JPS58109259U - heat dissipation device - Google Patents
heat dissipation deviceInfo
- Publication number
- JPS58109259U JPS58109259U JP581382U JP581382U JPS58109259U JP S58109259 U JPS58109259 U JP S58109259U JP 581382 U JP581382 U JP 581382U JP 581382 U JP581382 U JP 581382U JP S58109259 U JPS58109259 U JP S58109259U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation device
- heat
- dissipation plate
- abstract
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図と従来のトランジスタ７とヒートシンク２との連
結保持状態を説明するｈめの分解図、第２図、第３図は
夫々本考案の一実施例の説明図である。
１はビス、２はヒートシンク、？、７１．７□はトラン
ジスタ、１１．’、１１□′は高熱伝導性コンパウンド
の絶縁剤、１７は、高熱伝導性絶縁剤の接着剤。FIG. 1 is an exploded view illustrating a state in which a conventional transistor 7 and a heat sink 2 are connected and held, and FIGS. 2 and 3 are explanatory views of an embodiment of the present invention, respectively. 1 is a screw, 2 is a heat sink, ? , 71.7□ is a transistor, 11. ', 11□' is an insulating material made of a high thermal conductive compound, and 17 is an adhesive made of a highly thermally conductive insulating material.
Claims (1)
素子に対する密着部に予め高熱伝導性剤を塗布すること
を特徴とする放熱装置。1. A heat dissipation device comprising a heat dissipation plate and a heat dissipated element, the heat dissipation device comprising a heat dissipation plate and a portion of the heat dissipation plate that is in close contact with the heat dissipated electric element, and a highly thermally conductive agent is applied in advance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP581382U JPS58109259U (en) | 1982-01-20 | 1982-01-20 | heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP581382U JPS58109259U (en) | 1982-01-20 | 1982-01-20 | heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58109259U true JPS58109259U (en) | 1983-07-25 |
Family
ID=30018607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP581382U Pending JPS58109259U (en) | 1982-01-20 | 1982-01-20 | heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58109259U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS476832U (en) * | 1971-02-17 | 1972-09-25 | ||
| JPS54106173A (en) * | 1978-02-08 | 1979-08-20 | Nec Corp | Semiconductor device |
| JPS5537221B2 (en) * | 1975-12-25 | 1980-09-26 |
-
1982
- 1982-01-20 JP JP581382U patent/JPS58109259U/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS476832U (en) * | 1971-02-17 | 1972-09-25 | ||
| JPS5537221B2 (en) * | 1975-12-25 | 1980-09-26 | ||
| JPS54106173A (en) * | 1978-02-08 | 1979-08-20 | Nec Corp | Semiconductor device |
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