CN101241924B - Imaging device module and portable electronic apparatus utilizing the same - Google Patents

Imaging device module and portable electronic apparatus utilizing the same Download PDF

Info

Publication number
CN101241924B
CN101241924B CN200810008690XA CN200810008690A CN101241924B CN 101241924 B CN101241924 B CN 101241924B CN 200810008690X A CN200810008690X A CN 200810008690XA CN 200810008690 A CN200810008690 A CN 200810008690A CN 101241924 B CN101241924 B CN 101241924B
Authority
CN
China
Prior art keywords
imaging device
radiation component
component
radiation
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200810008690XA
Other languages
Chinese (zh)
Other versions
CN101241924A (en
Inventor
山宫国雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Imaging Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Imaging Corp filed Critical Olympus Imaging Corp
Publication of CN101241924A publication Critical patent/CN101241924A/en
Application granted granted Critical
Publication of CN101241924B publication Critical patent/CN101241924B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Abstract

The invention relates to an imaging device module and a portable electronic device using the imaging the module. In the imaging device module according to the invention, an opening (24) is provided in an FPC board (22) accommodated in an apparatus chassis (68). An insulating sheet (14) of an imaging device (12) is mounted opposite the opening on the FPC board (22). In a configuration of the imaging device module (10), a heat reflection member (16) is thermally coupled to the insulating sheet (14), and a first radiation member (42) thermally coupled to both the apparatus chassis (68) and the imaging device (12) is disposed so as to face the heat reflection member (16).

Description

The portable electric appts of imaging device module and this imaging device module of employing
Technical field
The present invention relates to a kind of portable electric appts, this portable electric appts comprises camera head unit and electronic photographing device, such as the interchangeable electronic photographing device of the camera lens that is combined with imaging device, relates more specifically to the cooling structure of imaging device module.
Background technology
Usually, when in this portable electric appts in conjunction with as the imaging device of electronic component with when constituting the CPU (CPU) of control circuit, not only need to adopt thermal control but also need guarantee dust control.For thermal control, when having improved dust control, the increase noise level thereby temperature of electronic component raises, this can cause the picture quality variation under the situation of electronic photographing device.Therefore, recently because the improvement of imaging device or cpu performance makes thermal control become big problem.
For example, Japanese Patent Application Laid-Open No.02-143152,2006-332894 and 2006-174226 disclose liquid cooling irradiation structure and air cooling irradiation structure.
In the disclosed liquid cooling irradiation structure of Japanese Patent Application Laid-Open No.02-143152, the surface of the integrated circuit component on making coldplate and being installed in circuit board contacts, and to small coolant flow channel cooling water supply so that coldplate is carried out water-cooled.By the heat conduction deformability material of layout such as the compound with thermal conductive resin in the thermal bonding portion between coldplate and integrated circuit component, thereby and the increase contact area obtains good thermal conductivity.
Specifically, on such as a face side of the circuit board of ceramic wafer, a plurality of integrated circuit components are installed.In being arranged in the liquid cooling module of circuit board, on the surface of integrated circuit component and be supplied with the heat conduction deformability material that plugs between the coldplate of coolant such as compound by the coolant flow channel, and between coldplate and integrated circuit component, realize good thermal bonding by the spring force of spring with thermal conductive resin.Liquid supplying apparatus comprises coolant supply pipe, switch valve and the mechanical pump that links to each other with coolant guiding channel.
Japanese Patent Application Laid-Open No.2006-332894 discloses a kind of air cooling imaging device, it comprises in the agent structure that is attached to camera body the shutter in the opening that is arranged in agent structure with the side installation portion that supports imaging lens, along optical axis, and image-generating unit.Image-generating unit comprises and is fixed in agent structure and by the imaging device of imaging device fixed head, optics optical low-pass filter, cover glass and the nude film (bear chip) of its support.In imaging device, the imaging device fixed head that constitutes radiant panel is in conjunction with also being fixed on the surface of non-imaging surface side, to guarantee from the surface of side installation portion the distance to the imaging surface (light-to-current inversion surface) of imaging device along optical axis direction.Come radiation because of driving the heat that imaging device produces by the imaging device fixed head, raise thereby suppress temperature.
Japanese Patent Application Laid-Open No.2006-174226 discloses a kind of imaging device oscillating-type image-generating unit with image stabilizing function, imaging device comprising encapsulation, lead terminal and cover glass is installed on the circuit board, and in the dorsal part placement of flexible plate of encapsulation, make the opening that is provided with in the circuit board against heat absorption surface such as the cooling element of Peltier element.Between the heat absorption surface of dorsal part and the cooling element of encapsulation, arrange little radiation component, arrange the large radiation parts, and little radiation component and large radiation parts pass through heat transfer component and thermal bonding in case side.
Summary of the invention
The portable electric appts that the purpose of this invention is to provide a kind of imaging device module and this imaging device module of employing, in this imaging device module, realized that by simple structure heat is transmitted efficiently, thereby improved cooling effectiveness and improved the manufacturing degree of freedom that comprises design.
The invention provides a kind of imaging device module, this imaging device module comprises:
Printed circuit board (PCB), this printed circuit board (PCB) are contained in the apparatus casing and are provided with opening;
Imaging device, this imaging device are installed on the described printed circuit board (PCB) and make insulating thin facing to the described opening in the described printed circuit board (PCB) simultaneously;
The infrared external reflection parts, this infrared external reflection arrangements of components becomes to be thermally bonded to the dorsal part of described imaging device, and reflects the infrared ray that sends from radiant panel; And
Radiation component, this radiation component are thermally bonded to described apparatus casing and are arranged to relative with described infrared external reflection parts.
The present invention also provides a kind of imaging device module, and this imaging device module comprises:
Imaging device, this imaging device are arranged to make insulating thin to be exposed to and installation surface opposite surfaces side;
Flexible printed circuit board, this flexible printed circuit board is contained in the apparatus casing, comprises that the electronic component of described imaging device is installed on the described flexible printed circuit board;
Radiation component, this radiation component is thermally bonded to described apparatus casing, and near described imaging device the dorsal part of the described flexible printed circuit board of local support, and be thermally bonded to the described insulating thin of described imaging device simultaneously;
Heat Conduction Material, this Heat Conduction Material is encapsulated in the described radiation component, and compares with described radiation component and to have good thermal conductivity; And
Support component, this support component is thermally bonded to described radiation component, and near described electronic component the dorsal part of the described flexible printed circuit board of local support.
The present invention also provides a kind of portable electric appts, uses the imaging device module in this portable electric appts, and this portable electric appts comprises:
Apparatus casing; And
The imaging device module, this imaging device module arrangement also is contained in the described apparatus casing, on the printed circuit board (PCB) in this imaging device module the encapsulation type imaging device is installed, hot acceptance division is arranged as the dorsal part that is thermally bonded to the described imaging device in the described imaging device module, relatively be furnished with radiation component with described hot acceptance division in described imaging device module, this radiation component is thermally bonded to described apparatus casing.
The present invention also provides a kind of portable electric appts, uses the imaging device module in this portable electric appts, and this portable electric appts comprises:
Apparatus casing; And
The imaging device module, this imaging device module arrangement also is contained in the described apparatus casing, the electronic component that comprises imaging device is installed on the flexible printed circuit board in this imaging device module, described imaging device is arranged so that insulating thin is exposed to and installation surface opposite surfaces side, the radiation component that is thermally bonded to described apparatus casing is thermally bonded to the insulating thin of described imaging device also simultaneously against described insulating thin, in described radiation component, be packaged with Heat Conduction Material with excellent heat conductivity, near the dorsal part of described radiation component described flexible printed circuit board of local support described imaging device, near the dorsal part of described radiation component described flexible printed circuit board of local support described electronic component also plugs the support component that is thermally bonded to described radiation component simultaneously.
According to the present invention, the heat that is installed in the imaging device on the described printed circuit board (PCB) passes to the infrared external reflection parts from insulating thin, and should heat with ultrared form from of the radiation component transmission of described infrared external reflection parts to the surface opposite side that is arranged in and installs described printed circuit board (PCB), should heat directly be transmitted simultaneously by heat conduction.Therefore, because the heat of imaging device can pass to radiation component effectively, thus can realize efficient cooling, and improve the manufacturing degree of freedom that comprises design.
According to the present invention, when the heat of the imaging device on being installed in described printed circuit board (PCB) passed to radiation component on the surface opposite side that is arranged in fitting printed circuit board from insulating thin, this heat by Heat Conduction Material and effectively conduction was given whole radiation component.Therefore, because the heat of imaging device can pass to radiation component effectively, thus can realize efficient cooling, and improve the manufacturing degree of freedom that comprises design.
According to the present invention, the heat that is installed in the imaging device on the described printed circuit board (PCB) is by heat conduction and radiation and pass to the radiation component of the surface opposite side that is arranged in and installs described printed circuit board (PCB) from the described infra-red heat reflection part that is arranged in the imaging device dorsal part.Therefore,,, and improve and to comprise the manufacturing degree of freedom of design, and can realize being suitable for the apparatus casing of the compactness of portable use so can realize efficient cooling because the heat of imaging device can pass to radiation component effectively.
According to the present invention, when the heat of the imaging device on being installed in described printed circuit board (PCB) passed to the described radiation component of the surface opposite side that is arranged in and installs described printed circuit board (PCB) from insulating thin, this heat was conducted effectively by Heat Conduction Material and is given whole radiation component.Therefore,,, and improve and to comprise the manufacturing degree of freedom of design, thereby can realize being suitable for the apparatus casing of the compactness of portable use so can realize efficient cooling because the heat of described imaging device can pass to described radiation component effectively.
Preferably, also comprise the lens unit with linear screw mechanism according to portable electric appts of the present invention, this linearity screw mechanism comprises the stepping motor that is provided with white space, and the optical axis of camera lens is by above-mentioned white space.
Advantage of the present invention will be set forth in explanation subsequently, and a part can become clear from this explanation, perhaps can know by implementing the present invention.Advantage of the present invention can realize and obtains by following means of specifically noting and combination.
Description of drawings
Accompanying drawing is included in the specification and constitutes the part of specification, shows current preferred implementation of the present invention, and with the big volume description that provides above with given below detailed description of the preferred embodiment one is used from explanation principle of the present invention.
Figure 1A is the cutaway view of expression according to the imaging device module of first embodiment of the invention;
Figure 1B is the cutaway view of expression according to another structure embodiment of the imaging device module of first embodiment of the invention;
Fig. 2 is illustrated in when the optical receiving surface side is seen the plane graph of the imaging device module of Figure 1A;
Fig. 3 is the cutaway view that is used to illustrate the camera unit of the imaging device module of wherein having used Figure 1B;
Fig. 4 is the cutaway view of the dust-proof mechanism of combination in the camera unit of presentation graphs 3;
Fig. 5 is the cutaway view of expression according to another embodiment of the imaging device module of first embodiment of the invention;
Fig. 6 is the cutaway view of expression according to another embodiment of the imaging device module of first embodiment of the invention;
Fig. 7 is the cutaway view of expression according to another embodiment of the imaging device module of first embodiment of the invention;
Fig. 8 is the cutaway view of expression according to another embodiment of the imaging device module of first embodiment of the invention;
Fig. 9 is the cutaway view of expression according to another embodiment of the imaging device module of first embodiment of the invention;
Figure 10 is the partial sectional view of the amplification major part of presentation graphs 9;
Figure 11 is the cutaway view of expression according to another embodiment of the imaging device module of first embodiment of the invention;
Figure 12 is the schematic diagram of representing wherein to have used according to the structure of the single-lens reflex electronic camera of the imaging device module of first embodiment of the invention; And
Figure 13 is the horizontal cross of expression according near the structure embodiment the mirror/imaging device unit of second embodiment of the invention.
Describe portable electric appts below with reference to accompanying drawings in detail according to imaging device module and this imaging device module of employing of first embodiment of the invention.
(first execution mode)
The imaging device module of first execution mode will be described below.
Figure 1A shows the imaging device module 101 of first execution mode.With reference to Figure 1A, in imaging device 12, the insulating thin 14 that is positioned at imaging device 12 dorsal parts engages the heat reflection parts (low radiation thin plate) 16 that have as the infrared external reflection parts, and for example imaging device 12 and heat reflection parts 16 hold and are arranged in the ceramic packaging main body 18.For example, heat reflection parts 16 are made and mirror finish (radiation coefficient is 0.1 or littler) by aluminum.By metal foil coated on the surface of heat reflection parts 16, metal oxide or IR-cut filter (high infrared reflection rate), perhaps apply white coating compound (low-E coating compound) to resin sheet, and form radiation coefficient be 0.1 to 0.6 and infrared reflectivity be 75 to 90% treatment surface.Therefore, when from imaging device 12 when radiant panel conducts heat, heat reflection parts 16 cover the infrared ray that sends from outside (for example radiant panel), and stop infrared ray incident.
Radiant panel and heat reflection parts (resin sheet of low-E) can be when the temperature that suppresses imaging device raise again, with the heat of radiant panel to space (near the gap of imaging device) radiation.The surface-coated of radiant panel has such as black coating compound, zirconia ceramics and contains the coating compound of the high radiation coefficient of ceramic material.The heat reflection parts are the infrared reflection of autoradiolysis plate in the future.
In package main body 18, relatively be provided with radiation opening 20 with heat reflection parts 16.The opening 20 of package main body 18 is facing to the radiation opening 24 in the flexible printed circuit board that is arranged on elastically deformable (hereinafter referred to as the FPC plate) 22, and FPC plate 22 is installed and be thermally bonded to package main body 18.
The lead terminal 28 of package main body 18 is connected to the electrode of imaging device 12 by bonding part 30.Lead terminal 28 is drawn out to the outside and links to each other with the wiring pattern of FPC plate 22.As shown in Figure 2, two sidepieces that will be vertical with the sidepiece that is furnished with the lead terminal 28 that is electrically connected to imaging device 12 are thermally bonded on the FPC plate 22, use the bond 34 with excellent heat conductivity that it is bonded to FPC plate 22 simultaneously.Upper surface part in package main body 18 adheres to cover glass 36, thereby holds imaging device 12 in the mode of sealing.
In FPC plate 22, be provided with plate end 40 and also simultaneously opening 24 be folded between the plate end.In plate end 40, in first radiation component 42 that constitutes radiation component, be provided with projection 44.Projection 44 is engaged to package main body 18 also simultaneously facing to package main body 18.First radiation component 42 is by making such as the metal material of copper or aluminium alloy, and partly locates relatively to be provided with opening 46 with the opening 24 of FPC plate 22 in the substantial middle of first radiation component 42.Package main body 18 is positioned at first radiation component, 42 places and by its support.
In first radiation component 42, be set to be arranged in the recess 24 of radiation component 42 as the high radiation thin plate 50 of INFRARED ABSORPTION parts.High radiation thin plate 50 is made by aluminum.It is orderly or unordered uneven to form that the processing of black alumite film, spline formation, crystal grain processing etc. are carried out in the surface of high radiation thin plate 50, so that should the surface can reflected infrared ray, be 0.9 or treated surface bigger, that infrared reflectivity is lower and heat absorption capacity is high thereby form radiation coefficient.The projection 46 of second radiation component 60 is inserted in the opening 52 that is arranged in the high radiation thin plate 50.Therefore, high radiation thin plate 50 absorbs the infrared ray from outside or heat reflection parts 16 effectively, and suppressing with the infrared radiation with the thermotropism reflection part is minimum.
When in projection 46 upper surface, forming little opening when will accumulate in heat between heat reflection parts 16 and the high radiation thin plate 50, improved radiation efficiency directly to external radiation.
Can carry out surface treatment by zone, and directly form high radiation thin plate 50 by first radiation component 42 in the face of heat reflection parts 16 to first radiation component 42.
In first radiation component 42, on the dorsal part of high radiation thin plate 50, be formed with recess 54.By ca(u)lk projection 46 and second radiation component, 60 crimping with hollow bumps 58 are incorporated into recess 54 and plug Heat Conduction Material 56 simultaneously, thereby one is assembled on first radiation component 42.Second radiation component 60 is by making with first radiation component, 42 identical materials.Heat Conduction Material 56 is made by thermal conductivity ratio first radiation component 42 and second radiation component, 60 high materials, for example graphitic carbon material, silica gel, metal foaming material, various porous polycrystalline material and graphite cake.
Therefore, leave to the outside, stagnate and prevent the hot saturated of imaging device 12 thereby can eliminate so-called heat from the opening 52 of the heat of heat reflection parts 16 projection 46 by second radiation component 60 from high radiation thin plate 50.But, be not that the upper surface that must form the projection 46 of opening 52, the second radiation components 60 can direct heat connect paramount radiation thin plate 50 in high radiation thin plate 50.
Resin sheet can be made by latent heat of phase change aggregate material (for example, wherein the microcapsules olefin material is filled with the organic material of carbon fiber), rather than is made by heat carrier.When the phase transition temperature with the latent heat aggregate material was set in 40 to 50 ℃ the scope, the temperature in can suppression equipment raise fast, thereby abnormal temperature that can the delay temperature transducer detects to improve user friendly.
Lower surface 42a, the 42b of radiation component 42 forms smooth (not needing ca(u)lk), to be filled with the resin sheet that the organic material of carbon fiber makes by microcapsule-type olefin material wherein and be engaged to radiation component 42, thereby the structure of having simplified radiation component 42 like this is convenient to assembling.
In first radiation component 42, be provided with housing junction surface 64.In the patchhole 66 that insert in FPC plate 22 at housing junction surface 64, and be thermally bonded to apparatus casing 68.Therefore, first radiation component 42 passes to apparatus casing 68 with the part of transmit heat, and slave unit housing 68 discharges heat to suppress the temperature rising of imaging device 12.
In FPC plate 22, be provided with four otch 70, between otch 70, be inserted with simultaneously as with the bond 34 (referring to Fig. 2) of the joint portion of package main body 18.The hot acceptance division 72 that vertically is located in first radiation component 42 is inserted in the otch 70.Hot acceptance division 72 is independent of high radiation thin plate 50 and receives from the heat of the surrounding wall radiation of package main body 18.In addition, hot acceptance division 72 has high radiation thin plate 74 to absorb infrared ray.
In described structure, when imaging device 12 is driven and produces when hot, heat passes to first radiation component 42 by heat conduction from package main body 18 and FPC plate 22.Simultaneously, the heat from the other electron component on the FPC plate 22 passes to first radiation component 42 by heat conduction via FPC plate 22.
Expectation be that combined dose 34 closure of the part of package main body 18 makes can not pass to the FPC plate from the heat that encapsulates whole 18 lower surface and the release of the gap between first radiation component 42.
The heat that produces in the imaging device 12 is directly passed to heat reflection parts 16 by insulating thin 14, and with ultrared form loses heat, the heat that is the infrared ray form passes to first radiation component 42 by high radiation thin plate 50 in heat reflection parts 16.From the sidewall radiation of the portion of hot of imaging device 12 from package main body 18.The heat that discharges from the sidewall of package main body 18 passes to the hot acceptance division 72 of first radiation component 42 by thermal radiation and convection current, and passes to first radiation component 42.
Thus, the heat that passes to first radiation component 42 in three kinds of modes (heat conduction, radiation and convection current) passes to second radiation component 60 by Heat Conduction Material 56.Heat is conducted on the whole effectively, and passes to apparatus casing 68 and to external radiation by housing junction surface 64.Therefore, to be cooled so that temperature is suppressed be aspiration level to imaging device 12.At this, thereby also cool off these electronic components from the other electron component loses heat that is installed on the FPC plate 22.
Thus, in imaging device module 10 1In, be provided with opening 24 in the FPC plate 22 in being contained in apparatus casing 68, and the insulating thin 14 of imaging device 12 is installed on the FPC plate 22 and face opening 24 simultaneously.Heat reflection parts 16 are thermally bonded to insulating thin 14, and first radiation component 42 that is thermally bonded to apparatus casing 68 and imaging device 12 is relatively arranged with heat reflection parts 16.
At this, in the heat reflection parts, when being stained with the resin sheet of low radiation thin plate, use can omit insulating thin 14.
In this case, the heat that is soldered to the imaging device 12 of FPC plate 22 passes to heat reflection parts 16 from insulating thin 14.Then, the part of the heat of being transmitted with ultrared form from heat reflection parts 16 to high radiation thin plate 50 or protruding 46 internal delivery.High radiation thin plate 50 is engaged to first radiation component 42 on the opposite side of the face of weld that is arranged in FPC plate 22.The heat that conducts to heat reflection parts 16 conducts to FPC plate 22 or hot acceptance division 72 from package main body 18, and conducts to first radiation component 42.
Figure 1B is the cutaway view of expression according to another structure embodiment of the imaging device module of first embodiment of the invention.
The difference of the structure of Figure 1B and the structure of Figure 1A is, projection 46 is not set, and is provided with Heat Conduction Material 76, the 3rd radiation component 78, Heat Conduction Material 56, second radiation component 60 and radiant panel 80 with overlapped way in first radiation component 42.Contain ceramic material and form radiant panel 80 by on the surface of second radiation component 60, applying, and radiant panel 80 is arranged to the heat of release of radiation.
First radiation component 42 is divided into two members, and Heat Conduction Material 76 is plugged in the boundary member between these two members, and radiant panel 80 adheres to from the teeth outwards, thereby can obtain higher radiation efficiency so that the radiant panel miniaturization.
Although described the encapsulation type imaging device in this embodiment, can come alternative package type imaging device with the nude film imaging device.
To be described as the use of picture apparatus module below.In this case, will the imaging device module 10 with structure shown in Figure 1B be described in the mode of embodiment.
For example, as shown in Figure 3, imaging device module 10 is assembled in as using between the lens unit 90 of the electronic camera of portable electric appts and the camera main-body 92.In Fig. 3, the member identical with Figure 1B and Fig. 2 represented with identical Reference numeral, and omission is to its detailed description.
That is, imaging device module 10 is contained in the unit connecting ring 94, and first radiation component 42 of imaging device module 10 is thermally bonded to unit connecting ring 94.In unit connecting ring 94, use screw component 96 that cardinal extremity is fixed in camera main-body 92.Dust-proof mechanism 100 shown in Figure 4 is assembled to the upper surface of imaging device module 10.
In dust-proof mechanism 100, optical low-pass filter 102 is set to close the opening 106 in attachment component 104.Optical low-pass filter 102 is arranged on the upper surface of imaging device 12, and plugs ring-shaped rubber supporting bracket 108 simultaneously.Be arranged on the imaging device 12 and plug simultaneously under the state of supporting bracket 108 at optical low-pass filter 102, use screw component 110 that attachment component 104 is fixed in apparatus casing 68 (not shown).Can prevent that like this dust from invading in the surface of cover glass 36 of package main body 18.
In attachment component 104, relatively be furnished with dustproof transparency glass plate 114 with optical low-pass filter 102 within a predetermined distance.Use screw component 118 to assemble transparency glass plate 114, be inserted with elastomeric element 116 simultaneously with the aeroseal of expectation.Between transparency glass plate 114 and attachment component 104, be inserted with (in this case such as the vibration production part 120 of piezoelectric element and ring-shaped rubber parts 122, although rubber components 122 is formed by O type ring, but it also can form the width identical with vibrating production part 120), be used for preventing that dust from invading the surface of optical low-pass filter 102.
Transparency glass plate 114 is with airtight mode and optical low-pass filter 102 positioned opposite, and can vibrate simultaneously.When vibration production part 120 vibrated by the driving of drive control part (not shown), vibration was transmitted.Transparency glass plate 114 vibration, and resist the elastic force of elastomeric element 116 simultaneously and keep airtight, thereby the dust of removing the surface that adheres to transparency glass plate 114 is invaded optical low-pass filter 102 to prevent dust.
With reference to Fig. 3, lens unit 90 is assembled to the leading section of unit connecting ring 94.The imaging len system holds and is arranged in the lens unit 90.For example, the imaging len system is formed by three groups of four elements, i.e. the 4th lens 130d of first group the first lens 130a, second group the second lens 130b and the 3rd lens 130c and the 3rd group.Lens unit 90 makes second group the second lens 130b and the 3rd lens 130c move to adjust focus along the direction of optical axis O.
The first lens 130a and the 4th lens 130d are contained in respectively among keeper 132a and the 132d, and locate and be fixed on the optical axis O by keeper 132a and 132d.The second lens 130b and the 3rd lens 130c are contained among the keeper 132b.Keeper 132b is supported by the guide 134 with anti-abnormal sound structure, and can move on the direction of arrow A of Fig. 3 and B along optical axis O simultaneously.
Keeper 132b is engaged to linear screw mechanism 136, and simultaneously can be along optical axis O linear movement on the direction of arrow A of Fig. 3 and B.Linear screw mechanism 136 is engaged to stepping motor 138 and can be driven simultaneously, and rotates in combination with the driving of stepping motor 138.Therefore, keeper 132a is along direction of arrow A and B linear movement.At this, keeper 132b is by guide 134 guiding and move along direction of arrow A and B, thus the second lens 130b and the 3rd lens 130c along axis movement to adjust focus.
Thus, by imaging device module 10 being assembled to the lens unit 90 of electronic camera, also realized efficient cooling simultaneously, thereby can realize compact camera main-body 92 and improved the manufacturing degree of freedom that comprises thermal design.
In the first embodiment, use the FPC plate 22 of elastically deformable to come structure imaging apparatus module and portable electric appts.The present invention is not limited to the FPC plate 22 of elastically deformable, can use printed circuit board to come structure imaging apparatus module and portable electric appts.In this case, can obtain similar effects.
The present invention is not limited to first execution mode.For example optionally, can be as Fig. 5 to structure imaging apparatus module 10a to 10f shown in Figure 11, and can obtain similar effects.In Fig. 5 to Figure 11, the member identical with Fig. 2 with Figure 1A, Figure 1B represented with identical Reference numeral, and omission is to its detailed description.
In imaging device module 10a shown in Figure 5, the present invention is applied to imaging device 12 wherein and is contained in encapsulated type in the package main body 18.
With reference to Fig. 5, in imaging device module 10a, in the bottom surface of package main body 18, be formed with opening 20 corresponding to the insulating thin 14 of imaging device 12.Heat reflection parts 16 are arranged in the opening 20.Heat reflection parts 16 are the infrared external reflection parts that are engaged to the insulating thin 14 of imaging device 12.
In the FPC plate 22 of imaging device 12 is installed, after the opening 20 of package main body 18, be formed with opening 24.In the opening 24 of the opening 20 of package main body 18 and FPC plate 22, insert the recessed first thermal bonding portion 142 in the end that is arranged on the metal radiation component of making by aluminium alloy 140.The leading section of the first thermal bonding portion 142 is thermally bonded to the insulating thin 14 of imaging device 12.
On the inwall of the first thermal bonding portion 142 of radiation component 140, be formed with radiation fin 144, and in the bottom surface of the first thermal bonding portion 142, relatively be furnished with high radiation thin plate 50a with heat reflection parts 16.Simultaneously, high radiation thin plate 50a is arranged to extend along FPC plate 22.Therefore, high radiation thin plate 50a receives infrared ray from 16 radiation of heat reflection parts this infrared ray is passed to the first thermal bonding portion 142.
In the first thermal bonding portion 142, removably be provided with the second thermal bonding portion 146 of broad.In the second thermal bonding portion 146, wider part is thermally bonded to the dorsal part of FPC plate 22.
Be provided with hollow bulb 148 in the second thermal bonding portion 146, wherein radiation fin stretches out from inner and outer wall.In hollow bulb 148, accommodate inorganic or organic latent heat aggregate material and the Heat Conduction Material 56 with excellent heat conductivity, for example graphitic carbon material, silica gel, metal foaming material, various porous polycrystalline material and graphite thin plate in airtight mode.Therefore, radiation component 140 has been guaranteed sufficient thermal radiation area.When transmitting to the first thermal bonding portion 142 when hot, can be by Heat Conduction Material 56 to the whole heat conduction that comprises the second thermal bonding portion 146, thus realize thermal radiation efficiently.
Use the imaging device 12a of so-called nude film to construct imaging device module 10b shown in Figure 6.
With reference to Fig. 6, in FPC plate 22, be formed with opening 24 corresponding to the insulating thin 14a of imaging device 12a.Heat reflection parts 16 as the infrared external reflection parts are arranged in the opening 24, and are engaged to the insulating thin 14a of imaging device 12a simultaneously.
Constitute first radiation component, 152 dorsal parts that the FPC plate 22 of imaging device 12a is installed disposed thereon of support component, and first radiation component 152 is thermally bonded to FPC plate 22.In first radiation component 152, relatively be formed with opening 154 with heat reflection parts 16.Be fixed in opening 154 by recessed second radiation component of making such as the metal material of copper 156 by screw component 158, and simultaneously facing to heat reflection parts 16.
In the sidewall of second radiation component 156, be provided with air vent hole 160, on the outer wall of the bottom surface of second radiation component 156, be formed with radiation fin 162.Therefore, second radiation component 156 can outwards leave the heat of transmitting by air vent hole 160 and radiation fin 162 effectively.
Use the ultra-violet curing bond the 3rd radiation component 166 of metal to be bonded to the inside of second radiation component 156.The surrounding wall of the 3rd radiation component 166 is provided with radiation fin 168, and the leading section of radiation fin 168 is thermally bonded to the inwall of second radiation component 156.In the 3rd radiation component 166, be provided with air vent hole 170 corresponding to the air vent hole 160 of second radiation component 156.Can outwards distribute effectively by the heat that air vent hole 170 transmits.
In first radiation component 152, be provided with projection 172.Projection 172 is inserted in the patchhole 40 of FPC plate 22, so that first radiation component 152 is thermally bonded to apparatus casing 176.Therefore, first radiation component 152 can leave the heat of transmitting by imaging device 12a and FPC plate 22 to apparatus casing 176.
First radiation component 152, second radiation component 156 are made by identical metal material with the 3rd radiation component 166.
Imaging device module 10c shown in Figure 7 is applied to have the single-lens reflex digital camera of image stabilization correction.Thereby, imaging device is supported and can be moved in perpendicular to the XY plane of imaging lens optical axis simultaneously by camera main-body, and according to the image stabilization state by the image stabilizing mechanism (linear motor that for example comprises drive coil and permanent magnet, the electromagnetic driver that comprises stepping motor and screw shaft, and the linear motor that uses piezoelectric element or flexural vibrations device) clap when getting image and in the XY plane, be driven.
With reference to Fig. 7, imaging device module 10c is formed by the imaging device 12a of nude film, and imaging device 12a and plate face relatively are installed on the FPC plate 22.In FPC plate 22, relatively be provided with opening 24 with insulating thin 14a.Heat reflection parts 16 are engaged to opening 24.
FPC plate 22 is layered on first radiation component of being made by metal material 180, and is arranged to be supported by first radiation component 180.Opening 182 is formed in first radiation component 180 and simultaneously facing to the opening 24 of FPC plate 22.To attach to the opening 182 of first radiation component 180 by the leading section that is recessed into second radiation component 184 that metal material is made, and be thermally bonded to first radiation component 180 simultaneously.
Known plate-shape metal pipe 186 as a kind of heat pipe (that is, so-called core pipe) is thermally bonded to the mid portion of second radiation component 184, and second radiation component 184 is closed by metal tube 186.In a surface of metal tube 186, relatively be furnished with high radiation thin plate 50 with heat reflection parts 16, and high radiation thin plate 50 has the treated surface that infrared reflectivity is low and heat absorption capacity is high.
In the inwall of second radiation component 184, be provided with guiding groove 188.Be attached at movingly between guiding groove 188 and the metal tube 186 by the metallic plate of making such as the metal material of copper 190, and be inserted with Heat Conduction Material 56 simultaneously such as silica gel and graphite light sheet material.In metallic plate 190, the leading section of adjusting screw component 192 engages with the bottom of second radiation component 184, and in the adjustable mode of screw adjustment screw component 192 is set.By carrying out the screw adjustment and vertically adjust metallic plate 190, and make metallic plate 190 with metal tube 186 press contacts and be inserted with Heat Conduction Material 56 simultaneously to adjusting screw component 192.
At this, Heat Conduction Material 56 is arranged between metal tube 186 and the metallic plate 190, and the air that discharges in the Heat Conduction Material 56 from the air vent hole built in metallic plate 190 193 simultaneously.Therefore, can pass through Heat Conduction Material 56 and metallic plate 190 heat conduction effectively between the metal tube 186 and second radiation component 184.
Metal tube 186 links to each other with the flexible synthetic resin pipe 196 that constitutes circulating path by tube connector 194.The condenser and the piezoelectric pump that are arranged in the housing on the equipment body side (not shown) are connected to flexible synthetic resin pipe 196 in proper order.Use has the heat pipe or the piezoelectric pump of core, will be supplied to metal tube 186 and condenser such as the working fluid cycles of pure water, alcohol and phase change medium, to distribute the heat of transmitting from imaging device.In this case, the heat that is preferably used for imaging device 12a of the working fluid with best boiling point produces the saturation temperature of temperature.
In first radiation component 180, be provided with thermal bonding portion 198.Thermal bonding portion 198 is inserted in the patchhole 40 in FPC plate 22, and is thermally bonded to apparatus casing 176.Therefore, first radiation component 180 can pass to apparatus casing 176 with heat by thermal bonding portion 198, and distributes the heat that is transmitted by the FPC plate 22 that comprises imaging device 12a.
First radiation component 180, second radiation component 184 and metallic plate 190 are made by identical materials.
Fig. 8 and Fig. 9 utilization show a part of the present invention by Fig. 3 of the Japanese patent application No.2007-315010 of applicant's submission of the application.
The imaging device 12a of the image-generating unit shown in Fig. 8 and Fig. 9 by the first motion framework of the fuzzy anti-locking mechanism of camera and the second motion framework (promptly, Fig. 8 and motion framework 230 shown in Figure 9) support, the fuzzy anti-locking mechanism of this camera is driven at upper edge, the plane two-dimensional directional (X and Y direction) perpendicular to the optical axis of imaging lens.Detecting when fuzzy, it is fuzzy that the imaging device 12a of image-generating unit is actuated to compensation with the drive division of describing along a direction after a while at upper edge, the plane two-dimensional directional perpendicular to the optical axis of imaging lens.
The fuzzy anti-locking mechanism of camera comprises the base portion that is fixed in the camera main-body (not shown), with respect to base portion along Y direction driven first framework that moves, with respect to the first motion framework along directions X driven second framework that moves, image-generating unit by the second motion frame supported, be installed on the base portion and comprise first electromagnetic drive source and driving mechanism so that the first motion framework along the first driving mechanism portion that the Y direction is moved, be installed on the base portion and comprise second electromagnetic drive source and driving mechanism so that the second motion framework along the second driving mechanism portion that directions X moves, and the FPC (flexible printed circuit board) that the control part of image-generating unit and phase pusher side is linked to each other.
Use the imaging device 12a of nude film to construct imaging device module 10d shown in Figure 8 (being applied to have the single-lens reflex digital camera of the image stabilizing function that is similar to Fig. 7).
With reference to Fig. 8, in FPC plate 22, relatively be formed with opening 24 with the insulating thin 14a of imaging device 12a.To have radiation coefficient and be 0.1 or the heat reflection parts 16 of littler treated surface be engaged to opening 24.
FPC plate 22 arranges and is thermally bonded to first radiation component 202 that this first radiation component 202 has constituted by the plate maintaining part of making such as the metal material of copper.When FPC plate 22 was kept by first radiation component 202, FPC plate 22 folded and is wrapped in around first radiation component 202, and FPC plate 22 is along being engaged and the location by the extruder member of making such as the metal material of copper 204.In extruder member 204, be formed with projection 206.Projection 206 is inserted in the FPC plates 22, thereby and projection 206 is contacted with 202 of first radiation components set up thermal bonding.
First radiation component 202 forms the tubular of the opening 24 that can hold FPC plate 22, and is provided with guiding groove 208 in the inner wall part of first radiation component 202.Second radiation component 210 and the 3rd radiation component 212 made by metal material are contained in the guiding groove 208 movingly.Second radiation component 210 and the 3rd radiation component 212 are engaged with each other and will be clipped between the two by the Heat Conduction Material 56 that silica gel or graphite thin plate form simultaneously.
The surface that faces with each other in second radiation component 210 and the 3rd radiation component 212 is provided with radiation fin 214 and 216. Radiation fin 214 and 216 is by Heat Conduction Material 56 and thermal bonding each other.In second radiation component 210 and the 3rd radiation component 212, for example the part of the 3rd radiation component 212 is used screw component 220 and is fixed in first radiation component 202, and holds and be arranged in first radiation component 202.High radiation thin plate 222 is on the surface that is engaged to above second radiation component 210 facing to heat reflection parts 16.
Temperature sensor 226 is installed on FPC plate 22.The temperature that temperature sensor 226 detects in first radiation component 202.Ambient temperature in temperature sensor 226 detections first radiation component 202 is to export to the control part (not shown) with detected temperature.The detected temperatures that detects first radiation component 202 based on the detection signal from temperature sensor 226 when control part is not less than predetermined temperature when reaching at least the scheduled time, and control part just generates danger signal and show the warning that stops such as operation on the display part (not shown).
Extruder member 232 engages with the circle segment of the imaging surface of imaging device 12a, and extruder member 232 is supported by the motion framework 230 that constitutes known image stabilizing mechanism.By motion framework 230 imaging device 12a is moved with two-dimensional approach, keep the surface direction of imaging device 12a constant simultaneously, thereby realize so-called image stabilizing function.Motion framework 230 is thermally bonded to extruder member 204 by the coupling device (not shown).The heat that produces because of the driving of motion framework 230 passes to the extruder member 204 and first radiation component 202 by coupling device, thereby leaves heat.
In Fig. 8, in the 3rd radiation component 212, be shaped on air vent hole 228.Air vent hole 228 is used for discharging the air of Heat Conduction Material 56 when second radiation component 210 and the 3rd radiation component 212 engage and be inserted with Heat Conduction Material 56 simultaneously.
In this embodiment, when in another surface of second radiation component 210, relatively arranging high radiation thin plate 50, can obtain heat transfer property preferably with infrared reflectivity is low and heat absorption capacity is high treated surface with heat reflection parts 16.
In imaging device module 10e shown in Figure 9, with 236 assemblings of known core pattern heat pipe and be thermally bonded to first radiation component 210 and second radiation component 212 of Fig. 8, and the opening 24 of heat pipe 236 by FPC plate 22 receives from the infrared ray of heat reflection parts 16 radiation of the insulating thin 14a that is thermally bonded to imaging device 12a.In Fig. 9 with Fig. 8 in identical member represent with identical Reference numeral, and omit detailed description to it.
Heat pipe 236 is formed by the circulating path that stores working fluid.Shown in Figure 10 as the partial sectional view of the amplification major part of presentation graphs 9, disclosed known piezoelectric pump 238 links to each other with the mid portion of heat pipe 236 in Japanese Patent Application Laid-Open No.2003-28068, and is inserted with seal valve 240 simultaneously.Piezoelectric pump 238 is installed on the FPC plate 22.When driving by the control part (not shown) and controlling seal valve 240, working fluid is supplied with the heat of reception from 16 radiation of heat reflection parts with being recycled, thereby and this heat is passed to first radiation component 210 to working fluid and second radiation component 212 is realized radiation.
Be used under the situation of electronic camera at imaging device module 10e, when user's switching imaging module, perhaps become predetermined temperature or when higher, control part (not shown) drive pressure electric pump 238 when near the temperature the imaging device 12a in startup power supply operation.When piezoelectric pump 238 was driven, working fluid circulated in heat pipe 236 heat is passed to second radiation component 210, Heat Conduction Material 56 and the 3rd radiation component 212, had suppressed near the temperature of imaging device 12a like this and had raise.
For the annular shape of heat pipe 236, for example the mid portion in the left side of Fig. 9 can form smooth in crooked also while both ends.Therefore, because guaranteed spatial margin, so can simplify the assembling of the bearing of the leading axle that is assembled to the motion that is used for guided-moving framework 230.
In this embodiment, be arranged to heat reflection parts 16 with heat pipe 236 when relative, can obtain effect preferably when high radiation thin plate 50.
Use the imaging device 12a of nude film to form imaging device module 10f shown in Figure 11.
With reference to Figure 11, imaging device 12a is installed on the FPC plate 22, and makes the insulating thin 14a of imaging device 12a face the plate face simultaneously.In FPC plate 22, with insulating thin 14a opening 24 is set relatively, and comprises that the circle segment of insulating thin 14a is stacked and be thermally bonded on the outer surface wall by recessed first radiation component of making such as the metal material of copper 250.
To be engaged to first radiation component 250 by recessed second radiation component made from first radiation component, 250 identical materials 252, and the open side of first radiation component 250 and second radiation component 252 is faced with each other.Second radiation component 252 holds the Heat Conduction Material 56 with excellent heat conductivity, for example silica gel and graphite thin plate.The inwall of first radiation component 250 and second radiation component 252 is provided with radiation fin 254 and 256. Radiation fin 254 and 256 is engaged with each other, and buries Heat Conduction Material 56 simultaneously between radiation fin 254 and 256 underground.
First radiation component, 250 supported frame partss 260 support, and are thermally bonded to the apparatus casing (not shown) and are inserted with support frame parts 260 simultaneously.Optical low-pass filter 262 and shutter 264 der group are filled to support frame parts 260, and the while is facing to the element surface of imaging device 12a.Ring-shaped rubber parts 264 are plugged between imaging device 12a and the optical low-pass filter 262, invade in the surface of optical low-pass filter 262 to prevent dust.
The electronic component 266 such as CPU (CPU) that is installed on the FPC plate 22 is thermally bonded to second radiation component 252, and plugs supporting bracket 268 simultaneously.Therefore, the heat that produces because of the electronic component 266 of drive installation on FPC plate 22 passes to second radiation component 252 by supporting bracket 268.
At this, heat passes to first radiation component 250 and second radiation component 252 from imaging device 12a and electronic component 266.So first radiation component 250 and second radiation component 252 be by radiation fin 254 and 256 and Heat Conduction Material 56 and conduction effectively each other, and be set to consistent temperature, and can dispel the heat effectively by support frame parts 260.
The imaging device module 10f of Figure 11 is used for being attached to camera main-body 270, and this camera main-body is as the camera case of the single-lens reflex electronic camera of the Figure 12 that constitutes portable electric appts.
In the single-lens reflex electronic camera, in camera main-body 270, be furnished with imaging optical system, finder optical system and focus detection optical system.Imaging optical system comprises imaging lens group 272a, half-mirror 272b and speculum 272c according to the order of light path.
Imaging lens group 272a removably is assembled to camera main-body 270, and is inserted with installation portion simultaneously.Half-mirror 272b is divided into the light path of imaging lens group 272a the direction of imaging device module 10f and finder optical system.Half-mirror 272b is formed by quick recovery speculum, and this restores speculum fast and can combine with shutter 264 and withdraw from imaging optical path.
Speculum 272c will guide to the focus detection optical system from the light of imaging set of lenses 272a.Speculum 272c can combine with half-mirror 272b and withdraw from imaging optical path.When speculum 272c when imaging optical path is withdrawn, be directed to imaging device module 10f from the light of imaging lens group 272a, and between the direction of imaging device module and focus detection optical system, switch from the light path of imaging lens group 272a.
The focus detection optical system comprises collector lens 274a, speculum 274b, aperture diaphragm group 274c, imaging optical system 274e and photo-electric conversion element circuit 274f again.Collector lens 274a is arranged near the imaging surface 272d that stretches out of the imaging surface that is equal to imaging lens group 272a.Speculum 274b is used for holding together from the light of collector lens 274a this light is contained in compact camera main-body 270.Aperture diaphragm group 274c has paired aperture diaphragm respectively along the vertical and horizontal directions.In imaging optical system 274e again, a pair of 274d of imaging len again and the combination of a pair of aperture diaphragm 274c one.
In the combination of a pair of aperture diaphragm 274c and the 274d of imaging len again that tackles mutually, the center of each aperture diaphragm 274c and corresponding imaging len 274d again depart from the optical axis of imaging lens group 272a.
Half-mirror 272b reverberation along on the light path of direction, finder optical system comprises filter (screen) 276a, pentagonal prism 276b and eyepiece 276c.Filter 276a is arranged in the imaging surface that stretches out of the imaging surface that is equal to imaging lens group 272a.
Dust-proof mechanism 100 shown in Figure 4 is arranged and is contained between optical low-pass filter 262 and the shutter 264.That is to say that attachment component 104 uses screw component 110 and is fixed in support frame parts 260, and attachment component 104 is arranged and is contained between optical low-pass filter 262 and the shutter 264.Therefore, combine to transparency glass plate 114 transmission vibrations, and remove the dust that adheres to transparency glass plate 114 surfaces, thereby prevent dust intrusion optical low-pass filter 262 by this vibration with vibration production part 120.
In this embodiment, imaging device module 101,10 and 10a to 10f are combined in camera unit and the single-lens reflex electronic camera.The present invention is not limited to present embodiment.For example, when the imaging device module is combined in comprise such as the portable electric appts of the portable terminal of mobile phone in the time, can obtain similar effects.
(second execution mode)
With reference to Figure 13 second execution mode of the present invention is described below.
Figure 13 is the horizontal cross of expression according near the structure embodiment the mirror/imaging device unit of second embodiment of the invention.
The mirror of second execution mode/imaging device unit 300 is such unit, and it is applied to the single-lens reflex digital camera and is supported by the chassis body of camera body (not shown).
With reference to Figure 13, mirror/imaging device unit 300 comprises side installation portion 302, front baffle 304, mirrored cabinet 306, restores speculum 308, imaging device 12 and afterframe 312 fast.The imaging lens (not shown) attaches to side installation portion 302 interchangeably.Side installation portion 302 attaches to front baffle 304.Restoring speculum 308 fast rotatably is contained in the mirrored cabinet 306.Afterframe 312 is the radiant panels that are bonded to the dorsal part of body side frame 310L and 310R securely.
Front baffle 304 has central opening.Side installation portion 302 is firmly bonded on the front surface side of central opening, and mirrored cabinet 306 is combined in the center of the rear surface side of front baffle 304 securely, and the rear surface portion of front baffle 304 is by the body side frame 310L and the 310R support of chassis body.
Afterframe 312 is formed by corrosion resistant plate or aluminium sheet.The rearward end that afterframe 312 crosses mirrored cabinet 306 arranges, and afterframe 312 is bonded on body side frame 310L and the 310R securely, and is inserted with pillar 314c and 314a respectively simultaneously.Pillar 314a and 314c have constituted thermal insulation part, are used for being blocked in the heat that imaging device 12 produces and transmit to body side frame 310L and 310R from afterframe 312.In afterframe 312, the radiation fin 316 that engages paramount radiation thin plate 50 is outwards arranged to improve thermal radiation effect.Radiation fin 316 is positioned at the position of radiation fin 316 facing to heat reflection parts 16.Receive on body side frame 310L and the 310R by screw thread by the predetermined patchhole in the middle of a plurality of patchholes of utilization in afterframe 312 for afterframe 312.
As mentioned above, front baffle 304, body side frame 310L and 310R and afterframe 312 fixed order and one combination form the box frame main body of hollow with the profile according to camera.
Right side frame 310R forms thinner than left side frame 310L.Therefore, the pillar 314a that is formed by thermal insulation part extends back with the shortage of compensation thickness from the dorsal part of body side frame 310R.Be vertically installed in the screw hole among the body side frame 310L fixedly afterframe 312 of joint screw by front end place at pillar 314a and pillar 314c.The long pillar 314b that is parallel to pillar 314a extension is used for the circuit board 320 at place, afterframe 312 rear portions is inserted the collar at the front end place that is formed on body side frame 310L, thereby circuit board 320 is fixed in body side frame 310R.
Mirrored cabinet 306 forms the box-shaped with central opening, and attaches to front baffle 304 at front surface flange part place.Rotatable quick recovery speculum 308 is arranged in the central opening, and the filter (not shown) is arranged in the opening top.Imaging device 12 is fixed in the rear portion of mirrored cabinet 306, and is inserted with imaging device supporting bracket 322 simultaneously.It is neighbouring with near the temperature the detection imaging device 12 that the temperature sensor (not shown) is arranged in imaging device 12.
Heat reflection parts 50 are engaged to the insulating thin 14 at the dorsal part of imaging device 12.Imaging device supporting bracket 322 be by will being inserted in the screw hole of screws in the dorsal part of mirrored cabinet 306 that inserts in the hole, and attach to mirrored cabinet 306.
In the dorsal part of mirrored cabinet 306, be formed with alignment pin, and alignment pin inserts inserting in the hole of imaging device supporting bracket 322 and afterframe 312 as retainer.Also leave enough gaps simultaneously in the location hole of alignment pin insertion afterframe 312, promptly alignment pin is in the loose fit state, and mirrored cabinet 306 is not directly fixed on afterframe 312.
Assembling structure between the location hole of alignment pin and afterframe 312 becomes, consider the scale error of the position of location hole in the scale error of the external diameter of location hole in the scale error, the position dimension error in the mirrored cabinet 306, afterframe 312 of the diameter of alignment pin in the mirrored cabinet 306 and the afterframe 312, between alignment pin and location hole, have the gap.When the big large deformation of chassis body, a described side clearance reduces, and has prevented further distortion like this.
Imaging device 12 is arranged in the opening in mirrored cabinet 306 dorsal parts, is engaged to the front surface of imaging device supporting bracket 322, and be arranged to by chassis body around.Imaging device 12 has a pair of lead-in wire (splicing ear) 324 that is positioned at the above and below of imaging device 12, and the 324 direction extensions towards optical axis O that go between.In the slotted hole (chip-removal hole) of the slotted hole (chip-removal hole) of the lead-in wire 324 loosening insertion imaging device supporting brackets 322 of imaging device 12, the circular chip-removal hole of afterframe 312 and circuit board 320.Lead-in wire 324 flexible printed boards 326 that are fixed on the circuit board 320, and imaging device 12 and circuit board 320 are electrically connected by pair of flexible printed panel 326.
Circuit board 320 inserts in the claw 310a that is arranged among the body side frame 310L, and by pillar 314b support and fixing by Screw 330.Described pair of flexible printed panel 326 has a plurality of patchholes that have around conductive pattern.The lead-in wire 324 of imaging device 12 can be inserted into and insert in the hole.Described pair of flexible printed panel 326 also has a plurality of connection patterns, and these connect patterns and are electrically connected to described conductive pattern and are connected to connection pattern on the circuit board 320.
For by radiation fin 316 shown in Figure 13 and afterframe 312 heat radiations, in the location arrangements of separating with the rear surface of the encapsulation of making by metal or synthetic resin by the high metal heating panel of thermal conductivity (but not shown in the accompanying drawings).This heating panel links to each other with in the afterframe 312 at least one by copper cash or plate and thermal radiation plate 316, thereby can increase thermal radiation effect.
The present invention is not limited to above-mentioned execution mode, and can make various modifications without departing from the present invention.In first and second execution modes, use the interchangeable single-lens reflex digital camera of camera lens as electronic camera.But the present invention is not limited to the single-lens reflex digital camera, and the present invention can be applicable to compact digital camera.
Therefore, the present invention is not limited to described execution mode, and can make various modifications without departing from the present invention.Described execution mode comprises the invention that is in each stage, but can extract various inventions by disclosed a plurality of formations are carried out appropriate combination.
Even some formation of deletion also can solve problem of the present invention from all shown in the execution mode constitute, under the situation that obtains effect of the present invention, can extract deleted some formation structure as the present invention.
[0159] attendant advantages and modification it will be apparent to those skilled in the art that.Therefore, the present invention more is not limited to the detail and the representative embodiments that show and describe in the broad range here at it.Thereby, can under the situation that does not break away from the spirit or scope that the present invention of being limited by claims and equivalent thereof conceives substantially, make various modifications.

Claims (7)

1. imaging device module, this imaging device module is characterised in that and comprises:
Imaging device, this imaging device are arranged to make that the insulating thin of this imaging device is exposed to this imaging device and the installation surface facing surfaces side that this imaging device is installed;
Flexible printed circuit board, this flexible printed circuit board is contained in the apparatus casing, comprises that the electronic component of described imaging device is installed on the described flexible printed circuit board;
Radiation component, this radiation component is thermally bonded to described apparatus casing, and near described imaging device the dorsal part of the described flexible printed circuit board of local support, and be thermally bonded to the described insulating thin of described imaging device simultaneously;
Heat Conduction Material, this Heat Conduction Material is encapsulated in the described radiation component, and compares with described radiation component and to have good thermal conductivity; And
Support component, this support component is thermally bonded to described radiation component, and near described electronic component the dorsal part of the described flexible printed circuit board of local support.
2. imaging device module according to claim 1 is characterized in that, a latent heat aggregate material is encapsulated in the described radiation component or with described radiation component and links to each other.
3. imaging device module according to claim 1, it is characterized in that, this imaging device module also comprises the lens unit with linear screw mechanism, and this linearity screw mechanism comprises the stepping motor that is provided with white space, and the optical axis of camera lens is by above-mentioned white space.
4. imaging device module according to claim 2 is characterized in that, described radiation component is formed by first radiation component and second radiation component,
Described first radiation component be thermally bonded to the encapsulation and described flexible printed circuit board at least one on, described imaging device is contained in the described encapsulation, and
Between described first radiation component and described second radiation component, be furnished with and compare Heat Conduction Material with excellent heat conductivity with described radiation component.
5. imaging device module according to claim 1 is characterized in that, a latent heat aggregate material is encapsulated in the described radiation component or with described radiation component and links to each other.
6. a portable electric appts uses the imaging device module in this portable electric appts, and this portable electric appts is characterised in that and comprises:
Apparatus casing; And
The imaging device module, this imaging device module arrangement also is contained in the described apparatus casing, and this imaging device module comprises:
Imaging device, this imaging device are arranged to make that the insulating thin of this imaging device is exposed to this imaging device and the installation surface facing surfaces side that this imaging device is installed;
Flexible printed circuit board, this flexible printed circuit board is contained in the described apparatus casing, comprises that the electronic component of described imaging device is installed on the described flexible printed circuit board;
Radiation component, this radiation component is thermally bonded to described apparatus casing, and near described imaging device the dorsal part of the described flexible printed circuit board of local support, and be thermally bonded to the described insulating thin of described imaging device simultaneously;
Heat Conduction Material, this Heat Conduction Material is encapsulated in the described radiation component, and compares with described radiation component and to have good thermal conductivity; And
Support component, this support component is thermally bonded to described radiation component, and near described electronic component the dorsal part of the described flexible printed circuit board of local support.
7. portable electric appts according to claim 6 is characterized in that described apparatus casing is a camera case.
CN200810008690XA 2007-02-08 2008-02-05 Imaging device module and portable electronic apparatus utilizing the same Expired - Fee Related CN101241924B (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007-029337 2007-02-08
JP2007029337 2007-02-08
JP2007029337 2007-02-08
JP2007321138 2007-12-12
JP2007321138A JP5060935B2 (en) 2007-02-08 2007-12-12 Image sensor module and portable electronic device using the same
JP2007-321138 2007-12-12

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN2010102424240A Division CN101916766B (en) 2007-02-08 2008-02-05 Imaging device module and portable electronic apparatus utilizing the same

Publications (2)

Publication Number Publication Date
CN101241924A CN101241924A (en) 2008-08-13
CN101241924B true CN101241924B (en) 2010-09-22

Family

ID=39839292

Family Applications (2)

Application Number Title Priority Date Filing Date
CN200810008690XA Expired - Fee Related CN101241924B (en) 2007-02-08 2008-02-05 Imaging device module and portable electronic apparatus utilizing the same
CN2010102424240A Expired - Fee Related CN101916766B (en) 2007-02-08 2008-02-05 Imaging device module and portable electronic apparatus utilizing the same

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2010102424240A Expired - Fee Related CN101916766B (en) 2007-02-08 2008-02-05 Imaging device module and portable electronic apparatus utilizing the same

Country Status (2)

Country Link
JP (1) JP5060935B2 (en)
CN (2) CN101241924B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010243634A (en) * 2009-04-02 2010-10-28 Sony Corp Image capturing apparatus
CN102129110B (en) * 2010-01-20 2014-05-14 智宝科技股份有限公司 Optical zoom system
JP5574776B2 (en) * 2010-03-26 2014-08-20 キヤノン株式会社 Lens barrel and imaging device
JP5820607B2 (en) * 2011-04-25 2015-11-24 株式会社シグマ Imaging apparatus and imaging system
JP6193753B2 (en) * 2013-06-27 2017-09-06 京セラ株式会社 Imaging device mounting substrate and imaging device
CN107976857B (en) * 2016-10-20 2021-04-30 台湾东电化股份有限公司 Optical system
CN109427264A (en) * 2017-08-30 2019-03-05 深圳市奥拓电子股份有限公司 A kind of light control plate and LED display
CN110896435B (en) * 2018-09-13 2021-07-20 三赢科技（深圳）有限公司 Camera module
JP6756357B2 (en) * 2018-11-29 2020-09-16 株式会社ニコン Imaging device
CN114740674B (en) * 2022-02-28 2023-12-08 广东安达智能装备股份有限公司 Miniature industrial CCD module and assembling method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2665441B2 (en) * 1993-05-21 1997-10-22 オリンパス光学工業株式会社 Endoscope
JPH08107526A (en) * 1994-10-05 1996-04-23 Olympus Optical Co Ltd Electronic image pickup device
JP3875505B2 (en) * 2001-03-29 2007-01-31 オリンパス株式会社 Imaging device
US20040061799A1 (en) * 2002-09-27 2004-04-01 Konica Corporation Image pickup device and portable terminal equipped therewith
US6956272B2 (en) * 2004-03-10 2005-10-18 Micron Technology, Inc. Support frame for semiconductor packages
JP2006174226A (en) * 2004-12-17 2006-06-29 Konica Minolta Photo Imaging Inc Imaging unit and imaging device

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
JP特开2003-110930A 2003.04.11
JP特开2006-174226A 2006.06.29
JP特开2006-332894A 2006.12.07
JP特开2006-349942A 2006.12.28

Also Published As

Publication number Publication date
JP2008219861A (en) 2008-09-18
CN101241924A (en) 2008-08-13
JP5060935B2 (en) 2012-10-31
CN101916766A (en) 2010-12-15
CN101916766B (en) 2013-04-10

Similar Documents

Publication Publication Date Title
CN101241924B (en) Imaging device module and portable electronic apparatus utilizing the same
US11887839B2 (en) Imaging unit and imaging apparatus
US7952640B2 (en) Image pickup element module, and lens unit and portable electronic device using image pickup element modules
US7928358B2 (en) Imaging device module and portable electronic apparatus utilizing the same
JP4083521B2 (en) Imaging device
KR101455124B1 (en) Image pickup apparatus having imaging sensor package
CN114114480B (en) Camera module and optical apparatus including the same
JP7108043B2 (en) Camera module and optical equipment including the same
WO2023001197A1 (en) Infrared thermal imaging shutter and infrared thermal imaging device
US20070153120A1 (en) Imaging apparatus
CN214544466U (en) Camera module and electronic equipment
WO2022127295A1 (en) Optical module
JP2008271487A (en) Imaging element module, lens unit using the imaging element module and portable electronic device
JP2009060459A (en) Heating suppressing method of imaging device, cooling method of imaging device, and electronic camera
JP4769055B2 (en) Cooling imaging unit and imaging apparatus equipped with the imaging cooling unit
US11877045B2 (en) Image-capturing apparatus with a plurality of camera modules and a support member in which at least one camera module is fixed to the support member using an adhesive, and electronic apparatus
JP2008227939A (en) Imaging device module and electronics using it
JP2010193308A (en) Image capturing unit
JP2013229894A (en) Imaging element module, lens unit using the same, and portable electronic apparatus using the same
RU2818664C2 (en) Drive motor, video camera module and electronic device
TWI802913B (en) Camera module and electronic device
CN115327810B (en) Light leakage prevention liquid crystal display module with good heat dissipation performance
KR20130024305A (en) Camera module
JP2017169176A (en) Imaging apparatus
CN115769123A (en) Driving motor, camera module and electronic equipment

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20151117

Address after: Tokyo, Japan, Japan

Patentee after: Olympus Corporation

Address before: Tokyo, Japan

Patentee before: Olympus Imaging Corp.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100922

Termination date: 20190205