JPS58187153U - Heat dissipation device for electronic components - Google Patents
Heat dissipation device for electronic componentsInfo
- Publication number
- JPS58187153U JPS58187153U JP8360182U JP8360182U JPS58187153U JP S58187153 U JPS58187153 U JP S58187153U JP 8360182 U JP8360182 U JP 8360182U JP 8360182 U JP8360182 U JP 8360182U JP S58187153 U JPS58187153 U JP S58187153U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- heat dissipation
- dissipation device
- insulating plate
- thermally conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 title claims 2
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の電子部品放熱装置を示す断面図、第２図
はこの考案の一実施例による電子部品放熱装置を示す断
面図である。
１・・・・・・トランジスタ、２・・・・・・金属性放
熱板、３１・・・・・・熱伝導性絶縁板、７・・曲スタ
ッド、６・・・・・・ナツト、尚、図中同一符号は夫々
間−又は相当部分を示す。FIG. 1 is a sectional view showing a conventional electronic component heat radiating device, and FIG. 2 is a sectional view showing an electronic component heat radiating device according to an embodiment of the invention. 1... Transistor, 2... Metal heat sink, 31... Heat conductive insulating plate, 7... Bent stud, 6... Nut, etc. , the same reference numerals in the figures indicate the corresponding parts.
Claims (1)
た熱伝導性絶縁板と、この熱伝導性絶縁板に固定された
スタッドとを備え、このスタッドにより上記熱伝導性絶
縁板上に電子部品を固定するようにしたことを特徴とす
る電子部品の放熱装置。It includes a metallic heat sink, a thermally conductive insulating plate provided in contact with the metallic heat sink, and a stud fixed to the thermally conductive insulating plate, and the stud allows the thermally conductive insulating plate to be A heat dissipation device for electronic components, characterized in that the electronic components are fixed to the device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8360182U JPS58187153U (en) | 1982-06-04 | 1982-06-04 | Heat dissipation device for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8360182U JPS58187153U (en) | 1982-06-04 | 1982-06-04 | Heat dissipation device for electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58187153U true JPS58187153U (en) | 1983-12-12 |
Family
ID=30092595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8360182U Pending JPS58187153U (en) | 1982-06-04 | 1982-06-04 | Heat dissipation device for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58187153U (en) |
-
1982
- 1982-06-04 JP JP8360182U patent/JPS58187153U/en active Pending
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