JP2004274164A - Optical module, its manufacturing method and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical module which can be made small in size and high in intedration, and to provide its manufacturing method and an electronic apparatus. <P>SOLUTION: The optical module includes a substrate 30 with an internal space 32 formed therein, an optical chip 10 with an optical portion 12, a lens 44 provided in the internal space 32 while leaving a space from the optical portion 12, and an integrated circuit chip 70 that is electrically connected to the optical chip 10 and provided on an outer surface of a wall 34 surrounding the internal space 32 in the substrate 30. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an optical module, a method for manufacturing the same, and an electronic device.
[0002]
[Prior art]
[0003]
[Patent Document 1]
JP-A-11-191865
BACKGROUND OF THE INVENTION
In an optical module of an imaging system such as a CCD or a CMOS sensor, an optical chip and a housing are provided on a substrate. On the surface of the optical chip, there is formed an optical part which enables mutual conversion of light and electric signals, and the housing holds the lens at a position corresponding to the optical part. An integrated circuit chip for processing an electric signal from the optical chip and other necessary electronic components are arranged on the substrate.
[0005]
According to this, since a plurality of components are mounted on the substrate plane, the planar area of the optical module is enlarged, and it has not been possible to cope with miniaturization and high integration. On the other hand, miniaturization and high integration of electronic devices including an optical module of an imaging system such as a mobile phone with a camera are desired.
[0006]
An object of the present invention is to achieve miniaturization and high integration of an optical module.
[0007]
[Means for Solving the Problems]
(1) An optical module according to the present invention includes: a base material having an internal space formed therein;
An optical chip having an optical portion;
At a distance from the optical portion, a lens provided in the internal space,
An integrated circuit chip electrically connected to the optical chip and provided on an outer surface of a wall of the base material surrounding the internal space;
including. According to the present invention, the integrated circuit chip is provided on the outer surface of the wall of the base material surrounding the internal space. This makes it possible to mount the optical chip and the integrated circuit chip three-dimensionally on the base material, thereby preventing the planar area of the optical module from increasing. Therefore, miniaturization and high integration of the optical module can be achieved.
(2) In this optical module,
A wiring pattern may be formed on the base material.
(3) In this optical module,
The wiring pattern includes a first terminal, and a second terminal formed on the outer surface of the wall.
The optical chip is electrically connected to the first terminal,
The integrated circuit chip may be electrically connected to the second terminal.
(4) In this optical module,
A wiring board attached to the base material, further including a wiring pattern,
The wiring board includes first and second regions,
The wiring pattern includes a first terminal formed in the first region, and a second terminal formed in the second region,
The optical chip is electrically connected to the first terminal in the first region,
The integrated circuit chip is electrically connected to the second terminal in the second region;
The wiring board may be bent between the first and second regions such that a surface of the second region and the outer surface of the wall face each other. According to this, since the wiring board is used, for example, a step of forming a wiring pattern on the base material and a step of bonding each chip to the base material can be omitted. Therefore, it is possible to easily reduce the size and increase the integration of the optical module by omitting difficult steps.
(5) In this optical module,
The wiring board includes a plurality of the second regions,
Each of the second regions may extend in a different direction from the first region.
(6) In this optical module,
The wiring board further includes a third region,
The wiring pattern may further include a third terminal formed in the third region.
(7) In this optical module,
The first region has a quadrilateral shape,
The second region may extend from three sides of the first region, and the third region may extend from the remaining one side.
(8) In this optical module,
The substrate includes first and second portions,
The first portion has a first hole, and holds the lens in the first hole;
The second portion has a second hole, and holds the first portion in the second hole;
The internal space may be configured such that the first and second holes communicate with each other.
(9) In this optical module,
The first portion may be position-adjustable along an axial direction of the second hole in the second portion. Thereby, the focus of the lens can be adjusted.
(10) In this optical module,
The second hole has a step formed by a first opening and a second opening located on the lens side and having a smaller opening diameter than the first opening;
The optical chip may be provided in the first opening such that the optical portion faces the second opening.
(11) In this optical module,
A light transmitting member may be provided in the second hole.
(12) An optical module according to the present invention includes the above electronic device.
(13) In the method for manufacturing an optical module according to the present invention, an optical chip having an optical portion is aligned with a base material having an internal space formed therein.
Providing a lens in the interior space, spaced from the optical portion;
Providing an integrated circuit chip on the outer surface of a wall of the substrate surrounding the internal space, so as to be electrically connected to the optical chip;
including. According to the present invention, the integrated circuit chip is provided on the outer surface of the wall of the base material surrounding the internal space. This makes it possible to mount the optical chip and the integrated circuit chip three-dimensionally on the base material, thereby preventing the planar area of the optical module from increasing. Therefore, miniaturization and high integration of the optical module can be achieved.
(14) In this method of manufacturing an optical module,
Of the wiring board having a wiring pattern, further comprising mounting an optical chip in a first region, mounting an integrated circuit chip in a second region, and attaching the wiring substrate to the base material,
The wiring board may be bent between the first and second regions such that the surface of the second region and the outer surface of the wall face each other. According to this, since the wiring board is used, for example, a step of forming a wiring pattern on the base material and a step of bonding each chip to the base material can be omitted. Therefore, it is possible to easily reduce the size and increase the integration of the optical module by omitting difficult steps.
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0009]
(First Embodiment)
1 and 2 are diagrams illustrating an optical module and a method of manufacturing the same according to a first embodiment of the present invention. FIG. 1 is a sectional view of the optical module, and FIG. 2 is a sectional view of the optical chip. The optical module according to the present embodiment includes an optical chip 10, a base 30, and an integrated circuit chip 70.
[0010]
The shape of the optical chip 10 is often a rectangular parallelepiped. The optical chip 10 may be a semiconductor chip. As shown in FIG. 2, the optical chip 10 has an optical part 12. The optical portion 12 is a portion where light enters or exits. The optical part 12 also converts light energy and other energy (for example, electricity). That is, the optical part 12 has a plurality of energy conversion elements (light receiving elements / light emitting elements) 14. In the present embodiment, the optical part 12 is a light receiving part. In this case, the optical chip 10 is a light receiving chip (for example, an imaging chip). The plurality of energy conversion elements (light receiving elements or image sensor elements) 14 are two-dimensionally arranged so that image sensing can be performed. That is, in the present embodiment, the optical module is an image sensor (for example, a CCD or a CMOS sensor). The energy conversion element 14 is covered with a passivation film 16. The passivation film 16 has optical transparency. When the optical chip 10 is manufactured from a semiconductor substrate (for example, a semiconductor wafer), the passivation film 16 may be formed of a silicon oxide film or a silicon nitride film.
[0011]
The optical part 12 may have a color filter 18. The color filter 18 is formed on the passivation film 16. Further, a flattening layer 20 may be provided on the color filter 18, and a microlens array 22 may be provided thereon.
[0012]
A plurality of electrodes 24 are formed on the optical chip 10. The electrode 24 is electrically connected to the optical part 12. The electrode 24 has a bump formed on the pad, but may be a pad alone. The electrode 24 is formed outside the optical part 12. The electrodes 24 may be arranged along a plurality of sides (for example, two or four opposing sides) or one side of the optical chip 10.
[0013]
An internal space 32 is formed in the base material 30. The internal space 32 includes a space serving as an optical path, and in the example illustrated in FIG. 1, further includes a space in which the optical chip 10 is arranged. The internal space 32 may be a through hole. The substrate 30 has a wall 34 surrounding the internal space 32. In the example shown in FIG. 1, an outer peripheral portion of the through hole (the internal space 32) is a wall portion 34. The wall 34 rises along the axial direction of the through hole (the internal space 32). The inner surface of the wall portion 34 (the surface on the side of the internal space 32) may be a curved surface. The outer surface of the wall portion 34 is preferably formed of a plurality of planes. By doing so, the integrated circuit chip 70 can be mounted on any plane. For example, the outer shape of the through hole (internal space 32) in plan view may be circular, and the outer shape of the wall portion 34 in plan view may be angular (for example, quadrilateral). The internal space 32 is not limited to a through hole extending in one direction as shown in FIG. 1, but may be a space extending in a plurality of directions (for example, an L-shaped space). In that case, a prism for optical path conversion is provided in the internal space 32.
[0014]
The substrate 30 is an exterior of the optical chip 10 and can be called a housing. The substrate 30 is preferably formed of a material that does not transmit or hardly transmits light. The substrate 30 holds the lens 44. If the substrate 30 and lens 44 are used for imaging, they can be referred to as imaging optics. The substrate 30 may be formed by, for example, injection molding a material such as a resin. In that case, the base material 30 is an injection molded body. The substrate 30 may be composed of a plurality of members that can be separated from each other as described later, or may be composed integrally of one member.
[0015]
The substrate 30 includes first and second portions 40 and 50. A lens 44 is attached to the first portion 40. That is, the first part 40 is a lens folder. More specifically, the first portion 40 has a first hole 42 and holds a lens 44 in the first hole 42. The lens 44 is formed by a holding structure (not shown) including a holding member that can be moved in the axial direction of the first hole 42 by using a screw (not shown) formed inside the first portion 40. , May be fixed in the first hole 42. The lens 44 is held at a distance from the optical part 12 of the optical chip 10.
[0016]
As shown in FIG. 1, the second part 50 has a second hole 52 and holds the first part 40 in the second hole 52. The first and second holes 42 and 52 communicate with each other to form one through hole, and form the internal space 32 as shown in FIG. That is, the internal space 32 includes the first and second holes 42 and 52. Outside the first part 40 and inside the second hole 52 of the second part 50, first and second screws 46, 58 are formed, whereby the first and second parts 42, 52 are connected. The position of the first portion 40 can be adjusted along the axial direction of the second hole 52 in the second portion 50 by the first and second screws 46 and 58. Thus, the focus of the lens 44 can be adjusted.
[0017]
In the example illustrated in FIG. 1, the second hole 52 includes a first opening 54 and a second opening 56 that is located on the lens 44 side and has a smaller opening diameter than the first opening 54. Have. A step is formed in the second hole 52 by the first and second openings 54 and 56. The optical chip 10 is provided in the first opening 54 having a large opening diameter. In that case, the optical part 12 faces the second opening 56. As shown in FIG. 1, the second portion 50 may constitute the wall portion 34.
[0018]
The light transmitting member 80 may be provided in the internal space 32. The light transmitting member 80 may be an optical filter. The light transmitting member 80 is not limited as long as it transmits light, and may transmit only light of a specific wavelength. For example, the light transmitting member 80 may be a member that transmits visible light but does not transmit light in the infrared region. The light transmitting member 80 may have a small loss for visible light and a large loss for light in the infrared region. An optical functional film is formed on the light transmitting member 80 as an optical filter. Examples of the optical functional film include an antireflection film (AR coat) and an infrared shielding film (IR coat). By forming the optical function film on the light transmitting member 80, it is not necessary to separately provide a device having an optical function, so that the size of the product can be reduced. In the example shown in FIG. 1, a light transmitting member 80 is provided in the second hole 52. Specifically, a light transmitting member 80 is provided between the optical chip 10 and the lens 44.
[0019]
In the present embodiment, the wiring pattern 60 is formed on the substrate 30. That is, a circuit component is constituted by the base material 30 and the wiring pattern 60. A circuit component can also be called an MID (Molded Interconnect Device). The wiring pattern 60 is composed of a plurality of wirings, and each wiring has a terminal serving as an electrical connection. The terminals are preferably formed on any plane of the substrate 30. The terminal may be a land. As a method for forming the wiring pattern 60, for example, a conductive film (eg, copper) is formed on the surface of the base material 30, and the conductive film is patterned by removing a part of the conductive film by laser beam, etching, or the like. Good. The terminals of the wiring pattern 60 are preferably subjected to plating (for example, nickel and gold plating). As a modification, a liquid conductive material may be discharged onto the base material 30 along a pattern. For example, a conductive material may be discharged by applying an ink-jet method. According to this, patterning of the conductive film can be performed in a small number of steps.
[0020]
As shown in FIG. 1, the wiring pattern 60 includes first and second terminals 62 and 64. The first terminal 62 is formed in the mounting region of the optical chip 10 in the base 30, and may be formed, for example, on the inner surface of the first opening 54. The second terminal 64 is formed in a mounting area of the integrated circuit chip 70, and may be formed on, for example, an outer surface of the wall 34. The first and second terminals 62 and 64 are electrically connected to each other. In the example shown in FIG. 1, the wiring pattern 60 further includes a third terminal 66. The third terminal 66 is an external terminal for electrically connecting to another electronic component. The region where the third terminal 66 is formed is not limited. For example, the third terminal 66 may be formed at the lower end of the wall 34 (the opening end of the first opening 54).
[0021]
The optical chip 10 may be provided inside the internal space 32 (for example, inside the first opening 54) as shown in FIG. As a modification, the optical chip 10 may be provided outside the internal space 32, in which case the optical part 12 is provided so as to face the internal space 32. The optical chip 10 is electrically connected to the wiring pattern 60 (specifically, the first terminal 62) via the electrode 24. The electrical connection between the two is made by using an anisotropic conductive material 26 such as an anisotropic conductive film (ACF) or an anisotropic conductive paste (ACP) to connect the conductive particles to the electrode 24 and the first terminal 62. It may be interposed between them. In that case, the optical part 12 is not covered with the anisotropic conductive material. Alternatively, the electrical connection between the two may be achieved by metal bonding using Au-Au, Au-Sn, solder, or the like.
[0022]
The integrated circuit chip (for example, a semiconductor chip) 70 is provided on the outer surface of the wall 34. In other words, the integrated circuit chip 70 is provided on the side surface of the base 30. As shown in FIG. 1, a plurality of integrated circuit chips 70 may be provided. The integrated circuit chip 70 is one in which an integrated circuit is formed on a base material (chip). The integrated circuit chip 70 may be a microprocessor. In the present embodiment, the integrated circuit chip 70 is electrically connected to the wiring pattern 60 (specifically, the second terminal 64) formed on the base 30 via the electrode 72. The integrated circuit chip 70 may be mounted face down on the wall 34. The electrical connection between the electrode 72 and the second terminal 64 can be the same as the electrical connection between the electrode 24 of the optical chip 10 and the first terminal 62 described above. An underfill material 74 may be provided between the integrated circuit chip 70 and the wall 34.
[0023]
Note that another electronic component (not shown) may be mounted on the base 30. Electronic components include active components (semiconductor chips with built-in integrated circuits, etc.), passive components (resistors, capacitors, etc.), functional components (components that change input signal characteristics such as filters), connection components (flexible boards, connectors, Switch, etc.) and conversion parts (parts for converting an input signal of a sensor or the like into a different energy system).
[0024]
According to the present embodiment, the integrated circuit chip 70 is provided on the outer surface of the wall 34 surrounding the internal space 32 in the base 30. By doing so, the optical chip 10 and the integrated circuit chip 70 can be mounted three-dimensionally on the base material 30, and the planar area of the optical module can be prevented from increasing. Therefore, miniaturization and high integration of the optical module can be achieved.
[0025]
The method of manufacturing the optical module according to the present embodiment includes positioning the optical chip 10 on the substrate 30, providing the lens 44 in the internal space 32, and forming the wall portion 34 so as to be electrically connected to the optical chip 10. Providing the integrated circuit chip 70 on the outer surface of the device. The order of each step is not limited. In the present embodiment, the optical chip 10 is mounted on the base material 30. Specifically, when the wiring pattern 60 is formed on the base material 30, the electrodes 24 of the optical chip 10 are electrically connected to the wiring pattern 60. In addition, other matters and effects can be derived from the contents described in the above-described optical module, and thus description thereof is omitted.
[0026]
The present invention is not limited to the embodiments described above, and various modifications are possible. For example, the invention includes configurations substantially the same as the configurations described in the embodiments (for example, a configuration having the same function, method, and result, or a configuration having the same object and result). Further, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. Further, the invention includes a configuration having the same operation and effect as the configuration described in the embodiment, or a configuration capable of achieving the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.
[0027]
(Second embodiment)
3 to 5 are diagrams illustrating an optical module and a method of manufacturing the optical module according to the second embodiment of the present invention. 3 is a cross-sectional view of the optical module, FIG. 4 is a plan view of the optical module, and FIG. 5 is a plan view of the wiring board in a state where the wiring board is developed in a plane. In the present embodiment, the optical module includes the optical chip 10, the base 30, the integrated circuit chip 70, and the wiring board 100. The contents described in the above embodiment can be applied to the optical chip 10 and the base 30. However, in the present embodiment, the wiring pattern need not be formed on the base material 30.
[0028]
The wiring substrate 100 has a wiring pattern 110 formed on a base substrate. In the present embodiment, the base substrate is a flexible substrate. The wiring pattern 110 may be formed on either one side or both sides of the base substrate. The wiring substrate 100 may be a single-layer or multilayer substrate. When the wiring pattern 110 is formed on both surfaces, electrical conduction between the surfaces may be achieved through through holes. In the example shown in FIG. 5, the wiring board 100 includes first to third regions 102, 104, and 106. The terminals (first to third terminals 112, 114, and 116) of the wiring pattern 110 are formed in each of the regions 102, 104, and 106. At least any two of the first to third terminals 112, 114, 116 may be electrically connected to each other.
[0029]
The optical chip 10 is mounted on the first region 102, and the optical chip 10 is electrically connected to the first terminal 112. In the example shown in FIG. 3, the surface of the optical chip 10 having the optical portion 12 and the electrode 24 faces the opposite side to the wiring board 100, and the electrode 24 is electrically connected to the first terminal 112 by the wire 120. It is connected. On the first region 102, a sealing material 122 for sealing an electrical connection portion (the electrode 24, the wire 120, and the first terminal 112) may be provided. The sealing material 122 may be formed by dropping a material (eg, resin) by potting, or may be molded by using a mold. The sealing material 122 is provided so as not to cover the optical part 12. The substrate 30 is attached to the first region 102. Both may be fixed by an adhesive material. As shown in FIG. 3, the optical chip 10 may be provided inside the first opening 54.
[0030]
As a modification, the optical chip 10 may be mounted on the surface of the first region 102 opposite to the surface of the base material 30. In that case, a light transmitting part is formed in a part of the first region 102, and the optical part 12 is arranged so as to face the light transmitting part. The light transmitting portion may be a through hole of the wiring board 100. Alternatively, the wiring substrate 100 may be a light transmitting substrate.
[0031]
The second area 104 is an area extending from the first area 102. The integrated circuit chip 70 is mounted on the second region 104, and the integrated circuit chip 70 is electrically connected to the second terminal 114. The integrated circuit chip 70 may be mounted face-down on the second region 104. The electrical connection between the electrode 72 of the integrated circuit chip 70 and the second terminal 114 is as described above.
[0032]
The wiring board 100 is bent such that the surface of the second region 104 and the outer surface of the wall 34 face each other. The integrated circuit chip 70 may be provided on a surface outside the second region 104, as shown in FIG. 3, or may be provided on a surface inside the second region 104. The second region 104 (or the integrated circuit chip 70) may be bonded and fixed to the outer surface of the wall 34.
[0033]
The wiring substrate 100 may have a plurality (for example, three) of the second regions 104. As shown in FIG. 4, for example, when the outer surface of the wall portion 34 is formed of four planes, any of the second regions 104 may be arranged on each of the three planes. At least one (one in FIG. 5) integrated circuit chip 70 is mounted in each second region 104. In the example shown in FIG. 5, each second region 104 extends from the first region 102 in a plurality of different directions. For example, the first region 102 may have a quadrilateral shape, and the second region 104 may extend from each of three sides of the first region 102. Note that the form of the wiring board 100 is not limited to this.
[0034]
In the third region 106, a third terminal 116 serving as an external terminal is formed. The third region 106 may extend from the first region 102, as shown in FIG. 5, or may extend from the second region 104. For example, the third region 106 may extend from the remaining one side of the first region 102 forming a quadrilateral.
[0035]
As shown in FIG. 4, the base material 30 may be surrounded by a ring-shaped protection member 130. In this way, the integrated circuit chip 70 and the like can be protected. The third region 106 may extend outside the protection member 130. It is preferable that the protective member 130 be a conductive member (for example, metal) because a shielding effect can be obtained.
[0036]
A slit (not shown) may be formed in a bent portion of the wiring board 100 (for example, between the first and second regions 102 and 104). This facilitates the formation and maintenance of the bent form of the wiring board 100.
[0037]
As a modification, the first to third regions 102, 104, 106 may be separated from each other. In that case, the wiring pattern 110 may be continuously formed between the regions 102, 104, and 106. Alternatively, the wiring patterns 110 of the regions 102, 104, and 106 may be electrically connected to each other, for example, via wires.
[0038]
According to the present embodiment, the optical chip 10 and the integrated circuit chip 70 are three-dimensionally mounted on the base 30 using the wiring substrate 100. Therefore, for example, a process of forming a wiring pattern on the base material 30 and a process of bonding each chip to the base material 30 can be omitted. Can be planned. The contents described in the above embodiment can be applied to other items and effects.
[0039]
In the method for manufacturing an optical module according to the present embodiment, after mounting the optical chip 10 and the integrated circuit chip 70 on each of the first and second regions 102 and 104, the base material 30 is placed on the first region 102. Attach. After that, the wiring substrate 100 is bent, and the integrated circuit chip 70 is provided on the outer surface of the wall portion 34 of the base material 30. Other items can be derived from the contents described in the first embodiment, and the effects are as already described.
[0040]
As an electronic device according to an embodiment of the present invention, a notebook personal computer 1000 shown in FIG. 6 includes a camera 1100 in which an optical module is incorporated. The digital camera 2000 shown in FIG. 7 has an optical module. Further, the mobile phone 3000 illustrated in FIGS. 8A and 8B includes a camera 3100 in which an optical module is incorporated.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating an optical module according to a first embodiment of the present invention.
FIG. 2 is a diagram illustrating an optical chip of the optical module according to the first embodiment of the present invention.
FIG. 3 is a diagram illustrating an optical module according to a second embodiment of the present invention.
FIG. 4 is a diagram illustrating an optical module according to a second embodiment of the present invention.
FIG. 5 is a diagram illustrating a wiring board of an optical module according to a second embodiment of the present invention.
FIG. 6 is a diagram showing an electronic apparatus according to the embodiment of the present invention.
FIG. 7 is a diagram showing an electronic apparatus according to the embodiment of the present invention.
FIGS. 8A and 8B are views showing an electronic device according to an embodiment of the present invention.
[Explanation of symbols]
10 optical chip, 12 optical part, 24 electrode, 30 base material
32 ... internal space, 34 ... wall, 40 ... first part,
42, a first hole, 44, a lens, 50, a second part, 52, a second hole,
54: first opening, 60: wiring pattern, 62: first terminal,
64: second terminal, 66: third terminal, 70: integrated circuit chip,
80: translucent member, 100: wiring board, 102: first region,
104: second area, 106: third area, 110: wiring pattern,
112: first terminal 114: second terminal 116: third terminal

Claims (14)

A base material having an internal space formed therein,
An optical chip having an optical portion;
At a distance from the optical portion, a lens provided in the internal space,
An integrated circuit chip electrically connected to the optical chip and provided on an outer surface of a wall of the base material surrounding the internal space;
Optical module including. The optical module according to claim 1,
An optical module having a wiring pattern formed on the substrate. The optical module according to claim 2,
The wiring pattern includes a first terminal, and a second terminal formed on the outer surface of the wall.
The optical chip is electrically connected to the first terminal,
An optical module, wherein the integrated circuit chip is electrically connected to the second terminal. The optical module according to claim 1,
A wiring board attached to the base material, further including a wiring pattern,
The wiring board includes first and second regions,
The wiring pattern includes a first terminal formed in the first region, and a second terminal formed in the second region,
The optical chip is electrically connected to the first terminal in the first region,
The integrated circuit chip is electrically connected to the second terminal in the second region;
The optical module, wherein the wiring substrate is bent between the first and second regions such that a surface of the second region and the outer surface of the wall face each other. The optical module according to claim 4,
The wiring board includes a plurality of the second regions,
An optical module in which each of the second regions extends in a different direction from the first region. The optical module according to claim 4 or claim 5,
The wiring board further includes a third region,
The optical module, wherein the wiring pattern further includes a third terminal formed in the third region. The optical module according to claim 6, wherein claim 5 is cited.
The first region has a quadrilateral shape,
An optical module in which the second region extends from three sides of the first region, and the third region extends from the remaining one side. The optical module according to any one of claims 1 to 7,
The substrate includes first and second portions,
The first portion has a first hole, and holds the lens in the first hole;
The second portion has a second hole, and holds the first portion in the second hole;
An optical module, wherein the internal space is configured such that the first and second holes communicate with each other. The optical module according to claim 8,
An optical module in which the position of the first portion is adjustable along the axial direction of the second hole in the second portion. The optical module according to claim 8 or 9,
The second hole has a step formed by a first opening and a second opening located on the lens side and having a smaller opening diameter than the first opening;
An optical module, wherein the optical chip is provided in the first opening so that the optical portion faces the second opening. The optical module according to any one of claims 8 to 10, wherein
An optical module comprising a light transmitting member provided in the second hole. An electronic device comprising the optical module according to claim 1. Aligning the optical chip having the optical portion with the substrate on which the internal space is formed,
Providing a lens in the interior space, spaced from the optical portion;
Providing an integrated circuit chip on the outer surface of a wall of the substrate surrounding the internal space, so as to be electrically connected to the optical chip;
An optical module manufacturing method including: The method for manufacturing an optical module according to claim 13,
Of the wiring board having a wiring pattern, further comprising mounting an optical chip in a first region, mounting an integrated circuit chip in a second region, and attaching the wiring substrate to the base material,
A method of manufacturing an optical module, wherein the wiring substrate is bent between the first and second regions so that the surface of the second region and the outer surface of the wall face each other.

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