JP5760828B2 - Heat dissipation structure - Google Patents

Description

  The present invention relates to a heat dissipation structure for releasing heat of an image sensor.

  2. Description of the Related Art In recent years, there has been a demand for higher image quality of captured images in imaging devices such as digital cameras. Here, in order to satisfy the demand for high image quality, it is desirable to efficiently release the heat of the image sensor that acquires the subject image formed by the photographing optical system. For this reason, it is considered to connect the image pickup device and the housing with a heat conducting member.

  In order to satisfy the demand for higher image quality, it is desirable to provide an image sensor at a position where a subject image formed by the photographing optical system can be appropriately acquired. For this reason, a reference plane for the imaging optical system is set in the housing, and the position of the imaging element in the imaging optical axis direction of the imaging optical system is adjusted and the imaging is performed so that the imaging plane of the imaging element matches the reference plane. It has been considered to perform so-called tilt adjustment of the image pickup element that adjusts the inclination of the image pickup element with respect to the optical axis direction with high accuracy.

  Here, since the above-described heat conducting member connects the image sensor and the housing, if the relative positional relationship between the housing and the image sensor changes as a result of the tilt adjustment described above, the image is captured. There is a risk of applying force to the element. For this reason, after the heat conducting member is brought into close contact with the heat radiating surface of the cooling element which is brought into close contact with the image pickup element to cool the heat pickup member, the heat conducting plate is made to adhere to the heat conducting member and then subjected to flexible processing. Is considered to be configured to be tightly screwed to a fixing bracket or casing of the image sensor (see Patent Document 1).

  However, in the above-described conventional configuration, the heat radiation plate is closely screwed to the fixing bracket or the housing of the image sensor, and the heat radiation plate is pressed against the image sensor via the heat conduction member and the cooling element, so that the tilt adjustment is performed. If the relative positional relationship between the housing and the image sensor changes as a result of this, the image sensor is pushed by the heat conducting member (the heat conducting member applies force to the image sensor). There is a possibility that the position may change, and there is room for improvement from the viewpoint of satisfying the demand for higher image quality of the captured image.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a heat dissipation structure that can prevent the position of the positioned imaging element from being changed regardless of the tilt adjustment.

  The heat dissipating structure according to claim 1 is inclined with respect to the casing so that an imaging surface of an imaging element for acquiring a subject image formed by the imaging optical system matches a reference plane for the imaging optical system set in the casing. The heat-radiating structure of the image sensor that is held by the tilt adjustment mechanism so as to be changeable, made of a material having thermal conductivity, and one end fixed to the image sensor and the other fixed to the housing A heat conductive member having an end portion and a long plate portion that has a long plate shape and connects the other end portion and the one end portion. In the heat conductive member, the one end portion and the long plate The first boundary part forming the boundary with the part and the second boundary part forming the boundary between the other end part and the long plate part are set along directions orthogonal to each other. And

  In the heat dissipation structure according to the present invention, it is possible to prevent the position of the positioned image sensor from being changed regardless of the tilt adjustment.

It is explanatory drawing which shows schematic structure of the digital camera 10 carrying the tilt adjustment mechanism 50 as an example which concerns on this invention. In order to describe the configuration of the tilt adjustment mechanism 50 and the heat dissipation structure 60, it is an explanatory view of the housing portion 39A viewed from the back surface side (the back surface 11b side of the image sensor 11). It is a typical perspective view which shows a mode that the holding plate 51 hold | maintains the image pick-up element 11 and the board | substrate 52 integrally. FIG. 3 is a schematic perspective view from the image sensor 11 side showing a state in which the holding plate 51 integrally holds the image sensor 11 and the substrate 52. In order to explain the configuration of the heat dissipation structure 60, it is an explanatory view of the housing portion 39A viewed from the back side (the back side 11b side of the image sensor 11). It is sectional drawing obtained along the II line | wire shown in FIG. 3 is a schematic perspective view showing a holding plate 51. FIG. 6 is a schematic perspective view showing an attachment frame 53. FIG. It is a perspective view which shows typically the support structure with respect to the 2nd to-be-supported part 51b2. It is a typical perspective view for demonstrating the structure of the supporting member 54, (a) shows a mode that it looked from arbitrary directions, (b) shows a mode seen from the direction different from (a). It is explanatory drawing which shows typically the cross section obtained along the II-II line | wire of FIG. It is explanatory drawing which shows the heat conductive member 61 of the thermal radiation structure 60 with a typical perspective view. It is explanatory drawing which shows typically the thermal radiation structure 60 in order to demonstrate the effect | action of the thermal radiation structure 60, (a) shows the initial position by the holding plate 51 and the attachment frame 53 being mutually parallel, (b) is FIG. 5C shows a state in which the relative position is changed in the adjustment direction AD (the direction of the photographing optical axis OA) while maintaining the state in which the holding plate 51 and the mounting frame 53 are parallel, and FIG. Shows how the relative slope changes. In order to describe the configuration of the heat dissipation structure 70 of another embodiment, it is an explanatory view similar to FIG. 2 when the housing portion 39A is viewed from the back surface side (the back surface 11b side of the image sensor 11). In the heat dissipation structure 70, it is explanatory drawing which shows the attachment state to the holding plate 51 of the heat conductive member 71. FIG. It is explanatory drawing which shows the holding plate side attachment member 72 of the heat conductive member 71 with a typical perspective view. It is explanatory drawing which shows the housing plate side attachment member 81 of the heat conductive member 71 with a typical perspective view.

  Hereinafter, a heat dissipation structure for an image sensor according to the present invention will be described with reference to the drawings.

  A configuration of a heat dissipation structure 60, which is an example of a heat dissipation structure for an image sensor according to the present invention, will be described with reference to FIGS. In FIG. 5, the image sensor 11 and the substrate 52 are omitted for easy understanding.

  First, the digital camera 10 equipped with the heat dissipation structure 60 will be described with reference to FIG. FIG. 1 is an explanatory diagram showing a schematic configuration of the digital camera 10. As shown in FIG. 1, the digital camera 10 includes an interchangeable lens unit 40 (imaging optical system) that can be attached to and detached from a camera body (main body unit) 39 (a casing unit 39A (see FIG. 2, etc.) described later). The image to be photographed, that is, the image of the subject, is read by the image sensor 11 and appropriately processed. In addition to the image sensor 11, the digital camera 10 includes a CDS circuit 12, an A / D conversion unit 13, a digital signal processing circuit 14, a compression / decompression circuit 15, a DRAM 16, a memory card 17, an SG unit 18, a CPU 19, a microphone 20, and an amplifier. Filter unit 21, A / D conversion unit 22, audio data compression / decompression circuit 23, D / A conversion unit 24, amplifier / filter unit 25, OSD 26, RAM 27, CPU bus 28, DC / DC converter 29, power supply 30, focal A plane shutter 31 is provided.

  The imaging device 11 is configured using a CCD (charge coupled device) or the like, and converts a subject image input via the interchangeable lens unit 40 and the focal plane shutter 31 into an electrical signal (analog image data). Output to the CDS circuit 12. The CDS circuit 12 is a correlated double sampling circuit, and reduces noise of the input electric signal and outputs it to the A / D converter 13. The A / D converter 13 converts the electrical signal whose noise has been reduced by the CDS circuit 12 into a digital signal (digital image) at an optimum sampling frequency (for example, an integer multiple of the subcarrier frequency of the NTSC (National Television System Committee) signal). Data). The digital image data converted by the A / D converter 13 is output to the digital signal processing circuit 14 although it is not clearly shown.

  The digital signal processing circuit 14 divides the digital image data from the A / D converter 13 into luminance data and color difference data, and performs data processing for γ (gamma) correction and image compression / decompression. This processed digital image data is displayed on an LCD (Liquid Crystal Display) 32 and an EVF (Electronic View Finder) 33. On the LCD 32 and the EVF 33, an OSD display screen (on-screen display) generated by the OSD 26 is appropriately displayed.

  The compression / decompression circuit 15 conforms to the JPEG format, and compresses digital image data by orthogonal transform / Huffman coding or decompresses it by Huffman decoding / inverse orthogonal transform.

  The DRAM 16 temporarily stores the compressed digital image data. The digital image data compressed in this way is stored (recorded) in the memory card 17 inserted in the card slot 34 as an image data file. In addition, the memory card 17 stores (records) digital audio data that has been compressed, which will be described later, as an audio data file.

  The SG unit 18 is a control signal generation unit, and cooperates with the CPU 19 to provide timing signals to the image sensor 11, the CDS circuit 12, and the A / D conversion unit 13, respectively, and appropriately synchronize them.

  The CPU 19 includes a RAM 27 and is connected to the digital signal processing circuit 14, the DRAM 16, the memory card 17, and the like via a CPU bus 28. Further, the CPU 19 responds to an instruction by an operation performed on the operation unit 35, the release button 36, and the zoom button 37 provided to be operable on the digital camera 10 or an operation instruction from the outside such as a remote controller (not shown). Control of the operation of each part of the digital camera 10 is comprehensively performed by a program stored in a ROM (not shown). The control of the operation of each unit includes, for example, control of recording operation of digital image data and digital audio data to the memory card 17, control of reproduction operation of digital image data and digital audio data recorded on the memory card 17, For example, drive control of the OSD 26 and the strobe 38 is performed.

  The microphone 20, the amplifier / filter unit 21, the A / D conversion unit 22, the audio data compression / decompression circuit 23, the D / A conversion unit 24, and the amplifier / filter unit 25 constitute a signal processing unit related to audio. Although not shown, the microphone 20 includes a conversion element that converts sound (voice) into an electrical signal. The microphone 20 converts the input sound into an electric signal (analog audio data) and outputs it to the amplifier / filter unit 21. The amplifier / filter unit 21 amplifies the input electric signal, cuts it off to a necessary band, and outputs it to the A / D conversion unit 22. The A / D converter 22 converts it into digital audio data at a sampling frequency that is twice or more the predetermined band, and outputs it to the audio data compression / decompression circuit 23. The audio data compression / decompression circuit 23 performs compression / encoding processing and appropriately records (stores) it in the memory card 17 or the like. The digital audio data recorded (stored) in the memory card 17 or the like is converted into an electric signal (analog audio data) by the D / A converter 24, amplified by the amplifier / filter unit 25, and audio not shown. It is output as sound (voice) through the output unit (speaker).

  Each part of the digital camera 10 is appropriately supplied with power from a power supply 30 via a DC / DC converter 29. The DC / DC converter 29 transforms the input voltage from the power supply 30.

  The imaging optical system that forms a subject image on the imaging device 11 (its imaging surface 11a) is, as described above, a housing portion 39A that constitutes a part of the camera body 39 of the digital camera 10 (see FIG. 2 and the like). It is comprised as the interchangeable lens part 40 made detachable with respect to. The interchangeable lens unit 40 is configured by accommodating an optical element group 41 composed of a plurality of optical elements in a lens group holding structure 42. In this embodiment, the optical element group 41 is formed of a plurality of optical elements (lenses, diaphragms, etc.) along the photographing optical axis OA from the objective lens located closest to the subject (object). In this specification, the optical axis in the imaging optical system, that is, the rotationally symmetric axis of each optical element serving as the center axis position of the optical element group 41 (lens group holding structure 42) is defined as the imaging optical system, that is, the digital camera 10. It is assumed that the photographing optical axis OA.

  The lens group holding structure 42 holds the optical element group 41 so as to be movable along the photographing optical axis OA. The lens group holding structure 42 is provided with a focus ring 43 and an aperture ring 44. The focus ring 43 can be rotated for focusing (focusing), and the position of each optical element in the optical element group 41 on the photographic optical axis OA is appropriately changed according to the change in the rotation posture. It is supposed to be configured. The aperture ring 44 can be rotated to adjust the amount of light, and is configured to appropriately change the aperture (not shown) of the optical element group 41 in accordance with a change in the rotation posture.

  Next, the configuration of the tilt adjustment mechanism 50 in the digital camera 10 will be described in detail with reference to FIGS. The tilt adjustment mechanism 50 adjusts the tilt of the image sensor 11, that is, sets the reference surface (reference position) Bp (see FIG. 1) to match the imaging surface 11 a (see FIG. 6) of the image sensor 11. It is possible to adjust the position of the image sensor 11 in the direction orthogonal to the plane Bp and the inclination of the image sensor 11 with respect to the direction. For this reason, the direction orthogonal to the reference plane Bp is the adjustment direction (see symbol AD in FIG. 3 and the like). The reference plane Bp (see FIG. 1) is set in the camera body 39 (see FIG. 1) of the digital camera 10 according to the optical characteristics of the photographing optical system (interchangeable lens unit 40). It is orthogonal to the optical axis OA direction. For this reason, the adjustment direction is parallel to the photographing optical axis OA direction. In the following, the adjustment direction is indicated by a reference symbol AD attached to an arrow directed to the subject side in the same manner as the photographing optical axis OA. In the present embodiment, as described above, since the photographing optical system is configured by the interchangeable lens unit 40 that can be attached to and detached from the camera body 39 in the digital camera 10, the reference plane Bp is that of the camera body 39. Among them, in the housing part 39A constituting the surface (mounting surface (not shown)) to which the interchangeable lens unit 40 is attached, it is set parallel to the mounting surface so as to be spaced from the mounting surface. Yes. For this reason, the tilt adjustment of the image sensor 11 is also referred to as flange back adjustment. As shown in FIG. 11, the housing portion 39A can form a camera body 39 in cooperation with the housing portion 39B.

  In the tilt adjusting mechanism 50, as shown in FIGS. 2 to 6, the image pickup device 11 is held by a holding plate 51 as an image pickup device holding plate, and the holding plate 51 is adjusted in an adjustment direction with respect to the housing portion 39A. It is supported via three support points that can be displaced to AD (locations where the supported location 51h contacts an adjustment cam surface 54e (see FIG. 9 and the like) described later). As shown in FIGS. 3 and 6, the imaging element 11 is provided with an optical filter 11 c (see FIG. 4) on the imaging surface 11 a side, and is electrically connected (mounted) to the substrate 52. A plurality of electronic components such as capacitors and resistors are mounted on the board 52, and each of the above-described components (electronic circuit (FIG. 1) together with a main board (not shown) electrically connected via a connector portion 52a. See)). The substrate 52 is provided with three mounting openings 52b at positions facing the back surface 11b of the mounted image pickup device 11 (the surface opposite to the image pickup surface 11a (the back surface of the package portion constituting the image pickup device 11)). It has been. Each mounting opening 52b is directed from the back surface side of the substrate 52 (on the side opposite to the surface on which the image sensor 11 is mounted) to each bonding portion 51a described later of the holding plate 51 to the back surface 11b of the image sensor 11. Is possible.

  As shown in FIG. 7, the holding plate 51 is formed of a material having thermal conductivity and has a flat plate shape as a whole. In this embodiment, the holding plate 51 has at least higher strength than the substrate 52. The holding plate 51 includes three adhesive portions 51a, three supported portions 51b, two reference holes 51c, two positioning boss portions 51d, three screw through holes 51e, and one screw retaining hole 51f. And having.

  The three bonding portions 51 a are formed by bending and deforming so that the central portion of the holding plate 51 is shifted to the front side (the back side when viewed from the front in FIG. 7), and the holding plate 51 is formed on the back side of the substrate 52. In the state where it is arranged, it is possible to reach the back surface 11b of the image sensor 11 from the corresponding mounting opening 52b (see FIGS. 2, 3 and 6). Each adhesive portion 51a is formed with an adhesive convex portion 51g which is a location addressed to the back surface 11b. The adhesive convex portion 51g is formed by being bent and deformed so that the adhesive portion 51a is partially shifted forward. Each adhesion part 51a is addressed to the back surface 11b of the image sensor 11 through each attachment opening 52b, and each adhesion convex part 51g is adhered to the back surface 11b, thereby being attached to the image sensor 11. Thereby, the holding plate 51 can hold the image sensor 11 integrally with the substrate 52 on which the image sensor 11 is mounted.

  The three supported portions 51b of the holding plate 51 are portions that are supported by the housing portion 39A (a mounting frame 53 described later). In this embodiment, each of the supported portions 51b is viewed in a direction orthogonal to the adjustment direction AD (a direction along the reference plane Bp (a plane parallel to the reference plane Bp)). Are provided at three locations so as to form a supported location 51h in contact with an adjustment cam surface 54e described later at the edge. One of the supported portions 51b (hereinafter, also referred to as the first supported portion 51b1 when individually described) is formed to extend in one direction from the central portion of the holding plate 51 while maintaining a flat state. . The remaining two supported portions 51b (hereinafter, one is also referred to as the second supported portion 51b2 and the other is also referred to as the third supported portion 51b3 when individually described) are flat from the central portion of the holding plate 51. It is formed to extend from a portion extended in the other direction opposite to the first supported portion 51b1 while maintaining the state to both sides in the direction orthogonal to the extended direction while maintaining a flat state. ing. For this reason, in this embodiment, the three supported portions 51b exist on the same plane.

  The two reference holes 51c of the holding plate 51 are provided through the holding plate 51 in order to position the holding plate 51 with respect to the housing portion 39A (attachment frame 53). In the present embodiment, one reference hole 51c is provided in the first supported portion 51b1, and the other reference hole 51c is provided in the third supported portion 51b3. As will be described later, the two reference holes 51c can pass the positioning protrusions 53c (see FIG. 8) of the mounting frame 53 fixed to the housing portion 39A. The two reference holes 51c are viewed in a direction (a direction along the reference plane Bp) perpendicular to the adjustment direction AD with respect to the mounting frame 53 (the casing portion 39A) by passing the corresponding positioning protrusions 53c. The position of the holding plate 51 is defined (see FIGS. 2 and 5). In this embodiment, the reference hole 51c located in the vicinity of the third supported portion 51b3 has an inner diameter dimension that is larger in one direction than the outer diameter dimension of the elongated hole, that is, the positioning projection 53c. The degree of freedom of the position through which the protrusion 53c passes, that is, the adjustment margin of the holding plate 51 is secured.

  The two positioning boss portions 51d of the holding plate 51 prevent relative displacement between the holding plate 51 and a heat conductive member 61 (its one end portion 62) described later. In the present embodiment, the two positioning boss portions 51d are provided side by side so as to sandwich the screw retaining hole 51f in the central portion of the holding plate 51, and the rear side (the side on which the substrate 52 is provided) from the central portion. Is in the shape of a column protruding on the opposite side.

  The three screw holes 51e of the holding plate 51 are provided through the holding plate 51 at positions near the supported portions 51b. As will be described later, each screw hole 51e can pass a proximal end cylindrical portion 56b of a stepped screw 56 provided in the mounting frame 53 and has an inner diameter that prevents a coil spring 55 provided therethrough from passing therethrough. It is set as a dimension (refer FIG. 11 etc.).

  One screw retaining hole 51f of the holding plate 51 is provided through the holding plate 51 at a position between the two positioning boss portions 51d as described above. The screw retaining hole 51f is provided with a thread groove on the inner peripheral surface, and can be engaged with a heat conduction fixing screw 59 described later (see FIG. 11). An attachment frame 53 is provided to provide the holding plate 51 on the camera body 39 (housing 39A) so that the inclination with respect to the adjustment direction AD can be adjusted.

  As shown in FIG. 8, the mounting frame 53 has a frame shape formed by penetrating the center of a flat plate-like member in a rectangular shape as a whole. The mounting frame 53 has three support holes 53a, four holding plate mounting holes 53b, two positioning projections 53c, three screw holes 53d, and two holding plate positioning holes 53e.

  The three support holes 53a support a support member 54 (see FIG. 10), which will be described later, in a rotatable manner, and are provided through the attachment frame 53 in the adjustment direction AD. Each support hole 53a is set so as to exist in the vicinity of the three supported portions 51b of the holding plate 51 in a state where the holding plate 51 is provided along the mounting frame 53 (see FIG. 2 and FIG. 2). (See FIG. 5).

  The four holding plate mounting holes 53b of the mounting frame 53 allow the mounting frame fixing screw 57 (the shaft portion) for fixing the mounting frame 53 to the housing portion 39A to pass therethrough. 53 is provided through the adjustment direction AD.

  The two positioning projections 53c of the mounting frame 53 are directed from the mounting frame 53 to the rear side (the side opposite to the side on which the interchangeable lens unit 40 is mounted) in a state where the mounting frame 53 is fixed to the housing portion 39A. It presents a rod shape extended in the adjustment direction AD. In the present embodiment, each positioning projection 53 c is made of a metal rod-like member, and is caulked after passing through a hole (not shown) provided in the mounting frame 53 and is provided in the mounting frame 53. .

  Three screw holes 53d of the mounting frame 53 are provided for fixing a stepped screw 56 (see FIG. 11 and the like) described later. Each screw hole 53d is formed by penetrating the mounting frame 53 in the adjustment direction AD and having a screw groove on the inner peripheral surface thereof. Each screw hole 53d (the screw groove) can be engaged with a tip screw portion 56a of a stepped screw 56 described later (see FIG. 11).

  The two holding plate positioning holes 53e of the mounting frame 53 prevent relative displacement between the mounting frame 53 and the housing portion 39A. The two holding plate positioning holes 53e can pass the positioning protrusions 39Aa (see FIG. 5) of the housing portion 39A. Each positioning projection 39Aa has a rod shape extending in the adjustment direction AD from the housing portion 39A toward the rear side (the side opposite to the side on which the interchangeable lens portion 40 is attached). In the present embodiment, one holding plate positioning hole 53e (left side when viewed from the front in FIG. 8) has an inner diameter dimension that is larger in one direction than the outer diameter dimension of the elongated hole, that is, the positioning projection 39Aa. Thus, the degree of freedom of the position through which the positioning protrusion 39Aa is passed, that is, the adjustment margin of the mounting frame 53 is secured.

  As shown in FIGS. 2 and 5, the mounting frame 53 has two holding plate positioning holes 53e through which the positioning projections 39Aa of the housing portion 39A pass, and four holding plate mounting holes 53b with mounting frame fixing screws 57. The mounting frame fixing screw 57 is engaged with the screw hole 39Ac (see FIG. 11) of the boss portion 39Ab of the housing portion 39A, so that a predetermined positional relationship is obtained when viewed in a direction orthogonal to the adjustment direction AD. And fixed to the casing 39A. At this time, the attachment frame 53 is set to be along a plane orthogonal to the adjustment direction AD.

  In the tilt adjustment mechanism 50, the three supported portions 51b (the supported portions 51h) of the holding plate 51 are supported by the mounting frame 53 (the housing portion 39A) so that they can be displaced in the adjustment direction AD. Tilt adjustment of the image sensor 11 held on the plate 51 is made possible. Since the structure for the displaceable support is basically the same as that of the three supported portions 51b (the supported portions 51h), hereinafter, in the second supported portion 51b2. The support structure will be described with reference to FIGS. 9, 10 and 11, and the other support structures will be omitted. FIG. 9 is a perspective view schematically showing a support structure for the second supported portion 51b2, FIG. 10 is a schematic perspective view for explaining the configuration of the support member 54, and FIG. (B) shows a state seen from a direction different from (a). FIG. 11 is an explanatory view schematically showing a cross section obtained along the line II-II in FIG.

  As shown in FIGS. 9 and 11, the support structure of the tilt adjustment mechanism 50 at the second supported portion 51b2 includes a support frame 54, a coil spring, and a mounting frame 53 fixed to the housing portion 39A (camera body 39). 55 and a stepped screw 56 are provided.

  As described above, the mounting frame 53 fixed to the housing portion 39A is provided along a surface orthogonal to the adjustment direction AD and has a flat plate shape as a whole. A flat surface perpendicular to the adjustment direction AD exists around 53a, and this is defined as an installation surface 53f. In the attachment frame 53, the support member 54 is installed in the support hole 53a (the surrounding installation surface 53f).

  As shown in FIG. 10, the support member 54 has a cylindrical shape as a whole and a hexagonal hole 54a having an axis equal to the axis (hereinafter referred to as the center axis MA), and a flange portion surrounding the center axis MA. 54b. The hexagonal hole 54a can be fitted with a hexagon wrench as a jig (not shown). The flange portion 54b protrudes from the lower part of the outer peripheral surface surrounding the central axis MA in the support member 54 over the entire circumference in the radial direction of the support member 54 (direction perpendicular to the central axis MA with respect to the central axis MA). Is provided. In the flange portion 54b, a plurality of teeth are formed by a plurality of grooves whose outer peripheral surfaces are along the direction of the central axis MA, thereby forming an uneven surface 54c.

  Further, in the support member 54, the lower surface is an installation flat surface 54d (see FIG. 11 and the like) that is a plane orthogonal to the central axis MA, and the upper surface is an adjustment cam surface 54e. The adjustment cam surface 54e has a height dimension viewed in the direction of the central axis MA when viewed in the rotational direction around the central axis MA, that is, the support member 54 viewed in the direction of the central axis MA with respect to the installation flat surface 54d. Is defined by a spiral plane so that the thickness dimension is continuously changed. In other words, the adjustment cam surface 54e is a single plane inclined with respect to the direction of the central axis MA, and is viewed in the distance from the installation flat surface 54d that is a plane orthogonal to the central axis MA, that is, in the direction of the central axis MA. The position is gradually changed. For this reason, a vertical wall surface along the central axis MA is formed between one end having the largest height dimension when viewed in the direction of the central axis MA on the adjustment cam surface 54e and the other end having the smallest height dimension. ing. In addition, in this embodiment, in addition to the adjustment cam surface 54e, a stop wall portion 54f is provided on one end of the adjustment cam surface 54e that has the largest height when viewed in the direction of the central axis MA. . As will be described later, the stop wall portion 54f has the largest height dimension when the second supported portion 51b2 (the supported portion 51h) of the holding plate 51 supported by the adjustment cam surface 54e is viewed in the direction of the central axis MA. Therefore, the adjustment cam surface 54e is prevented from moving (falling) from one end to the other end having the smallest height dimension without being inclined.

  Further, in the support member 54, a cylindrical shaft portion 54g (see FIG. 11) is provided at the central portion of the installation flat surface 54d. The cylindrical shaft portion 54g has a cylindrical shape having an outer diameter smaller than that of the support member 54 (the flange portion 54b) with the central axis line MA as the center, and is provided so as to protrude from the installation flat surface 54d along the central axis line MA. Yes. The cylindrical shaft portion 54g can be inserted into the support hole 53a of the mounting frame 53 and can be freely rotated in the inserted state. Therefore, the support member 54 can be rotatably provided on the installation surface 53f of the attachment frame 53 by inserting the cylindrical shaft portion 54g into the support hole 53a.

  In order to press the second supported portion 51 b 2 (the supported location 51 h) of the holding plate 51 against the adjustment cam surface 54 e of the support member 54 and to press the support member 54 against the installation surface 53 f of the mounting frame 53. 9 and 11, a coil spring 55 and a stepped screw 56 are provided. The coil spring 55 is set to have an outer diameter that cannot be passed through the screw hole 51 e of the holding plate 51. Further, the coil spring 55 is set to have an inner diameter dimension that can surround a base end cylindrical portion 56b described later of the stepped screw 56 and cannot pass through a head portion 56c described later. As will be described later, the coil spring 55 is supported on the installation surface 53f of the mounting frame 53 when the support member 54 is rotated by a jig (hexagon wrench (not shown)) fitted in the hexagonal hole 54a. In order to rotate the member 54 stably, the length dimension and the spring force capable of pressing the support member 54 against the installation surface 53f via the second supported portion 51b2 (the supported portion 51h) of the holding plate 51. Is set to Here, the stable rotation means that the support member 54 rotates while maintaining the state where the installation surface 53f and the installation flat surface 54d are in contact with each other. The coil spring 55 is fixed to the holding plate 51 and the mounting frame 53 by a stepped screw 56.

  As shown in FIG. 11, the stepped screw 56 has a distal end screw portion 56a, a base end cylindrical portion 56b, and a head portion 56c. The tip screw portion 56 a has a columnar shape with a thread groove provided on the outer peripheral surface, and can be engaged with the screw hole 53 d of the mounting frame 53. The proximal cylindrical portion 56b has a cylindrical shape with an outer diameter larger than that of the distal screw portion 56a, can pass through the inside of the coil spring 55, and can pass through the screw through hole 51e of the holding plate 51. The outer diameter of the frame 53 cannot pass through the screw hole 53d. The head portion 56 c has a disk shape with a larger outer diameter than the base end cylindrical portion 56 b, and has an outer diameter that cannot be passed inward of the coil spring 55.

  In this tilt adjustment mechanism 50, the cylindrical shaft portion 54 g of the support member 54 is inserted into the support hole 53 a of the attachment frame 53, and the support member 54 is rotatably provided on the installation surface 53 f of the attachment frame 53. At this time, in the support member 54, the installation flat surface 54d is a plane orthogonal to the central axis MA, and the installation surface 53f of the mounting frame 53 is along a plane orthogonal to the adjustment direction AD. Therefore, the central axis MA is along the adjustment direction AD. Each screw hole 53d of the mounting frame 53 is made into the corresponding screw through hole 51e of the holding plate 51 while the second supported portion 51b2 (the supported portion 51h) of the holding plate 51 is applied to the adjustment cam surface 54e of the support member 54. The holding plate 51 is disposed on the mounting frame 53 so as to face each other. A stepped screw 56 in which a coil spring 55 is arranged around the base cylindrical portion 56b from above the holding plate 51 (the side opposite to the side where the image pickup device 11 is provided) connects the base cylindrical portion 56b to the holding plate 51. The tip screw part 56 a is passed through the screw hole 51 e and is engaged with the screw hole 53 d of the mounting frame 53.

  Accordingly, the stepped screw 56 is abutted around the screw hole 53 d in the mounting frame 53 and fixed to the mounting frame 53. The coil spring 55 is abutted on the periphery of the screw passage hole 51e in the holding plate 51, and surrounds the proximal end cylindrical portion 56b with the central axis MA between the mounting frame 53 and the head portion 56c of the stepped screw 56. Along with compression. For this reason, the coil spring 55 presses the holding plate 51 toward the mounting frame 53 in the direction along the central axis MA, and the second supported portion 51b2 (the supported location 51h) is adjusted to the adjustment cam surface of the support member 54. The state of pressing against 54e is maintained. The coil spring 55 presses the support member 54 against the installation surface 53 f of the mounting frame 53 via the second supported portion 51 b 2 (the supported location 51 h) of the holding plate 51.

  Therefore, the support member 54 has the installation flat surface 54d pressed against the installation surface 53f of the attachment frame 53 by the coil spring 55, and the interference of the cylindrical shaft portion 54g inserted into the support hole 53a of the attachment frame 53. Movement in a direction perpendicular to the adjustment direction AD (center axis MA) is prevented. The support member 54 can stably rotate on the installation surface 53f of the mounting frame 53 with the central axis MA as the rotation center, and the adjustment cam surface 54e serves as a reference surface Bp (see FIG. 1). The holding plate 51 (second supported portion 51b2) is supported in an adjustment direction AD orthogonal to the other.

  As described above, the holding plate 51 is orthogonal to the adjustment direction AD with respect to the mounting frame 53 (the casing portion 39A) by passing the positioning projections 53c of the mounting frame 53 through the two reference holes 51c. The position of the holding plate 51 as viewed in the direction is defined (see FIGS. 2 and 5). For this reason, in the attachment frame 53 (housing part 39A), when viewed in a direction orthogonal to the adjustment direction AD, the positional relationship of the second supported part 51b2 (the supported part 51h) with respect to the support member 54 changes. Absent. On the other hand, as described above, the support member 54 can be stably rotated about the center axis MA on the installation surface 53f of the mounting frame 53 as the center of rotation. A contact position on the adjustment cam surface 54e with respect to the second supported portion 51b2 (the supported location 51h) of the holding plate 51 by being rotated through a combined hexagon wrench (jig (not shown)) or the like. Can be gradually changed. The adjustment cam surface 54e is a spiral inclined surface that changes the thickness dimension of the support member 54 as viewed in the direction of the central axis MA, and the central axis MA is parallel to the adjustment direction AD. Then, by rotating the support member 54, the support point in the adjustment direction AD with respect to the second supported portion 51b2 (the supported location 51h) of the holding plate 51 is changed according to the adjustment cam surface 54e (its inclination). It can be gradually changed in the adjustment direction AD.

  Here, in the tilt adjustment mechanism 50, as described above, the holding plate 51 is supported at the three points of the first supported part 51b1 and the third supported part 51b3 in addition to the second supported part 51b2. Each of the support members 54 (the adjustment cam surface 54e) allows the support position in the adjustment direction AD of the mounting frame 53 (housing 39A) to be gradually changed according to the adjustment cam surface 54e. Therefore, in the tilt adjustment mechanism 50, the tilt of the holding plate 51 with respect to the adjustment direction AD and the position in the adjustment direction AD can be finely and continuously adjusted in the camera body 39. The adjustment of the inclination and the adjustment of the position in the optical axis direction with respect to the reference plane Bp (see FIG. 1) of the image pickup element 11 held integrally can be performed with high accuracy. In the tilt adjustment mechanism 50, when the tilt adjustment of the image sensor 11 is completed, an adhesive is applied between the flange portion 54b (the uneven surface 54c) and the mounting frame 53 (the installation surface 53f) of each support member 54. As a result, an adhesive mass 58 is formed (see FIG. 9). Thereby, in the tilt adjustment mechanism 50, the rotation posture of each support member 54 is maintained, and the state in which the tilt adjustment is performed in the image sensor 11 can be maintained. At this time, the adhesive lump 58 enters the recess of the concavo-convex surface 54c of the flange portion 54b and is hardened, so that the support members 54 can be more securely prevented from rotating (see FIG. 9). Further, since the tilt adjustment mechanism 50 uses the support member 54 having the spiral adjustment cam surface 54e, the tilt adjustment of the image sensor 11 can be performed with higher accuracy while having a smaller and simpler configuration. In addition, in the tilt adjustment mechanism 50, each supported portion 51 b (the supported portion 51 h) of the holding plate 51 is pressed against the adjustment cam surface 54 e of the support member 54 by the coil spring 55. The position of each support point in the adjustment direction AD with respect to 51 can be adjusted more appropriately, and the tilt adjustment of the image sensor 11 can be performed with higher accuracy.

  The tilt adjustment mechanism 50 is provided with a heat dissipation structure 60 that releases heat generated from the image sensor 11 to a camera body 39 as a casing of the digital camera 10. The heat dissipation structure 60 has a heat conducting member 61. The heat conducting member 61 has a plate shape made of a material having heat conductivity and is appropriately bent (see FIG. 12). As shown in FIG. 12, the heat conducting member 61 has one end portion 62, a first boundary portion 63, a long plate portion 64, a second boundary portion 65, and the other end portion 66.

  The one end 62 is provided as an attachment location to the holding plate 51 (see FIG. 2 and the like) and has a flat plate shape. The one end portion 62 is a central portion of the holding plate 51, and corresponds to a portion corresponding to the back side of the held image sensor 11 (a portion surrounded by the three adhesive portions 51a (hereinafter also referred to as a fixed portion)) and a surface. It is possible to touch. The one end portion 62 is provided with two one end portion positioning holes 62a and one one end portion mounting hole 62b.

  The one end positioning holes 62a prevent relative displacement between the holding plate 51 and the one end 62. The two one end portion positioning holes 62a are provided corresponding to the two positioning boss portions 51d (see FIG. 7 and the like) of the holding plate 51, and each of them can pass the corresponding positioning boss portion 51d. (Refer to FIG. 2 etc.). In this embodiment, one end portion positioning hole 62a (on the left side when viewed from the front in FIG. 12) is one direction than the outer diameter of the elongated hole that opens the peripheral edge portion of the one end portion 62, that is, the positioning boss portion 51d. Only the inner diameter is increased, and the degree of freedom of the position through which the positioning boss 51d is passed is ensured. The one end mounting hole 62b is provided so as to penetrate the one end 62 in the thickness direction between the two one end positioning holes 62a. The one end mounting hole 62b is provided corresponding to a screw retaining hole 51f (see FIG. 7 and the like) of the holding plate 51, and can pass a heat conduction fixing screw 59 (see FIG. 2 and the like) which will be described later. It is said that.

  The one end portion 62 is connected to the long plate portion 64 by the first boundary portion 63. As will be described later, the first boundary portion 63 has a boundary between the one end portion 62 and the long plate portion 64 that are parallel to each other in a single linear direction parallel to them (hereinafter also referred to as a first direction). Form along. In the present embodiment, the first boundary portion 63 is different from each other in the position viewed in the direction orthogonal to the surface formed by the one end portion 62 and the long plate portion 64 (hereinafter, also referred to as the orthogonal direction), and the one end portion 62. And the long plate portion 64 are connected to each other. That is, the first boundary portion 63 is provided along the plane including the first direction and the orthogonal direction between the one end portion 62 and the long plate portion 64 and is attached to the holding plate 51. On the other hand, the long plate portion 64 is displaced to the side opposite to the side on which the holding plate 51 is attached.

  The long plate portion 64 has a long flat plate shape and is parallel to the one end portion 62. In the present embodiment, the long plate portion 64 has a plate shape that is long in the direction orthogonal to the first direction and the orthogonal direction. Here, the long length means that the length dimension in the long direction is at least about twice the length dimension in the direction (width direction (first direction)) orthogonal to the long direction. say. The long plate portion 64 has one end portion 62 existing on the back side of the image sensor 11 and the other end portion 66 (contact piece portion 66b described later) pressed against the housing portion 39A (camera body 39) as described later. Therefore, the length dimension in the longitudinal direction is the difference in the adjustment amount in the tilt adjustment mechanism 50, that is, the difference in the height dimension due to the adjustment cam surface 54e in each support member 54. In comparison, it is sufficiently large.

  The long plate portion 64 is connected to the other end portion 66 by the second boundary portion 65 at the end portion opposite to the one end portion 62 viewed in the long direction. The second boundary portion 65 has a single linear direction parallel to them and perpendicular to the first direction, as will be described later. (Hereinafter also referred to as the second direction). In the present embodiment, the second boundary portion 65 connects the long plate portion 64 and the other end portion 66 by making the positions seen in the orthogonal direction described above greatly different from each other than the first boundary portion 63. ing. That is, the second boundary portion 65 is provided between the long plate portion 64 and the other end portion 66 along the plane including the second direction and the orthogonal direction described above, and the first boundary portion 63 exists. It is supposed to be orthogonal to the surface.

  The other end portion 66 is an attachment location to the attachment frame 53 and is provided as a contact location to the housing portion 39A (see FIG. 2 and the like). The other end portion 66 has a mounting plate portion 66a having a flat plate shape, and a contact piece portion 66b protruding therefrom so as to be elastically deformable. The mounting plate portion 66a can be brought into contact with the surface of the mounting frame 53 that is close to the housing portion 39A in a state where the mounting frame 53 is attached to the housing portion 39A. In this embodiment, the mounting location in the mounting frame 53 is a peripheral location of the holding plate mounting hole 53b on the upper left end when viewed from the front in FIG. The mounting plate portion 66a is provided with one other end mounting hole 66c. The other end mounting hole 66c is provided so as to penetrate the mounting plate portion 66a in the thickness direction. The other end mounting hole 66c is provided corresponding to the holding plate mounting hole 53b (see FIG. 8 and the like) of the mounting frame 53, and allows the mounting frame fixing screw 57 (see FIG. 11 and the like) to pass therethrough. It is possible.

  The contact piece portion 66b is provided so as to rise from the mounting plate portion 66a in the orthogonal direction without directly contacting the second boundary portion 65. In the present embodiment, the contact piece portion 66b is provided in the mounting plate portion 66a so as to be separated from the edge portion where the second boundary portion 65 is provided and to extend in the orthogonal direction from the edge portion along the first direction. ing. Further, in the contact piece portion 66b, the extended tip portion is curved outward (on the side opposite to the side where the mounting plate portion 66a exists) to form a contact portion 66d.

  In the heat dissipating structure 60, the heat conducting member 61 configured as described above corresponds to the two one end positioning holes 62a of the one end 62 as shown in FIG. 2, FIG. 3, FIG. 5, FIG. Fixing for heat conduction through the positioning boss 51d of the holding plate 51 with the one end 62 brought into contact with the fixing portion (center portion) of the holding plate 51 on the surface and passing through the one end mounting hole 62b of the one end 62. The one end 62 is attached to the holding plate 51 by engaging the screw 59 with the screw retaining hole 51 f of the holding plate 51. For this reason, the one end part 62 becomes a location attached to the image sensor 11 side serving as a heat source. In the present embodiment, the one end portion 62 is attached to the holding plate 51 with an adhesive material having thermal conductivity, although not shown in the drawings, so that heat conduction is more efficient.

  Further, in the heat dissipation structure 60, the mounting plate fixing screw 57 passed through the other end portion mounting hole 66c of the mounting plate portion 66a by bringing the mounting plate portion 66a of the other end portion 66 into contact with the mounting portion of the mounting frame 53 on the surface. Is engaged with the screw hole 39Ac (see FIG. 11) of the boss portion 39Ab of the housing portion 39A through the holding plate attachment hole 53b of the attachment frame 53, so that the other end 66 is fixed to the attachment frame 53, that is, it is fixed. It is attached to the housing part 39A (camera body 39). For this reason, the other end portion 66 is a location that is attached to the housing (camera body 39) side that serves as a heat dissipation location. Therefore, in this embodiment, the attachment location on the attachment frame 53 is provided along the image sensor holding plate (holding plate 51) in the housing (camera body 39), and the mounting plate portion 66a of the other end 66 is provided. It functions as a housing mounting surface that is mounted with its surface facing. Here, when the image sensor 11 (holding plate 51) is not adjusted by the tilt adjusting mechanism 50, the holding plate 51 and the mounting frame 53 are provided along a plane orthogonal to the adjustment direction AD. The one end portion 62 and the other end portion 66 are provided along a plane orthogonal to the adjustment direction AD, and the long plate portion 64 that connects them is also provided along the plane orthogonal to the adjustment direction AD (FIGS. 11 and FIG. 11). 13 (a)). At this time, at the other end 66, as shown in FIG. 11, when the housing 39B is attached to the housing 39A to form the camera body 39, the space between the mounting plate portion 66a and the contact piece portion 66b. Due to the elastic deformation, the contact portion 66d of the contact piece portion 66b is pressed against the casing 39B (camera body 39). For this reason, in the present embodiment, the portion of the housing portion 39B where the contact portion 66d comes into contact functions as a housing contact surface in the housing (camera body 39) by elastic deformation with the mounting plate portion 66a as a reference. . As a result, in the heat dissipation structure 60, the image pickup device 11 held there and the camera body 39 can be connected via the holding plate 51 so that heat can be transferred by the heat conducting member 61. Heat can be released.

  In the heat dissipation structure 60, the adjustment direction AD of the holding plate 51 in the camera body 39 by the tilt adjustment mechanism 50 while maintaining the state where the image sensor 11 and the camera body 39 are connected to each other by the heat conducting member 61. It is possible to prevent an increase in the force with which the heat conducting member 61 pushes the holding plate 51 due to a change in the inclination with respect to and a change in the position in the adjustment direction AD. This will be described below with reference to FIG. In FIG. 13, for easy understanding, the state in which the position of the holding plate 51 in the adjustment direction AD is changed in the camera body 39 (see FIG. 13B) and the adjustment direction AD of the holding plate 51. Although the state in which the inclination is changed (see FIG. 13C) is emphasized, it does not always coincide with the actual change in the position and orientation of the holding plate 51.

  As described above, the tilt adjustment mechanism 50 can change the inclination of the holding plate 51 with respect to the adjustment direction AD in the camera body 39 (see FIG. 13C), and in the adjustment direction AD of the holding plate 51. Can be changed (see FIG. 13B). Then, since the position and posture of the holding plate 51 in the camera body 39 change, when a heat transfer member that connects the holding plate 51 and the camera body 39 so as to be able to transfer heat is provided, heat is generated with respect to the camera body 39 as a reference. There is a possibility that a force that the transmission member pushes the holding plate 51 is generated.

  On the other hand, in the heat dissipation structure 60, the heat conducting member 61 having one end 62 attached to the holding plate 51 and the other end 66 attached to the attachment frame 53 fixed to the camera body 39 (housing 39A). The one end portion 62 and the other end portion 66 are connected by a long plate portion 64 via a first boundary portion 63 and a second boundary portion 65 located at both ends as viewed in the longitudinal direction. . For this reason, when the position and posture of the holding plate 51 change in the camera body 39, the relative positions of the holding plate 51 and the mounting frame 53 change in the adjustment direction AD (the direction of the photographing optical axis OA) (FIG. 13). Even if the relative inclination of the holding plate 51 and the mounting frame 53 changes (see FIG. 13C), the long plate portion 64 is deformed to efficiently absorb. Thus, it is possible to prevent a relatively pressing force from being generated between the one end portion 62 and the other end portion 66. This can be considered as follows. In the heat conductive member 61, the long plate portion 64 has a long flat plate shape, and one end portion 62 is provided at one end portion viewed in the long direction via the first boundary portion 63, and the long plate portion 64 is long. Since the other end 66 is provided via the second boundary 65 at the other end as viewed in the scale direction, the change in the relative positional relationship between the one end 62 and the other end 66 is long. It can be absorbed by the bending deformation over the entire length of the plate portion 64. In addition, in the heat conducting member 61, the first boundary portion 63 that connects the one end portion 62 and the long plate portion 64 extends in the first direction, and the first boundary portion 63 that connects the long plate portion 64 and the other end portion 66. Since the second boundary portion 65 extends in the second direction, the change in the relative positional relationship between the one end portion 62 and the other end portion 66 can be absorbed by the bending deformation of the long plate portion 64 in the twisting direction. it can.

  As described above, in the heat dissipation structure 60 according to the present invention, the heat conduction that connects the one end portion 62 and the other end portion 66 with the long plate portion 64 through the first boundary portion 63 and the second boundary portion 65 that are orthogonal to each other. Since one end 62 of the member 61 is attached to the holding plate 51 and the other end 66 is attached to the attachment frame 53, the tilt adjustment mechanism 50 causes the holding plate 51 and the attachment frame 53 to be relative to each other. Even if the general positional relationship is changed, the change can be absorbed by the bending deformation in the twisting direction over the entire length of the long plate portion 64, so that the other end portion 66 (its contact piece portion 66b) is pushed. It is possible to efficiently suppress the occurrence of a force by which the heat conducting member 61 with the case portion 39B (camera body 39) applied as a reference presses the holding plate 51. For this reason, it is possible to prevent the position of the positioned image sensor 11 from being changed regardless of the tilt adjustment.

  Further, in the heat dissipation structure 60, since the heat conducting member 61 is provided along the long plate portion 64 along a surface orthogonal to the adjustment direction AD, each support provided on the mounting frame 53 in the tilt adjustment mechanism 50 is provided. Changes in the relative positional relationship between the holding plate 51 and the mounting frame 53 due to adjustment of the respective support points in the adjustment direction AD at the member 54 (its adjustment cam surface 54e) are twisted over the entire length of the long plate portion 64. It is possible to absorb more efficiently due to the bending deformation at.

  Further, in the heat dissipation structure 60, the length dimension of the long plate portion 64 of the heat conducting member 61 in the longitudinal direction is the amount of adjustment in the tilt adjustment mechanism 50, that is, the height dimension due to the adjustment cam surface 54 e in each support member 54. Since it is sufficiently large compared to the difference, the change in the relative positional relationship between the holding plate 51 and the mounting frame 53 is caused by the bending deformation in the twisting direction over the entire length of the long plate portion 64. It can be absorbed more efficiently.

  In the heat dissipation structure 60, it is possible to maintain a state in which the image sensor 11 and the camera body 39 are connected to each other by the heat conducting member 61 regardless of the tilt adjustment, so that a high-quality captured image can be acquired. . This is particularly effective since the number of digital cameras 10 having a moving image shooting function is increasing in recent years, and the driving time of the image sensor 11 is increased in this moving image shooting scene.

  In the heat dissipation structure 60, the other end portion 66 of the heat conducting member 61 is attached to the attachment frame 53 in a state where the attachment plate portion 66a is in contact with the attachment portion (housing attachment surface), and protrudes elastically from the attachment frame 53. Since the contact piece portion 66b (the contact portion 66d) to be pressed is pressed against the housing portion 39B (housing contact surface), the tilt adjustment by the tilt adjusting mechanism 50 (the holding plate 51 and the mounting frame 53 are not connected). The heat conducting member 61 and the camera body 39 can be brought into contact with each other between the mounting frame 53 and the housing portion 39B which are in a fixed positional relationship regardless of the positional relationship). For this reason, the state where the image pickup device 11 and the camera body 39 are connected to each other via the holding plate 51 so as to be able to transfer heat can be reliably maintained in a predetermined state.

  In the heat dissipation structure 60, the other end portion 66 of the heat conducting member 61 is attached to the attachment frame 53 in a state where the attachment plate portion 66a is in contact with the attachment portion (housing attachment surface), and protrudes elastically from the attachment frame 53. Since the contact piece portion 66b (the contact portion 66d) to be pressed is pressed against the housing portion 39B (housing contact surface), the housing portion 39B is attached to the housing portion 39A provided with the mounting frame 53. When the camera body 39 is mounted, the reaction force from the housing portion 39B of the contact piece portion 66b (its contact location 66d) can be absorbed by elastic deformation of the contact piece portion 66b with respect to the attachment plate portion 66a. Therefore, it is possible to prevent the image sensor 11 from reaching.

  In the heat dissipation structure 60, in the heat conducting member 61, the one end portion 62 and the long plate portion 64 are located at different positions in the adjustment direction AD and are connected by the first boundary portion 63. Since the end portion 66 is located at a different position in the adjustment direction AD and is connected by the second boundary portion 65, the influence of the change in the relative positional relationship between the holding plate 51 and the mounting frame 53 is affected by the end portion 62 and Since the influence can be exerted on the long plate portion 64 while preventing the other end portion 66 from reaching the other end portion 66, it is ensured that the image pickup device 11 and the camera body 39 are connected via the holding plate 51 so as to be able to transfer heat. It is possible to absorb the change in the relative positional relationship between the holding plate 51 and the mounting frame 53 while maintaining the above.

  In the heat dissipating structure 60, in the heat conducting member 61, the long plate portion 64 having a positional relationship along the holding plate 51 with respect to the one end portion 62 attached to the holding plate 51 is the holding plate 51 in the adjustment direction AD. Since it is displaced to the side opposite to the side to be attached and is connected by the first boundary portion 63, a gap can be provided between the holding plate 51 and the long plate portion 64, so that the long plate portion It is possible to prevent the bending deformation in the twisting direction at 64.

  In the heat dissipating structure 60, in the heat conducting member 61, the one end portion 62 faces the fixing portion (central portion) of the holding plate 51 while passing the positioning boss portions 51d of the holding plate 51 respectively corresponding to the two one end portion positioning holes 62a. Since the one end portion 62 is attached to the holding plate 51 by the heat conduction fixing screw 59 in the state of being in contact with each other, it is possible to reliably prevent the positional relationship between the one end portion 62 and the holding plate 51 from changing. Therefore, the state where the image sensor 11 and the camera body 39 are connected via the holding plate 51 so as to be able to transfer heat can be reliably maintained.

  In the heat radiating structure 60, in the heat conducting member 61, the other end portion 66 faces the mounting portion (housing mounting surface) in the mounting frame 53 while passing the mounting frame fixing screw 57 through the other end mounting hole 66c of the mounting plate portion 66a. Since the other end portion 66 is attached to the attachment frame 53 by the attachment frame fixing screw 57 in a state of being in contact with each other, the relative rotation around the attachment frame fixing screw 57 between the other end portion 66 and the attachment frame 53 is performed. Since there is room, it is possible to assist the absorption of the change in the relative positional relationship between the holding plate 51 and the mounting frame 53 due to the deformation of the long plate portion 64.

  Therefore, in the heat dissipation structure 60 according to the present invention, it is possible to prevent the position of the positioned image sensor 11 from being changed regardless of the tilt adjustment.

Other examples

  Next, a heat dissipation structure 70 according to another embodiment will be described with reference to FIGS. The other embodiment is an example in which the configuration of the heat dissipation structure 70 is different from the digital camera 10 of the above-described embodiment. Since the basic configuration of the digital camera 10B (tilt adjustment mechanism 50) of the other embodiment is the same as that of the digital camera 10 (tilt adjustment mechanism 50) of the above-described embodiment 1, the same configuration is not necessary. The same reference numerals are given, and detailed description thereof is omitted. Moreover, since the heat dissipation structure 70 of another Example is the same as that of the heat dissipation structure 60 of Example 1 mentioned above, the same code | symbol is attached | subjected to the part of an equal structure, and the detailed description is given. Omitted. FIG. 14 is an explanatory view similar to FIG. 2 in which the housing portion 39A is viewed from the back surface side (the back surface 11b side of the image sensor 11) in order to explain the configuration of the heat dissipation structure 70. FIG. 15 is an explanatory diagram showing a state in which the heat conducting member 71 is attached to the holding plate 51 in the heat dissipation structure 70. FIG. 16 is an explanatory view showing the holding plate side mounting member 72 of the heat conducting member 71 in a schematic perspective view. FIG. 17 is an explanatory view showing the housing plate side mounting member 81 of the heat conducting member 71 in a schematic perspective view.

  As shown in FIGS. 14 to 17, the heat dissipation structure 70 of another embodiment includes a holding plate side mounting member 72 and a housing plate side mounting member 81 as a heat conducting member 71. The holding plate side mounting member 72 and the case plate side mounting member 81 have a plate shape made of a material having thermal conductivity, and are appropriately bent.

  First, as shown in FIG. 16, the holding plate side mounting member 72 includes a mounting piece portion 73, a boundary portion 74, an extension plate portion 75, and a contact piece portion 76. The attachment piece 73 is provided as an attachment location to the holding plate 51 (see FIG. 14 and the like) and has a flat plate shape. The attachment piece 73 is a central portion of the holding plate 51 and is a portion (hereinafter referred to as a fixed portion) surrounded by a portion corresponding to the back side of the held image sensor 11 (three adhesive portions 51a (adhesive convex portions 51g thereof)). It is also possible to make contact with the surface))). For this reason, the attachment piece part 73 becomes a location attached to the image sensor 11 side serving as a heat source. In the present embodiment, the mounting piece 73 is one end that becomes an edge of the holding plate side mounting member 72 when viewed on a plane orthogonal to the photographing optical axis OA (adjustment direction AD) in a state of being attached to the holding plate 51. The extension direction from the first to the other end on the boundary part 74 side is bent at an intermediate position, and the other end (the boundary part 74) overlaps with the holding plate 51 when viewed on the photographing optical axis OA (adjustment direction AD). The positional relationship does not occur (see FIGS. 14 and 15). The attachment piece portion 73 is provided with two attachment piece portion positioning holes 73a and two attachment piece portion attachment holes 73b.

  The both attachment piece part positioning holes 73 a prevent relative displacement between the holding plate 51 and the attachment piece part 73. The two attachment piece portion positioning holes 73a are provided corresponding to the two positioning boss portions 51d of the holding plate 51, and each can pass the corresponding positioning boss portion 51d (FIG. 14). And FIG. 15). In this embodiment, one mounting piece portion positioning hole 73a (on the right side when viewed from the front in FIG. 16) is an elongated hole that opens the peripheral edge on one end side of the mounting piece portion 73, that is, the outer diameter of the positioning boss portion 51d. The inner diameter dimension is larger in only one direction than the dimension, and the degree of freedom of the position through which the positioning boss 51d is passed is ensured. The two attachment piece portion attachment holes 73b penetrate the attachment piece portion 73 in the thickness direction at a position between the two attachment piece portion positioning holes 73a and the round hole (left side when viewed from the front in FIG. 16). Is provided. Both the attachment piece part attachment holes 73b are provided corresponding to screw retaining holes (not shown) of the holding plate 51, and can pass heat fixing screws 59B described later.

  The attachment piece portion 73 is connected to the elongated plate portion 75 by a boundary portion 74. The boundary portion 74 is configured along a single straight direction (hereinafter also referred to as a boundary direction) parallel to the boundary between the mounting piece portion 73 and the elongated plate portion 75 that are parallel to each other, as will be described later. To do. In the present embodiment, the boundary portion 74 is different from the attachment piece portion 73 in the position seen in the direction orthogonal to the surface formed by the attachment piece portion 73 and the elongated plate portion 75 (hereinafter also referred to as the orthogonal direction). The elongated plate portion 75 is connected. That is, the boundary portion 74 is provided between the attachment piece portion 73 and the elongated plate portion 75 along the plane including the boundary direction and the orthogonal direction described above, and with respect to the attachment piece portion 73 attached to the holding plate 51. Thus, the extension plate portion 75 is displaced toward the side where the holding plate 51 is attached.

  The elongated plate portion 75 has a long flat plate shape and is parallel to the attachment piece portion 73. In this embodiment, the extension plate portion 75 is seen from one end on the boundary portion 74 side when viewed on a plane orthogonal to the photographing optical axis OA (adjustment direction AD) in a state where the attachment piece portion 73 is attached to the holding plate 51. The extending direction toward the other end on the contact piece 76 side is curved and formed. The extension plate portion 75 forms a protruding piece portion that protrudes elastically deformable with respect to the attachment piece portion 73 in cooperation with the boundary portion 74.

  In the elongated plate portion 75, a contact piece portion 76 is provided at an end portion on the opposite side to the attachment piece portion 73 when viewed in the longitudinal direction of bending. The contact piece 76 is formed to protrude toward the image sensor 11 side of the photographing optical axis OA (adjustment direction AD) in a state of being attached to the holding plate 51, and then is curved to the opposite side to the protrusion direction. ing. The contact piece 76 is a portion that comes into contact with the housing plate side mounting member 81 as will be described later.

  In the holding plate side mounting member 72, the long plate portion 64 includes a mounting piece portion 73 existing on the back side of the image pickup device 11 and a housing attached to the housing portion 39A (camera body 39) as will be described later. Since it extends in the longitudinal direction so as to connect the plate-side mounting member 81 (a contact surface 82a described later), the length dimension in the longitudinal direction is the adjustment amount in the tilt adjusting mechanism 50, that is, each support member 54. Compared with the difference in height dimension due to the adjusting cam surface 54e in FIG.

  The case plate side attachment member 81 is provided as an attachment member to the camera body 39 (see FIG. 14). As shown in FIG. 17, the case plate side attachment member 81 has a contact surface portion 82, a boundary portion 83, and an attachment piece portion 84. The contact surface portion 82 is provided as a location that constitutes a contact surface 82a with which the contact piece portion 76 is contacted, as well as a location where the contact frame portion 76 is contacted (see FIG. 14 and the like). The contact surface 82a is a flat surface, and can be relatively slid in a state in which the contact surface 82a is in contact with a contact portion (a portion protruding by bending) in the contact piece portion 76. The contact surface portion 82 is provided with two contact surface portion positioning holes 82b and one contact surface portion mounting hole 82c.

  The two contact surface portion positioning holes 82b prevent relative displacement between the mounting frame 53 and the contact surface portion 82. The two contact surface portion positioning holes 82b are provided corresponding to the two positioning projections 53g (see FIG. 14) of the mounting frame 53, and each can pass the corresponding positioning projection 53g. In this embodiment, one contact surface portion positioning hole 82b (on the right side in FIG. 17 when viewed from the front) has an inner diameter dimension that is larger in one direction than the outer diameter dimension of the long hole, that is, the positioning projection 53g. Thus, the degree of freedom of the position through which the positioning protrusion 53g is passed is ensured. The contact surface portion mounting hole 82c is provided through the contact surface portion 82 in the thickness direction. These contact surface portion mounting holes 82c are provided corresponding to screw retaining holes (not shown) of the mounting frame 53, and can pass through mounting frame fixing screws 57B (see FIGS. 14 and 15) described later. It is said that.

  The contact surface portion 82 is connected to the attachment piece portion 84 by a boundary portion 83. The boundary portion 83 is configured along a single straight direction (hereinafter also referred to as a boundary direction) parallel to the boundary between the contact surface portion 82 and the mounting piece portion 84 that are parallel to each other, as will be described later. Is. In the present embodiment, the boundary portion 83 differs from the contact surface portion 82 and the mounting piece in positions viewed in a direction orthogonal to the surface formed by the contact surface portion 82 and the mounting piece portion 84 (hereinafter also referred to as an orthogonal direction). It is supposed to connect the portion 84. That is, the boundary portion 83 is provided between the contact surface portion 82 and the attachment piece portion 84 along the surface including the boundary direction and the orthogonal direction described above, and with respect to the contact surface portion 82 attached to the attachment frame 53, The mounting piece 84 is displaced toward the subject side (the casing 39A side).

  The attachment piece portion 84 has a flat plate shape and is parallel to the contact surface portion 82. The attachment piece portion 84 is provided as an attachment location to the housing portion 39A (see FIG. 14). The attachment piece 84 is provided with an attachment piece attachment hole 84a. The attachment piece part attachment hole 84a is provided through the attachment piece part 84 in the thickness direction. The attachment piece portion attachment hole 84a is provided corresponding to a screw retaining hole (not shown) of the housing portion 39A so that a heat conduction fixing screw 59C described later can be passed therethrough.

  In the heat dissipation structure 70, the housing plate side mounting member 81 configured as described above has the positioning projections 53g of the mounting frame 53 respectively corresponding to the two contact surface portion positioning holes 82b of the contact surface portion 82, as shown in FIG. The attachment surface fixing screw 57B passed through the contact surface portion attachment hole 82c of the contact surface portion 82 is brought into contact with the attachment portion (not clearly shown) of the attachment frame 53 with the surface. The contact surface portion 82 is attached to the attachment frame 53 by meshing with a screw retaining hole 53 (not shown). Further, the housing plate side mounting member 81 makes the mounting piece portion 84 come into contact with a mounting portion (not clearly shown) in the housing portion 39A on the surface, and the mounting piece portion mounting hole 84a of the mounting piece portion 84 is provided. The attachment piece 84 is attached to the housing portion 39A by meshing the fixing screw 59C for heat conduction that is passed through a screw retaining hole (not shown) of the housing portion 39A. As described above, the housing plate side attachment member 81 is fixed to the camera body 39. For this reason, the attachment piece part 84 becomes a location attached to the housing | casing (camera body 39) side used as a thermal radiation location.

  Further, the holding plate side mounting member 72 fixes the mounting piece 73 on the holding plate 51 while passing the positioning boss portions 51 d of the holding plate 51 corresponding to the two mounting piece positioning holes 73 a of the mounting piece 73. The heat conduction fixing screw 59B passed through each mounting piece portion mounting hole 73b of the mounting piece portion 73 is brought into contact with a portion (center portion) with a surface and meshed with a screw retaining hole (not shown) of the holding plate 51. Thus, the attachment piece 73 is attached to the holding plate 51. Then, in the holding plate side attachment member 72, the contact piece portion 76 (the contact portion) connected to the attachment piece portion 73 via the boundary portion 74 and the extension plate portion 75 is a contact surface portion of the housing plate side attachment member 81. It is pressed against the contact surface 82a defined by 82 (see FIGS. 14 and 15). In this other embodiment, the attachment piece 73 is attached to the holding plate 51 by an adhesive having thermal conductivity, although not shown in the drawing, so that heat conduction is more efficient.

  For this reason, in the heat dissipation structure 70, the image pickup device 11 and the camera body 39 held there via the holding plate 51 are connected to the holding plate side mounting member 72 and the housing plate side mounting member 81 as the heat conducting members 71. Can be connected so that heat can be transferred, and the heat generated from the image sensor 11 can be released. Here, when the image sensor 11 (holding plate 51) is not adjusted by the tilt adjusting mechanism 50, the holding plate 51 and the mounting frame 53 are provided along a plane orthogonal to the adjustment direction AD. The attachment piece portion 73 and the extension plate portion 75 of the holding plate side attachment member 72 and the contact surface portion 82 (the contact surface 82a) of the housing plate side attachment member 81 are provided along a surface orthogonal to the adjustment direction AD. ing. For this reason, the contact piece 76 (the contact location) of the holding plate side mounting member 72 is pressed against the contact surface 82 a of the contact surface portion 82 of the housing plate side mounting member 81 in the adjustment direction AD.

  In the heat dissipation structure 70, the heat conducting member 71 is held by the holding plate 51 due to a change in the inclination of the holding plate 51 with respect to the adjustment direction AD in the camera body 39 by the tilt adjustment mechanism 50 and a change in the position in the adjustment direction AD. It is possible to prevent an increase in the force for pressing. This will be described below.

  In the heat dissipation structure 70, the contact piece portion 76 (the contact portion thereof) of the holding plate side attachment member 72 with the attachment piece portion 73 attached to the holding plate 51 is fixed to the camera body 39 (the attachment frame 53 and the housing portion 39A). The contact surface portion 82 a of the contact surface portion 82 of the housing plate side mounting member 81 is configured to be in contact with the contact surface portion 82 a. At this time, in the holding plate-side attachment member 72, the contact piece portion 76 is elastically deformable through the boundary portion 74 and the extension plate portion 75 by the cooperation of the boundary portion 74 and the extension plate portion 75. Therefore, the contact piece 76 (the contact location) is pressed against the contact surface 82 a of the contact surface portion 82. The contact surface 82a can be relatively slid in a state in which the contact surface 82a is in contact with a contact location (location projected by bending) in the contact piece portion 76. For this reason, when the position and posture of the holding plate 51 change in the camera body 39, the position (contact position) where the contact piece portion 76 (the contact location) contacts the contact surface 82a of the contact surface portion 82 is changed. Since the contact state can be maintained, changes in the position and posture of the holding plate 51 in the camera body 39 can be efficiently absorbed, and the holding plate side mounting member 72 and the case plate side mounting member 81 It is possible to prevent a relative force from being generated.

  Thus, in the heat dissipation structure 70 of another embodiment, the protruding piece portions (the boundary portion 74 and the extension plate portion 75) that protrude elastically deformably are provided on the holding plate side mounting member 72 fixed to the holding plate 51. Since the tip portion (contact piece 76) is pressed against the contact surface 82a of the housing plate side mounting member 81 fixed to the camera body 39 (the mounting frame 53 and the housing portion 39A), tilt adjustment is performed. Even if the relative positional relationship between the holding plate 51 and the camera body 39 is changed by the mechanism 50, absorption is performed by changing the position where the tip portion (contact piece portion 76) of the protruding piece portion contacts the contact surface 82a. Therefore, it is possible to efficiently suppress the force that the heat conducting member 71 pushes the holding plate 51 with reference to the camera body 39 against which the housing plate side mounting member 81 is pressed. For this reason, it is possible to prevent the position of the positioned image sensor 11 from being changed regardless of the tilt adjustment.

  Further, in the heat dissipation structure 70, the contact piece portion 76 (the contact portion) of the holding plate side mounting member 72 is pressed against the contact surface 82 a of the contact surface portion 82 of the housing plate side mounting member 81 in the adjustment direction AD. Therefore, the holding plate 51 and the mounting frame 53 (camera body 39) are adjusted by adjusting each support point in the adjustment direction AD by each support member 54 (its adjustment cam surface 54e) provided on the mounting frame 53 in the tilt adjustment mechanism 50. Even if the relative positional relationship with () changes, it is possible to maintain the state where the contact piece 76 (the contact location) is in contact with the contact surface 82 a of the contact surface portion 82. For this reason, it is possible to reliably maintain a state in which the imaging element 11 and the camera body 39 are connected via the holding plate 51 so that heat can be transferred.

  Furthermore, in the heat dissipation structure 70, in the holding plate side mounting member 72, the mounting piece 73 and the extension plate 75 are positioned at different positions in the adjustment direction AD and are connected by the boundary portion 74. While preventing the influence of the change in the relative positional relationship with the attachment frame 53 (camera body 39) from reaching the attachment piece 73, the influence is affected by the contact piece 76 (the contact location) and the contact surface 82. 82a can be extended to a position where the camera body 39 is in contact with the camera body 39, so that the state where the image pickup device 11 and the camera body 39 are connected to each other through the holding plate 51 so as to be able to transfer heat is reliably maintained. Changes in the positional relationship can be absorbed.

  In the heat dissipating structure 70, in the holding plate side mounting member 72, the extension plate portion 75 that defines a positional relationship along the holding plate 51 and that contacts the housing plate side mounting member 81 (its contact surface 82 a) is provided on the holding plate. 51 is displaced to the subject side (housing side 39A side) in the adjustment direction AD with respect to the attachment piece 73 attached to 51, and is connected by the boundary part 74, so that the protruding piece part (extension plate part 75) It is possible to prevent the displacement of the tip portion (contact piece portion 76) of the protruding piece portion due to elastic deformation in the adjustment direction AD. For this reason, in order to absorb the change in the relative positional relationship between the holding plate 51 and the camera body 39, the position where the tip portion of the protruding piece portion (contact piece portion 76) contacts the contact surface 82a can be changed. .

  In the heat radiating structure 70, the housing plate side mounting member 81 is used for tilt adjustment by the tilt adjusting mechanism 50 (change in the positional relationship between the holding plate 51 and the mounting frame 53), and the housing portion 39 </ b> A as the camera body 39 and the housing portion. Since it is fixed to the camera body 39 by being attached to the attachment frame 53 and the casing 39A, which are in a fixed positional relationship regardless of attachment to 39B, the image pickup device 11 and the camera body 39 via the holding plate 51 It is possible to reliably maintain the connected state so as to be capable of transferring heat in a predetermined state.

  In the heat dissipation structure 70, the state in which the image pickup device 11 and the camera body 39 are connected to each other by the heat conducting member 71 (the holding plate side mounting member 72 and the casing plate side mounting member 81) so as to be able to transfer heat is maintained regardless of the tilt adjustment. Therefore, it is possible to acquire a high-quality captured image. This is particularly effective since the number of digital cameras 10 having a moving image shooting function is increasing in recent years, and the driving time of the image sensor 11 is increased in this moving image shooting scene.

  In the heat dissipating structure 70, in the holding plate side mounting member 72, the mounting piece 73 is fixed on the holding plate 51 (center) while passing the positioning boss portions 51 d of the holding plate 51 corresponding to the two mounting piece positioning holes 73 a. Since the attachment piece 73 is attached to the holding plate 51 by the two heat conduction fixing screws 59B in a state where the portion is in contact with the surface, the positional relationship between the attachment piece 73 and the holding plate 51 changes. This can be reliably prevented, so that the state where the image pickup device 11 and the camera body 39 are connected to each other via the holding plate 51 so as to be able to transfer heat can be reliably maintained.

  Therefore, the tilt adjustment mechanism 50 according to the present invention can prevent the position of the positioned image sensor 11 from being changed regardless of the tilt adjustment.

  In the above-described embodiment, the heat dissipation structure 60 as an example of the heat dissipation structure according to the present invention has been described. However, the imaging surface of the imaging element that acquires the subject image formed by the imaging optical system is set in the housing. A heat dissipation structure for the image sensor that is held by a tilt adjustment mechanism so that the tilt with respect to the housing can be changed so as to coincide with a reference plane with respect to the photographing optical system, and is made of a material having thermal conductivity. A heat conducting member having one end fixed to the other end, the other end fixed to the housing, and a long plate that has a long plate shape and connects the other end to the one end. The heat conduction member includes a first boundary portion that forms a boundary between the one end portion and the long plate portion, and a second boundary portion that forms a boundary between the other end portion and the long plate portion. , Heat dissipation structure set along the direction orthogonal to each other Sufficient if, but is not limited to the aforementioned embodiments.

  In the above-described embodiment, the first boundary portion 63 (first direction) and the second boundary portion 65 (second direction) are orthogonal to each other, but one end 62 and the other end 66 are As long as it is possible to absorb the change in the relative positional relationship by bending deformation of the long plate portion 64 in the twisting direction, it is not necessary to be orthogonal in a strict sense.

  Further, in the above-described embodiment, the first boundary portion 63 is configured to connect the one end portion 62 and the long plate portion 64 with the positions seen in the orthogonal direction being different from each other, and the second boundary portion 65 is orthogonal. The long plate portion 64 and the other end portion 66 are connected to each other at different positions as viewed in the direction, but the holding plate 51 to which the one end portion 62 is attached and the attachment frame 53 to which the other end portion 66 is attached. As long as the positional relationship changes relatively, it is sufficient that the change can be absorbed by the bending deformation in the twisting direction of the long plate portion 64, and is limited to the above-described embodiment. is not.

  In the above-described embodiment, the holding plate 51 that holds the image sensor 11 is supported by the three support points that can be displaced in the adjustment direction AD with respect to the housing portion 39A. It is sufficient that at least three or more can be provided in the adjustment direction AD with respect to 39A, and the present invention is not limited to the above-described embodiment.

  In the above-described embodiment, the heat dissipation structure 60 is mounted on the digital camera 10, but an image sensor (image sensor) with respect to a reference plane (reference plane Bp) set in the housing with respect to the photographing optical axis OA of the photographing optical system. If the tilt adjustment of 11) is required, it may be mounted on an imaging device (digital camera) provided with an imaging optical system integrally with the housing. The housing may be mounted on an imaging unit that is housed in the body and is detachable from the imaging apparatus body, and is not limited to the above-described embodiment.

  In the embodiment described above, the heat dissipation structure 60 is mounted on the digital camera 10, but it may be mounted on a portable information terminal device such as a PDA (Personal Data Assistant) or a mobile phone incorporating a camera function. However, the present invention is not limited to the examples. This is because many of such portable information terminal devices include functions and configurations that are substantially the same as those of the digital camera 10 although the appearance is slightly different. Similarly, the heat dissipation structure 60 according to the present invention may be employed in an image input device.

  As described above, the heat dissipation structure of the present invention has been described based on the embodiments. However, the specific configuration is not limited to the embodiments, and design changes and additions are allowed without departing from the gist of the present invention. The

DESCRIPTION OF SYMBOLS 10 Digital camera 11 Image pick-up element 11a Image pick-up surface 39 Camera body 39A (as an example of a housing | casing) Case part 39B (as an example of a case) Case part 40 (as an example of a case) Interchangeable lens portion 50 Tilt adjustment mechanism 51 Holding plate 52b1 (as an example of an image sensor holding plate) First supported portion 52b2 (being a supported point) Second supported portion 52b3 (being a supported point) Third supported portion 53 (being a supported point) Mounting frame 54 (fixed to a housing as an example) 54 Support member 54e Adjustment cam surface (as a cam surface forming a support point) 60 Heat dissipation structure 61 Heat conduction Member 62 One end portion 63 First boundary portion 64 Long plate portion 65 Second boundary portion 66 Other end portion 66a Mounting plate portion 66b Contact piece portion AD Adjustment direction Bp Reference plane

Japanese Unexamined Patent Publication No. 09-037161

Claims (7)

The tilt adjustment mechanism is held by a tilt adjustment mechanism so that the tilt with respect to the housing can be changed so that the imaging surface of the image sensor for acquiring a subject image formed by the photographing optical system matches the reference surface for the photographing optical system set in the housing. A heat dissipation structure for the image sensor,
Made of a material having thermal conductivity, one end fixed to the imaging element, the other end fixed to the housing, a long plate-like shape, the other end and the one end A long plate portion to be connected, and a heat conducting member having
In the heat conducting member, a first boundary portion that forms a boundary between the one end portion and the long plate portion, and a second boundary portion that forms a boundary between the other end portion and the long plate portion, A heat dissipating structure characterized by being set along directions orthogonal to each other. The tilt adjustment mechanism includes an image sensor holding plate that holds the image sensor, and a cam surface that forms a support point that supports the image sensor holding plate so as to be displaceable in an adjustment direction orthogonal to the reference plane. Having at least three support members,
The heat radiating structure according to claim 1, wherein the one end portion is attached to the imaging element holding plate so that a surface thereof is directed. The other end portion protrudes from the mounting plate portion so as to be elastically deformable, and a mounting plate portion that is attached to the housing in such a manner as to face the housing mounting surface provided along the imaging element holding plate in the housing. And a contact piece portion
The contact piece portion is pressed against a housing contact surface different from the housing mounting surface of the housing by elastic deformation based on the mounting plate portion. Heat dissipation structure.   3. The heat conduction member according to claim 2, wherein the first boundary portion is connected to the long plate portion by changing the position in a direction perpendicular to the reference plane. Item 4. The heat dissipation structure according to item 3.   5. The heat dissipation structure according to claim 4, wherein in the heat conducting member, the long plate portion is provided along the imaging element holding plate while being spaced from the imaging element holding plate.   3. The heat conduction member according to claim 2, wherein the second boundary portion has a different position in a direction orthogonal to the reference plane to connect the other end portion and the long plate portion. The heat dissipation structure according to claim 5.   An imaging apparatus comprising the heat dissipation structure according to any one of claims 1 to 6.