JPS5989541U - Integrated circuit for high frequency power amplification - Google Patents
Integrated circuit for high frequency power amplificationInfo
- Publication number
- JPS5989541U JPS5989541U JP18516182U JP18516182U JPS5989541U JP S5989541 U JPS5989541 U JP S5989541U JP 18516182 U JP18516182 U JP 18516182U JP 18516182 U JP18516182 U JP 18516182U JP S5989541 U JPS5989541 U JP S5989541U
- Authority
- JP
- Japan
- Prior art keywords
- high frequency
- frequency power
- power amplification
- integrated circuit
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａは従来の高周波電力増幅用集積回路の外観を示
す斜視図、同図すは同断面図、同図Ｃは同回路にシール
ド板を設けた取り付は状態を示す二部切欠側面図、第２
図ａは本考案回路の外観を示す斜視図、同図すは同断面
図、同図Ｃは同回路の取り付は状態を示す側面図である
。
１・・・放熱板、１□・・・Ｌ字型部、２・・・非導電
性キャップ、４・・・セラミック基板、５・・・トラン
ジスタ・ベレット、１０・・・取り付けねじ、２１・・
・無線機の放熱器。Figure 1a is a perspective view showing the external appearance of a conventional integrated circuit for high frequency power amplification, the same figure is a sectional view of the same, and Figure 1C is a two-part notched side view showing the state in which the circuit is installed with a shield plate. Figure, 2nd
Figure A is a perspective view showing the external appearance of the circuit of the present invention, and Figure C is a side view showing the state in which the circuit is installed. DESCRIPTION OF SYMBOLS 1... Heat sink, 1□... L-shaped part, 2... Non-conductive cap, 4... Ceramic board, 5... Transistor bellet, 10... Mounting screw, 21...・
・radiator for radio equipment.
Claims (1)
、該基板上に構成される高周波電力増幅回路と、該回路
を囲う非導電性のキャップとを具備し、前記放熱板は、
前記キャップの側面を覆いかつ該キャップの頂部側で他
の金属体に取付け６れるようにしたことを特徴とする高
周波電力増幅用集積回路。The heat sink includes a heat sink, an insulated circuit board mounted on the heat sink, a high frequency power amplification circuit configured on the board, and a non-conductive cap surrounding the circuit, and the heat sink includes:
An integrated circuit for high frequency power amplification, characterized in that the side surface of the cap is covered and the top side of the cap is attached to another metal body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18516182U JPS5989541U (en) | 1982-12-07 | 1982-12-07 | Integrated circuit for high frequency power amplification |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18516182U JPS5989541U (en) | 1982-12-07 | 1982-12-07 | Integrated circuit for high frequency power amplification |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5989541U true JPS5989541U (en) | 1984-06-18 |
Family
ID=30400282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18516182U Pending JPS5989541U (en) | 1982-12-07 | 1982-12-07 | Integrated circuit for high frequency power amplification |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5989541U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6340400A (en) * | 1986-08-05 | 1988-02-20 | 富士通株式会社 | Assembly of circuit module |
-
1982
- 1982-12-07 JP JP18516182U patent/JPS5989541U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6340400A (en) * | 1986-08-05 | 1988-02-20 | 富士通株式会社 | Assembly of circuit module |
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