JPS6192067U - - Google Patents

Info

Publication number
JPS6192067U
JPS6192067U JP17772384U JP17772384U JPS6192067U JP S6192067 U JPS6192067 U JP S6192067U JP 17772384 U JP17772384 U JP 17772384U JP 17772384 U JP17772384 U JP 17772384U JP S6192067 U JPS6192067 U JP S6192067U
Authority
JP
Japan
Prior art keywords
notch
insulating substrate
curvature
radius
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17772384U
Other languages
Japanese (ja)
Other versions
JPH0310678Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17772384U priority Critical patent/JPH0310678Y2/ja
Publication of JPS6192067U publication Critical patent/JPS6192067U/ja
Application granted granted Critical
Publication of JPH0310678Y2 publication Critical patent/JPH0310678Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例による絶縁基板のノ
ツチ部分の断面図、第2図は第1図の実施例に供
するグラフを示す図、第3図および第4図はそれ
ぞれ従来例を示す概略図である。 1…放熱板、2…絶縁基板、3…ノツチ部、3
…ノツチ角部、4…半田。
Fig. 1 is a sectional view of a notch portion of an insulating substrate according to an embodiment of the present invention, Fig. 2 is a diagram showing a graph for the embodiment of Fig. 1, and Figs. 3 and 4 respectively show conventional examples. It is a schematic diagram. DESCRIPTION OF SYMBOLS 1... Heat sink, 2... Insulating board, 3... Notch part, 3
1 ...notch corner, 4...solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 回路部品を実装すべき絶縁基板に方形状のノツ
チ部を形成し、この絶縁基板を放熱板上に搭載す
る構造の高出力用の混成集積回路装置において、
前記絶縁基板に形成されるノツチ部のノツチ幅を
l、ノツチ角部の曲率半径をpとしたとき、この
曲率半径pを前記ノツチ幅lの0.075倍以上
に設定したことを特徴とする混成集積回路装置。
In a high-output hybrid integrated circuit device that has a structure in which a rectangular notch is formed on an insulating substrate on which circuit components are mounted, and this insulating substrate is mounted on a heat sink,
When the notch width of the notch formed in the insulating substrate is l, and the radius of curvature of the notch corner is p, the radius of curvature p is set to 0.075 times or more the notch width l. Hybrid integrated circuit device.
JP17772384U 1984-11-22 1984-11-22 Expired JPH0310678Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17772384U JPH0310678Y2 (en) 1984-11-22 1984-11-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17772384U JPH0310678Y2 (en) 1984-11-22 1984-11-22

Publications (2)

Publication Number Publication Date
JPS6192067U true JPS6192067U (en) 1986-06-14
JPH0310678Y2 JPH0310678Y2 (en) 1991-03-15

Family

ID=30735295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17772384U Expired JPH0310678Y2 (en) 1984-11-22 1984-11-22

Country Status (1)

Country Link
JP (1) JPH0310678Y2 (en)

Also Published As

Publication number Publication date
JPH0310678Y2 (en) 1991-03-15

Similar Documents

Publication Publication Date Title
JPS6192067U (en)
JPS6194356U (en)
JPH0425289U (en)
JPS61207038U (en)
JPS60174244U (en) hybrid integrated circuit
JPS5863704U (en) chip resistor
JPH04774U (en)
JPS61192455U (en)
JPS6439649U (en)
JPS6052632U (en) Power semiconductor devices
JPS63136378U (en)
JPS6061740U (en) Hybrid integrated circuit device
JPS61171247U (en)
JPS6420740U (en)
JPS6444641U (en)
JPS61149354U (en)
JPS59171350U (en) Semiconductor element mounting structure
JPS6157559U (en)
JPS6252943U (en)
JPS59146960U (en) hybrid integrated circuit
JPS61144697U (en)
JPS588956U (en) Mounting structure of transistors, etc. on heatsink
JPS63105349U (en)
JPS6249268U (en)
JPS6161840U (en)