JPS58116245U - Mounting structure of semiconductor image sensor - Google Patents
Mounting structure of semiconductor image sensorInfo
- Publication number
- JPS58116245U JPS58116245U JP1982013671U JP1367182U JPS58116245U JP S58116245 U JPS58116245 U JP S58116245U JP 1982013671 U JP1982013671 U JP 1982013671U JP 1367182 U JP1367182 U JP 1367182U JP S58116245 U JPS58116245 U JP S58116245U
- Authority
- JP
- Japan
- Prior art keywords
- image sensor
- semiconductor image
- mounting structure
- heat
- end surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はこの考案の一実施例を示す撮像装置の ゛一
部破断側面断面図、第２図はこの考案の要部を拡大して
示す概略ｉ図、第３図はこの考案に係 ゛る放熱構造
の他の実施例を示す概略斜視図である。 。
２・・・・・・撮像装置本体、７・・・・・・放熱板、
８・・・・・・半 、１ 導体撮像素子、１１・・・・
・・支持部、１５・・・・・・熱伝導 ・板、１
６・・・・・・平面放熱部、１７・・・・・・熱伝導性
柔軟部材。Fig. 1 is a partially cutaway side sectional view of an imaging device showing an embodiment of this invention, Fig. 2 is a schematic diagram showing an enlarged view of the main parts of this invention, and Fig. 3 is a diagram related to this invention. FIG. 3 is a schematic perspective view showing another example of the heat dissipation structure. . 2... Imaging device main body, 7... Heat sink,
8...half, 1 conductor image sensor, 11...
...Support part, 15... Heat conduction - Plate, 1
6... Planar heat dissipation part, 17... Heat conductive flexible member.
Claims (2)
に取付けられるとともに、端面に半導体撮像素子が密着
保持され、かつ外周に平面放熱部が形成された放熱板と
、弾性部材からなり、一端面が装置本体に固定され、他
端面が上記放熱板の平面放熱部に弾性的に密着させられ
た熱伝導板とを備えてなる半導体撮像素子の実装構造。(1) Consisting of a heat dissipation plate that is mounted in a position adjustable manner on a support section provided on the device main body, has a semiconductor image sensor closely held on its end face, and has a planar heat dissipation section formed on its outer periphery, and an elastic member; 1. A mounting structure for a semiconductor image sensor, comprising a heat conductive plate having one end surface fixed to a device main body and the other end surface being elastically brought into close contact with a flat heat dissipating portion of the heat dissipating plate.
導性柔軟部材を介在させたことを特徴とする実用新案登
録請求の範囲第１項記載の半導体撮像素子の実装構造。(2) A mounting structure for a semiconductor image sensor according to claim 1, wherein a heat conductive flexible member is interposed between the other end surface of the heat conductive plate and the planar heat radiating portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982013671U JPS58116245U (en) | 1982-02-03 | 1982-02-03 | Mounting structure of semiconductor image sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982013671U JPS58116245U (en) | 1982-02-03 | 1982-02-03 | Mounting structure of semiconductor image sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58116245U true JPS58116245U (en) | 1983-08-08 |
Family
ID=30026172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982013671U Pending JPS58116245U (en) | 1982-02-03 | 1982-02-03 | Mounting structure of semiconductor image sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58116245U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013005361A1 (en) * | 2011-07-01 | 2013-01-10 | パナソニック株式会社 | Image capture device |
| JP2019050418A (en) * | 2018-11-29 | 2019-03-28 | 株式会社ニコン | Imaging apparatus |
-
1982
- 1982-02-03 JP JP1982013671U patent/JPS58116245U/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013005361A1 (en) * | 2011-07-01 | 2013-01-10 | パナソニック株式会社 | Image capture device |
| JP5221821B1 (en) * | 2011-07-01 | 2013-06-26 | パナソニック株式会社 | Imaging device |
| US8736754B2 (en) | 2011-07-01 | 2014-05-27 | Panasonic Corporation | Imaging device |
| JP2019050418A (en) * | 2018-11-29 | 2019-03-28 | 株式会社ニコン | Imaging apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS58116245U (en) | Mounting structure of semiconductor image sensor | |
| JPS58118756U (en) | Mounting structure of semiconductor image sensor | |
| JPS58175641U (en) | Semiconductor component mounting equipment | |
| JPS5967943U (en) | Cooling structure for semiconductor devices | |
| JPS6146744U (en) | Heat dissipation mechanism for integrated circuit devices | |
| JPS5929048U (en) | Heatsink mounting structure for semiconductor components | |
| JPS6146745U (en) | Centralized heat dissipation mechanism for integrated circuit devices | |
| JPS5950361U (en) | Planar heating element for vehicle heat insulation sheet | |
| JPS6037248U (en) | hybrid integrated circuit | |
| JPS58177949U (en) | Heat dissipation fin mounting structure for semiconductor devices | |
| JPS59119039U (en) | Heat dissipation structure for semiconductor devices | |
| JPS6088557U (en) | Heat dissipation device for semiconductor devices | |
| JPS59149639U (en) | Transistor holding device | |
| JPS6048247U (en) | Transistor holding device | |
| JPS6052632U (en) | Power semiconductor devices | |
| JPS58109259U (en) | heat dissipation device | |
| JPS6081657U (en) | Heat sink for semiconductor devices | |
| JPS58164239U (en) | semiconductor equipment | |
| JPH0371696U (en) | ||
| JPS60116248U (en) | Heat sink for semiconductor devices | |
| JPH02129793U (en) | ||
| JPS5961544U (en) | Mounting structure of heat sink on heat generating parts | |
| JPS5989577U (en) | Circuit board warpage prevention device | |
| JPS60129151U (en) | semiconductor equipment | |
| JPS596846U (en) | Heater structure of semiconductor stack |