member that intersects the optical axis of the optical system is at an angle that is rotated +45 degrees clockwise from the first axis with the second axis as the center, as viewed from the second axis .

In the imaging device according to the second aspect of the present invention,
An optical member having optical anisotropy can be used as a part of an optical filter, and does not require a new member for dust prevention, contributing to a reduction in the number of parts and a compact device. .

An imaging apparatus according to a third aspect of the present invention provides:
An image sensor (12) for capturing an image;
A transparent member (18) provided to face the imaging element (12);
An excitation member (20) provided on the transparent member (18) for vibrating the transparent member (18);
The transparent member (18) and the excitation member (20) are fixed with an epoxy ultraviolet curing adhesive.

For example, the imaging device according to the present invention is
An image sensor (12) for capturing an image;
A transparent member (18) provided to face the imaging element (12);
An excitation member (20) provided on the transparent member (18) for vibrating the transparent member (18);
The transparent member (18) and the excitation member (20) may be fixed with a cationic polymerization type ultraviolet curable adhesive.

The manufacturing method of the imaging device of the present invention includes:
Intersecting the optical axis of the optical system of a rectangular quartz plate including a quartz crystal structure and a second shaft is an electrical axis perpendicular to said first axis and the first axis is a crystal growth axis (18) A vibration member (20) for bending and vibrating the quartz plate (18) is provided on the surface,
The crystal plate (18) is disposed so as to face the image sensor (12) that captures an image by the optical system (48) ,
The quartz crystal is such that the surface of the quartz crystal plate intersecting the optical axis of the optical system has an angle rotated about +45 degrees counterclockwise from the first axis with the second axis as the center when viewed from the second axis. A plate is formed .

  An optical device according to the present invention is an optical device including the imaging device described above, and includes not only a still camera or a video camera but also an optical device such as a microscope and a mobile phone.

  In the above description, in order to explain the present invention in an easy-to-understand manner, the description has been made in association with the reference numerals of the drawings showing the embodiments, but the present invention is not limited to this. The configuration of the embodiment described later may be improved as appropriate, or at least a part of the configuration may be replaced with another component. Further, the configuration requirements that are not particularly limited with respect to the arrangement are not limited to the arrangement disclosed in the embodiment, and can be arranged at a position where the function can be achieved.

Hereinafter, the present invention will be described based on embodiments shown in the drawings.
FIG. 1 is an overall block diagram of a camera according to an embodiment of the present invention.
FIG. 2 is a plan view of the imaging apparatus shown in FIG.
FIG. 3 is a schematic sectional view taken along line III-III shown in FIG.
4 is a schematic cross-sectional view taken along line IV-IV shown in FIG.
5A and 5B are schematic diagrams for explaining the crystal axes of quartz,
6A to 6C are plan views showing the relationship between the crystal plate shown in FIGS. 3 and 4 and the crystal axis of the crystal,
7A to 7E are schematic diagrams showing vibration modes;
FIG. 8 is a schematic diagram showing the relationship between distortion generated in the quartz plate and bending vibration,
FIG. 9 is a graph showing the relationship between vibration frequency and frequency step,
FIG. 10 is a graph showing the relationship between drive frequency and vibration acceleration,
11A, 11B, and 12 are cross-sectional views of main parts according to other embodiments of the present invention,
FIG. 13 is a flowchart showing a method for manufacturing an imaging apparatus according to an embodiment of the present invention.
14A is a plan view of an optically anisotropic plate used in an imaging apparatus according to another embodiment of the present invention, FIG. 14B is a side view of the optically anisotropic plate shown in FIG. 14A,
FIG. 15 is a diagram showing the relationship between the direction of the optically anisotropic plate and the elastic coefficient;
16A and 16B are diagrams showing the vibration state of the optical anisotropic plate,
FIG. 17 is a schematic view of an ingot from which an optically anisotropic plate is cut,
FIG. 18 is a side view of the ingot,
FIG. 19 is a plan view of the ingot.
FIG. 20 is a schematic diagram showing optical characteristics of the optically anisotropic plate,
21A to 21C are side views of an optically anisotropic plate according to a comparative example of the present invention.
First embodiment

  First, the overall configuration of the camera of this embodiment will be described with reference to FIG. The blur correction device 2 having the image sensor unit 4 is disposed inside the camera body 40 so that the crystal plate 18 of the image sensor unit 4 intersects the optical axis α of the optical lens group 48 substantially perpendicularly. The crystal plate 18 will be described later.

  As shown in FIG. 1, a lens barrel 42 is detachably attached to the camera body 40. In some compact cameras and the like, there is a camera in which the lens barrel 42 and the camera body 40 are integrated, and the type of camera is not particularly limited. Further, the present invention can be applied not only to a still camera but also to an optical device such as a video camera, a microscope, and a mobile phone. In the following description, a single lens reflex camera in which the lens barrel 42 and the camera body 40 are detachable will be described for ease of explanation.

  Inside the camera body 40, a shutter member 44 is disposed in front of the image sensor unit 4 in the optical axis α direction. A mirror 46 is disposed in front of the shutter member 44 in the optical axis α direction, and a diaphragm portion 47 and an optical lens group 48 built in the lens barrel 42 are disposed in front of the optical axis α direction. It is.

  The camera body 40 incorporates a body CPU 50 and is connected to the lens CPU 58 via a lens contact 54. The lens contact 54 electrically connects the body CPU 50 and the lens CPU 58 by connecting the lens barrel 42 to the camera body 40. A power source 52 is connected to the body CPU 50. The power source 52 is built in the camera body 40.

  The body CPU 50 includes a release switch 51, a strobe 53, a display unit 55, a gyro sensor 70, an EEPROM (memory) 60, an anti-vibration switch 62, a dust-proof filter driving circuit 56, an image processing controller 59, an AF sensor 72, and an anti-vibration follow-up control. IC74 etc. are connected. An image sensor 59 (see FIGS. 2 to 4) of the image sensor unit 4 is connected to the image controller 59 via an interface circuit 57, and image processing of an image captured by the image sensor 12 can be controlled. It has become. The image sensor 12 is configured by a solid-state image sensor such as a CCD or a CMOS, for example.

  The body CPU 50 has a communication function with the lens barrel 42 and a control function of the camera body 40. Further, the body CPU 50 calculates the image stabilization drive unit target position from the information input from the EEPROM 60 and the blur angle, focal length information, and distance information calculated in response to the output from the gyro sensor 70, and the image stabilization drive. The target position is output to the image stabilization tracking control IC 74. In addition, the body CPU 50 inputs the sensor output of the gyro sensor 70 to the body CPU 50 via an amplifier (not shown), and obtains the deflection angle by integrating the angular velocity of the gyro sensor 70.

  The body CPU communicates whether or not the lens barrel 42 is completely mounted, and calculates the target position from the focal length and distance information input from the lens CPU 58 and the gyro sensor. If the release switch 51 is half-pressed, an instruction for a shooting preparation operation such as an anti-shake drive is output to the lens CPU 58 and the anti-shake tracking control IC 74 according to the situation such as AE and AF. When fully pressed, instructions such as mirror drive, shutter drive, and aperture drive are output.

  The display unit 55 is mainly composed of a liquid crystal display device or the like, and displays output results and menus. The release switch 51 is a switch for controlling the timing of shutter driving, and outputs the state of the switch to the body CPU 50. When half-pressed, the vibration-proof driving is performed according to AF, AE, and the situation. When fully pressed, the mirror is raised and the shutter is driven. Etc.

  The mirror 46 is for projecting an image on the viewfinder when determining the composition, and retracts from the optical path during exposure. Information on the release switch 51 is input from the body CPU 50, and the mirror is raised when fully pressed and the mirror is lowered after the exposure is completed. It is driven by a mirror driving unit (not shown) (for example, a DC motor). A sub mirror 46 a is connected to the mirror 46.

  The sub mirror 46a is a mirror for sending light to the AF sensor, and reflects the light beam that has passed through the mirror and guides it to the AF sensor. The sub mirror 46a is retracted from the optical path during exposure.

  The shutter member 44 is a mechanism that controls the exposure time. Information on the release switch 51 is input from the body CPU 50, and the shutter is driven when fully pressed. It is driven by a shutter drive unit (not shown) (for example, a DC motor).

  The AF sensor 72 is a sensor for performing autofocus (AF). As this AF sensor, a CCD is usually used. The image stabilization switch 62 outputs the image stabilization ON / OFF state to the image sensor unit CPU. The gyro sensor 70 detects the angular velocity of the blur generated in the body and outputs it to the body CPU 50. The EEPROM 60 has information such as a gain value and an angle adjustment value of the gyro sensor and outputs the information to the body CPU.

  The dustproof drive filter drive circuit 56 is connected to the piezoelectric element 20 shown in FIGS. 2 and 3 described later, and drives the piezoelectric element 20 when a predetermined condition is satisfied, as shown in FIGS. 7B to 7E. Then, the quartz plate 18 is vibrated, and dust and the like adhering to the surface 181 of the quartz plate 18 that is substantially orthogonal to the optical axis α (see FIG. 1) of the optical lens group 48 are blown away.

  For example, a voltage such as a periodic rectangular wave or sine wave is applied to the piezoelectric element 20. By controlling the dustproof filter driving circuit 56 and applying a periodic voltage to the piezoelectric element 20 in this way, the crystal plate 18 vibrates, and the inertial force received by the dust from the surface of the crystal plate 18 is the dust adhesion force. Exceeds the value, the dust moves away from the surface of the quartz plate 18.

  The periodic driving of the piezoelectric element 20 preferably drives the piezoelectric element 20 at a frequency that causes the surface of the quartz plate 18 to resonate in order to obtain as large an amplitude as possible with a low voltage. The resonant frequency is determined by the shape, material, support method, and vibration mode. It is preferable to support the crystal plate 18 at a node position where the amplitude is zero. The support structure for the crystal plate 18 will be described later.

  In the present embodiment, a vibration mode selection circuit 80 is connected to the dustproof drive filter drive circuit 56. The vibration mode selection circuit 80 controls the dustproof drive filter drive circuit 56 through the body CPU 50. Details of the control by the vibration mode selection circuit 80 will be described later.

  The image stabilization tracking control IC 74 is an IC for performing image stabilization control. Based on the image stabilization drive unit target position input from the body CPU 50 and the image stabilization drive unit position information input from the position detection unit, the movement amount of the image stabilization drive unit is calculated and output to the image stabilization drive driver 76. That is, the image stabilization unit control IC 74 receives the position signal of the image sensor unit from the position sensor 33 and the output signal from the body CPU 50. The body CPU 50 calculates the image stabilization drive unit target position from the blur angle calculated by receiving the output of the gyro sensor 70, the focal length information detected by the focal length encoder, the distance information detected by the distance encoder 64, and the like. The image stabilization drive unit target position is output to the image stabilization tracking control IC 74.

  The image stabilization drive driver 76 is a driver for controlling the image stabilization drive unit, and receives the drive amount from the image stabilization tracking control IC and controls the drive direction and drive amount of the image stabilization drive unit. In other words, the image stabilization drive driver 76 sends drive current to the coils 28x and 28y based on the input information from the image stabilization tracking control IC 74, and moves the image sensor unit 4 in the X-axis and Y-axis directions with respect to the fixed portion 6. Image blur correction control.

  The lens barrel 42 shown in FIG. 1 includes a focal length encoder 66, a distance encoder 64, a diaphragm 47, a drive motor 68 that controls the diaphragm 47, a lens CPU 58, a lens contact 54 with the body, and a plurality of lenses. Group 48 is provided. The lens contact 54 includes a contact for supplying a lens driving system power from the camera body 40, a contact for a CPU power source for driving the lens CPU 58, and a contact for digital communication.

  Driving system power and CPU power are supplied from a power source 52 of the camera body 40, and supply power for the lens CPU 58 and the driving system. At the digital communication contact, communication for inputting digital information such as focal length, subject distance, and focus position information output from the lens CPU 58 to the body CPU 50 and digital information such as a focus position and an aperture amount output from the body CPU 50 are provided. Is communicated to the lens CPU 58. The lens CPU 58 performs AF and aperture control in response to focus position information and aperture amount information from the body CPU 50.

  The focal length encoder 66 converts the focal length from the position information of the zoom lens group. That is, the focal length encoder 66 encodes the focal length and outputs it to the lens CPU.

  The distance encoder 64 converts the subject distance from the position information of the focusing lens group. That is, the distance encoder 64 encodes the subject distance and outputs it to the lens CPU.

  The lens CPU has a communication function with the camera body 40 and a control function of the lens group 48. A focal length, a subject distance, and the like are input to the lens CPU and output to the body CPU 50 via a lens contact. Release information and AF information are input from the body CPU 50 via the lens contact 54.

  As shown in FIGS. 2 to 4, the image sensor unit 4 according to the present embodiment includes a substrate 10, and an image sensor 12 is fixed to the upper surface of the central portion of the substrate 10. A case 17 is disposed around the imaging element 12 and is fixed to the surface of the substrate 10 so as to be detachable or non-detachable.

  The case 17 is made of, for example, an insulating material such as a synthetic resin or ceramic, and an inner peripheral side mounting portion 17a and an outer peripheral side mounting portion 17b are formed in steps on the upper surface thereof. The outer periphery of the optical member element 30 having optical transparency is attached to the inner peripheral side attachment portion 17a of the case 17. As a result, the periphery of the image sensor 12 is sealed by the substrate 10, the case 17, and the optical member element 30.

  A crystal plate 18 is disposed on the outer peripheral side mounting portion 17 b of the case 17 via an airtight seal member 16, and is pressed against the airtight seal member 16 by a pressure member 19. Here, a metal plate is used as the pressure member 19, and the quartz plate 18 is urged toward the hermetic seal member 16 by the elastic force resulting from the deformation of the pressure member 19.

  As a result, the storage space in which the imaging element 12 and the optical member element 30 are provided is in an airtight state, and dust and the like can be prevented from entering the storage space from the outside of the case. The pressure member 19 is detachably screwed to the upper surface of the case 17, for example, and the rectangular crystal plate 18 is positioned in the longitudinal direction by positioning pins 17 c formed on the upper surface of the case 17. Yes. The hermetic seal member 16 is made of a low-rigidity material such as foamed resin or rubber, and absorbs the movement of bending vibration of the crystal plate 18 described later while ensuring airtightness.

  In this embodiment, the optical member element 30 has a laminated structure of a plurality of optical plates, and is constituted by a laminated plate of a quartz plate 13, an infrared absorbing glass plate 14, and a quartz wave plate (λ / 4 wave plate) 15. It is. The optical member element 30 composed of these laminated plates is a rectangle having an area smaller than that of the quartz plate 18, and is larger than the plane side area of the image sensor 12 and has an area covering the entire image sensor 12.

  The quartz wavelength plate 15 is an optical plate that can change linearly polarized light into circularly polarized light, and the infrared absorbing glass plate 14 has a function of absorbing infrared rays. Further, the quartz plate 13 is a quartz plate having birefringence directions different from each other by 90 degrees with respect to the quartz plate 18, and if one of the quartz plates has birefringence in the 90 degree direction (short side direction), The other quartz plate is a quartz plate having birefringence in the 0 degree direction (long side direction). In the present embodiment, the quartz plate 18 is a quartz plate having birefringence in the 0 degree direction (long side direction), and the quartz plate 13 is a quartz plate having birefringence in the 90 degree direction (short side direction).

  That is, in the present embodiment, an optical low-pass filter (OLPF) is basically constituted by the two crystal plates 13 and 18 arranged apart from each other. In general, the optical low-pass filter includes an optical low-pass filter (OLPF) in which an infrared absorbing glass 14 and a quartz wavelength plate 15 are all laminated between two quartz plates 13 and 18.

  In this embodiment, inside the case 17, the two crystal plates 13 and 18 are arranged apart from each other, and in particular, the crystal plate 18 arranged outside the case 17 is a crystal 18a shown in FIGS. 5A and 5B. A crystal plate cut out at a specific angle (θ = + 45 degrees) is used. The crystal 18a may be an artificial crystal or a natural crystal.

  As shown in FIGS. 5A and 5B, the crystal axis of the crystal 18a is, for example, a crystal electric axis (X axis) which is a right-handed coordinate axis, a crystal mechanical axis (Y axis), and an optical axis of the crystal (Z axis). ). The optical axis of crystal is the crystal growth axis. The electric axis of the crystal is an axis that passes through a ridge line that is perpendicular to the optical axis of the crystal and parallel to the optical axis of the crystal. The plus direction (+ X direction) of the electric axis is the direction of the electric axis, and is a direction in which a positive charge is generated when pressure is applied. The minus direction (−X direction) of the electric axis is the direction of the electric axis, and is a direction in which a negative charge is generated when pressure is applied. The crystal mechanical axis is an axis orthogonal to the optical axis of the crystal and the electrical axis of the crystal. The electrical axis of quartz, the mechanical axis of quartz, and the optical axis of quartz are sometimes referred to as the X axis of quartz, the Y axis of quartz, and the Z axis of quartz.

  In the present embodiment, the crystal plate 18 has a surface 181 that intersects (substantially orthogonal) to the optical axis α (see FIG. 1) of the optical lens group 48, as viewed from the plus direction (+ X direction) of the electric axis. It is cut out from the crystal 18a so as to have an angle θ = about +45 degrees counterclockwise from the optical axis (Z axis) of the crystal to the mechanical axis (Y axis) with the X axis as the center.

  In the present embodiment, the angle of about +45 degrees includes a value changed from +45 degrees. For example, a sufficient effect can be obtained if the variation is ± 3 degrees with respect to an angle of +45 degrees. Further, a positive value of the angle θ is an angle in the clockwise direction with respect to the Z axis toward the arrow on the X axis, and an angle in the opposite direction is a negative value.

  In the present embodiment, the crystal plate 13 constituting a part of the optical member element 30 is cut out from the crystal 18a so that the plane with an angle of θ = about +45 degrees is a flat plate surface, similarly to the crystal plate 18a. A flat plate may be sufficient and the flat plate cut out at other angles may be sufficient. However, the direction of birefringence of the crystal plate 13 is preferably a crystal plate that is 90 degrees different from the crystal plate 18. This is to effectively function as OPLF and prevent the moire phenomenon.

  The crystal plate 18 made of a flat plate cut with a plane of θ = + 45 degrees from the crystal 18a has a different elastic coefficient compared to the crystal plate made of a flat plate cut with a plane of angle θ = −45 degrees. The bending stiffness is low and the resonance frequency is about 20% lower.

  The thickness of the crystal plate 18 is optimally designed according to the pixel pitch of the image sensor, and is the same as the thickness of the crystal plate 13, for example.

  As shown in FIGS. 6A and 6B, the crystal plate 18 is cut out in a rectangular shape from the crystal 18a shown in FIG. 5B, and the short side direction of the rectangle is parallel to the X axis of the crystal 18a. The front and back surfaces of the quartz plate 18 are surfaces that are inclined at an angle of about 45 degrees with respect to the Z-axis and the Y-axis.

  As shown in FIGS. 2, 3, 6A, and 6B, a pair of piezoelectric elements 20 as excitation members are provided on the surface of the crystal plate 18 (the outer surface with respect to the case 17). 18 are adhered to both side positions along the long side direction L so as to extend in parallel to the X-axis direction. The piezoelectric element 20 is composed of, for example, a PZT element.

  Next, the vibration mode of the crystal plate 18 by the piezoelectric element 20 will be described mainly with reference to FIGS.

  In the present embodiment, a signal is sent from the vibration mode selection circuit 80 shown in FIG. 1 to the dustproof filter driving circuit 56, and for example, as shown in FIGS. 7B and 7C, the quartz plate 18 is moved in the longitudinal direction L (X Vibrated in the sixth bending vibration mode along the direction perpendicular to the axis. There are seven nodes 22 in the sixth bending vibration mode along the longitudinal direction L of the quartz plate 18, and these nodes 22 are parallel to the X axis. The position of the vibration node 22 does not change when the vibration mode does not change, as shown in FIGS. 7B and 7C.

  When changing the vibration mode, a signal is sent from the vibration mode selection circuit 80 shown in FIG. 1 to the dustproof filter driving circuit 56 to change the vibration mode. For example, by increasing the drive frequency, the crystal plate 18 can be vibrated in the seventh bending vibration mode along the longitudinal direction L of the crystal plate 18 as shown in FIGS. 7D and 7E.

  There are eight nodes 22 in the seventh bending vibration mode along the longitudinal direction L of the crystal plate 18, and these nodes 22 are parallel to the X axis. The position of the vibration node 22 does not change when the vibration mode does not change, as shown in FIGS. 7D and 7E.

  As shown in FIGS. 7B to 7E, the position of the node 22 on the quartz plate 18 can be changed by changing the vibration mode. As a result, in a certain vibration mode, dust or the like remaining on the surface of the crystal plate 18 without being blown off at the position of the node 22 is changed. Will be blown away. As a result, dust can be removed over the entire outer surface of the crystal plate 18.

  In the present embodiment, the pressure member 19 shown in FIGS. 2 to 4 is disposed near the nodes 22 located outside the piezoelectric elements 20 arranged on both sides of the crystal plate 18 in the longitudinal direction L. Is pressed in the direction of the hermetic seal member 16 from the outer surface. The pressure member 19 only pressurizes both sides of the crystal plate 18 in the longitudinal direction L in parallel with the vibration node 22, and does not press both ends of the crystal plate 18 in the direction orthogonal to the bending vibration node 22. . This is to prevent the bending vibration of the crystal plate 18 from being suppressed.

  When the crystal plate 18 bends and vibrates in accordance with the drive frequency of the piezoelectric element 20, as shown in FIG. 8, the crystal plate 18 is perpendicular to the X axis in the plane direction (in this embodiment, the longitudinal direction of the crystal plate 18). L), compressive strain and tensile strain are generated inside the quartz plate 18.

  In the image pickup device unit 4 according to the present embodiment, the crystal plate 18 can be used as a part of the OLPF, and does not require a new member for dust prevention, reducing the number of parts and compacting the apparatus. Contributes to

  Also, as shown in FIGS. 5A and 5B, it has a surface that is at an angle of about +45 degrees with respect to the Z axis, as compared to a quartz plate that has a surface that is at an angle of about −45 degrees with respect to the Z axis. The quartz plate 18 has a different elastic coefficient, a low bending rigidity, and a resonance frequency that is about 20% lower. Therefore, the quartz plate 18 is easily bent and has a high dust removal capability.

  Further, since the crystal plate 18 has a low resonance frequency, the output frequency (drive frequency) of the drive circuit for the piezoelectric element 20 can be lowered. If the drive frequency can be lowered, for example, when the drive frequency is changed stepwise using the clock frequency of the microcomputer, as shown in FIG. 9, the frequency step Δf becomes smaller as the drive frequency becomes lower. It becomes possible to reduce from Δf2 to Δf1. As shown in FIG. 10, in the vibration mode in which the vibration acceleration reaches a peak at a high drive frequency f2, the frequency step Δf2 is wide and it is difficult to vibrate at a frequency position where the vibration acceleration reaches a peak.

  On the other hand, as shown in FIG. 10, in the vibration mode in which the vibration acceleration has a peak at a low driving frequency f1, the width of the frequency step Δf1 can be narrowed and is close to the frequency position where the vibration acceleration has a peak. It is easy to vibrate at a position. In this embodiment, since the driving frequency is low, the design and manufacture of the vibration circuit is facilitated.

  Furthermore, in this embodiment, since the quartz plate 18 is rectangular and the imaging surface of the imaging device 12 is rectangular, the space occupied by the quartz plate for dust protection can be reduced compared to the case of vibrating circular glass. Contributes to downsizing of the device.

  Furthermore, in this embodiment, one crystal plate 18 constituting a part of the OPLF is spaced from the optical member element 30 of the OPLF excluding the crystal plate 18 at a predetermined interval corresponding to the thickness of the hermetic seal member 16. Is provided. Therefore, as compared with the case where the entire OPLF including the crystal plate 18 and the optical member element 30 is vibrated, it is possible to increase the vibration acceleration with less energy by vibrating only the crystal plate 18, and the dustproof effect. Will contribute to energy saving.

  Further, in the present embodiment, the vibration due to vibration acceleration is caused by using the bending vibration (driving frequency is several tens to several hundreds kHz) of the quartz plate 18 instead of the vibration due to the surface acoustic wave of the quartz plate (driving frequency is several MHz). Because of its removal function, it is excellent in dustproof effect.

  The present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the present invention.

  For example, in the above-described embodiment, as shown in FIGS. 6A and 6B, the crystal plate 18 is rectangular, and the short side of the rectangle is substantially parallel to the X axis. However, as shown in FIG. The side may be substantially parallel to the X axis. In the above-described embodiment, the pair of piezoelectric elements 20 are arranged on both sides in the long side direction of the rectangular crystal plate 18, but may be arranged on both sides in the short side direction.

  In another embodiment, the width in the longitudinal direction L of the crystal plate 18 is made larger than the case 17 shown in FIGS. 2 to 3, and at both ends of the crystal plate 18 in the longitudinal direction L, on the back surface of the crystal plate 18. You may comprise so that the piezoelectric element 20 may adhere | attach.

  In still another embodiment, as shown in FIGS. 11A and 11B, an optical member plate is formed by integrating a light transmitting plate 90 with a quartz plate 18, and integrated as shown in FIGS. 7B to 7E. You may bend and vibrate. Although it does not specifically limit as an optical member board, For example, it is comprised with a glass plate or another optical characteristic board. The thickness of the light transmission plate 90 is not particularly limited, but is preferably about the thickness of the crystal plate 18 or less.

  The means for integrating the crystal plate 18 and the light transmission plate 90 is not particularly limited, and examples thereof include adhesion. The piezoelectric element 20 may be adhered to the surface of the quartz plate 18 or may be adhered to the surface of the light transmission plate 90.

Although the manufacturing method of the imaging device according to the first embodiment described above is not particularly limited, for example, as illustrated in FIG. 13, the imaging device can be manufactured by the following steps. First, in step S1, the crystal plate 18 is formed. As described above, the crystal plate 18 is preferably cut out at a predetermined angle. Next, in step S <b> 2, the piezoelectric element 20 is fixed to the crystal plate 18. For fixing the quartz plate 18 and the piezoelectric element 20, it is preferable to use an epoxy-based ultraviolet curable adhesive or a cationic polymerization type ultraviolet curable adhesive as shown in a second embodiment to be described later. Next, in step S <b> 3, the crystal plate 18 is disposed so as to face the image sensor 12.
Second embodiment

  The second embodiment of the present invention is a modification of the first embodiment described above, and has the same configuration and operational effects as the first embodiment except as described below.

  In the present embodiment, as shown in FIG. 12, the piezoelectric element 20 is fixed to the outer surface 18a of the quartz plate 18 with an epoxy-based ultraviolet curable adhesive. That is, a cured product layer 21 in which an epoxy-based ultraviolet curable adhesive is cured is formed between the piezoelectric element 20 and the outer surface 18 a of the crystal plate 18. Thus, the cured product layer 21 fixes the piezoelectric element 20 to the outer surface 18 a of the crystal plate 18.

  Since the epoxy ultraviolet curable adhesive has a smaller shrinkage rate than, for example, an acrylic adhesive, the piezoelectric element 20 can be bonded with high accuracy. In the present embodiment, since an epoxy ultraviolet curing adhesive having excellent surface curability is used, the protruding portion 21a of the cured product layer 21 protruding from the bonding surface between the piezoelectric element 20 and the crystal plate 18 is used. As for, the adhesive is sufficiently cured. Therefore, in the image sensor unit according to the present embodiment, the uncured adhesive remaining in the protruding portion or the like does not ooze out during cleaning of the quartz plate 18 and prevents the quartz plate 18 from being soiled. ing.

  In addition, since the epoxy ultraviolet curing adhesive is used, the piezoelectric element 20 can be easily bonded by irradiating ultraviolet rays from the sealing surface 18b side of the quartz plate 18. Furthermore, in this embodiment, since the ultraviolet curable adhesive is used, the thermal load applied to the crystal plate 18 at the time of bonding is suppressed as compared with the case where the thermosetting adhesive is used.

  The epoxy-based ultraviolet curable adhesive used in the present embodiment may include a colorant that colors the epoxy-based ultraviolet curable adhesive. If the epoxy ultraviolet curable adhesive contains a colorant, the cured product layer 21 is also colored. Therefore, even after the piezoelectric element 20 is bonded, by observing the cured product layer 21 from the sealing surface 18b side of the crystal plate 18, the shape of the cured product layer 21 and the bubbles present in the cured product layer 21 are observed. Etc. can be recognized relatively easily. Therefore, the inspection of the adhesion state between the piezoelectric element 20 and the crystal plate 18 can be easily performed.

  Further, by coloring the cured product layer 21, the cured product layer 21 is prevented from causing unnecessary reflection, and the image to be captured is deteriorated by the light reflected by the cured product layer, or unnecessary for the image to be captured. It is possible to prevent a mixed image from being mixed. Furthermore, the cured product layer 21 containing the colorant may cover at least a part of the piezoelectric element 20. Thereby, it is possible to prevent the piezoelectric element from causing unnecessary reflection, and it is possible to prevent an image to be captured from being deteriorated by the light reflected by the piezoelectric element or an unnecessary image from being mixed into the image to be captured.

  Furthermore, a cleaning region 32 indicated by a two-dot chain line in FIG. 2 is provided on the outer surface 18a of the crystal plate 18 according to the present embodiment. The cleaning area 32 is formed so as to include at least an area corresponding to the imaging element 12 in the outer surface 18a.

  When assembling the camera or performing user maintenance, a cleaning paper or the like containing a solvent such as alcohol is pressed against the cleaning area 32 and wiped to remove dust attached to the cleaning area 32. Is done. By performing a cleaning operation using a solvent on the quartz plate 18, dust that cannot be removed simply by vibrating the quartz plate 18 with the piezoelectric element 20 can be removed.

  In the crystal plate 18 according to the present embodiment, both ends of the cleaning region 32 in the long side direction L are in contact with the piezoelectric element 20, and the cleaning region 32 is formed so as to include a region corresponding to the optical member element 30. Yes. It is preferable that the cleaning area 32 has a sufficiently large area as compared with the area corresponding to the imaging element 12. Thereby, it is possible to more reliably prevent dust from being reflected on the image sensor 12. The cleaning region 32 only needs to include a region corresponding to the imaging element 12, and may be the entire external surface 18 a excluding the contact surface between the cured product layer 21 and the pressure member 19, for example.

  Here, when the external surface 18 a of the quartz plate 18 is cleaned using a solvent, the solvent used in the cleaning operation may come into contact with the cured product layer 21. In such a case, the conventional technology using an acrylic adhesive as an adhesive for bonding the piezoelectric element has poor solvent resistance, so that the cured product that has been cured by the adhesive melts when it comes into contact with the solvent, and crystal There is a possibility that a problem of soiling the board may occur.

  Further, in the prior art, a cured product obtained by curing the adhesive may melt when it comes into contact with a solvent, which may cause a problem that the adhesive strength is reduced or the piezoelectric element is peeled off. However, in this embodiment, since the cured product layer 21 is composed of an epoxy-based ultraviolet curable adhesive having good solvent resistance, even if the cured product layer 21 comes into contact with the solvent, the cured product layer 21 is melted. There is nothing. Therefore, in the imaging element unit 4 according to the present embodiment, it is possible to prevent the quartz plate 18 from being soiled, the adhesive strength of the piezoelectric element 20 from being lowered, or the piezoelectric element 20 from being peeled off due to the cured product layer 21 being melted. it can.

  As described above, since the imaging unit 4 according to the present embodiment uses an epoxy-based ultraviolet curable adhesive, the piezoelectric element 20 is attached to the external surface 18a where the cleaning region 32 is formed with high adhesion reliability. In addition, it can be bonded while maintaining maintainability.

  In the embodiment, an epoxy ultraviolet curable adhesive is used as an adhesive for adhering the piezoelectric element 20 to the crystal plate 18, but as another embodiment, a cationic polymerization type ultraviolet curable having a protonic acid as an active species. A mold adhesive may be used. The cationic polymerization type ultraviolet curable adhesive can also be used as an adhesive for bonding the piezoelectric element 20 to the quartz plate 18 in the same manner as the epoxy type ultraviolet curable adhesive. Even when the cationic polymerization type ultraviolet curable adhesive is used, the same effect as that obtained when the epoxy ultraviolet curable adhesive described in the above-described embodiment is used in comparison with the prior art.

In the above-described embodiment, the piezoelectric element 20 is bonded to the surface of the crystal plate 18 via the cured product layer 21. However, the embodiment is not limited thereto, and is integrated with the crystal plate 18 as shown in FIG. 11B. The piezoelectric element 20 may be bonded to the light transmitting plate 90 through the cured product layer 21. Alternatively, the piezoelectric element 20 may be bonded to the surface of a single or multilayer light transmission plate that is not the quartz plate 18 via the cured product layer 21.
Third embodiment

  The second embodiment of the present invention is a modification of the first embodiment and the second embodiment described above, and has the same configuration and operational effects as the first embodiment except as described below.

  In this embodiment, an optically anisotropic plate 18 made of lithium niobate is used instead of the quartz plate 18 in the first and second embodiments. Since the optically anisotropic plate 18 made of lithium niobate has birefringence characteristics that are equal to or better than the quartz plate 18, it can be used as at least part of the OLPF.

Further, the optically anisotropic plate 18 made of lithium niobate also has mechanical anisotropy, and there exists a direction in which bending vibration is easy with respect to the crystal axis. Therefore, by cutting the lithium niobate crystal body in such a direction as to cause bending vibration in the same manner as in the first embodiment, bending vibration shown in FIGS. 7B to 7E can be easily generated.
Fourth embodiment

  14A and 14B are diagrams showing an optical member 30 using the optically anisotropic plate 18 containing lithium niobate. The optical member 30 includes an optically anisotropic plate 18 containing lithium niobate and a piezoelectric element 20 attached to the optically anisotropic plate 18.

  As shown in FIG. 14B, the optically anisotropic plate 18 is configured such that the Z axis is positioned at a position where the Z axis rotates −45 degrees around the X axis with respect to the normal direction n of the optically anisotropic plate 18. ing.

In the illustrated embodiment, the XYZ axes that define the direction of the optically anisotropic plate 18 containing lithium niobate are determined based on the directions of the elastic constants shown in FIG. In FIG. 15, C ₃₃ (elastic coefficient in the Z direction) is 2.424 × 10 ¹¹ N / m ² and C ₁₁ (elastic coefficient in the X and Y directions) is 2.030 × 10 ¹¹ N / m ² . Yes, C ₃₃ (elastic coefficient in the Z direction) is larger than C ₁₁ (elastic coefficient in the X or Y direction).

  16A and 16B are diagrams showing the vibration state of the optical member 30. FIG. In FIG. 16A and FIG. 16B, the optical anisotropic plate 18 is driven by the piezoelectric element 20 to bend and vibrate so that a vibration node 22 is generated.

  As shown in FIGS. 17 to 19, the optically anisotropic plate 18 made of lithium niobate is obtained, for example, by cutting out from an ingot 900 of lithium niobate. Specifically, first, the wafer 910 is sliced from the ingot 900 shown in FIGS. Next, the wafer 910 shown in FIG. 19 is cut with a dicer or the like to obtain the optically anisotropic plate 18.

  In this embodiment, since the optically anisotropic plate 18 made of lithium niobate is used, the refractive index difference between the ordinary ray and the extraordinary ray is large compared to the case where the quartz optically anisotropic plate is used. Become. For this reason, the optically anisotropic plate 18 containing lithium niobate has a thickness required to obtain a predetermined amount of separation width smaller than that of the quartz optically anisotropic plate, thereby reducing the thickness of the device. Can do.

  FIG. 20 is a diagram showing the optical characteristics of the optical anisotropic plate 18. In FIG. 20, an ordinary ray a1 that vibrates perpendicular to the paper surface and an extraordinary ray a2 that vibrates parallel to the paper surface and perpendicular to the traveling direction are incident on the optical anisotropic plate 18. The extraordinary ray a2 is refracted by the angle θ1 with respect to the ordinary ray a1, exits from the optically anisotropic plate 18, and enters the image sensor 12. This angle θ1 is larger in the lithium niobate substrate than in the quartz substrate. For this reason, the optical member 30 shown in FIG. 20 has a larger separation width b1 corresponding to the larger angle θ.

  Further, since the optical member 30 of the present embodiment uses the optical anisotropic plate 18 cut in the direction shown in FIGS. 14A and 14B, it is parallel to the X axis as shown in FIGS. 16A and 16B. The bending rigidity when driven to generate the node 22 is reduced, and dust can be removed well.

  21A to 21C are views showing optical members 91 to 93 according to comparative examples of the present invention. The optical members 91 to 93 of the comparative example are different from the optical member 30 of this embodiment shown in FIGS. 14A and 14B in the cutting direction of the optical anisotropic plate, and have higher bending rigidity than the optical member 30 of this embodiment. .

  In the first to fourth embodiments described above, the image pickup device that performs the shake correction by moving the image pickup device has been described. However, the present invention is not limited to this. For example, an imaging apparatus that performs blur correction by moving a lens may be used, or an imaging apparatus that does not have a blur correction function.

  Further, for example, the optically anisotropic substrate 18 containing lithium niobate of the fourth embodiment is used instead of the quartz plate 18 shown in FIG. You may comprise a member board. This is because by integrating the light transmitting plate 90 with the optically anisotropic substrate 18, the rigidity becomes higher than in the case of the optically anisotropic substrate 18 alone. For example, even if the optically anisotropic substrate 18 is thin and the rigidity is low, sufficiently high rigidity can be obtained in the state of the optical member plate integrated with the light transmission plate 90.

  Similarly, an optically anisotropic substrate 18 containing lithium niobate of the fourth embodiment is used in place of the quartz plate 18 shown in FIG. 11B, and a light transmitting plate 90 is integrated with the optically anisotropic substrate 18 to form an optical member. You may comprise a board. This is because by integrating the light transmitting plate 90 with the optically anisotropic substrate 18, the rigidity becomes higher than in the case of the optically anisotropic substrate 18 alone.

  You may improve suitably the structure of the 1st-4th Example. Further, at least part of the configuration of the first embodiment may be combined with at least part of the configuration of the second to fourth embodiments, and at least part of the configuration of the second embodiment may be combined with the first, third to third. You may combine with at least one part of the structure of 4th Example, You may combine at least one part of the structure of 3rd Example with at least one part of the structure of 1st-2nd or 4th Example.

FIG. 1 is an overall block diagram of a camera according to an embodiment of the present invention. FIG. 2 is a plan view of the imaging apparatus shown in FIG. 3 is a schematic cross-sectional view taken along the line III-III shown in FIG. 4 is a schematic cross-sectional view taken along line IV-IV shown in FIG. 5A and 5B are schematic diagrams for explaining the crystal axes of quartz. 6A and 6B are a plan view and a side view showing the relationship between the crystal plate shown in FIGS. 3 and 4 and the crystal axis of the crystal, and FIG. 6C is the relationship between the crystal plate and crystal crystal axis according to another example. FIG. FIG. 7A is a schematic diagram showing the relationship between the crystal axis of quartz and the plane of the crystal plate, and FIGS. 7B to 7E are schematic diagrams showing vibration modes. FIG. 8 is a schematic view showing the relationship between the distortion generated in the quartz plate and the bending vibration. FIG. 9 is a graph showing the relationship between the vibration frequency and the frequency step. FIG. 10 is a graph showing the relationship between drive frequency and vibration acceleration. 11A and 11B are cross-sectional views of main parts according to other embodiments of the present invention. FIG. 12 is a cross-sectional view of an essential part according to still another embodiment of the present invention. FIG. 13 is a flowchart showing a method for manufacturing an imaging device according to an embodiment of the present invention. 14A is a plan view of an optically anisotropic plate used in an imaging apparatus according to another embodiment of the present invention, and FIG. 14B is a side view of the optically anisotropic plate shown in FIG. 14A. FIG. 15 is a diagram showing the relationship between the direction of the optically anisotropic plate and the elastic coefficient. 16A and 16B are diagrams showing the vibration state of the optically anisotropic plate. FIG. 17 is a schematic view of an ingot from which an optically anisotropic plate is cut out. FIG. 18 is a side view of the ingot. FIG. 19 is a plan view of the ingot. FIG. 20 is a schematic view showing the optical characteristics of the optical anisotropic plate. 21A to 21C are side views of an optically anisotropic plate according to a comparative example of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 2 ... Shake correction apparatus 4 ... Image pick-up element unit 12 ... Image pick-up element 13 ... Crystal plate 14 ... Infrared absorption glass plate 15 ... Quartz wavelength plate 16 ... Airtight seal member 17 ... Case 18 ... Crystal plate 18a ... Crystal 19 ... Pressure member 20 ... Piezoelectric element 22 ... Node of vibration 30 ... Optical member element 56 ... Dust-proof filter drive circuit 80 ... Vibration mode selection circuit

Claims (26)

Provided to face the image pickup device for capturing an image formed by an optical system, including quartz crystal structure and a second shaft is an electrical axis perpendicular to said first axis and the first axis is a crystal growth axis A crystal plate,
Provided on a surface intersecting the optical axis of the optical system in the quartz plate, and a vibration member which bending vibration of the quartz plate,
The surface of the quartz crystal plate that intersects the optical axis of the optical system is at an angle rotated about +45 degrees counterclockwise from the first axis with the second axis as the center, as viewed from the second axis. Imaging device. The imaging apparatus according to claim 1,
An imaging apparatus, wherein the crystal plate is a flat plate cut out from the crystal in a direction having birefringence of light. The imaging apparatus according to claim 1 or 2 ,
An imaging apparatus in which a surface of the quartz plate that intersects the optical axis of the optical system is substantially parallel to the second axis of the quartz crystal. An imaging apparatus according to any one of claims 1 to 3 ,
The imaging apparatus, wherein the quartz plate is rectangular, and a short side of the rectangle is substantially parallel to the second axis of the quartz. An imaging apparatus according to any one of claims 1 to 3 ,
The imaging apparatus, wherein the quartz plate is rectangular, and a long side of the rectangle is substantially parallel to the second axis of the quartz. An imaging apparatus according to any one of claims 1 to 5 ,
An imaging apparatus comprising: a drive unit that drives the vibrating member so that distortion occurs in the crystal plate in a direction substantially orthogonal to the second axis of the crystal. The imaging device according to any one of claims 1 to 6 ,
The quartz plate is rectangular;
The driving unit is an imaging device that drives so that a vibration node substantially parallel to a side of the rectangular crystal plate is generated. An imaging apparatus according to any one of claims 1 to 7 ,
The drive unit is an imaging device that drives the vibrating member such that bending vibration in which a vibration node is substantially parallel to the second axis of the crystal is generated in the crystal plate. An imaging apparatus according to any one of claims 1 to 8 ,
An imaging apparatus comprising an epoxy-based ultraviolet curable adhesive provided between the quartz plate and the vibrating member and fixing the quartz plate and the vibrating member. An imaging apparatus according to any one of claims 1 to 8 ,
An imaging device provided with a cationic polymerization type ultraviolet curable adhesive provided between the quartz plate and the vibrating member and fixing the quartz plate and the vibrating member. An imaging apparatus according to any one of claims 1 to 10 ,
An imaging apparatus having a vibration mode changing means for changing a vibration mode of the crystal plate by the vibration member. An optical system including lithium niobate provided opposite to an imaging device that captures an image by an optical system and having a first axis that is a crystal growth axis and a second axis that is an electric axis perpendicular to the first axis Members,
Wherein provided on a surface intersecting the optical axis of the optical system in the optical member, it has a vibration member for flexural vibration of the optical member,
Imaging in which the surface of the optical member that intersects the optical axis of the optical system is at an angle rotated +45 degrees clockwise from the first axis with the second axis as a center when viewed from the second axis apparatus. An imaging apparatus according to claim 12 ,
The optical member is an imaging device having optical birefringence characteristics. An imaging apparatus according to claim 12 or 13 ,
The imaging device, wherein the optical member is a rectangular plate, and the vibration member is provided along a side of the rectangular plate. An imaging apparatus according to any one of claims 12 to 14 ,
The optical member includes first and second birefringent plates having two types of optical birefringence characteristics, and the vibration member is provided in the first birefringent plate. The imaging apparatus according to claim 15 , wherein
An imaging apparatus, wherein the first birefringent plate is provided at a distance from a part of the optical member excluding the first birefringent plate. An imaging apparatus according to any one of claims 12 to 16 , wherein
An imaging apparatus comprising an epoxy-based ultraviolet curable adhesive provided between the optical member and the vibration member and fixing the optical member and the vibration member. An imaging apparatus according to any one of claims 12 to 16 , wherein
An imaging apparatus comprising a cationic polymerization type ultraviolet curable adhesive provided between the optical member and the vibration member and fixing the optical member and the vibration member. An imaging apparatus according to any one of claims 1 to 11 ,
The imaging device, wherein the vibration member is provided on a side of the quartz plate opposite to a side on which the imaging element is provided. The imaging apparatus according to any one of claims 1 to 11 , wherein
An imaging apparatus, wherein a cleaning region for cleaning with a solvent is provided on a side of the quartz plate opposite to the side on which the imaging element is provided. The imaging device according to claim 9 or 17 ,
The said epoxy type ultraviolet curable adhesive contains the additive which colors the said epoxy type ultraviolet curable adhesive, The imaging device characterized by the above-mentioned. An imaging apparatus according to any one of claims 1 to 11, 19 and 20,
At least a part of the quartz plate is an optical low-pass filter. An imaging apparatus according to claim 9 , wherein
The quartz plate is a sealing member having a sealing surface for sealing the imaging element and an external surface facing the sealing surface,
The outer surface is provided with a cured product layer obtained by curing the epoxy-based ultraviolet curable adhesive, and the cured product layer fixes the vibration member to the outer surface. . An optical device comprising the imaging device according to claim 1 . A plane intersecting the optical axis of the optical system of the quartz plate rectangular including quartz crystal structure and a second shaft is an electrical axis perpendicular to said first axis and the first axis is a crystal growth axis, A vibration member for bending and vibrating the quartz plate is provided,
The crystal plate is disposed so as to face an image sensor that captures an image by the optical system ,
The quartz crystal is such that the surface of the quartz crystal plate intersecting the optical axis of the optical system has an angle rotated about +45 degrees counterclockwise from the first axis with the second axis as the center when viewed from the second axis. A method for manufacturing a photographing apparatus for forming a plate . A method of manufacturing a photographing apparatus according to claim 25 ,
A method of manufacturing an imaging apparatus, wherein the crystal plate is formed such that a surface of the crystal plate that intersects the optical axis of the optical system is substantially parallel to the second axis of the crystal.

Images