JP2004134876A - Optical module and manufacturing method thereof, circuit board, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical module provided with a plurality of optical chips and the product of which is downsized. <P>SOLUTION: The optical module includes: first and second cases 40, 41; a first optical chip 10 mounted in an opening 60 of the first case 40; a second optical chip 11 mounted in an opening 60 of the second case 41; and first and second lens 42, 43, and the first and second cases 40, 41 are mutually fixed so that the openings 60 are communicatively connected and the first and second optical chips 10, 11 are placed in a way that the respective optical parts 12 are directed opposite to each other. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an optical module and a method for manufacturing the same, a circuit board, and an electronic device.
[0002]
[Prior art]
[0003]
[Patent Document 1]
JP 2001-333332 A
BACKGROUND OF THE INVENTION
2. Description of the Related Art There is known an imaging device in which an optical chip is mounted on a substrate and a housing is attached. The housing is provided so as to surround the optical chip, and a lens is fixed above the optical chip. Generally, an imaging device includes one optical chip. Therefore, there is a problem that not only can the image of the subject in a plurality of directions not be captured at the same time, but also the angle of the camera must be frequently adjusted for each subject. On the other hand, when the imaging device includes a plurality of optical chips, it is important to reduce the size of the product by suppressing the space for the optical chips and the housing.
[0005]
An object of the present invention is to provide a plurality of optical chips and reduce the size of a product.
[0006]
[Means for Solving the Problems]
(1) An optical module according to the present invention includes: a first housing provided with an opening and a wiring pattern;
A second housing provided with an opening and a wiring pattern;
A first optical chip mounted in the opening of the first housing so as to be electrically connected to the wiring pattern;
A second optical chip mounted in the opening of the second housing so as to be electrically connected to the wiring pattern;
A first lens corresponding to the optical portion of the first optical chip and held by the first housing;
A second lens corresponding to the optical portion of the second optical chip and held by the second housing;
Including
The first and second housings are fixed to each other so that the openings communicate with each other,
The first and second optical chips are arranged such that the respective optical parts face in opposite directions.
[0007]
According to the present invention, for example, the first and second optical chips are arranged so that their respective optical parts face in opposite directions, so that, for example, the first and second optical chips overlap each other. And the size of the device can be reduced.
[0008]
(2) In this optical module,
The first and second optical chips may be arranged so that at least some of them overlap each other.
[0009]
According to this, the first and second optical chips are arranged so that at least a part thereof overlaps each other. Therefore, the area occupied by the first and second optical chips can be reduced.
[0010]
(3) In this optical module,
The first optical chip is arranged such that the optical portion faces in a direction opposite to the second housing,
The second optical chip may be arranged so that the optical portion faces in a direction opposite to the first housing.
[0011]
(4) In this optical module,
The semiconductor device may further include a circuit chip disposed in the opening of any of the first and second housings and electrically connected to at least one of the first and second optical chips.
[0012]
(5) In this optical module,
The circuit chip comprises:
A first circuit chip on which the first optical chip is stacked;
A second circuit chip on which the second optical chip is stacked;
May be included.
[0013]
According to this, since the optical chip and the circuit chip can be integrated, the size of the device can be further reduced.
[0014]
(6) In this optical module,
Each of the optical portions of the first and second optical chips may include a plurality of light receiving units arranged for image sensing.
[0015]
(7) In this optical module,
The optical portion of each of the first and second optical chips may have a color filter.
[0016]
(8) In this optical module,
The optical portion of each of the first and second optical chips may have a microlens array.
[0017]
(9) The optical module is mounted on a circuit board according to the present invention.
[0018]
(10) An electronic device according to the present invention includes the above electronic device.
[0019]
(11) The method for manufacturing an optical module according to the present invention includes: (a) electrically connecting a first optical chip to the wiring pattern in the opening of the first housing provided with the opening and the wiring pattern; To be connected to
(B) mounting a second optical chip in the opening of the second housing provided with the opening and the wiring pattern so as to be electrically connected to the wiring pattern;
(C) providing a first lens corresponding to the optical portion of the first optical chip;
(D) providing a second lens corresponding to the optical portion of the second optical chip;
(E) fixing the first and second housings to each other so that the openings communicate with each other at least after the steps (a) and (b);
Including
In the steps (a) and (b), the first and second optical chips are arranged such that the respective optical parts face in opposite directions.
[0020]
According to the present invention, since the first and second optical chips are arranged so that their respective optical parts face in opposite directions, for example, the first and second optical chips are arranged so as to overlap each other. And the size of the device can be reduced.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing an optical module according to an embodiment to which the present invention is applied. This optical module has a plurality of optical chips (first and second optical chips 10 and 11 in FIG. 1). FIG. 2 is a sectional view of the optical chip.
[0022]
As shown in FIG. 2, the first optical chip 10 has an optical part 12. The optical portion 12 is a portion where light enters or exits. The optical part 12 also converts light energy and other energy (for example, electricity). That is, the optical part 12 has a plurality of energy conversion elements (light receiving elements / light emitting elements) 14. In the present embodiment, the optical part 12 is a light receiving part. The plurality of energy conversion elements (light receiving elements or image sensor elements) 14 are two-dimensionally arranged so that image sensing can be performed. That is, in the present embodiment, the optical module is an image sensor (for example, a CCD or a CMOS sensor). The energy conversion element 14 is covered with a passivation film 16. The passivation film 16 has optical transparency. When manufacturing the first optical chip 10 from a semiconductor substrate (for example, a semiconductor wafer), the passivation film 16 may be formed of SiO ₂ or SiN.
[0023]
The optical part 12 may have a color filter 18. The color filter 18 is formed on the passivation film 16. Further, a flattening layer 20 may be provided on the color filter 18, and a microlens array 22 may be provided thereon.
[0024]
A plurality of electrodes 24 are formed on the first optical chip 10. The electrode 24 has a bump formed on the pad, but may be a pad alone. The electrode 24 is formed outside the optical part 12. The electrodes 24 may be arranged along a plurality of sides (for example, two or four sides facing each other) or one side of the first optical chip 10.
[0025]
The optical part 12 is preferably sealed by a sealing part 30. By doing so, the optical portion 12 can be protected from moisture, and dust can be prevented from entering the optical portion 12. The sealing portion 30 has a light transmitting property and is provided so as to avoid the electrode 24. For example, the sealing portion 30 has a plate portion 32 disposed above the optical portion 12 and a spacer portion 34 continuously formed around the optical portion 12. The plate portion 32 may transmit only light of a specific wavelength, for example, may transmit visible light but do not transmit light in an infrared region. A closed space is formed between the plate part 32 and the optical part 12. This space may be reduced in pressure from the atmospheric pressure, may be in a vacuum, or may be filled with nitrogen or dry air.
[0026]
As the configuration of the second optical chip 11, the contents of the first optical chip 10 can be applied. The outer shapes of the first and second optical chips 10 and 11 may be the same size or different sizes.
[0027]
As shown in FIG. 1, the optical module 1 includes first and second housings 40 and 41. The first and second housings 40 and 41 are cases of the first and second optical chips 10 and 11. The first and second housings 40 and 41 may be cylindrical lens barrels. The first and second housings 40 and 41 have a three-dimensional shape, and can be formed by, for example, resin injection molding. The first and second housings 40 and 41 may be MID (Molded Interconnect Device).
[0028]
The first housing 40 holds the first lens 42. If the housing and lens are used for imaging, they can be referred to as imaging optics. The first lens 42 is arranged at a position corresponding to the optical part 12 of the first optical chip 10. The first housing 40 has a first portion 44 serving as a lens holder, and a second portion 46 serving as an attachment portion to the second housing 41. The first lens 42 is attached to the first portion 44. First and second holes 44 and 50 are formed in the first and second portions 44 and 46 above the optical portion 12. The first and second holes 48, 50 communicate with each other. Then, the first lens 42 is mounted in the first opening 48 of the first portion 44. The first lens 42 includes a holding structure including a holding member that can be moved in a direction along the axis of the first hole 48 by using a screw (not shown) formed inside the first portion 44. (Not shown), it may be fixed in the first hole 48. The first lens 42 is held at a distance from the optical part 12 of the first optical chip 10. Outside the first part 44 and inside the second hole 50 of the second part 46, first and second screws 52, 54 are formed, by which the first and second parts 44, 54 are formed. 46 is connected. Thus, the first and second screws 52, 54 move the first and second portions 44, 46 in a direction along the axis of the first and second openings 48, 50. Thereby, the focus of the first lens 42 can be adjusted. Note that a filter 56 may be provided in the second portion 46 of the first housing 40 so as to cover the second opening 50. The filter 56 may transmit only light of a specific wavelength, for example, may transmit visible light but do not transmit light in an infrared region.
[0029]
The first housing 40 is provided with an opening 60. The opening 60 is formed to be larger than the outer shape of the first optical chip 10 so that the first optical chip 10 can be accommodated. The opening 60 is formed in the second portion 46. The filter 56 described above is interposed between the opening 60 and the second hole 50. The opening 60 has a support surface (bottom surface) 62 that supports the first optical chip 10 on the inner periphery thereof. The support surface 62 is preferably a surface perpendicular to the optical axis.
[0030]
A wiring pattern 64 is formed on the first housing 40. The wiring pattern 64 has a plurality of wirings. Each wiring is formed so as to reach at least the inner surface of the opening 60 (specifically, the support surface 62). Each wiring may be extended from the inner surface of the opening 60 to the outer surface of the first housing 40 through the opening end. By doing so, electrical continuity can be achieved from outside the first housing 40 via the wiring pattern 64. The wiring pattern 64 can be formed by, for example, forming a conductive layer on the first housing 40 by sputtering, patterning with a laser to remove a part, and plating the remaining part.
[0031]
The second lens 43 is fixed to the second housing 41. As the configuration of the second housing 41, the contents of the first housing 40 can be applied. The shapes of the first and second housings 40 and 41 may be the same.
[0032]
The first optical chip 10 is mounted in the opening 60 of the first housing 40. In other words, the first housing 40 is provided so as to surround the first optical chip 10. The first optical chip 10 is electrically connected to the wiring pattern 64. More specifically, the first optical chip 10 is arranged such that the surface on which the electrode 24 is formed faces the support surface 62, and the electrode 24 and a part of the wiring pattern 64 on the support surface 62 are electrically connected. . Their electrical connection can be achieved by metal bonding or the like. Alternatively, the electrical connection may be achieved by applying wire bonding using a wire.
[0033]
The second optical chip 11 is mounted in the opening 60 of the second housing 40, and the description of the first optical chip 10 and the first housing 40 described above can be applied. Note that the electrical connection portion may be sealed with a sealing portion (not shown) such as a resin.
[0034]
The first and second housings 40 and 41 are fixed to each other so that the respective openings 60 communicate with each other. That is, the opening end of the opening 60 of the first housing 40 is connected to the opening end of the opening 60 of the second housing 41. In this case, it is preferable that the opening ends of the first and second housings 40 and 41 coincide with each other, because the first and second housings 40 and 41 are easily connected. The first and second housings 40 and 41 may be bonded with an adhesive or may be mechanically fixed. The first and second optical chips 10 and 11 are accommodated in a space formed by the openings 60 of the first and second housings 40 and 41 communicating with each other.
[0035]
The first and second optical chips 10, 11 are arranged such that their respective optical parts 12 face in opposite directions. In other words, the surface on which the optical portion 12 of the first optical chip 10 is formed and the surface on which the optical portion 12 of the second optical chip 11 is formed face in the opposite direction. In the example shown in FIG. 1, the first and second optical chips 10 and 11 are mounted in a direction in which both optical portions 12 do not face each other (outward direction). More specifically, the first optical chip 10 is arranged such that its optical part 12 faces the opposite direction to the second housing 41, and the second optical chip 11 has its optical part 12 Are arranged so as to face in the opposite direction to the housing 40. Thus, a path through which light enters or exits from the optical portion 12 can be secured in the outward direction.
[0036]
The first and second optical chips 10 and 11 may be arranged so that at least some of them overlap each other. The first and second optical chips 10 and 11 may all overlap, all and part, or partially overlap. By doing so, the area occupied by the first and second optical chips 10 and 11 can be reduced.
[0037]
The first and second optical chips 10 and 11 may be bonded with an adhesive or the like. Specifically, the surface of the first optical chip 10 opposite to the optical part 12 and the surface of the second optical chip 11 opposite to the optical part 12 may be bonded. According to this, since the first and second optical chips 10 and 11 are directly fixed, the thickness of the device can be reduced. Alternatively, a substrate (for example, a flexible substrate or a rigid substrate) may be interposed between the first and second optical chips 10 and 11.
[0038]
According to the optical module according to the present embodiment, the first and second optical chips 10 and 11 are arranged such that the respective optical portions 12 face in opposite directions. Therefore, for example, the first and second optical chips 10 and 11 can be arranged so as to overlap each other, and the device can be downsized.
[0039]
FIG. 3 is a diagram showing a circuit board having the optical module according to the present embodiment. In the example shown in FIG. 3, the optical module 1 is provided with a plurality of leads 70 electrically connected to one of the wiring patterns 64 of the first and second housings 40 and 41. The lead 70 may be for insertion mounting, and extends parallel to the optical axis. The leads 70 serve as external terminals of the optical module 1. The leads 70 are electrically connected to a circuit board (for example, a motherboard) 72. More specifically, a wiring pattern 74 of copper or the like is formed on the circuit board 72, and leads 70 are inserted into through holes 76 overlapping a part of the wiring pattern 74. The lead 70 may be electrically connected to the wiring pattern 74 by a brazing material 78 such as solder. The circuit board 72 has a through hole 80 serving as a light passage, and one of the lenses of the optical module 1 is aligned with the through hole 80. Alternatively, a light transmissive member (for example, glass) may be provided instead of the through hole 80. As shown in FIG. 3, the size of the product can be reduced by overlapping the circuit board 72 and the optical module 1 in the thickness direction.
[0040]
Apart from the above, the optical module 1 and the circuit board 72 may be electrically connected by a tape (or film) on which wiring is formed. Note that electronic components other than the optical module 1 may be mounted on the circuit board 72.
[0041]
FIG. 4 is a diagram illustrating a method for manufacturing the optical module according to the present embodiment. The method of manufacturing the optical module includes mounting the first and second optical chips 10 and 11, providing the first and second lenses 42 and 43, and providing the first and second housings 40 and 43. 41, including fixing them to each other.
[0042]
First, the first optical chip 10 is mounted in the opening 60 of the first housing 40. Then, before or after the mounting step of the first optical chip 10, the first lens 42 is attached to the first portion 44, and the first and second portions 44 and 46 are joined. On the other hand, as shown in FIG. 4, the same steps as described above are performed for the second optical chip 11 and the second housing 41. Thereafter, the first and second housings 40 and 41 are fixed to each other so that the openings 60 communicate with each other. The description of the optical module will be omitted for the other contents because the description of the optical module can be applied.
[0043]
5 to 8 are views showing modified examples of the present embodiment. In the following description, common and conceivable items (configuration, operation, function, and effect) with the other embodiments are omitted. The present invention includes matters achieved by combining a plurality of embodiments.
[0044]
FIG. 5 is a diagram illustrating an optical module according to a modification of the present embodiment. In this modification, a circuit chip (semiconductor chip) 90 is mounted. A desired integrated circuit is formed on the circuit chip 90. The circuit chip 90 is used for signal processing before and after energy conversion (for example, A / D conversion). The circuit chip 90 is disposed in one of the openings 60 of the first and second housings 40 and 41, and the wiring pattern 64 is provided on one or both of the first and second optical chips 10 and 11. Are electrically connected via The circuit chip 90 is surrounded by the first and second housings 40 and 41.
[0045]
As shown in FIG. 5, the circuit chip 90 is arranged in the opening 60 of the first housing 40 together with the first optical chip 10. The opening 60 of the first housing 40 has a plurality of support surfaces such that a plurality of steps are formed on the inner periphery, and the first optical chip 10 or the circuit chip 90 is supported by any of the support surfaces. May be. In the example shown in FIG. 5, the first optical chip 10 is supported by the first support surface 62, and the circuit is formed by the second support surface 63 closer to the second housing 41 than the first support surface 62. The chip 90 is supported. The first optical chip 10 is arranged closer to the first lens 42 than the circuit chip 90 is. In the example shown in FIG. 5, the circuit chip 90 is arranged such that the surface on which the electrodes (for example, bumps) 92 are formed faces the direction of the second support surface 63, and the electrodes 92 and the wiring on the second support surface 63 are arranged. A part of the pattern 64 is electrically connected. Further, the first optical chip 10 may be stacked in a region inside the electrode 92 of the circuit chip 90. That is, a stack structure may be formed by the optical chip and the circuit chip. By doing so, the optical chip and the circuit chip can be integrated, so that the size of the device can be further reduced.
[0046]
As shown in FIG. 5, a substrate 94 may be arranged in the opening 60 of the second housing 41. Specifically, a substrate 94 may be interposed between the circuit chip 90 on which the first optical chip 10 is stacked and the second optical chip 11. The substrate 94 allows the first and second optical chips 10 and 11 and the circuit chip 90 to be integrated.
[0047]
FIG. 6 is a diagram illustrating an optical module according to a modification of the present embodiment. In this modification, a plurality of circuit chips (first and second circuit chips 90 and 96 in FIG. 6) are mounted. As shown in FIG. 6, the first optical chip 10 may be stacked on the first circuit chip 90, and the first optical chip 11 may be stacked on the second circuit chip 96. For other configurations, the contents already described can be applied. In the present modified example, one circuit chip corresponds to one optical chip, so that, for example, signals from the first and second optical chips 10 and 11 can be simultaneously processed.
[0048]
FIG. 7 is a diagram illustrating an optical module according to a modification of the present embodiment. In the present modification, wire bonding using the wire 100 is applied to the electrical connection between the first and second optical chips 10 and 11. A wiring 93 electrically connected to the electrode 92 is formed on the first circuit chip 90, and the electrode 24 of the first optical chip 10 and the wiring 93 of the first circuit chip 90 are electrically connected by wires 100. May be connected. The electrical connection part is preferably sealed with a sealing part 102 such as a resin. The sealing portion 102 may be attached to a side surface of the sealing portion 30 that seals the optical portion 12. After the first optical chip 10 is electrically connected to the first circuit chip 90, the first circuit chip 90 is electrically connected to the wiring pattern 64. The contents of the first optical chip 10 and the first circuit chip 90 can be applied to the electrical connection between the second optical chip 11 and the second circuit chip 96.
[0049]
FIG. 8 is a diagram illustrating an optical module according to a modification of the present embodiment. In the present modification, the first and second optical chips 10 and 11 have the electrodes 104 at least on the side surfaces. The electrode 104 may have an L-shape that covers the corners of the first and second optical chips 10 and 11. The electrodes 104 may be formed by packaging the first and second optical chips 10 and 11 for surface mounting. The first and second optical chips 10 and 11 have a function similar to that of a semiconductor chip in a form called LCC (Leadless chip carrier). The first and second optical chips 10 and 11 are electrically connected to the wiring pattern 64 via the electrodes 104. As shown in FIG. 8, when the electrodes 104 are formed at the corners of the first and second optical chips 10 and 11, if the electrodes 104 and the corners of the opening 60 are aligned, they will be uneven. The engagement allows easy and reliable electrical connection. In the example shown in FIG. 8, the first and second circuit chips 90 and 96 also have the electrode 104 similarly. The first and second circuit chips 90 and 96 may be packaged in an LCC (Leadless chip carrier) type.
[0050]
FIGS. 9A and 9B show a mobile phone 1000 as an electronic device including an optical module according to an embodiment of the present invention. The mobile phone 1000 has a camera 1100 in which the above-described optical module is incorporated. The camera 1100 can capture an image of a subject from both the front and the back of a mobile phone, for example.
[0051]
The present invention is not limited to the embodiments described above, and various modifications are possible. For example, the invention includes configurations substantially the same as the configurations described in the embodiments (for example, a configuration having the same function, method, and result, or a configuration having the same object and result). Further, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. Further, the invention includes a configuration having the same operation and effect as the configuration described in the embodiment, or a configuration capable of achieving the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating an optical module according to an embodiment of the present invention.
FIG. 2 is a diagram showing an optical chip incorporated in the optical module according to the embodiment of the present invention.
FIG. 3 is a diagram showing a circuit board according to the embodiment of the present invention.
FIG. 4 is a diagram illustrating a method for manufacturing an optical module according to an embodiment of the present invention.
FIG. 5 is a diagram showing an optical module according to a modification of the embodiment of the present invention.
FIG. 6 is a diagram illustrating an optical module according to a modification of the embodiment of the present invention.
FIG. 7 is a diagram showing an optical module according to a modification of the embodiment of the present invention.
FIG. 8 is a diagram showing an optical module according to a modification of the embodiment of the present invention.
FIGS. 9A and 9B are views showing an electronic device according to an embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 1st optical chip, 11 2nd optical chip, 12 optical parts, 18 color filters, 22 micro lens array, 40 1st housing, 41 2nd housing, 42 1st lens, 43rd 2 lenses, 60 openings, 64 wiring patterns, 90 first circuit chips, 96 second circuit chips

Claims (11)

A first housing provided with an opening and a wiring pattern;
A second housing provided with an opening and a wiring pattern;
A first optical chip mounted in the opening of the first housing so as to be electrically connected to the wiring pattern;
A second optical chip mounted in the opening of the second housing so as to be electrically connected to the wiring pattern;
A first lens corresponding to the optical portion of the first optical chip and held by the first housing;
A second lens corresponding to the optical portion of the second optical chip and held by the second housing;
Including
The first and second housings are fixed to each other so that the openings communicate with each other,
An optical module in which the first and second optical chips are arranged such that the respective optical portions face in opposite directions. The optical module according to claim 1,
An optical module in which the first and second optical chips are arranged so that at least some of them overlap each other. The optical module according to claim 1 or 2,
The first optical chip is arranged such that the optical portion faces in a direction opposite to the second housing,
An optical module, wherein the second optical chip is arranged so that the optical part faces in a direction opposite to the first housing. The optical module according to any one of claims 1 to 3,
An optical module further comprising a circuit chip disposed in the opening of any of the first and second housings and electrically connected to at least one of the first and second optical chips. The optical module according to claim 4,
The circuit chip comprises:
A first circuit chip on which the first optical chip is stacked;
A second circuit chip on which the second optical chip is stacked;
Optical module including. The optical module according to any one of claims 1 to 5,
An optical module in which each of the optical portions of the first and second optical chips has a plurality of light receiving sections arranged for image sensing. The optical module according to any one of claims 1 to 6,
An optical module, wherein the optical portion of each of the first and second optical chips has a color filter. The optical module according to any one of claims 1 to 7,
An optical module, wherein the optical portion of each of the first and second optical chips has a microlens array. A circuit board on which the optical module according to claim 1 is mounted. An electronic device comprising the optical module according to claim 1. (A) mounting a first optical chip in the opening of the first housing provided with the opening and the wiring pattern so as to be electrically connected to the wiring pattern;
(B) mounting a second optical chip in the opening of the second housing provided with the opening and the wiring pattern so as to be electrically connected to the wiring pattern; Providing a first lens corresponding to the optical portion of one optical chip;
(D) providing a second lens corresponding to the optical portion of the second optical chip;
(E) fixing the first and second housings to each other so that the openings communicate with each other at least after the steps (a) and (b);
Including
A method for manufacturing an optical module, wherein in the steps (a) and (b), the first and second optical chips are arranged such that the respective optical parts face in opposite directions.

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