JP2006332894A - Imaging device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an imaging device with superior positional accuracy of an imaging element in an assembled state along with superior heat radiation. <P>SOLUTION: The imaging device includes a body-side mount 14 assembled in a main body structure 4 of a camera body 3 for supporting a photographing lens, a shutter 6 arranged along an optical axis O at the opening of the main body structure 4, an image pick-up unit 8 and the like. The image pick-up unit 8 has an imaging element fixing plate 28 supported firmly by the main body structure 4, an optical low pass filter 22, a protective glass 24, and a bare chip imaging element 26. In the imaging element 26, a non-image pick-up side surface 26c is fixed to an imaging element fixing plate 28 and the imaging element 26 is assembled with an accurate length from the surface of the body side mount 14 to an image pick-up face(photoelectric conversion face) in the direction of optical axis. In addition, the bare chip imaging element 26 is fixed by bonding to the imaging element fixing plate 28 so that its superior heat radiation is realized. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a support structure for an image sensor.

2. Description of the Related Art Conventionally, in an imaging apparatus that electronically captures a subject image, the one disclosed in Patent Document 1 regarding a structure for incorporating an imaging element into the imaging apparatus is a light transmissive member and a wiring bonded to the light transmissive member. The present invention relates to an image pickup apparatus having an image pickup element unit including a substrate and an image pickup element mounted so as to pick up a subject image that has passed through a lens unit and a light transmissive member in an opening of the wiring board. In the imaging apparatus, the imaging element unit is incorporated with the surface of the light transmissive member facing the imaging element facing the receiving surface facing the lens unit of the imaging apparatus body, The imaging element unit can be accurately positioned in the optical axis direction of the unit.
Japanese Patent Laid-Open No. 2002-218293.

  However, in the imaging apparatus disclosed in Patent Document 1 described above, an imaging element is connected to a flexible printed circuit board (hereinafter referred to as FPC), and this FPC is incorporated as a structural member in the camera body. However, this FPC has a variation in the position of the photoelectric conversion surface (imaging surface) in the direction of the optical axis O in terms of dimensional accuracy as a mechanical structure, and the positional accuracy of the photoelectric conversion surface in the imaging device is necessarily good. I can't say that. In addition, since the image sensor is connected to the FPC, there is a problem that the heat dissipation of the image sensor is not good.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an imaging apparatus that has a high positional accuracy of an imaging element in a state of being incorporated in the imaging apparatus and has a good heat dissipation effect.

  An image pickup apparatus according to claim 1 of the present invention is a flexible printed board in which an optical member that transmits imaging light, a connection pattern is provided on one surface, and the surface of the optical member is fixed to the other surface. An imaging device electrically connected via the bumps and the connection pattern on the one surface of the flexible printed circuit board so that the imaging surface faces the optical member, and the imaging surface of the imaging device. And a support member fixed to the back surface.

  The imaging apparatus according to claim 2 of the present invention is the imaging apparatus according to claim 1, wherein the flexible printed circuit board has an opening, and the imaging light passes through the optical member and the opening to capture the imaging. To reach the surface.

  According to a third aspect of the present invention, in the imaging device according to the first aspect, the imaging device further includes a photographing lens support member to which the photographing lens can be attached and detached, and the support member is attached to the photographing lens support member. Fixed.

  ADVANTAGE OF THE INVENTION According to this invention, the position accuracy of the image pick-up element in the state integrated in the imaging device can be provided, and the imaging device with the sufficient heat dissipation effect can be provided.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a longitudinal sectional view showing a main configuration of a single-lens reflex camera (camera body) as one embodiment of the present invention. FIG. 2 is an exploded perspective view of the imaging device incorporated in the camera body. FIG. 3 is a longitudinal sectional view of the imaging unit of the imaging apparatus.

  The single-lens reflex camera of this embodiment (hereinafter referred to as a single-lens reflex camera) is an interchangeable lens barrel having the camera body 1 of FIG. 1 and an optical member (imaging lens, aperture) detachable from the camera body 1. (Not shown). In the following description, the subject side in the optical axis O direction of the photographing lens shown in FIG. 1 is defined as the front, and the imaging surface side (imaging surface side) is defined as the rear. The Y direction perpendicular to the optical axis O is the vertical direction, and the + side is the upward direction.

  An imaging device is housed in the camera exterior 2 of the camera body 1, and the imaging device is fixedly supported by the camera exterior 2 and has a main body structure 4 having a central opening 4 a along the optical axis O, and the above-described structure. A body side mount 14 as a photographing lens support member to which the interchangeable lens barrel is attached and detached, and a main mirror 5 as a constituent member disposed along the optical axis O in the central opening 4a of the main body structure 4 , Including a focal plane shutter 6 and an imaging unit 8, and further fixedly supported on the upper side of the main body structure 4, and a focusing screen 9, a pentaprism 10, and an eyepiece 11 as members constituting the finder device. Comprising.

  A liquid crystal monitor device 12 is disposed inside the monitor display window 13 on the back side of the camera exterior 2.

  The body side mount 14 is fixed to the front surface of the main body structure 4 in a state of being applied in the direction of the optical axis O.

  The main mirror 5 can be rotated between an oblique position that reflects the subject light flux toward the upper focusing screen and a retracted position that is retracted from the subject optical path of the optical axis O.

  The shutter 6 is disposed at a position behind the main mirror 5 on the optical axis O and at an oblique position.

  The image pickup unit 8 is a unit arranged at a rear position of the shutter 6, and has an image pickup element fixing plate 28 as a support member and a back surface of the fixing plate 28 via an insulating sheet 27 as shown in FIGS. An image pickup element 26 whose side is bonded and fixed, a connection flexible printed circuit board (hereinafter referred to as a connection FPC) 25 attached and connected to an image pickup surface side surface 26a which is the front surface of the image pickup element 26, and a protective glass made of a light transmitting member 24, an optical low-pass filter 22 supported by the rubber frame 23, and a holder member 21 that holds the rubber frame 23 and the low-pass filter 22. Further, an interface circuit component or A circuit board 29 on which image processing circuit components and the like are mounted is disposed.

  The image sensor fixing plate 28 is formed of an aluminum plate or a stainless steel plate, and holds the image sensor 26 and also has a heat radiation function of the image sensor. As will be described later, the imaging element fixing plate 28 is fixedly attached to the imaging unit support portion 4c on the back surface of the main body structure 4.

  The insulating sheet 27 is a sheet having a predetermined dimension and a very thin thickness, and is provided with an adhesive application hole 27a.

  The connection FPC 25 has an opening 25a at the center, connection connectors 25b at the upper and lower ends, and an FPC-side connection pattern 25c on the back side.

  The imaging element 26 is a bare chip type (non-package) imaging element, and a connection bump 26b for the connection FPC 25 is provided on the imaging surface side surface 26a side of the front surface. The imaging surface (photoelectric conversion surface) is located at a predetermined distance from the non-imaging surface side surface 26c, which is the back surface of the imaging surface side surface 26a.

  The non-imaging surface side surface 26c, which is the back surface of the image sensor 26, is bonded and fixed to the front surface side of the image sensor fixing plate 28 with the insulating sheet 27 interposed therebetween. Further, in a state where the imaging surface side surface 26a which is the lens barrel side of the imaging element 26 is exposed from the opening 25a of the connection FPC 25, the connection bump 26b and the connection pattern 25c on the connection FPC side are in contact with each other. Bonded and fixed. In this fixed state, the imaging surface of the imaging device 26 is in a state of facing the lens barrel that is an optical member.

  The protective glass 24 is adhered by covering the front surface of the opening 25a of the connection FPC 25 in a sealed state. Therefore, the intrusion of dust from the inside of the optical low-pass filter 22 on the outer side of the imaging surface side surface 26 a of the imaging element 26 is prevented by the protective glass 24.

  The holder member 21 is a frame member having an opening 21a in the center, and is fixed to the front side of the image sensor fixing plate 28 (screw) with a rubber frame 23 having an optical low-pass filter 22 attached to the back of the opening 21a. Or by gluing). In the fixed state, the frame-shaped protrusion 23 a disposed over the entire circumference of the back side of the rubber frame 23 comes into close contact with the front surface of the protective glass 24. Therefore, the surface of the protective glass 24 that protects the image pickup surface side surface 26a of the image pickup element 26 is sealed from the outer periphery, thereby preventing dust from entering from inside the body.

  The image pickup device fixing plate 28 to which the image pickup device 26, the connection FPC 25, the protective glass 24, the optical low-pass filter 22, and the holder member 21 are attached as the image pickup unit 8 has three convex shapes provided on the back side of the main body structure 4. It is positioned and attached to the imaging unit support 4c. Specifically, the positioning hole 28b of the image sensor fixing plate 28 is fitted into a positioning pin (not shown) provided in the image pickup unit support 4c of the main body structure 4 to perform the optical axis O orthogonal positioning, and the screw 30 is connected to the image sensor. The screw insertion hole 28a of the fixing plate 28 is inserted and screwed into the screw hole 4b of the support portion 4c to fix the image sensor fixing plate 28 in the optical axis O direction. Further, the connection connector portion 25b of the connection FPC 25 is inserted into the connector portion of the circuit board 29 and connected.

  In the imaging device incorporated in the camera body 1 as described above, the imaging element fixing plate 28 is positioned in a direction orthogonal to the optical axis O in a state where the imaging unit 8 is fixedly attached to the back surface of the main body structure 4. In this state, it is applied to the imaging unit mounting portion 4b and fixed with high positional accuracy in the direction of the optical axis O. A bare chip type image pickup element 26 is fixed to the image pickup element fixing plate 28 with an insulating sheet 27 interposed therebetween. Therefore, the accuracy of the distance (flange back) from the front surface of the body-side mount 14 fixed to the front surface side of the image sensor fixing plate 28 to the imaging surface (photoelectric conversion surface) of the image sensor 26 on the image sensor fixing plate 28 is Considering that the image pickup element 26 is a bare chip, high accuracy is ensured.

  Furthermore, since the image pickup element 26 is not a package type but a bare chip, and the image pickup element 26 is bonded and fixed to the image pickup element fixing plate 28 made of a metal plate via a thin insulating sheet 27, the image pickup element 26 is provided. The heat generation amount is radiated by using the image sensor fixing plate 28 as a heat radiating plate, and the temperature rise of the image sensor 26 can be suppressed. Since it is a bare chip, it is advantageous in terms of cost.

  The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention at the stage of implementation. Further, the above embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements.

  The image pickup apparatus according to the present invention can be used as an image pickup apparatus in which the position accuracy of an image pickup element to be incorporated is good and the heat dissipation effect is good.

1 is a longitudinal sectional view showing a main configuration of a single-lens reflex camera (camera body) as an embodiment of the present invention. It is a disassembled perspective view of the imaging device integrated in the camera body of FIG. It is a longitudinal cross-sectional view of the imaging unit of the imaging device incorporated in the camera body of FIG.

Explanation of symbols

14 ... Body side mount (photographing lens support member)
25 ... Connection FPC (flexible printed circuit board)
25a ... Opening (opening of flexible printed circuit board)
25c ... Pattern for connection 26 ... Image sensor 26b ... Bump 28 ... Image sensor fixing plate (support member)

Claims (3)

An optical member that transmits imaging light;
A flexible printed circuit board provided with a connection pattern on one surface and the surface of the optical member fixed on the other surface;
An image sensor electrically connected via the bumps and the connection pattern on the one surface of the flexible printed circuit board so that the image pickup surface faces the optical member;
A support member fixed to the back surface of the imaging surface of the imaging element;
An imaging device characterized by comprising: The imaging apparatus according to claim 1, wherein the flexible printed board has an opening, and the imaging light passes through the optical member and the opening to reach the imaging surface. The imaging apparatus according to claim 1, further comprising a photographing lens support member to which the photographing lens can be attached and detached, wherein the support member is fixed to the photographing lens support member.

Images