JP4840114B2 - Camera module and manufacturing method thereof - Google Patents

Description

  The present invention relates to a small camera module with excellent productivity and a method for manufacturing the camera module.

  In recent years, electronic devices such as mobile phones have become more and more popular. Particularly, along with the high functionality, lightness, and miniaturization of mobile phones with built-in cameras, there has been a demand for further thinning and downsizing of the camera module that is an imaging part.

  As shown in FIG. 12, the conventional camera module includes a three-dimensional circuit board MID unit 604 in which a solid-state imaging device 603 having a light receiving portion 636 is attached to an inner concave portion and stud bump mounting, and a circuit board 613 in which electronic components 617 are surface-mounted. A camera module having a structure in which a lens barrel unit 619 having a lens barrel 625 and a lens 626 is integrated is disclosed (for example, see Patent Document 1 or Patent Document 2).

  Below, the assembly process of the MID unit 604 currently disclosed by patent document 1 is demonstrated using FIG.

  First, the circuit pattern 611a provided on the housing 611 made of a resin molded product and the bumps 602 provided on the solid-state imaging device 603 such as a CCD are bonded with a conductive adhesive 607 such as an Ag paste. Next, after the adhesive 607 is cured, a sealing agent 616 such as an ultraviolet thermosetting resin is injected between the convex portion of the housing 611 and the solid-state imaging device 603 using the dispenser nozzle 615 around the entire periphery thereof. . At this time, the sealing agent 616a flowing out in the vicinity of the light receiving portion 636 of the solid-state imaging device 603 is cured by irradiating with ultraviolet rays from the light source 632 as indicated by an arrow, and the sealing agent 616a flows into the light receiving portion 636. It is preventing. Next, the MID unit 604 is heated to about 110 ° C. in a heating furnace to cure the entire sealant 616a. Next, after the sealant is cured, an infrared filter (IR filter) 608 is attached near the light receiving unit 636 of the solid-state imaging device 603 on the lower surface of the MID unit 604.

The MID unit of the camera module is manufactured by the above process.
JP 2002-204400 A JP 2002-184963 A

  However, according to the camera module of Patent Document 1, it is necessary to fix the solid-state imaging device to the casing of the MID unit with a sealant. Therefore, it is necessary to provide a gap of, for example, about 1.5 mm between the convex portion of the housing and the solid-state imaging device, and there is a problem that the outer shape of the MID unit cannot be reduced. Further, in the assembly process of the MID unit, there are many processes such as bonding and curing of bumps, injection of ultraviolet curable resin sealing agent for fixing the solid-state image sensor and ultraviolet curing, and bonding process by thermal curing of the sealing agent. However, there is also a problem that the manufacturing cost increases due to the complexity. In addition, by repeating the complicated thermosetting process, cracks are likely to occur in the Ag paste at the joints of the bumps, leading to a decrease in connection reliability. The camera module includes a substrate on which a signal processing circuit and electronic components are surface-mounted on the MID unit. For this reason, the shape of the camera module becomes large and it is difficult to reduce the thickness.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a camera module that can be easily reduced in size and thickness, and that is excellent in productivity and connection reliability, and a manufacturing method thereof.

  In order to achieve the above object, a camera module of the present invention is formed in a lens barrel unit having a lens, a light receiving portion on a main surface and a surface electrode formed on at least one surface and formed in a groove on a side surface. A solid-state imaging device having a recessed electrode and a housing having a through-hole provided with a protruding electrode at a position facing the groove, and the solid-state imaging device is fitted into the through-hole of the housing so as to protrude from the recessed electrode. It has the structure which connected the partial electrode. Furthermore, a convex electrode may be provided on the side surface of the solid-state imaging element, a concave electrode may be provided in the through hole, and the convex electrode and the concave electrode may be connected by fitting the solid-state imaging element into the through hole of the housing. As a result, there is no need to provide gaps or bumps for applying the resin for fixing the solid-state imaging device, so the camera module can be easily reduced in size and thickness.

  Furthermore, the housing is provided with a positioning portion for positioning the solid-state imaging device in at least a part of the through hole. Thereby, adjustment of the optical image formation of a solid-state image sensor can be performed easily.

  Furthermore, a signal processing circuit element may be further fitted and connected in the thickness direction of the housing. This eliminates the need for a surface-mounting substrate, thereby further reducing the thickness. In addition, since the solid-state imaging element and the signal processing circuit element can be connected by a short wiring, the signal transmission speed can be easily increased by reducing the stray capacitance.

  Further, the signal processing circuit element has a concave electrode on the side surface and is connected to the convex electrode of the through hole. Further, the signal processing circuit element may have a convex electrode on the side surface and be connected to the concave electrode of the through hole. Moreover, the through-hole is provided in step shape in the cross section. As a result, since it is not necessary to connect the signal processing circuit elements with bumps or anisotropic conductive resin, a camera module that is further reduced in size and thickness can be obtained.

  Furthermore, the signal processing circuit element has an electrode terminal on one surface, a connection terminal is formed at the stepped step portion of the through hole, and the electrode terminal of the signal processing circuit element is connected to the connection terminal of the through hole. ing. This eliminates the need for a surface mount substrate and facilitates thinning.

  Further, the housing further includes a concave portion provided with a convex portion formed with a connection electrode to be connected to the electronic component inside, and the electronic component is fitted into the concave portion to be connected to the connection electrode. As a result, an electronic component can be built in the housing, and thus a camera module that is further reduced in size and thickness can be realized.

  The method for manufacturing a camera module according to the present invention includes a case forming step of forming a case having a through hole having a convex electrode at a position facing a groove of a solid-state imaging device in which a concave electrode is formed in a groove on a side surface. And a connecting step of fitting the solid-state imaging device into the through hole to connect the concave electrode and the convex electrode, and a lens barrel unit attaching step of attaching the lens barrel unit to the housing. Furthermore, a convex electrode is formed on the side surface of the solid-state imaging device, a concave electrode is formed in the through hole, and the convex electrode and the concave electrode are connected by fitting the solid-state imaging device into the through hole of the housing. Good. Accordingly, a camera module that is easy to connect and excellent in repairability can be produced with high productivity.

  Further, the connecting step includes a step of fitting the solid-state imaging element in a state where the housing is preheated to enlarge the size of the through hole. Further, the housing forming step includes a step of forming a through hole larger than the size of the solid-state imaging element in advance, and the connecting step includes a step of connecting the concave electrode and the convex electrode by thermally contracting the through hole. . By these, since it can connect by a simple method, without using an adhesion hardening process at a connection process, productivity improves further.

  According to the camera module and the manufacturing method thereof of the present invention, a small and thin camera module excellent in productivity and connection reliability can be realized.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a schematic cross-sectional view showing the configuration of a camera module according to the first embodiment of the present invention.

  2A is a schematic perspective view showing the configuration of the housing of the camera module according to the first embodiment of the present invention, and FIG. 2B is a schematic cross-sectional view taken along the line AA of FIG. is there. The case of FIG. 2 is shown with the case of FIG. 1 upside down. In the following embodiments, the same constituent elements will be described with the same reference numerals.

  As shown in FIG. 1, the camera module 1 includes at least a lens barrel unit 10 having a lens 101 for optical imaging and a resin housing 13. The housing 13 has a through-hole 16 provided with a convex electrode 162 formed at a position facing the groove on the side surface of the solid-state image sensor 15. Further, the housing 13 includes a light receiving portion 151 that receives optical imaging on the main surface in the through hole 16, and a recessed electrode 152 that is connected to a surface electrode formed on at least one surface and formed in a groove on the side surface. For example, a solid-state imaging device 15 such as a CCD is fitted. In the present embodiment, an electronic component 185 such as a signal processing circuit element 180 or a chip capacitor is mounted on the opposite side of the housing 13 from the lens barrel unit 10 via a circuit pattern 133, such as a resin. The circuit board 18 is made of.

  The camera module 1 having the above configuration is attached to a flexible substrate, a rigid substrate 19 or the like via a ceramic inter-plate connection terminal 191, for example.

  Hereinafter, the configuration of the housing 13 of the camera module 1 will be described in detail with reference to FIG. As shown in FIG. 2, a solid-state imaging device 15 having a light receiving portion 151 that receives optical imaging on the main surface and a recessed electrode 152 formed on a side groove portion 152 a is fitted in the through hole 16 in the housing 13. Yes. The solid-state imaging device 15 has a surface electrode 153 formed on the light receiving portion 151 surface side connected to the recessed electrode 152 provided in the groove portion 152a. Note that the surface electrode 153 of the solid-state imaging device 15 is formed of, for example, an Al electrode, and the recessed electrode 152 is formed of, for example, a Cu electrode. Furthermore, in order to improve the reliability of each electrode such as contact resistance and environmental resistance, the surface thereof is plated with gold.

  In the through hole 16 of the housing 13, a convex electrode 162 made of, for example, a gold-plated Cu electrode is formed on a convex portion 162 a provided at a position facing the groove portion 152 a of the solid-state imaging device 15. Has been. Further, the convex electrode 162 is connected to a circuit pattern 133 formed on the surface of the frame of the housing 13 and made of, for example, a Cu electrode plated with gold.

  Then, the solid-state imaging device 15 is fitted into the through hole 16 of the housing 13, and the concave electrode 152 and the convex electrode 162 are fitted and connected to each other, and connected to, for example, an external circuit via the circuit pattern 133. The

  Further, in the present embodiment, for example, a glass IR filter 17 fitted in the housing 13 is provided above the light receiving portion 151 of the solid-state imaging device 15 in order to improve image quality and protect the element. .

  In the present embodiment, for example, a positioning portion 161a having a stepped shape or a protruding shape is provided to position the solid-state imaging device 15 at a predetermined position of at least a part of the through hole 16 of the housing 13, and the optical This makes it easy to adjust the image.

  Further, the position in the depth direction of the housing into which the solid-state imaging element 15 is fitted is not particularly limited, but it is preferable to fit in the vicinity of the center of the thickness of the housing. Thereby, it is possible to prevent warpage or deformation due to expansion / contraction of the solid-state imaging device or the housing.

  Here, as the solid-state imaging device 15, a CCD, a CMOS sensor, or the like can be used.

  The cross-sectional shape of the groove 152a of the solid-state imaging device 15 and the convex portion 162a of the through-hole 16 is not particularly limited as long as the cross-sectional shape is a semicircular shape, a wedge shape, or the like. For example, the curvature of the groove 152a of the solid-state imaging device 15 may be provided in a semicircular shape slightly larger than the curvature of the convex portion 162a provided in the through hole 16 at a position facing it. Thereby, the groove part 152a and the convex part 162a are fitted relative to each other, the solid-state imaging device 15 is mechanically held in the through hole 16 of the housing 13, and a stable connection is possible.

  Further, in the present embodiment, an example in which the protective resin 14 is provided with, for example, a thermosetting resin or an ultraviolet curable resin that covers a connection fitting portion between the through-hole 16 of the housing 13 and the solid-state imaging device 15 or the like. Although shown, it is not particularly necessary.

  In the present embodiment, the example in which the concave electrode is provided in the groove on the side surface of the solid-state imaging device and connected to the convex electrode of the housing has been described, but the present invention is not limited thereto. For example, the convex electrode may be provided on the side surface of the solid-state imaging device, the concave electrode may be provided in the through hole of the housing, and the convex electrode and the concave electrode may be connected. Furthermore, it is good also as a structure which provides a recessed part electrode and a convex part electrode in the side surface of a solid-state image sensor, provides a convex part electrode and a concave part electrode in the through-hole of a housing | casing, and connects a corresponding convex part electrode and a concave part electrode.

  According to the embodiment of the present invention, the solid-state imaging device 15 is fitted into the through-hole 16 of the housing 13 and mechanically incorporated, and the concave electrode 152 of the solid-state imaging device 15 and the convex electrode of the through-hole 16 are included. 162 is electrically connected integrally. As a result, there is no need for a gap for bonding and fixing the solid-state imaging device 15 and the housing 13, and the camera module 1 that is small and thin can be realized.

  In addition, if the solid-state image sensor fitted in the through-hole is determined to be defective, the defective solid-state image sensor can be removed from the through-hole and replaced with a non-defective product, resulting in a camera module with excellent repairability and low production cost. It is done.

  Hereinafter, a method of manufacturing the camera module housing according to the first embodiment of the present invention will be described in detail with reference to FIGS.

  FIG. 3 is a schematic cross-sectional view illustrating a process of the method for manufacturing the camera module housing according to the first embodiment of the present invention, and FIG. 4 is a schematic perspective view corresponding to each process of FIG. .

  First, as shown in FIGS. 3A and 4A, a housing 13 made of a resin material such as PPA (polyphthalamide), LCP (liquid crystal polymer), PEEK (polyetheretherketone), or epoxy, for example. In addition, a through-hole 16 having a convex portion 162a having a semicircular cross section, for example, is formed at a position facing a groove provided in the solid-state imaging device. At this time, a step-shaped positioning portion 161 a for positioning the solid-state imaging device 15 is formed in the through hole 16 of the housing 13. Here, the housing | casing 13 which has the through-hole 16 provided with the convex part 162a is shape | molded collectively, for example by extrusion molding and injection molding.

  Next, the convex electrode 162 is formed on the surface of the convex portion 162a of the through hole 16 of the housing 13 by, for example, copper (Cu) plating, and the surface is plated with gold as necessary. Similarly, a circuit pattern 133 to be connected to the circuit board 18 in FIG. 1 is formed on at least one surface of the housing 13 to be connected to the convex electrode 162 by, for example, copper (Cu) plating or the like. The surface is gold-plated.

  Next, as shown in FIGS. 3B and 4B, a solid-state imaging device 15 is prepared. At this time, the solid-state imaging device 15 has a light receiving portion 151 and a recessed electrode 152 formed in a side groove portion 152a connected to a surface electrode 153 formed in the periphery thereof. And the surface electrode 153 and the recessed part electrode 152 are connected, the connection part is plated, for example with aluminum (Al) or copper (Cu), and the surface is further gold-plated as needed.

  Here, the convex electrode of the casing, the circuit pattern, the concave electrode of the solid-state imaging device, the surface electrode, and the like are formed using a photolithography method, an etching method, or the like.

  Next, as shown in FIGS. 3C and 4C, the housing 13 is heated in advance so that the size of the through hole 16 of the housing 13 is larger than that of the solid-state imaging device 15. In this state, the solid-state imaging device 15 is assembled and fitted up to the positioning portion 161 a of the through hole 16 of the housing 13.

  Next, as shown in FIG. 3D and FIG. 4D, the housing 13 in which the solid-state image sensor 15 is fitted is cooled, and the solid-state image sensor 15 is mechanically held in the through hole 16. . At the same time, the concave electrode 152 of the solid-state imaging device 15 and the convex electrode 162 of the through-hole 16 are brought into contact with each other so as to be integrally connected electrically and mechanically. At this time, since the gold plating which is soft and does not corrode is formed on the surface of each electrode, the contact resistance is low and the connection reliability is increased.

  Next, as shown in FIGS. 3E and 4E, for example, a thermosetting resin or the like is protected so as to cover at least the fitting portion between the through hole 16 of the housing 13 and the solid-state imaging device 15. Resin 14 is applied and cured. Note that the protective resin is not shown in the perspective view of FIG. Then, a glass IR filter 17 is fitted into the housing 13 above the light receiving portion 151 of the solid-state imaging device 15 and its periphery is fixed with an adhesive (not shown). The housing 13 of the camera module 1 is formed by the above process.

  Next, the lens barrel unit 10 shown in FIG. 1 is attached to the housing 13, and an electronic component 185 such as a signal processing circuit element 180 or a chip capacitor is provided on the opposite side via a circuit pattern 133 formed on the housing. The mounted circuit board 18 is attached and solder-mounted, for example. Thereby, the camera module 1 as shown in FIG. 1 can be produced.

  Here, an electrically insulating material that has a thermal expansion coefficient larger than that of the semiconductor element and the electronic component and is easy to process is used as the housing 13. For example, in addition to thermoplastic resins such as PPA (polyphthalamide), LCP (liquid crystal polymer), and PEEK (polyether ether ketone), polyacetal, polyamide, modified polyphenylene oxide, polybutylene terephthalate (poly (oxytetramethyleneoxytere)) Engineering plastics such as phthaloyl)) and thermosetting resins such as epoxy resins can be used.

  According to the embodiment of the present invention, a plurality of conventional adhesive curing steps can be significantly reduced by a simple method of collectively holding and electrically connecting a solid-state imaging device. As a result, workability and yield are improved, and a camera module can be manufactured with high productivity. In addition, the simple method of the connecting step can easily cope with automation and can further improve productivity.

(Second Embodiment)
FIG. 5 is a schematic cross-sectional view showing a configuration of a camera module according to the second embodiment of the present invention. FIG. 6A is a schematic perspective view showing the configuration of the housing of the camera module according to the second embodiment of the present invention, and FIG. 6B is a schematic cross-sectional view taken along line AA of FIG. It is. The case of FIG. 6 is shown with the case of FIG. 5 upside down.

  The second embodiment is different from the first embodiment in that signal processing circuit elements are further incorporated and connected in the thickness direction of the housing. In this embodiment, the signal processing circuit element has a concave electrode on the side surface and is connected to the convex electrode of the through hole.

  That is, as shown in FIGS. 5 and 6, the camera module 2 according to the second embodiment of the present invention is made of, for example, PPA (polyphthalamide), LCP (liquid crystal polymer), PEEK (polyetheretherketone), or the like. A signal processing circuit element 280 such as a DSP, which is a functional circuit element, is fitted and connected to the through hole 26 of the casing 23 together with the solid-state imaging element 15. A lens barrel unit 20 having a lens 101 for optical image formation is attached to the housing 23.

  In the present embodiment, the case 23 is described with an example in which a concave portion 27 in which a convex connection electrode 272 is formed is provided in the housing 23 and an electronic component 285 such as a chip capacitor is built in the concave portion 27. Not limited to this. Thereby, it is possible to further reduce the thickness, but it goes without saying that it may be mounted on another substrate as in the first embodiment.

  Further, the camera module 2 having the above-described configuration includes the lens barrel unit 20, the solid-state imaging device 15, the signal processing circuit element 280, and the housing 23 having the electronic component 285, and the circuit pattern 233 formed on the housing 23 is interposed therebetween. And attached to the substrate 29.

  Hereinafter, the configuration of the housing 23 of the camera module 2 will be described in detail with reference to FIG.

  As shown in FIG. 6, the through-hole 26 of the housing 23 includes a convex electrode 262, through which at least the solid-state imaging device 15 and the signal processing circuit element 280 are fitted. The solid-state imaging device 15 is connected to the convex electrode 262 of the through hole 26 of the housing 23 by a concave electrode 152 formed in a groove on the side surface thereof. Further, the signal processing circuit element 280 has a surface electrode 281 connected to the recessed electrode 282 provided in the groove 282a. Like the solid-state imaging device 15, the signal processing circuit element 280 is a convex of the recessed electrode 282 and the through hole 26 of the housing 23. The partial electrode 262 is fitted and incorporated. The surface electrode 281 of the signal processing circuit element 280 is formed of, for example, an Al electrode, and the recessed electrode 282 is formed of, for example, a Cu electrode. Furthermore, in order to improve the reliability of each electrode such as contact resistance and environmental resistance, the surface thereof is plated with gold.

  Further, the housing 23 is further provided with a concave portion 27 provided with a connection electrode 272 formed on the convex portion 272a on the inside, and an electronic component 285 such as a chip capacitor or a chip resistor is fitted in the concave portion 27. It is connected. Thereby, a thinner camera module can be realized by the height of the electronic component.

  According to the present embodiment, the same effect as that of the first embodiment can be obtained, a functional circuit element such as a signal processing circuit element is built in the housing without the need for a surface mount substrate, and the like. A thin camera module can be realized.

  In addition, when a solid-state image sensor or signal processing circuit element fitted in a through hole is determined to be defective, the defective element can be removed from the through hole and replaced with a non-defective product. A module is obtained.

  Further, by incorporating the signal processing circuit element or the like in the housing, the wiring distance between the solid-state imaging element and the signal processing circuit element can be shortened. As a result, the stray capacitance caused by the wiring can be reduced, the signal transmission processing speed can be increased, and a high-performance camera module can be realized.

  In the present embodiment, the example in which the concave electrode is provided in the groove on the side surface of the solid-state imaging device or the signal processing circuit element and is connected to the convex electrode of the housing is described, but the present invention is not limited thereto. For example, a convex electrode may be provided on the side surface of the solid-state imaging device or the signal processing circuit element, and a concave electrode may be provided in the through-hole of the housing to connect the convex electrode and the concave electrode. Further, a concave electrode and a convex electrode are provided on the side surface of the solid-state imaging device or signal processing circuit element, and the convex electrode and the concave electrode are provided in the through hole of the housing, and the corresponding convex electrode and the concave electrode are connected. It is good.

  Below, the manufacturing method of the housing | casing of the camera module which concerns on the 2nd Embodiment of this invention is demonstrated in detail using FIG. Note that the camera module housing according to the second embodiment can be similarly manufactured by the manufacturing method of the first embodiment, but another manufacturing method will be described below as an example. It goes without saying that the manufacturing method described below can also be applied to the first embodiment.

  FIG. 7 is a schematic cross-sectional view illustrating a process of a method for manufacturing a camera module housing according to the second embodiment of the present invention.

  In the manufacturing method shown in FIG. 7, a housing having a through hole or a recess larger than the size of a solid-state imaging device, a signal processing circuit element or an electronic component is formed in advance, and then the through hole or the recess is thermally contracted to be connected. This is different from the manufacturing method of FIG.

  First, as shown in FIG. 7 (a), a through hole provided with a semicircular convex portion 262a at a position facing each groove portion of the solid-state imaging device and the signal processing circuit element in which the concave electrode is formed in the side groove portion. 26 is formed with a dimension L1 larger than the dimension L2 of the solid-state imaging device and the signal processing circuit, and the housing 23 is formed. Similarly, a concave portion 27 having a convex portion 272a at a position facing the terminal electrode 286 of the electronic component, in which the electronic component 285 such as a chip capacitor is incorporated, is formed in the housing 23 with a size larger than the size of the electronic component 285. At this time, a step-shaped positioning portion 261 a for positioning the solid-state imaging element 15 is formed in the through hole 26 of the housing 23.

  Specifically, as the material of the housing 23, for example, a two-stage curable resin such as an epoxy resin or a polyolefin resin as shown in the relationship between the housing molding temperature and the through-hole diameter in FIG. 8 is used. Then, the resin is molded at a first temperature (for example, about 115 ° C.), and after cooling, a casing 23 having a through hole 26 having a large dimension L1 and a concave part 27 having a large dimension is formed. In addition, as a method of shaping | molding, you may carry out batch processing shaping | molding, for example by extrusion molding, injection molding, etc.

  Thereafter, convex electrodes 262 and connection electrodes 272 are respectively formed on the surfaces of the convex portions 262a and 272a of the molded housing 23 by, for example, copper (Cu) electrodes, and the surfaces thereof are subjected to gold plating.

  Next, as shown in FIG. 7B, a solid-state imaging device 15, a signal processing circuit element 280, and an electronic component 285 are prepared. At this time, the signal processing circuit element 280 includes, for example, a copper (Cu) electrode on the surface of the groove 282a on the side surface, and has a concave electrode 282 plated with gold as necessary. Further, the electronic component 285 has terminal electrodes 286 formed with silver (Ag) electrodes, for example, at both ends thereof.

  Next, as shown in FIG. 7C, the solid-state imaging device 15 is embedded in a through-hole 26 formed large with the dimension L1 of the housing 23, and is positioned and incorporated by a positioning portion 261a. Further, the signal processing circuit element 280 is embedded in the through hole 26 and incorporated. Then, the electronic component 285 is embedded in the recess 27.

  Next, as shown in FIG. 7D, the housing 23 is thermally contracted, the size of the through hole 26 is contracted to L2, the size of the concave portion 27 is reduced, and the solid-state imaging device is placed in the through hole 26. 15 and the signal processing circuit element 280 are mechanically held by fitting the electronic component 285 in the recess 27. At this time, the concave electrodes 152 and 282 of the groove portions 152a and 282a of the solid-state imaging device 15 and the signal processing circuit element 280 are electrically and mechanically connected to the convex electrode 262 of the convex portion 262a of the through hole 26 by contact. Further, the terminal electrode 286 of the electronic component 285 and the connection electrode 272 of the recess 27 are connected in the same manner.

  Specifically, by heating the housing 23 at a second temperature (for example, about 150 ° C.) higher than the first temperature, the size of the through hole is thermally contracted from L1 to L2, and the recess 27 The dimensions are heat shrunk and then cooled. Thereby, the solid-state imaging device 15, the signal processing circuit element 280, and the electronic component 285 are fitted in the housing 23, and the electrodes are connected to each other.

  Next, as shown in FIG. 7 (e), a protective resin is applied so as to cover at least the fitting portion between the through hole 26 and the recess 27 of the housing 23 and the solid-state imaging device 15, the signal processing circuit element 280, and the electronic component 285. (Not shown) is applied and cured. Then, the IR filter 17 is fitted into the housing 23 above the light receiving portion 151 of the solid-state imaging device 15 and its periphery is fixed with an adhesive (not shown). By the above process, the housing 23 of the camera module 2 is formed.

  Next, the camera module 2 as shown in FIG. 5 can be manufactured by attaching the lens barrel unit 20 to the housing 23.

  Here, as a case material used in the present embodiment, for example, PPA (polyphthalamide), LCP (liquid crystal polymer), PEEK (polyether ether ketone), a polyolefin resin, or a fluorine resin is used. Can do.

  According to the embodiment of the present invention, a simple method of collectively holding and electrically connecting a solid-state imaging element, a signal processing circuit element, and an electronic component can greatly increase a plurality of conventional adhesive curing processes. Can be reduced. As a result, workability and yield are improved, and a camera module can be manufactured with high productivity. In addition, the simple method of the connecting step can easily cope with automation and can further improve productivity.

(Third embodiment)
FIG. 9 is a schematic cross-sectional view showing a configuration of a camera module according to the third embodiment of the present invention. FIG. 10A is a schematic perspective view showing the configuration of the housing of the camera module according to the third embodiment of the present invention, and FIG. 10B is a schematic cross-sectional view taken along the line AA of FIG. It is. The casing of FIG. 10 is shown with the casing of FIG. 9 upside down.

  The third embodiment is different from the second embodiment in that the through hole of the housing has a stepped shape of at least two steps in its cross section.

  That is, as shown in FIG. 9, in the camera module 3 according to the present embodiment, a stepped through hole is formed in the housing 33, and the solid-state imaging device 15 and the signal processing circuit element 380 are fitted in the respective step portions. And have a connected configuration. A lens barrel unit 20 having a lens 101 for optical image formation is attached to the housing 33.

  In the present embodiment, as in the second embodiment, the electronic component 285 is built in the recess of the housing 33.

  Further, the camera module 3 includes a lens barrel unit 20, a solid-state imaging device 15, a signal processing circuit element 380, and a housing 33 having an electronic component 285, and via a circuit pattern 333 formed in the housing 33, It is attached to the substrate 39.

  Hereinafter, the configuration of the housing 33 of the camera module 3 will be described in detail with reference to FIG. As shown in FIG. 10, the through-hole 36 of the housing 33 has a projecting electrode 362 and is provided with a stepped portion having two steps in at least a cross section. In addition, a signal processing circuit element 380 having a different size is fitted. The solid-state imaging device 15 is connected to the convex electrode 362 of the through hole 36 of the housing 33 by a concave electrode 152 formed in a groove on the side surface thereof. Furthermore, the signal processing circuit element 380 having a different external shape has a surface electrode 381 connected to the recessed electrode 382 provided in the groove 382a. Similar to the solid-state imaging device 15, the recessed electrode 382 and the through-hole of the housing 33 are provided. 36 convex electrodes 362 are fitted and incorporated. At this time, the groove portion 382a provided on the side surface of the solid-state imaging device 15 and the signal processing circuit element 380 having a size different from that of the solid-state imaging device 15 are formed so as to be fitted in common to the convex portion 362a provided in the through hole 36. .

  According to the embodiment of the present invention, the same effects as those of the second embodiment can be obtained, and a small and thin camera module can be realized even when the sizes of the solid-state imaging device and the signal processing circuit device are different. .

  In addition, although the example which embeds an electronic component in a housing | casing was demonstrated above, it is not restricted to this. For example, the electronic component may be taken out of the housing and mounted on an external substrate. Thereby, at least the width | variety of a housing | casing can be made small and it can reduce in size.

  In the present embodiment, the example in which the concave electrode is provided in the groove on the side surface of the solid-state imaging device or the signal processing circuit element and is connected to the convex electrode of the housing is described, but the present invention is not limited thereto. For example, a convex electrode may be provided on the side surface of the solid-state imaging device or the signal processing circuit element, and a concave electrode may be provided in the through-hole of the housing to connect the convex electrode and the concave electrode. Further, a concave electrode and a convex electrode are provided on the side surface of the solid-state imaging device or signal processing circuit element, and the convex electrode and the concave electrode are provided in the through hole of the housing, and the corresponding convex electrode and the concave electrode are connected. It is good. Thereby, the same effect is acquired.

(Fourth embodiment)
FIG. 11 is a schematic cross-sectional view illustrating a configuration of a housing of a camera module according to the fourth embodiment.

  In the fourth embodiment, the through hole of the housing has a stepped shape of at least two steps in the cross section, and the connection formed in the step portion of the electrode terminal and the through hole formed on the surface of the signal processing circuit element This is different from the third embodiment in that it is connected to a terminal.

  That is, as shown in FIG. 11, the through-hole 46 is formed in at least two steps in the cross section, and the connection terminal 463 of the stepped portion 43 a of the through-hole 46 and the electrode terminal 482 of the signal processing circuit element 480 are For example, it has the structure connected by stud bump mounting. Then, the concave electrode 152 provided on the side surface of the solid-state imaging device 15 and the convex electrode 462 of the through hole 46 are connected together at the lower stage of the through hole 46. Further, a signal processing circuit element 480 having an electrode terminal 482 such as a bump provided on the element surface is disposed on the stepped portion 43a in the upper stage of the through hole 46, and the connection terminal 463 and the electrode terminal 482 are mounted by stud bump. At this time, although not shown, a protective resin (not shown) is applied and bonded and fixed at least to a connection portion between the connection terminal and the electrode terminal and a connection portion of the solid-state imaging device for protection.

  Further, as in FIG. 2, a circuit board on which a lens barrel unit and electronic components are surface-mounted is attached to a casing 43 to which an IR filter 17 is attached, thereby constituting a camera module.

  According to the fourth embodiment of the present invention, since the signal processing circuit element is connected to and attached to the step portion of the through hole by a method such as stud bump mounting, a surface mounting substrate is not used, so that the size and thickness are reduced. Can be made inexpensive.

  In the present embodiment, the example in which the electrode terminal is provided on the signal processing circuit element and the stud bump is mounted and connected is described, but the present invention is not limited to this. For example, the electrode terminal and the connection terminal of the signal processing circuit element may be connected by an ACF / ACP method using an anisotropic conductive film, and the NCF that connects the electrode terminal after first applying the resin and cures the resin. -You may connect by methods, such as NCP method and metal joining. Thus, a thin camera module can be realized by embedding the solid-state imaging device in the through-hole and further incorporating the signal processing circuit element in the through-hole provided in two steps.

  Moreover, you may embed an electronic component further in a housing | casing. Thereby, the camera module which has an electronic component can be further reduced in thickness.

  In the present embodiment, the example in which the concave electrode is provided in the groove on the side surface of the solid-state imaging device and is connected to the convex electrode of the housing is described, but the present invention is not limited to this. For example, the convex electrode may be provided on the side surface of the solid-state imaging device, the concave electrode may be provided in the through hole of the housing, and the convex electrode and the concave electrode may be connected. Furthermore, it is good also as a structure which provides a recessed part electrode and a convex part electrode in the side surface of a solid-state image sensor, provides a convex part electrode and a concave part electrode in the through-hole of a housing | casing, and connects a corresponding convex part electrode and a concave part electrode.

  The camera module according to the present invention has a great effect that it is easy to reduce the size and thickness, and is excellent in productivity and connection reliability, and is useful in the field of use such as a portable digital device such as a mobile phone or a micro camera. .

1 is a schematic cross-sectional view showing a configuration of a camera module according to a first embodiment of the present invention. (A) Schematic perspective view showing the configuration of the housing of the camera module according to the first embodiment of the present invention (b) Schematic cross-sectional view taken along line AA of FIG. Sectional schematic explaining the process of the manufacturing method of the housing | casing of the camera module which concerns on the 1st Embodiment of this invention Schematic perspective view for explaining the steps of the manufacturing method of the camera module housing according to the first embodiment of the present invention. Sectional schematic which shows the structure of the camera module which concerns on the 2nd Embodiment of this invention. (A) Schematic perspective view showing the configuration of the housing of the camera module according to the second embodiment of the present invention (b) Schematic cross-sectional view taken along line AA of FIG. Sectional schematic diagram explaining the process of the manufacturing method of the housing | casing of the camera module which concerns on the 2nd Embodiment of this invention. The graph which shows the relationship between the housing molding temperature and the through-hole diameter of the manufacturing method of the housing | casing of the camera module which concerns on the 2nd Embodiment of this invention. Sectional schematic which shows the structure of the camera module which concerns on the 3rd Embodiment of this invention. (A) Schematic perspective view showing the configuration of the housing of the camera module according to the third embodiment of the present invention (b) Schematic cross-sectional view taken along the line AA of FIG. Sectional schematic which shows the structure of the housing | casing of the camera module which concerns on the 4th Embodiment of this invention. Sectional drawing which shows the structure of the conventional camera module The figure explaining the assembly process of the MID unit of the conventional camera module

Explanation of symbols

1, 2, 3 Camera module 10, 20 Lens barrel unit 13, 23, 33, 43 Case 14 Protective resin 15 Solid-state imaging device 16, 26, 36, 46 Through hole 17 IR filter 18 Circuit board 19, 29, 39 Substrate 27 Concave part 43a Step part 101 Lens 133, 233, 333 Circuit pattern 151 Light receiving part 152, 282, 382 Concave electrode 152a, 282a, 382a Groove part 153, 281, 381 Surface electrode 161a, 261a Positioning part 162, 262, 362, 462 Convex part electrode 162a, 262a, 272a, 362a Convex part 180, 280, 380, 480 Signal processing circuit element 185, 285 Electronic component 191 Inter-plate connection terminal 272 Connection electrode 286 Terminal electrode 463 Connection terminal 482 Electrode terminal

Claims (10)

A lens barrel unit having a lens;
A solid-state imaging device having a light receiving portion on a main surface and a recessed electrode formed in a groove on a side surface connected to a surface electrode formed on at least one surface;
A housing having a through-hole provided with a convex electrode at a position facing the groove, and a concave portion provided with a convex portion formed with a connection electrode connected to an electronic component inside ;
The solid-state imaging element is fitted into the through-hole of the housing to connect the concave electrode and the convex electrode,
A camera module , wherein the electronic component is fitted in the recess and connected to the connection electrode . A convex electrode is provided on a side surface of the solid-state imaging device, a concave electrode is provided in the through-hole, and the solid-state imaging device is fitted into the through-hole of the housing to connect the convex electrode and the concave electrode. The camera module according to claim 1. The camera module according to claim 1, wherein the housing includes a positioning unit that positions the solid-state imaging device in at least a part of the through hole. The camera module according to any one of claims 1 to 3, wherein a signal processing circuit element is further fitted and connected in a thickness direction of the casing. The camera module according to claim 4, wherein the signal processing circuit element has a concave electrode on a side surface and is connected to the convex electrode of the through hole. The camera module according to claim 4, wherein the signal processing circuit element has a convex electrode on a side surface and is connected to the concave electrode of the through hole. A housing forming step of forming a housing having a through-hole having a convex electrode at a position facing the groove of a solid-state imaging device in which a concave electrode is formed in a groove on a side surface;
A connection step of connecting the concave electrode and the convex electrode by fitting the solid-state imaging device into the through hole in a state where the casing is preheated and the size of the through hole is enlarged .
A lens barrel unit mounting step for attaching the lens barrel unit to the housing;
A method for manufacturing a camera module. A convex electrode is formed on a side surface of the solid-state imaging device, a concave electrode is formed in the through-hole, and the solid-state imaging device is fitted into the through-hole of the casing, and the convex electrode and the concave electrode The method of manufacturing a camera module according to claim 7 , wherein: Case formation in which a convex electrode is provided at a position facing the groove of a solid-state imaging device in which a concave electrode is formed in a groove on a side surface, and a casing having the through-hole larger than the size of the solid-state imaging device is formed in advance. Process,
A connecting step of fitting the solid-state imaging device into the through-hole and thermally contracting the through-hole to connect the concave electrode and the convex electrode;
A lens barrel unit mounting step for attaching the lens barrel unit to the housing;
A method for manufacturing a camera module. A convex electrode is formed on a side surface of the solid-state imaging device, a concave electrode is formed in the through-hole, and the solid-state imaging device is fitted into the through-hole of the casing, and the convex electrode and the concave electrode The method for manufacturing a camera module according to claim 9 , wherein:

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