JP2012090033A - Imaging module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imaging module capable of suppressing peeling at the adhesion part of an imaging device and a printed wiring board in the case of flip-chip mounting the imaging device onto the printed wiring board.SOLUTION: The imaging module includes: a solid-state imaging device 2 which has a light receiving part 2a for receiving light and generating electric signals formed on a surface, is provided with a plurality of projection electrodes on the peripheral edge part of the surface, and is provided with an organic film 23 more on the inner peripheral side than the peripheral edge part of the surface; a printed wiring board 3 which is arranged facing the solid-state imaging device 2, has an opening 3a formed in a region facing the light receiving part 2a, and is provided with a plurality of electrode pads connected with the plurality of projection electrodes respectively; and an adhesive 4 which is interposed between the peripheral edge part and the printed wiring board more on the outer peripheral side than the region provided with the organic film 23, and fixes the solid-state imaging device 2 and the printed wiring board 3.

Description

  The present invention relates to an imaging module provided with a solid-state imaging device such as a CCD or a CMOS.

  2. Description of the Related Art Conventionally, various types of electronic imaging devices have appeared, such as digital cameras and digital video cameras, endoscopes for observing the inside of an organ of a subject, and mobile phones equipped with an imaging function. An electronic image pickup apparatus includes an image pickup module in which a solid-state image pickup device (hereinafter also simply referred to as an image pickup device) such as a CCD or CMOS image sensor is mounted on a printed wiring board, and a subject is placed on a light receiving portion of the image pickup device by an optical system such as a lens The optical image is formed, and an image of the subject is picked up by the photoelectric conversion processing of the image pickup device.

  Usually, an image sensor forms a light receiving unit and a drive circuit unit that photoelectrically convert received light on a semiconductor substrate, and arranges optical components such as a color filter and a micro lens on the light receiving unit, and has a predetermined function. It is manufactured by forming an organic film having a predetermined area and cutting it into chips. For example, the organic film is formed in a region excluding the light receiving portion for the purpose of shielding light, or is formed on the entire side where the microlens is disposed for the purpose of flattening the optical component placement surface. For example, Patent Document 1 and Patent Document 2 are known as techniques relating to such an organic film.

  Such an image sensor is mounted on a printed wiring board in which an opening corresponding to the light receiving portion is formed via an electrode disposed on a peripheral portion of the surface, and a light transmitting material such as a cover glass is formed above the image pickup region. An imaging member is manufactured by attaching a sex member.

Japanese Patent Laid-Open No. 5-21771 JP-A-5-299625

  By the way, when the image pickup device is flip-chip mounted on the printed circuit board, an adhesive is disposed between the periphery of the opening of the printed circuit board and the peripheral portion of the image pickup device (the region where the electrode is provided). The adhesive is cured in a state where the image sensor is pressed against each other. However, if the printed circuit board after mounting the image sensor is exposed to high temperature, high humidity, etc. by a reliability test or the like, the bonded portion between the image sensor and the printed circuit board (ie, semiconductor substrate, organic film, adhesive) , And the portion where the printed wiring board overlaps) may occur.

  The present invention has been made in view of the above, and has a mounting structure that can suppress peeling at an adhesion portion between an imaging element and a printed wiring board when the imaging element is flip-chip mounted on the printed wiring board. An object of the present invention is to provide an imaging module.

  In order to solve the above-described problems and achieve the object, an imaging module according to the present invention has a light receiving portion that receives light and generates an electrical signal on a surface, and a plurality of protruding electrodes on a peripheral portion of the surface. And a solid-state imaging device provided with an organic film on the inner peripheral side of the peripheral portion of the surface, and arranged in a region facing the solid-state imaging device and facing the light-receiving unit A printed wiring board having an opening and provided with a plurality of electrode pads respectively connected to the plurality of protruding electrodes, and the peripheral edge and the printed wiring board on the outer peripheral side of the region where the organic film is provided And an adhesive for fixing the solid-state imaging device and the printed wiring board.

  In the imaging module, the opening has a larger area than the light receiving portion, and the organic film is a region extending from an outer edge of the light receiving portion to an outer peripheral side, and at least an edge of the opening is formed on the surface. It is provided in the area | region containing the part projected on.

  In the imaging module, the organic film has substantially the same shape as the opening.

  In the imaging module, the organic film is a light shielding film that blocks light from entering a region other than the light receiving portion of the solid-state imaging device.

  In the imaging module, the solid-state imaging device further includes a color filter disposed on the light receiving unit and a microlens disposed on the color filter, and the organic film covers at least the color filter. And a flattening film for flattening the arrangement surface of the microlenses.

  According to the present invention, the adhesive disposed between the peripheral edge of the solid-state imaging device and the peripheral portion of the opening to separate the solid-state imaging device and the printed wiring board from the adhesive of the solid-state imaging device. Since an organic film having a predetermined function is provided in the region, and the organic film is not interposed in the bonding portion between the solid-state imaging device and the printed wiring board, the peeling at the bonding portion is suppressed, and the solid-state imaging device and the printed wiring board It is possible to maintain the certainty of adhesion.

FIG. 1 is a side sectional view showing a configuration example of an imaging module according to Embodiment 1 of the present invention. 2 is a cross-sectional view when the imaging module according to Embodiment 1 of the present invention is cut along AA shown in FIG. FIG. 3 is a flowchart showing a method for manufacturing the imaging module according to Embodiment 1 of the present invention. FIG. 4A is a cross-sectional view showing a step of arranging a color filter in the manufacturing process of the solid-state imaging device. FIG. 4B is a cross-sectional view illustrating a process of forming an organic film (light-shielding film) in the manufacturing process of the solid-state imaging device. FIG. 4C is a cross-sectional view showing a step of forming an organic film (lens flattening layer) in the manufacturing process of the solid-state imaging device. FIG. 4D is a cross-sectional view illustrating a process of arranging the microlens in the manufacturing process of the solid-state imaging device. FIG. 4E is a cross-sectional view illustrating a process of forming the protruding electrode in the manufacturing process of the solid-state imaging device. FIG. 5 is a schematic diagram showing a process of applying an adhesive to a printed wiring board. FIG. 6 is a schematic diagram illustrating a process of mounting a solid-state imaging device on a printed wiring board via an adhesive. FIG. 7 is a schematic diagram illustrating a process of adhering a translucent member to a printed wiring board. FIG. 8 is a cross-sectional view illustrating a configuration example of an imaging module according to Embodiment 2 of the present invention. FIG. 9 is a cross-sectional view showing a part of FIG.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of an imaging module according to the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments. In the description of the drawings, the same parts are denoted by the same reference numerals. The drawings are schematic, and it should be noted that the relationship between the thickness and width of each member, the ratio of each member, and the like are different from the actual ones. Also in the drawings, there are included portions having different dimensional relationships and ratios.

(Embodiment 1)
FIG. 1 is a cross-sectional view showing a configuration example of an imaging module according to Embodiment 1 of the present invention. 2 is a cross-sectional view of the imaging module according to Embodiment 2 taken along the line AA shown in FIG. As shown in FIGS. 1 and 2, the imaging module 1 includes a solid-state imaging device 2 that captures an image of a subject, a printed wiring board 3 on which the solid-state imaging device 2 is flip-chip mounted, a solid-state imaging device 2 and a printed wiring. An adhesive 4 for fixing the substrate 3, a translucent member 5 for transmitting light from the subject, and an adhesive 6 for fixing the translucent member 5 and the printed wiring board 3 are provided. The printed wiring board 3 is provided with an opening 3a, and the solid-state imaging device 2 receives light that has passed through the translucent member 5 and the opening 3a, and outputs an electrical signal representing an image of the subject.

  The solid-state imaging device 2 is a bare chip-like semiconductor device exemplified by a CCD or CMOS image sensor, and has an imaging function of receiving light from a subject and capturing an image of the subject. In the first embodiment, the case where the solid-state imaging device 2 is a CMOS image sensor will be described. However, the present invention can also be applied to a CCD.

  The solid-state imaging device 2 includes a chip substrate 20 having a light receiving portion 2a and a drive circuit portion (not shown) formed on the surface, a color filter 21 and a microlens 22 provided on the light receiving portion 2a, and a chip substrate 20. The organic film 23 disposed in the predetermined region, the protruding electrodes 24 arranged on the peripheral edge of the chip substrate 20 on the surface on which the light receiving portion 2a and the drive circuit portion are formed, and the organic film provided on the color filter 21 25. Note that the organic film 25 is not necessarily provided.

The chip substrate 20 includes a semiconductor wafer such as silicon (Si) and a wiring layer (not shown) formed thereon. On the chip substrate 20, an insulating layer 2b that covers the wiring layer and an electrode 2c that is electrically connected to the wiring layer are formed. The insulating layer 2b is, for example, a silicon nitride film (SiN) or a silicon oxide film (SiO ₂ ). In the first embodiment, a silicon nitride film is formed. In addition to silicon, germanium, gallium arsenide (GaAs), gallium nitride (GaN), silicon carbide (SiC), or the like is also used as a material for the semiconductor wafer.

  The light receiving part 2a is formed, for example, at the central portion of the surface of the chip substrate 20. The light receiving unit 2a is configured by a pixel group arranged in a predetermined shape such as a lattice shape, and photoelectrically converts light received through the microlens 22 and a color filter 21 of a predetermined color. A drive circuit unit (not shown) is a drive circuit for performing an imaging operation, and is formed around the light receiving unit 2a.

  The organic film 23 is a film formed of an organic material, and has a function such as light shielding. In the first embodiment, the organic film 23 is a light-shielding film formed around the light-receiving portion 2a with, for example, an acrylic resin, phenol resin, polyvinyl alcohol, casein or the like colored with a dye, and goes to a region other than the light-receiving portion 2a. To suppress dark current caused by light irradiation.

  Further, the organic film 23 extends to at least the projected edge 3b ′ when the edge 3b of the opening 3a of the printed wiring board 3 is projected onto the chip substrate 20 in a region extending from the outer edge of the light receiving portion 2a to the outer peripheral side. Formed to exist. Preferably, it may be formed up to the outer peripheral side of the projected edge 3b '(that is, a region partially overlapping with the peripheral region of the projected opening 3a). On the other hand, the organic film 23 is formed leaving the peripheral edge portion (arrangement region of the protruding electrode 24) of the chip substrate 20 so that the end portion thereof does not contact the adhesive 4 described later.

  A plurality of protruding electrodes 24 are arranged so as to surround the light receiving portion 2a and the drive circuit portion (not shown). These protruding electrodes 24 are, for example, stud bumps such as gold or copper formed by a wire bonding method, and are connected to the drive circuit unit via the electrodes 2c formed on the surface of the chip substrate 20 and internal wiring (not shown). Electrically connected. In addition, the protruding electrode 24 may be a metal bump or a metal ball such as gold, silver, copper, indium or solder formed by a plating method, or a resin ball having a surface plated with metal. May be. Or the conductive adhesive patterned by printing etc. may be sufficient.

  The organic film 25 is a lens flattening layer formed on the color filter 21 and the organic film 23 using, for example, an acrylic resin, a phenol resin, or the like, and flattens the arrangement surface of the microlens 22. Similarly to the organic film 23, the organic film 25 is also formed so as to leave the peripheral portion of the surface of the chip substrate 20 so that the end portion thereof does not come into contact with the adhesive 4 described later. In FIG. 2, the organic film 25 is omitted.

  The printed wiring board 3 is, for example, FPC (Flexible Printed Circuits) that can be easily deformed by application of an external force, and a surface of the substrate body 30 that faces the solid-state image sensor 2 of the substrate body 30 in which the opening 3a is formed. The circuit wiring 31 and the electrode pad 32 are formed. The substrate body 30 is formed of a resin such as glass fiber reinforced epoxy or polyimide. As the printed wiring board 3, a rigid circuit board that is not easily deformed as compared with the FPC may be used.

  The opening 3a is formed in a region facing the light receiving unit 2a and has a larger area than the light receiving unit 2a. By defining the shape and area of the opening 3a in this way, it is possible to allow light from the subject to enter the light receiving portion 2a, particularly light from an oblique direction (edge 3b side) in the end region of the light receiving portion 2a. To.

  A plurality of circuit wirings 31 are patterned around the opening 3a, and electrode pads 32 are formed at each end of the circuit wirings 31. The arrangement pattern of the electrode pads 32 corresponds to the arrangement pattern of the protruding electrodes 24 of the solid-state imaging device 2.

  The adhesive 4 is interposed between the solid-state imaging device 2 and the printed wiring board 3 to bond the solid-state imaging device 2 and the printed wiring board 3 and close the gap between the two. More specifically, the adhesive 4 is disposed between the peripheral portion (region including the protruding electrode 24) on the surface of the chip substrate 20 and the peripheral region of the opening 3 a of the printed wiring board 3. At this time, the adhesive 4 is disposed on the outer peripheral side of the organic film 23 so as to be separated from the organic film 23. The adhesive 4 may be an epoxy, phenol, silicon, urethane, acrylic or other insulating adhesive, or may be an anisotropic conductive adhesive.

  The translucent member 5 is an optical member that is transparent to light from the subject, and is realized using a resin such as glass or acrylic, a low-pass filter, an IR cut filter, a lens, or a prism. As shown in FIG. 1, the translucent member 5 is fixed to the printed wiring board 3 via an adhesive 6 from the opposite side of the solid-state imaging device 2 with the printed wiring board 3 interposed therebetween. The adhesive 6 is interposed between the substrate surface around the opening 3 a of the printed wiring board 3 and the translucent member 5 to bond the printed wiring board 3 and the translucent member 5. The translucent member 5 fixed on the printed wiring board 3 covers the opening 3a from above the printed wiring board 3, and hermetically seals the light receiving part 2a of the solid-state imaging device 2 together with the adhesive 6. Thus, foreign matter from the opening 3a side of the printed wiring board 3 is prevented without impairing the light transmittance to the light receiving portion 2a.

  In the solid-state imaging device 2 flip-chip mounted on the printed wiring board 3 in this way, the light receiving unit 2a receives light from the subject via the translucent member 5 and the like, and performs photoelectric conversion processing on the received light. . The drive circuit unit generates an imaging signal of a subject based on the signal subjected to the photoelectric conversion processing by the light receiving unit 2a, and outputs it to the printed wiring board 3 side through the protruding electrode 24.

  Next, a method for manufacturing the imaging module 1 shown in FIG. 1 will be described. FIG. 3 is a flowchart illustrating an example of a method for manufacturing the imaging module 1. The imaging module 1 prepares the solid-state imaging device 2, the printed wiring board 3, and the translucent member 5 on which a desired organic film 23 is formed in advance as components of the imaging module 1, and uses the adhesives 4 and 6, Manufactured by combining these components.

  First, in step S1 of FIG. 3, as shown in FIG. 4A, a chip substrate 20 provided with an insulating layer 2b and an electrode 2c is prepared, and a color filter 21 is disposed on the light receiving portion 2a on the chip substrate 20. To do.

  In the subsequent step S2, as shown in FIG. 4B, an organic film 23 that functions as a light shielding film is formed in a region excluding the light receiving portion 2a and the peripheral portion 2d of the chip substrate 20. As a method of forming the organic film 23, various known methods can be used. For example, a resist is applied on the chip substrate 20 to form a pattern in which an area excluding the light receiving portion 2a and the peripheral portion 2d is an opening, and an acrylic resin or phenol colored with a dye using the resist pattern as a mask. The organic film 23 is formed by applying a resin, polyvinyl alcohol, casein or the like, and then the resist is removed. Alternatively, after an organic film is applied to the entire surface of the chip substrate 20, a mask in which the light receiving portion 2a and the peripheral portion 2d are opened is formed, and an excess organic film formed in the opening portion is removed. good.

  In step S <b> 3, as shown in FIG. 4C, an organic film 25 such as an acrylic resin or a phenol resin that functions as a lens flattening layer is formed on the color filter 21 and the organic film 23. Similar to the organic film 23, the organic film 25 is also formed in a region excluding the peripheral edge 2d. About the formation method of the organic film 25, it is the same as that of process S2.

  In step S4, as shown in FIG. 4D, the microlens 22 is disposed in a region corresponding to each color filter 21 on the organic film 25.

  Further, in step S5, as shown in FIG. 4E, the protruding electrode 24 is formed on the electrode 2c by, for example, a wire bonding method. In this way, the solid-state imaging device 2 is manufactured.

  Next, in step S <b> 6, as shown in FIG. 5, the adhesive 4 is applied to the mounting surface of the solid-state imaging device 2 in the printed wiring board 3. Specifically, the adhesive 4 is applied endlessly around the opening 3a so as to cover all the electrode pads 32 and surround the opening 3a from a position separated from the opening 3a by a predetermined distance. Is done. The predetermined distance and the amount of the adhesive 4 to be applied are determined based on, for example, the range of the organic films 23 and 25 formed on the solid-state imaging device 2, the flow distance of the adhesive 4, and the like.

  In subsequent step S7, as shown in FIG. 6, the solid-state imaging device 2 is mounted on the printed wiring board 3 to which the adhesive 4 is applied. Specifically, the solid-state imaging device 2 is pressed against the adhesive 4 on the printed wiring board 3 with the opening 3 a of the printed wiring board 3 and the light-receiving portion 2 a of the solid-state imaging device 2 facing each other. Thereby, each protruding electrode 24 and each electrode pad 32 are connected while spreading the adhesive 4 on the mounting surface of the solid-state imaging device 2. Then, the printed wiring board 3 and the solid-state imaging device 2 are fixed through the adhesive 4 by curing the adhesive 4 by a predetermined curing process. The adhesive 4 may be cured by heat treatment or may be cured by ultraviolet irradiation treatment.

  Furthermore, in step S8, as shown in FIG. 7, the translucent member 5 is attached to the printed wiring board 3 via the adhesive 6, and the opening 3a of the printed wiring board 3 is sealed. Specifically, first, the adhesive 6 is applied to the substrate surface of the printed wiring board 3 opposite to the mounting surface of the solid-state imaging device 2 so as to surround the opening 3a, and then on the printed wiring board 3 The translucent member 5 is pressed against the adhesive 6. Thereafter, the adhesive 6 is cured by a predetermined curing process to fix the printed wiring board 3 and the translucent member 5. Thus, the translucent member 5 fixed to the printed wiring board 3 hermetically seals the opening 3a. Note that the adhesive 6 may be cured by heat treatment or by ultraviolet irradiation treatment.

  The imaging module 1 shown in FIG. 1 is manufactured by sequentially performing the manufacturing processes of the above-described processes S1 to S8. Such an imaging module 1 is built in various types of electronic imaging devices such as a digital camera and a digital video camera, an endoscope for observing the inside of an organ of a subject, and a mobile phone having an imaging function. Used.

  As described above, in the imaging module 1 according to the first embodiment, the organic films 23 and 25 are disposed leaving the peripheral edge 2d of the solid-state imaging device 2, and at the time of flip chip mounting, the organic films 23 and 25 are arranged. On the other hand, the adhesive 4 is disposed so as to prevent the organic films 23 and 25 from interposing at the bonded portion between the solid-state imaging device 2 and the printed wiring board 3. Accordingly, even when stress such as heat, humidity, pressure, etc. is applied in an environment such as a flip chip mounting process or a subsequent reliability test, characteristics of the organic films 23 and 25 themselves (for example, heat ( Line) expansion coefficient etc. will not affect the bonded part. Therefore, peeling between the solid-state imaging device 2 and the adhesive 4 can be suppressed, and the adhesion state between the two can be reliably maintained. As a result, the yield of the imaging module 1 can be improved.

  In the first embodiment, the two types of organic films 23 and 25, which are a light shielding film and a lens flattening layer, are formed. However, the functions and materials of the organic film are not limited to these. For example, only a light shielding film may be formed, or an organic film having a different function such as a protective film may be further added. In any case, the organic film may be formed by leaving the peripheral edge of the solid-state image sensor 2 so that the organic film is not interposed in the bonded portion between the solid-state image sensor 2 and the printed wiring board 3.

(Embodiment 2)
Next, an imaging module according to Embodiment 2 of the present invention will be described with reference to FIGS. The side cross-sectional structure of the imaging module according to Embodiment 2 is the same as that shown in FIG. 1, and FIG. 8 is a cross-sectional view of the imaging module according to Embodiment 2 taken along line AA shown in FIG. It is. FIG. 9 is an enlarged view showing a part of the imaging module 1-2 in FIG.

  The imaging module 1-2 includes a solid-state imaging device 7 and a printed wiring board 8 shown in FIG. 8 instead of the solid-state imaging device 2 and the printed wiring board 3 shown in FIG. These solid-state imaging device 7 and printed wiring board 8 are fixed by an adhesive 9. In the solid-state imaging device 7, the pattern of the organic film 71 and the protruding electrodes 72 and 73 provided on the chip substrate 70 is different from the organic film 23 and the protruding electrode 24 shown in FIG. Further, in the printed wiring board 8, the pattern of the opening 8a, the circuit wiring 81, and the electrode pads 82 and 83 provided in the board body 80 is the same as the opening 3a, the circuit wiring 31, and the electrode pad 32 shown in FIG. Is different. Other configurations are the same as those in the first embodiment.

  In the solid-state imaging device 7, a light receiving portion 7 a is formed at a substantially central portion of the chip substrate 70, and a rectangular shape with four corners cut out around it (that is, an upper portion of a drive circuit portion not shown) (substantially). An organic film 71 having a cross shape is formed. The shape of the organic film 71 is substantially equal to an opening 8a of the printed wiring board 8 described later. The organic film 71 is a film formed of an organic material, and has functions such as light shielding, contamination prevention, surface protection, and planarization. In the second embodiment, as the organic film 71, a film made of acrylic resin, phenol resin, polyvinyl alcohol, casein or the like colored with a dye having a light shielding function is formed. The organic film 71 is formed in a region extending from the outer edge of the light receiving portion 7a to the outer peripheral side so as to extend at least to the edge 8b of the opening 8a when viewed from the upper surface. Preferably, the organic film 71 is formed up to the outer peripheral side of the edge 8b. On the other hand, the organic film 71 is formed leaving the peripheral edge portion (arrangement region of the protruding electrodes 72 and 73) on the surface of the chip substrate 70 so that the end portion and the adhesive 9 are separated.

  8 and 9, only the organic film 71 functioning as a light shielding film is shown, but an organic film as a lens flattening layer may be further provided as in the first embodiment. In this case, similarly to the organic film 71, the further provided organic film is disposed leaving the peripheral edge portion of the surface of the chip substrate 70.

  Two types of protruding electrodes are provided on the surface of the chip substrate 70. A plurality of outer protruding electrodes 72 are formed on the periphery of the chip substrate 70 along the outer periphery of the chip substrate 70 so as to surround the light receiving unit 7a and the surrounding drive circuit unit (not shown). On the other hand, a plurality of inner protruding electrodes 73 are formed at four corners cut out from the original rectangle of the organic film 71 (two in each corner in FIG. 8, a total of eight). That is, the inner protruding electrode 73 is positioned closer to the light receiving portion 7 a than the outer protruding electrode 72. The plurality of outer protruding electrodes 72 and inner protruding electrodes 73 are electrically connected to the drive circuit section via electrodes (not shown) formed on the chip substrate 70 of the solid-state imaging device 7.

  The outer protruding electrode 72 and the inner protruding electrode 73 may be stud bumps such as gold or copper formed by a wire bonding method, or gold, silver, copper, indium, solder, or the like formed by a plating method. Metal bumps may be used. Alternatively, the outer protruding electrode 72 and the inner protruding electrode 73 may be a metal ball, a resin ball having a surface plated with metal, or a conductive adhesive patterned by printing or the like. There may be.

  On the other hand, the substrate body 80 of the printed wiring board 8 is formed with an opening 8a centered on a position facing the light receiving portion 7a. The opening 8a also has a shape in which four corners of a rectangle are cut out (substantially cross shape). In addition, a plurality of circuit wirings 81 are formed around the opening 8a, and each end of the plurality of circuit wirings 81 corresponds to each arrangement of the outer protruding electrode 72 and the inner protruding electrode 73. The outer electrode pad 82 or the inner electrode pad 83 is formed.

  As shown in FIG. 9, the opening 8 a is designed in consideration of the size of the light receiving portion 7 a of the solid-state imaging device 7 described above and the distance relationship with respect to the outer protruding electrode 72 and the inner protruding electrode 73. Specifically, the opening 8a has a larger opening area than the light receiving portion 7a. Such an opening 8a faces the light receiving portion 7a and allows light from the subject to enter the light receiving portion 7a.

  The outer electrode pad 82 and the inner electrode pad 83 are a plurality of rows of electrode terminals formed in two rows on the outer side and the inner side along the edge 8b of the opening 8a. A plurality of outer electrode pads 82 are formed in the periphery of the opening 8a corresponding to the arrangement of the outer protruding electrodes 72 of the solid-state imaging device 7 shown in FIG. 8, and by flip-chip mounting between the printed wiring board 8 and the solid-state imaging device 7. Connected to the outer protruding electrode 72. On the other hand, the inner electrode pads 83 are formed in the same number as the inner protruding electrodes 73 on the opening 8a side as compared with the outer electrode pads 82, corresponding to the arrangement of the inner protruding electrodes 73 of the solid-state imaging device 7 shown in FIG. The The plurality of inner electrode pads 83 are connected to the inner protruding electrodes 73 by flip-chip mounting of the printed wiring board 8 and the solid-state imaging device 7.

  The adhesive 9 is interposed between the solid-state image sensor 7 and the printed wiring board 8 and adheres the solid-state image sensor 7 and the printed wiring board 8 as in the first embodiment. The adhesive 4 may be, for example, an epoxy, phenol, silicon, urethane, acrylic, or other insulating adhesive, or an anisotropic conductive adhesive.

The adhesive 9 is applied endlessly on each outer electrode pad 82 so as to surround the opening 8 a, and further applied on each inner electrode pad 83. Thereafter, the applied adhesive 9 flows radially by pressing the solid-state imaging device 7 against the printed wiring board 8, and finally, between the substrate surface around the opening 8 a and the solid-state imaging device 7. Wetting spreads and the bottom shape is formed along the outer periphery of the solid-state imaging device 7. Further, the adhesive 9 is cured by a predetermined curing process, and as a result, the gap between the solid-state image sensor 7 and the printed wiring board 8 is closed, and the solid-state image sensor 7 and the printed wiring board 8 are fixed.
Similar to the first embodiment, such an imaging module 1-2 is manufactured by the manufacturing process shown in FIG.

  In the first and second embodiments described above, a rectangular or substantially cross-shaped opening is formed on the printed wiring board side, and an organic film having a shape substantially equal to the opening is disposed on the solid-state imaging device side. did. However, the shapes of the opening and the organic film are not limited to those of the first and second embodiments. For example, the circular shape or the corner is an arc according to the shape of the light receiving portion of the solid-state imaging device, the wiring pattern, or the like. A desired shape such as a rectangular shape or a cross shape can be adopted.

DESCRIPTION OF SYMBOLS 1, 1-2 Imaging module 2, 7 Solid-state image sensor 2a, 7a Light-receiving part 2b Insulating layer 2c Electrode 2d Peripheral part 3, 8 Printed wiring board 3a, 8a Opening part 3b, 8b Edge 4, 6, 9 Adhesive 5 Through Optical member 20, 70 Chip substrate 21 Color filter 22 Micro lens 23, 25, 71 Organic film 24 Projection electrode 30, 80 Substrate body 31, 81 Circuit wiring 32 Electrode pad 72 Outer projection electrode 73 Inner projection electrode 82 Outer electrode pad 83 Inner electrode pad

Claims (5)

A light receiving portion that receives light and generates an electrical signal is formed on the surface, a plurality of protruding electrodes are provided on the peripheral portion of the surface, and an organic film is provided on the inner peripheral side of the peripheral portion of the surface. Solid-state image sensor,
A printed wiring board disposed opposite to the solid-state imaging device, having an opening formed in a region facing the light receiving portion, and provided with a plurality of electrode pads respectively connected to the plurality of protruding electrodes;
An adhesive that is interposed between the peripheral portion and the printed wiring board on the outer peripheral side of the region where the organic film is provided, and fixes the solid-state imaging device and the printed wiring board;
An imaging module comprising: The opening has a larger area than the light receiving part,
2. The organic film according to claim 1, wherein the organic film is provided in a region that extends from an outer edge of the light receiving portion to an outer peripheral side and includes at least a portion obtained by projecting an edge of the opening on the surface. The imaging module described.   The imaging module according to claim 2, wherein the organic film has substantially the same shape as the opening.   The imaging module according to claim 1, wherein the organic film is a light shielding film that blocks light from entering a region other than the light receiving portion of the solid-state imaging device. The solid-state imaging device further includes a color filter disposed on the light receiving unit, and a microlens disposed on the color filter,
5. The imaging according to claim 1, wherein the organic film is a flattening film that is disposed so as to cover at least the color filter and planarizes a placement surface of the microlens. module.

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