WO2023001197A1

WO2023001197A1 - Infrared thermal imaging shutter and infrared thermal imaging device

Info

Publication number: WO2023001197A1
Application number: PCT/CN2022/106810
Authority: WO
Inventors: 胡长伟; 蒋红卫; 戴挺
Original assignee: 杭州微影软件有限公司
Priority date: 2021-07-23
Filing date: 2022-07-20
Publication date: 2023-01-26
Also published as: CN220437589U; CN113566978A

Abstract

An infrared thermal imaging shutter (1) and an infrared thermal imaging device (10). The infrared thermal imaging shutter (1) comprises a shutter body (2); a light transmission opening (3) is provided on the shutter body (2); and an infrared transmission component (4) blocks the light transmission opening (3). The infrared thermal imaging device (10) comprises an infrared thermal imaging shutter (30) and a detector module (20); the detector module (20) comprises an infrared detector chip (201); the infrared detector chip (201) is provided with an infrared window layer (202); the infrared thermal imaging shutter (30) comprises a light transmission opening (301); and the light transmission opening (301) corresponds to the infrared window layer (202).

Description

Infrared thermal imaging shutter and infrared thermal imaging device

technical field

The present disclosure relates to the technical field of infrared detection, in particular to an infrared thermal imaging shutter and an infrared thermal imaging device.

Background technique

The infrared detector chip has a metal package, a ceramic shell package, and a COB (Chip on Board, chip on board) package in the package form. Since the COB package can directly paste the infrared detector chip on the PCB board (Printed Circuit Board, printed circuit board), the infrared detector chip and the PCB board are connected by metal wires, so this packaging method does not require metal shells and The ceramic shell can be made very small, suitable for miniaturized and integrated product applications.

However, since the COB-packaged infrared detector chip is not wrapped like metal and ceramics, the distance between the infrared window layer on the infrared detector chip and the internal focal plane of the chip is very close. If there are dust particles and other pollutants falling on the On the infrared window layer, white spots or grains will form on the image, which will affect the quality of the image.

Contents of the invention

In view of this, an embodiment of the present disclosure provides an infrared thermal imaging shutter and an infrared thermal imaging device, so as to improve the quality of infrared thermal imaging.

In a first aspect, an embodiment of the present disclosure provides an infrared thermal imaging shutter, including: a shutter body, a light-transmitting opening is provided on the shutter body, and an infrared-transmitting member blocking the light-transmitting opening.

According to a specific implementation of an embodiment of the present disclosure, the infrared transmission member is arranged on the light exit side of the light transmission port; or, the infrared transmission member is provided on the light entrance side of the light transmission port; or , the infrared-transmitting member is blocked in the light-transmitting opening.

According to a specific implementation manner of an embodiment of the present disclosure, on the shutter body, a groove is provided on the light exit side of the light transmission port, and the infrared transmission member is disposed in the groove.

According to a specific implementation manner of an embodiment of the present disclosure, the infrared-transmitting member is a sheet or plate-shaped body made of an infrared-transmitting material.

According to a specific implementation of an embodiment of the present disclosure, the infrared transparent member is bonded to the shutter body by glue; or, the infrared transparent member is pressed against the shutter body by a pressing member; or, the The infrared transmission part is fixed on the shutter body through a clip.

In the second aspect, the embodiment of the present disclosure also provides an infrared thermal imaging device, including: an infrared thermal imaging shutter and a detector module; wherein, the detector module includes an infrared detector chip, and the infrared detector chip There is an infrared window layer on it; the infrared thermal imaging shutter is the infrared thermal imaging shutter described in any of the aforementioned implementation modes, and a light-transmitting port is provided on the shutter body, and the light-transmitting port corresponds to the infrared window layer .

According to a specific implementation of an embodiment of the present disclosure, the detector module further includes a printed circuit board, on which a heat conduction layer is arranged; the infrared detector chip is arranged on the heat conduction layer, And through the metal wire through the heat conduction layer and electrically connected to the printed circuit board; or, the detector module also includes a printed circuit board, and the infrared detector chip is arranged on the printed circuit board , and is electrically connected to the printed circuit board through metal wires.

According to a specific implementation manner of an embodiment of the present disclosure, an accommodating cavity is formed between the infrared thermal imaging shutter and the heat conduction layer, and the infrared detector chip is located in the accommodating cavity.

According to a specific implementation manner of an embodiment of the present disclosure, an accommodating cavity is formed between the infrared thermal imaging shutter and the printed circuit board, and the infrared detector chip is located in the accommodating cavity.

According to a specific implementation of an embodiment of the present disclosure, an annular side wall is provided on the side of the heat conduction layer close to the infrared thermal imaging shutter, and the end surface of the side wall is close to the heat conduction layer with the infrared thermal imaging shutter. One side of the thermal imaging shutter is in contact with the side wall, the side of the heat conduction layer close to the infrared thermal imaging shutter, and the side of the infrared thermal imaging shutter close to the heat conduction layer, enclosing the accommodating cavity or, an annular side wall is provided on the side of the infrared thermal imaging shutter close to the heat conduction layer, and the end face of the side wall is in contact with the side of the heat conduction layer close to the infrared thermal imaging shutter, so The side wall, the side of the infrared thermal imaging shutter close to the heat conduction layer, and the side of the heat conduction layer close to the infrared thermal imaging shutter form the accommodating cavity.

According to a specific implementation of an embodiment of the present disclosure, a flexible dust-proof member is provided around the infrared detector chip on the heat-conducting layer; the first side of the flexible dust-proof member is in contact with the heat-conducting layer , the second side is in contact with the infrared thermal imaging shutter.

According to a specific implementation of an embodiment of the present disclosure, a flexible dust-proof member is provided around the infrared detector chip on the printed circuit board; the first side of the flexible dust-proof member is in contact with the printed circuit board. The circuit board is in contact, and the second side is in contact with the infrared thermal imaging shutter.

According to a specific implementation manner of an embodiment of the present disclosure, a first threading hole is provided on the printed circuit board, a second threading hole is provided on the heat conduction layer, and the first threading hole and the second threading hole The holes correspond to each other; a threading notch or a third threading hole is provided on the flexible dust-proof member, and the threading notch or the third threading hole corresponds to the second threading hole.

According to a specific implementation manner of an embodiment of the present disclosure, a groove is provided on the heat conducting layer, and the infrared detector chip is arranged in the groove.

According to a specific implementation of an embodiment of the present disclosure, the distance between the outer surface of the infrared transparent member and the focal plane of the infrared detector chip is greater than or equal to 1mm and less than or equal to 6mm; wherein, the distance between the outer surface of the infrared transparent member The outer surface is the surface on the side of the infrared transmitting member away from the infrared detector chip.

In the embodiment of the present disclosure, the infrared thermal imaging shutter and the infrared thermal imaging device set an infrared transmission member at the light transmission port of the infrared thermal imaging shutter. The light port enters to affect the infrared thermal imaging, so as to facilitate the improvement of the infrared thermal imaging quality.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present disclosure. Those skilled in the art can also obtain other drawings based on these drawings without creative work.

FIG. 1 is a schematic diagram of a three-dimensional structure of an infrared thermal imaging shutter according to an embodiment of the present disclosure;

Fig. 2 is a schematic cross-sectional structure diagram of Fig. 1 (the blades and other structures in the light-transmitting port are omitted);

3 is a schematic diagram of the overall structure of an infrared detector according to an embodiment of the present disclosure;

Fig. 4 is a schematic diagram of the three-dimensional structure of the infrared thermal imaging shutter in Fig. 3;

Fig. 5 is a schematic diagram of the three-dimensional structure of the detector module in Fig. 3;

Figure 6a is a schematic cross-sectional view of Figure 3, and Figure 6b is a schematic cross-sectional view of Figure 3 in another embodiment;

Fig. 7 is an enlarged schematic view of Fig. 6a.

detailed description

Embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. It should be clear that the described embodiments are only some of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present disclosure.

The embodiment of the present disclosure aims to provide an infrared thermal imaging shutter, an infrared detector, and an infrared thermal imaging device. By setting an infrared transmission member at the light transmission port of the infrared thermal imaging shutter, it is possible to prevent dust particles from passing through the infrared thermal imaging shutter. The light transmission port enters to affect the infrared thermal imaging, so that the quality of infrared thermal imaging can be improved.

Infrared thermal imaging mainly uses the spectral radiation emitted by the observed object itself to obtain target images, and mainly works in two atmospheric windows of 3μm-5μm and 8μm-14μm. In one example, the infrared detector of the embodiment of the present disclosure can work in an atmospheric window of 8 μm-14 μm.

Fig. 1 is a schematic structural diagram of an infrared thermal imaging shutter according to an embodiment of the present disclosure. Referring to Fig. 1, the infrared thermal imaging shutter 1 of this embodiment includes: a shutter body 2, on which a light-transmitting port 3 is provided, and The light-transmitting port 3 is blocked by an infrared-transmitting member 4 .

Wherein, the infrared transparent member 4 is a component made of infrared transparent material. The infrared transparent material is a material that can transmit light in the wavelength range of 1-14 μm. The infrared transparent material can be silicon, germanium, zinc sulfide, zinc selenide, etc. The infrared transparent member 4 may be in the shape of a sheet, a plate, or the like. In some implementations, an anti-reflection film may be coated on at least one side of the infrared transmission member 4 .

The infrared transmission part 4 can be fixed on the infrared thermal imaging shutter by glue, or can be fixed on the infrared thermal imaging shutter by pressing the pressing part, or can be fixed on the shutter body by a clip . The pressing piece or clamping piece can be a pressing piece or clamping piece with elasticity, or a pressing piece or clamping piece without elasticity. A tight connection can be realized between the infrared transmission member 4 and the infrared thermal imaging shutter, so that dust cannot pass through the joint surface of the two.

The infrared transmission member 4 can transmit infrared light, and at the same time, can block dust particles and the like from entering through the light transmission port to affect infrared thermal imaging. In this embodiment, the infrared thermal imaging quality can be improved by arranging the infrared transmission member 4 at the light transmission port 3 .

As shown in FIG. 2 , there are usually extendable or retractable blades (not shown in the figure) inside the light transmission port 3 , and the opening and closing of the blades can be controlled by the control circuit board. In order to avoid dust particles that may exist at the blades from running out from the light exit side 5 of the light transmission port 3, in a possible implementation, the infrared transmission member 4 can be blocked on the light exit side 5 of the light transmission port 3, so that It can prevent the dust particles outside the infrared thermal imaging shutter from falling on the imaging device (such as an infrared detector chip) after running out of the light outlet side 5 of the light transmission port 3, and can also avoid the possible existence of dust particles at the blades inside the light transmission port 3. The dust particles run out from the light exit side of the light transmission port 3 and land on the imaging device, which can block the dust particles more completely, so as to prevent the dust particles from affecting the infrared thermal imaging, thereby facilitating better improvement of the infrared thermal imaging quality. Embodiments of the present disclosure are not limited thereto.

In another possible implementation manner, the infrared transmission member 4 may also be arranged on the light incident side 6 of the light transmission opening 3 . In other embodiments, the infrared transparent member 4 can also be blocked in the light-transmitting opening 3 . It should be understood that, when the infrared transparent member 4 is blocked in the light transmission opening 3 , the infrared transmission member 4 will not interfere with the protruding or retractable blades in the light transmission opening 3 .

Referring to Fig. 2, when the infrared transmission member 4 is blocked on the light exit side 5 of the light transmission port 3, on the shutter body 2, a groove 7 is provided on the light exit side 5 of the light transmission port 3, and the The infrared transparent part 4 can be arranged in the groove 7, so that the structure of the whole infrared thermal imaging shutter can be made more compact.

Referring to Fig. 3 and Fig. 6a and 6b, the infrared detector 10 of this embodiment may include: a detector module 20 and an infrared thermal imaging shutter 30, wherein the detector module 20 includes an infrared detector chip 201, and in the infrared detector There is an infrared window layer 202 on the chip 201; a light transmission port 301 is provided on the infrared thermal imaging shutter 30, and an infrared transmission member 302 is blocked at the light transmission port 301; the light transmission port 301 corresponds to the infrared window layer 202, an example Among them, the light-transmitting opening 301 can be arranged coaxially with the infrared window layer 202 .

The infrared detector in this embodiment may be a cooled or uncooled infrared focal plane infrared detector.

On the focal plane of the infrared detector chip, an array of photosensitive elements (that is, an array of picture elements) is arranged. The infrared window layer is the packaging structure of the infrared detector chip, and the infrared detector chip is vacuum-packaged through the infrared window layer. The infrared detector chip with the infrared window layer may be obtained by packaging the infrared detector chip at the wafer level or at the pixel level. The infrared window layer may be a silicon wafer or a germanium wafer, therefore, the infrared window layer may also be called a silicon window layer or a germanium window layer, referred to as a silicon window or a germanium window.

As shown in FIG. 3 , the infrared thermal imaging shutter 30 can be fixedly connected with the detector module 20 . Extendable or retractable blades (not shown in the figure) can be provided in the light transmission port 301 of the infrared thermal imaging shutter 30, and the zero adjustment and correction of the detector module can be realized by controlling the opening and closing of the blades .

The infrared transmission member 302 provided on the infrared thermal imaging shutter 30 may be a component made of an infrared transmission material. The infrared transparent material is a material that can transmit light in the wavelength range of 1-14 μm. The infrared transparent material can be silicon, germanium, zinc sulfide, zinc selenide, etc. The infrared transparent member 302 can be in the shape of a sheet, a plate, or the like. In some implementations, an anti-reflection film may be coated on at least one side of the infrared transmission member 302 .

The infrared transmission part 302 can be fixed on the thermal imaging shutter 30 by glue, can also be fixed on the thermal imaging shutter 30 by pressing a pressing part, or can be fixed on the thermal imaging shutter 30 by a clip. Shutter 30 on. In this way, a tight connection can be realized between the infrared transmission member and the infrared thermal imaging shutter, so that dust cannot pass through the joint surface of the two. When installing the infrared transmission part, it is necessary to keep the surface of the infrared transmission part clean and free of dirt, and not to introduce dust particles.

The infrared transmission member 302 is set at the light transmission port 301 to prevent external dust particles from falling on the infrared window layer 202 after entering through the light transmission port 301, so that the infrared detector chip can be improved. 201 thermal imaging quality. Even if dust particles fall on the surface of the infrared transmission part 302, due to the existence of the infrared transmission part 302, the dust particles are relatively far away from the focal plane of the infrared detector chip 201, thus reducing the impact of the infrared detector chip 201 on the dust. The sensitivity of the particles can also improve the thermal imaging quality of the infrared detector chip 201 to a certain extent.

Referring to Fig. 3 and Fig. 4, in the present embodiment, infrared transmission part 302 is arranged on the side (also can be referred to as the bottom of infrared thermal imaging shutter) of infrared thermal imaging shutter 30 close to detector module 20, can make full use of like this The spatial position of the infrared thermal imaging shutter 30 close to the side of the detector module 20 not only has a dust-proof effect, but also makes the overall structure more compact. In other embodiments, the infrared transmission member 302 can also be arranged on the side of the infrared thermal imaging shutter 30 away from the detector module 20 (also referred to as the top of the infrared thermal imaging shutter), or at the light transmission port Inside 301.

When the infrared transparent member 302 is arranged on the side of the infrared thermal imaging shutter 30 close to the detector module 20, in order to increase the distance between the infrared transparent member 302 and the infrared window layer 202 as much as possible, to more effectively reduce the infrared For the sensitivity of the detector chip 201 to dust particles, a groove 303 can be provided on the side of the infrared thermal imaging shutter 30 close to the detector module 20 , and the infrared transparent member 302 can be arranged in the groove 303 .

Referring to Fig. 6a and b, the detector module 20 also includes a printed circuit board 203, on which a heat conduction layer 204 can be arranged; the infrared detector chip 201 is arranged on the heat conduction layer 204, and is passed through by a metal wire. The heat conducting layer 204 is electrically connected to the printed circuit board 203 . The infrared detector chip 201 can be dissipated through the heat conduction layer 204 . In a possible implementation manner, the heat conduction layer 204 may be a metal heat conduction sheet, and the embodiments of the present disclosure are not limited thereto. In other embodiments, the infrared detector chip 201 may also be directly disposed on the printed circuit board, and electrically connected to the printed circuit board through metal wires. The printed circuit board can be a semi-finished product after SMT/wave soldering, also called PCBA. The infrared detector chip is placed on the PCB board through the COB packaging form, and the volume of the device can be made relatively small, which is suitable for the application of miniaturized and integrated products.

In one embodiment, an accommodation cavity 205 may be formed between the infrared thermal imaging shutter 30 and the heat conduction layer 204 , and the infrared detector chip 201 is located in the accommodation cavity 205 .

In this embodiment, as shown in FIG. 6 a , an annular side wall 206 can be provided on the side of the heat conduction layer 204 close to the infrared thermal imaging shutter 30 , and the end face of the side wall 206 is close to the side of the infrared thermal imaging shutter 30 close to the heat conduction layer 204 . The sides are in contact, the side wall 206 , the side of the heat conduction layer 204 close to the infrared thermal imaging shutter 30 , and the side of the infrared thermal imaging shutter 30 close to the heat conduction layer 204 enclose the accommodating cavity 205 . The thermally conductive layer 204 with side walls 206 may also be referred to as a heat sink.

In other embodiments, an annular side wall 206 (as shown in FIG. 6 b ) is provided on the side of the infrared thermal imaging shutter 30 close to the heat conduction layer 204 , and the end face of the side wall 206 is close to the side of the heat conduction layer 204 close to the infrared thermal imaging shutter 30 . One side is in contact, and the side wall, the side of the infrared thermal imaging shutter 30 close to the heat conduction layer 204 , and the side of the heat conduction layer 204 close to the infrared thermal imaging shutter 30 enclose the accommodating cavity.

Through the accommodating cavity, the infrared detector chip can be protected, reducing the possibility of dust particles entering from between the infrared thermal imaging shutter and the heat conduction layer (also called the side) and falling on the infrared window layer sex.

Referring to Fig. 5 and Fig. 6a and b, in order to more completely block dust particles (especially fine dust particles) from falling on the infrared window layer 202 from between the infrared thermal imaging shutter 30 and the heat conduction layer 204, the accommodating cavity 205 can Inside, the flexible dust-proof member 40 is arranged around the infrared detector chip 201, and the first side of the flexible dust-proof member 40 is in contact with the heat conduction layer 204, and the second side is in contact with the infrared thermal imaging shutter 30, so that the flexible The dust-proof part 40, the heat conduction layer 204 and the infrared thermal imaging shutter 30 form a closed cavity, and the infrared detector chip 201 is located in the closed cavity, through which the closed cavity can be more thoroughly (or more effectively) Prevent dust particles from entering from the assembly gap between the infrared thermal imaging shutter 30 and the detector module 20 and falling on the infrared window layer 202 .

In this embodiment, the infrared transmission part assembled at the bottom of the infrared thermal imaging shutter can isolate the introduction of dust particles above the detector, and the flexible dustproof part can prevent dust particles from entering from the assembly gap between the infrared thermal imaging shutter and the detector module. In summary, the dust-proof effect of the two makes the infrared detector chip be enclosed in a smaller cavity, which can prevent the introduction of external dust.

Referring to Fig. 7, the height of the top surface (i.e. the outer surface) of the infrared transmission member from the focal plane of the infrared detector chip is h1, the thickness of the infrared transmission member is t, and the distance from the top surface of the infrared window layer of the infrared detector chip to the focal plane is h1. The height is h2, and the gap between the bottom surface of the infrared transmission part and the top surface of the infrared detector chip is s, then h1=h2+s+t; in this embodiment, the external dust particles will be isolated outside the infrared transmission part , that is, the minimum distance between the height of dust particles and the focal plane of the detector h=h1=h2+s+t, h>h2, that is, the distance between dust particles and the focal plane of the infrared detector chip is effectively increased, thereby reducing the infrared detector The sensitivity of the chip to dust particles, even if dust falls on the surface of the infrared transmission part, it will not have a significant impact on the imaging of the infrared detector chip.

In one example, the distance h between the outer surface of the infrared transmission member and the focal plane of the infrared detector chip can be greater than or equal to 1mm and less than or equal to 6mm, which can significantly reduce the infrared detector chip's resistance to dust particles. Sensitivity; wherein, the outer surface of the infrared-transmitting member is the surface of the infrared-transmitting member on a side away from the infrared detector chip.

The height of the flexible dust-proof part 40 can be greater than the height of the side wall 206. In this way, when the infrared thermal imaging shutter 30 and the detector module 20 are fixed together, the flexible dust-proof part 40 can be extruded by the infrared thermal imaging shutter 30. It is ensured that the two sides of the flexible dust-proof member 40 (ie, the aforementioned first side and the second side) are in close contact with the heat-conducting layer 204 and the infrared thermal imaging shutter 30 respectively, so as to improve the sealing performance.

The flexible dust-proof member 40 can be a flat annular body with a window in the middle. The material of the flexible dust-proof member 40 may be rubber or foam, etc. In a possible implementation manner, the flexible dust-proof member 40 may be made of dust-free foam.

The accommodating cavity formed between the infrared thermal imaging shutter 30 and the heat conduction layer 204 can prevent larger dust particles from falling on the infrared window layer 202 from between the infrared thermal imaging shutter 30 and the heat conduction layer 204 . Further, the closed cavity formed between the flexible dust-proof member 40, the heat-conducting layer 204 and the infrared thermal imaging shutter 30 can block fine dust particles from assembling the infrared thermal imaging shutter 30 and the detector module 20. The gap enters and falls on the infrared window layer 202 .

A heat conduction layer is provided on the printed circuit board, but when the aforesaid accommodating cavity (not shown) is formed between the infrared thermal imaging shutter and the heat conduction layer, in order to prevent dust particles from passing from the infrared thermal imaging shutter and the detector module The assembly gap of the group enters and falls on the infrared window layer, and a flexible dustproof part can also be arranged around the infrared detector chip; the first side of the flexible dustproof part is in contact with the heat conduction layer, and the second side is in contact with the infrared thermal imaging shutter 30 contacts. In this way, dust particles can also be effectively prevented from entering between the assembly surface of the infrared thermal imaging shutter and the detector module and falling on the infrared window layer.

As shown in Figure 6a and b, the infrared thermal imaging shutter 30 can be provided with a drive circuit board 304 (not shown) that drives the blades on the infrared thermal imaging shutter 30 to extend or retract, and the drive circuit board 304 can pass through The wire is electrically connected to the infrared thermal imaging shutter connector 207 on the printed circuit board 203 . In one embodiment, a first threading hole 208 is provided on the printed circuit board 203, a second threading hole 209 is provided on the heat conducting layer 204, and the first threading hole 208 corresponds to the second threading hole 209; The wires of the driving circuit board 304 at the bottom of the thermal imaging shutter 30 are electrically connected to the infrared thermal imaging shutter connector 207 on the printed circuit board 203 through the second threading hole 209 and the first threading hole 208 . A threading notch 401 (not shown) or a third threading hole may be provided on the flexible dustproof member 40, the threading notch 401 or the third threading hole corresponds to the second threading hole 209, the threading notch 401 or The third threading hole can avoid the wires, so that the presence of the flexible dust-proof member 40 will not electrically connect the wires to the drive circuit board and the infrared thermal imaging shutter connector 207 on the printed circuit board. The connection acts as a hindrance.

In a possible implementation manner, when the infrared detector chip is directly arranged on the printed circuit board (not shown), an accommodating cavity may also be formed between the infrared thermal imaging shutter and the printed circuit board. The detector chip is located in the accommodating cavity. The form of the accommodation cavity is similar to that of the accommodation cavity between the infrared thermal imaging shutter and the heat conduction layer in the foregoing embodiments.

In this embodiment, in the accommodating cavity formed between the infrared thermal imaging shutter and the printed circuit board, a flexible dust-proof member can also be arranged around the infrared detector chip, and the first side of the flexible dust-proof member It is in contact with the printed circuit board, and the second side is in contact with the infrared thermal imaging shutter, so that a closed cavity can be formed between the flexible dustproof part, the printed circuit board and the infrared thermal imaging shutter, and the infrared detector chip Located in the closed cavity, the closed cavity can more thoroughly (or more effectively) prevent dust particles from entering from the assembly gap between the infrared thermal imaging shutter and the detector module and falling on the infrared window layer.

In this embodiment, through the accommodating cavity formed between the infrared thermal imaging shutter and the printed circuit board, larger dust particles can be prevented from entering and falling into the gap between the infrared thermal imaging shutter and the detector module. on the infrared window layer. Further, the closed cavity formed between the flexible dust-proof member, the printed circuit board and the infrared thermal imaging shutter can prevent fine dust particles from entering from the assembly gap between the infrared thermal imaging shutter and the detector module. Fall on the infrared window layer.

In a possible implementation manner, in order to protect the infrared detector chip 201 as shown in Fig. In this way, in addition to cooling the infrared detector chip 201, the heat conducting layer 204 can also protect the infrared detector chip 201 through the groove 210, and the embodiment of the present disclosure is not limited thereto. Those skilled in the art should understand that the thermal conduction layer 204 may not be provided with a groove for placing the infrared detector chip.

A detector module external connector 211 may be provided on the back of the printed circuit board 203 .

In a possible implementation manner, when the infrared detector chip is directly arranged on the printed circuit board, but there is no accommodating cavity (not shown) formed between the infrared thermal imaging shutter and the printed circuit board, To prevent dust particles from entering the assembly gap between the infrared thermal imaging shutter and the detector module and falling on the infrared window layer, a flexible dustproof part can also be arranged around the infrared detector chip; the first side of the flexible dustproof part is in contact with the printed The circuit board is in contact with the second side, and the second side is in contact with the infrared thermal imaging shutter. In this way, dust particles can be effectively prevented from entering from the assembly gap between the infrared thermal imaging shutter and the detector module and falling on the infrared window layer.

The above embodiments are especially suitable for infrared detector chips in COB packaging. Compared with other packaging forms, the device volume can be relatively small, which is suitable for miniaturization and integrated product applications, and by setting infrared transmission parts, external dust can be prevented Particles fall on the infrared window layer after entering through the light-transmitting opening, so that the thermal imaging quality of the infrared detector chip can be improved. Dust particles can only fall on the surface of the infrared transmission part, which increases the distance between the focal plane of the infrared detector chip and the dust particles, effectively reduces the sensitivity of the infrared detector chip to dust, and can also improve the performance of the infrared detector chip to a certain extent. thermal imaging quality.

Embodiments of the present disclosure also provide an infrared thermal imaging device, which includes the infrared detector described in any one of the foregoing embodiments.

In the infrared thermal imaging device of this embodiment, by arranging an infrared transparent member on the infrared thermal imaging shutter of the infrared detector, dust particles can be prevented from falling on the infrared window layer on the infrared detector chip, which is conducive to reducing the temperature of the infrared detector chip. Sensitivity to dust particles improves the imaging quality of the infrared detector chip. Specifically, in the infrared detector and the infrared thermal imaging device of the embodiment of the present disclosure, the space at the bottom of the infrared thermal imaging shutter can be effectively used, and an infrared transmission member is installed at the bottom of the infrared thermal imaging shutter to isolate the dust from the area above the infrared detector. At the same time, the circumference of the infrared detector chip can be covered with flexible dust-proof parts. After the infrared thermal imaging shutter is assembled to the infrared detector module, the flexible dust-proof parts are pressed together to isolate the dust from the side area of the infrared detector. It is enclosed in a small cavity to prevent other dust from being introduced into the infrared detector.

An infrared transmission part is installed at the bottom of the infrared thermal imaging shutter, dust particles can only fall on the surface of the infrared transmission part, which increases the distance between the focal plane of the infrared detector chip and dust particles, effectively reducing the sensitivity of the infrared detector chip to dust In this way, it will not cause problems such as white spots in the image, which greatly improves the image quality and reduces the difficulty of controlling dust particles in the production process.

It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is a relationship between these entities or operations. There is no such actual relationship or order between them. Furthermore, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus comprising a set of elements includes not only those elements, but also includes elements not expressly listed. other elements of or also include elements inherent in such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

Each embodiment in this specification is described in a related manner, the same and similar parts of each embodiment can be referred to each other, and each embodiment focuses on the differences from other embodiments.

For the convenience of description, the above devices are described by dividing their functions into various units/modules and describing them separately. Of course, when implementing the present disclosure, the functions of each unit/module can be implemented in one or more pieces of software and/or hardware.

The above is only a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present disclosure should be within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be determined by the protection scope of the claims.

Claims

An infrared thermal imaging shutter comprising:

A shutter body (2), which is provided with a light-transmitting port (3) on the shutter body (2), and

An infrared transmission member (4) arranged at the light transmission opening (3) is blocked.
The infrared thermal imaging shutter according to claim 1, wherein,

The infrared transmission member (4) is blocked on the light exit side (5) of the light transmission port (3); or,

The infrared transmission member (4) is blocked on the light incident side (6) of the light transmission port (3); or,

The infrared transmission member (4) is blocked in the light transmission opening (3).
The infrared thermal imaging shutter according to claim 1, wherein, on the shutter body (2), a groove (7) is provided on the light exit side (5) of the light transmission port (3), and the infrared The penetrating member (4) is arranged in the groove (7).
The infrared thermal imaging shutter according to any one of claims 1-3, wherein the infrared transparent member (4) is a sheet or plate made of infrared transparent material.
The infrared thermal imaging shutter according to any one of claims 1-4, wherein,

The infrared transmission member (4) is bonded to the shutter body (2) by glue; or,

The infrared transparent member (4) is pressed against the shutter body (2) by a pressing member; or,

The infrared transparent part (4) is fixed on the shutter body (2) through a clip.
An infrared thermal imaging device, comprising: an infrared thermal imaging shutter (30) and a detector module (20); wherein,

The detector module (20) includes an infrared detector chip (201), and an infrared window layer (202) is provided on the infrared detector chip (201);

The infrared thermal imaging shutter (30) is the infrared thermal imaging shutter (1) described in any one of the preceding claims 1-4, and a light transmission port (301) is provided on the shutter body, and the light transmission port ( 301) corresponds to the infrared window layer (202).
The infrared thermal imaging device according to claim 6, wherein,

The detector module (20) also includes a printed circuit board (203), on which a heat conduction layer (204) is arranged; the infrared detector chip (201) is arranged on the on the heat-conducting layer (204), and pass through the heat-conducting layer (204) to be electrically connected with the printed circuit board (203) through a metal wire;

or,

The detector module (20) also includes a printed circuit board (203), the infrared detector chip (201) is arranged on the printed circuit board (203), and is connected to the printed circuit board (203) through a metal wire. The circuit board (203) is electrically connected.
The infrared thermal imaging device according to claim 7, wherein an accommodation cavity (205) is formed between the infrared thermal imaging shutter (30) and the heat conduction layer (204), and the infrared detector chip (201) is located in the accommodation cavity (205).
The infrared thermal imaging device according to claim 7, wherein an accommodation cavity (205) is formed between the infrared thermal imaging shutter (30) and the printed circuit board (203), and the infrared detection The device chip (201) is located in the accommodating cavity (205).
The infrared thermal imaging device according to claim 8, wherein an annular side wall (206) is provided on the side of the heat-conducting layer (204) close to the infrared thermal imaging shutter (30), and the side wall ( 206) is in contact with the side of the infrared thermal imaging shutter (30) close to the heat conduction layer (204), and the side wall (206) and the heat conduction layer (204) are close to the infrared thermal imaging shutter One side of (30) and the side of the infrared thermal imaging shutter (30) close to the heat conduction layer (204) enclose the accommodation cavity (205); or,

An annular side wall (206) is provided on the side of the infrared thermal imaging shutter (30) close to the heat conduction layer (204), and the end face of the side wall (206) is close to the heat conduction layer (204). One side of the infrared thermal imaging shutter (30) is in contact, the side wall (206), the side of the infrared thermal imaging shutter (30) close to the heat conduction layer (204), and the heat conduction layer (204 ) close to the side of the infrared thermal imaging shutter (30), enclosing the accommodating cavity (205).
The infrared thermal imaging device according to any one of claims 7, 8 or 10, wherein, on the heat conducting layer (204), a flexible dust-proof member ( 40); the first side of the flexible dust-proof member (40) is in contact with the heat conduction layer (204), and the second side is in contact with the infrared thermal imaging shutter (30).
The infrared thermal imaging device according to claim 9, wherein, on the printed circuit board (203), a flexible dust-proof member (40) is arranged around the infrared detector chip (201); The first side of the flexible dustproof member (40) is in contact with the printed circuit board (203), and the second side is in contact with the infrared thermal imaging shutter (30).
The infrared thermal imaging device according to claim 11, wherein a first threading hole (208) is provided on the printed circuit board (203), and a second threading hole is provided on the heat conducting layer (204) (209), the first threading hole (208) corresponds to the second threading hole (209);

A threading notch (401) or a third threading hole is provided on the flexible dustproof member (40), and the threading notch (401) or the third threading hole corresponds to the second threading hole (209) .
The infrared thermal imaging device according to any one of claims 7, 8, 10-13, wherein a groove (210) is provided on the heat conducting layer (204), and the infrared detector chip (201) is provided with within said groove (210).
The infrared thermal imaging device according to any one of claims 6-14, wherein the distance between the outer surface of the infrared transmission member (302) and the focal plane of the infrared detector chip (201) is greater than or equal to 1mm, less than or equal to 6mm; wherein, the outer surface of the infrared transmission member (302) is the surface of the infrared transmission member (302) away from the infrared detector chip (201).