JPS61144697U - - Google Patents
Info
- Publication number
- JPS61144697U JPS61144697U JP2645185U JP2645185U JPS61144697U JP S61144697 U JPS61144697 U JP S61144697U JP 2645185 U JP2645185 U JP 2645185U JP 2645185 U JP2645185 U JP 2645185U JP S61144697 U JPS61144697 U JP S61144697U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- heat dissipation
- heat
- element mounting
- dissipation fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の制御盤の構成図、第２図は従
来の制御盤の構成図である。
１……ボツクス、２……電子部品、３……プリ
ント基板、４……半導体素子、５……断熱材、７
……放熱フイン。
FIG. 1 is a block diagram of a control panel according to the present invention, and FIG. 2 is a block diagram of a conventional control panel. 1...Box, 2...Electronic component, 3...Printed circuit board, 4...Semiconductor element, 5...Insulating material, 7
...Heat dissipation fin.
Claims (1)
熱する様にした制御盤において、前記放熱フイン
の半導体素子取り付け側で半導体素子取り付け位
置以外を断熱材で覆つたことを特徴とする半導体
制御盤の放熱構造。 A heat dissipation structure for a semiconductor control panel in which heat generated from a semiconductor element is dissipated from a heat dissipation fin, characterized in that the semiconductor element mounting side of the heat dissipation fin is covered with a heat insulating material other than the semiconductor element mounting position. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2645185U JPS61144697U (en) | 1985-02-27 | 1985-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2645185U JPS61144697U (en) | 1985-02-27 | 1985-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61144697U true JPS61144697U (en) | 1986-09-06 |
Family
ID=30522472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2645185U Pending JPS61144697U (en) | 1985-02-27 | 1985-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61144697U (en) |
-
1985
- 1985-02-27 JP JP2645185U patent/JPS61144697U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS61144697U (en) | ||
| JPH0193792U (en) | ||
| JPS59145045U (en) | Transistor fixing device | |
| JPH01154689U (en) | ||
| JPS63128741U (en) | ||
| JPS6346899U (en) | ||
| JPS6262446U (en) | ||
| JPS6439648U (en) | ||
| JPH03104793U (en) | ||
| JPH01174990U (en) | ||
| JPH0330440U (en) | ||
| JPS587351U (en) | Heat dissipation mechanism | |
| JPS61174775U (en) | ||
| JPS61157337U (en) | ||
| JPH01133743U (en) | ||
| JPS61186297U (en) | ||
| JPS6146744U (en) | Heat dissipation mechanism for integrated circuit devices | |
| JPS6037295U (en) | Heat dissipation structure | |
| JPS6192067U (en) | ||
| JPH031498U (en) | ||
| JPS63149544U (en) | ||
| JPS59177957U (en) | radiator | |
| JPS60194394U (en) | electronic controller | |
| JPH0160596U (en) | ||
| JPS60124094U (en) | printed wiring board |