CN213364039U - Soft and hard board subassembly and infrared module - Google Patents
Soft and hard board subassembly and infrared module Download PDFInfo
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- CN213364039U CN213364039U CN202022627453.0U CN202022627453U CN213364039U CN 213364039 U CN213364039 U CN 213364039U CN 202022627453 U CN202022627453 U CN 202022627453U CN 213364039 U CN213364039 U CN 213364039U
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Abstract
The utility model relates to a soft or hard board subassembly and infrared module, soft or hard board subassembly includes A, B circuit board and connecting plate, and the A circuit board includes hardboard layer A1, A2, and the B circuit board includes hardboard layer B1, B2, and the connecting plate includes connecting cable and connecting plate CA, CB; the connecting plate CA is provided with a contact CA matched with the electric contact A, and the connecting plate CB is provided with a contact CB matched with the electric contact B; the contact CA is communicated with the contact CB through a connecting cable; the connection plates CA are crimped between the hard board layers A1, A2, and the connection plates CB are crimped between the hard board layers B1, B2. The infrared module comprises an infrared module assembly and a soft and hard board assembly, and the infrared module assembly is installed on the soft and hard board assembly through a board bracket. The utility model fully utilizes the advantages of the soft and hard plate component, light weight and thin medium; the working efficiency is improved; the plate occupying the internal structural space of the module is reduced; the reliability testing capability of the entire machine such as vibration impact and the like can be effectively improved.
Description
Technical Field
The utility model relates to a soft or hard board subassembly and adopt infrared module of this soft or hard board subassembly belongs to infrared thermal imaging technical field.
Background
Pcb (printed Circuit board), which is called printed Circuit board in chinese, is an important electronic component, is a support for electronic components, and is a carrier for electrical connection of electronic components. It is called a "printed" circuit board because it is made using electronic printing.
The existing miniaturized infrared equipment has very small volume, the volume required between the PCB and the PCB is also very small, and the existing miniaturized infrared module has the following defects: use FPC flexible circuit board to connect two stereoplasm PCB boards in the PCB board design, use SMT technique to weld the welding agent such as tin with the FPC connector firmly on every PCB board specifically, then use the FPC soft arranging wire that both ends have the golden finger to insert respectively in the draw-in groove of the FPC connector at both ends, utilize the draw-in groove of FPC connector to push down the FPC golden finger, make the contact of FPC golden finger contact FPC connector realize electrical connection, the connector of installing on the circuit board occupies the volume ratio greatly, miniaturized infrared module volume is subject to module structure position, communication is difficult to realize between board and the board. Moreover, the connection strength between the FPC golden finger and the hard PCB board has general reliability testing capabilities such as vibration impact resistance, and the connection between the FPC golden finger and the FPC connector is loosened or opened and closed due to vibration impact, so that the product is failed.
SUMMERY OF THE UTILITY MODEL
The utility model discloses not enough to prior art exists, provide a simple structure, have the characteristic of rigid-flexible combination, can improve the anti-vibration and the ability of shocking resistance of board and complete machine structure, can satisfy the soft or hard board subassembly at complicated complete machine structure internally mounted and adopt the infrared module of this soft or hard board subassembly simultaneously.
The utility model provides an above-mentioned technical problem's technical scheme as follows: a soft hardware board assembly comprises a circuit board A, a circuit board B and connecting plates, wherein the circuit board A comprises a hard board layer A1 and a hard board layer A2, the circuit board B comprises a hard board layer B1 and a hard board layer B2, and the connecting plates comprise connecting cables, connecting plates CA and connecting plates CB which are arranged at two ends of the connecting cables;
an electric contact A used for being connected with the circuit board B is arranged on the hard board layer A1 and/or the hard board layer A2, and an electric contact B used for being connected with the circuit board A is arranged on the hard board layer B1 and/or the hard board layer B2;
a connection point CA matched with the electric contact A is arranged on the connection plate CA, and a connection point CB matched with the electric contact B is arranged on the connection plate CB;
the contact CA is communicated with the contact CB through the connecting cable;
the connection plates CA are crimped between the hard board layer A1 and hard board layer A2, and the connection plates CB are crimped between the hard board layer B1 and hard board layer B2.
Furthermore, the circuit board A and the circuit board B are PCBs, and the connecting board is a flexible board.
The utility model has the advantages that: the connector does not need to be installed on the circuit board, so that the occupied internal space is reduced, the joint of the circuit board and the connecting plate is firmly fixed by compression, the flexible and rigid board component is integrally designed, the connection of an FPC golden finger and the FPC connector is omitted, and the shock resistance and the vibration resistance of the flexible and rigid board component are greatly improved; the connecting plate part of the soft and hard plate component is soft and tough, the toughness is strong, the integral vibration and impact resistance and the signal transmission quality are guaranteed, the soft characteristic guarantees that the special requirements of inserting, folding, overturning and the like in a complex whole machine structure can be met, the installation is convenient, and the application is wider.
On the basis of the technical scheme, the utility model discloses can also do following improvement.
The utility model discloses still relate to an infrared module, including infrared module subassembly, still include as above the soft or hard board subassembly, infrared module subassembly passes through the board support mounting and is in on the soft or hard board subassembly.
The utility model has the advantages that: the flexible and rigid combined soft and hard board assembly with the flexibility and the rigidity is formed by pressing and connecting the flexible board and the circuit board, the integrated advantages of the flexible board and the rigid board are achieved, the internal structure space of the whole infrared module is very compact, the flexible characteristic of the soft and hard board assembly can be freely stacked in the structure space, the rigidity of the rigid board is achieved at the two ends of the soft and hard board assembly, and the combination position of the soft and hard board is particularly achieved, so that the impact resistance and the vibration capacity of the infrared module are guaranteed. The utility model fully utilizes the advantages of the soft and hard plate component, light weight and thin medium; the original procedure of assembling the FPC golden finger and the FPC connector is omitted, and the working efficiency is improved; the internal structural space of the miniature infrared module originally occupied by plates and the like is reduced; the reliability testing capability of the entire machine such as vibration impact and the like can be effectively improved.
On the basis of the technical scheme, the utility model discloses can also do following improvement.
Further, the infrared module assembly is installed on the circuit board A.
Adopt above-mentioned further scheme's beneficial effect to be, infrared module subassembly passes through the board support mounting on the A circuit board.
Furthermore, the infrared module assembly comprises a movement frame, and an FPGA plate, a signal plate, a detector and a shutter which are arranged on the movement frame.
Adopt above-mentioned further scheme's beneficial effect be, FPGA board, signal board, detector and shutter form miniaturized signal acquisition and signal analysis module, accessible hardboard subassembly signal transmission is connected to on the screen.
Further, a shutter dust cover is arranged on the outer side of the shutter.
Adopt above-mentioned further scheme's beneficial effect be, gather filths such as dust easily between the shutter of module front end and the detector that carries out the signal acquisition conversion, increase the influence that the filth that the shutter shield can effectively prevent external environment from leading to the fact this infrared module, help dustproof, protect infrared module.
Furthermore, a positioning folding edge matched with the outer contour of the shutter is arranged on the shutter dustproof cover.
The beneficial effects of adopting above-mentioned further scheme are that, simple to operate is convenient for realize the location installation of shutter shield, guarantees the protection to infrared module simultaneously.
Furthermore, a heat conduction silica gel pad is arranged between the detector and the signal plate.
The beneficial effect who adopts above-mentioned further scheme is that, the cooperation of current detector and the direct cartridge of signal board, there is not enough because of the signal distortion that the more heat dissipation of heat production harmfully caused, dispels the heat through heat conduction silica gel pad, makes the heat that the circuit board that carries out signal acquisition and signal processing produced can be timely dispel the heat to the transmission of the signal quality of infrared module has been guaranteed.
Further, the detector is installed in the movement frame through a detector support.
The beneficial effect of adopting the further scheme is that the positioning and installation of the detector in the movement frame are realized.
Drawings
Fig. 1 is a schematic structural diagram of a rigid-flexible board assembly of the present invention;
fig. 2 is a schematic view of a split structure of the hard and soft plate assembly of the present invention;
fig. 3 is a schematic structural diagram of the infrared module of the present invention;
fig. 4 is a schematic view of a split structure of the infrared module of the present invention;
fig. 5 is a schematic view of a split structure of an infrared module at another angle of the present invention;
in the figure, 1, a soft and hard plate component; 101. a, a circuit board; 102. a hard board layer A1; 103. a hard board layer A2; 104. b, a circuit board; 105. a hard board layer B1; 106. a hard board layer B2; 107. a connecting plate; 108. a connecting plate CA; 109. a connecting plate CB; 110. connecting a cable; 2. a shutter; 3. a shutter dust cover; 31. positioning and folding edges; 4. a movement frame; 5. a detector support; 6. a detector; 7. a heat-conducting silica gel pad; 8. a signal plate; 9. an FPGA board; 10. a plate holder; 11. and (4) screws.
Detailed Description
The principles and features of the present invention are described below in conjunction with examples, which are set forth only to illustrate the present invention and are not intended to limit the scope of the present invention.
As shown in fig. 1 and 2, a flexible printed circuit board assembly 1 includes an a circuit board 101, a B circuit board 104 and a connection board 107, where the a circuit board includes a hard board layer a1102 and a hard board layer a2103, the B circuit board includes a hard board layer B1105 and a hard board layer B2106, and the connection board includes a connection cable 110, and a connection board CA108 and a connection board CB109 provided at two ends of the connection cable; the connecting plate CA108, the connecting plate CB109 and the connecting cable are of an integral structure;
an electric contact A used for being connected with the circuit board B is arranged on the hard board layer A1 and/or the hard board layer A2, and an electric contact B used for being connected with the circuit board A is arranged on the hard board layer B1 and/or the hard board layer B2;
a connection point CA matched with the electric contact A is arranged on the connection plate CA, and a connection point CB matched with the electric contact B is arranged on the connection plate CB;
the contact CA is communicated with the contact CB through the connecting cable;
the connection plates CA are crimped between the hard board layer A1 and hard board layer A2, and the connection plates CB are crimped between the hard board layer B1 and hard board layer B2.
The circuit board A and the circuit board B are PCBs, and the connecting plate is a flexible plate.
As shown in fig. 3-5, the utility model discloses still relate to an infrared module, including infrared module subassembly, still include as above the soft or hard board subassembly 1, infrared module subassembly passes through board support 10 to be installed on the soft or hard board subassembly 1.
The infrared module assembly is installed on the circuit board A. The infrared module assembly is installed on the circuit board A through the board bracket.
The infrared module assembly comprises a movement frame 4, an FPGA plate 9, a signal plate 8, a detector 6 and a shutter 2, wherein the FPGA plate, the signal plate, the detector 6 and the shutter are arranged on the movement frame. The FPGA board, the signal board, the detector and the shutter form a miniaturized signal acquisition and signal analysis module which can be connected to a screen through signal transmission of the soft and hard board assembly.
And a shutter dustproof cover 3 is arranged on the outer side of the shutter. The shutter of module front end and carry out the filth such as dust of gathering easily between the detector of signal acquisition conversion, increase the influence that the filth that the shutter shield can effectively prevent external environment caused this infrared module, help dustproof, protect infrared module.
And a positioning folding edge 31 matched with the outer contour of the shutter is arranged on the shutter dustproof cover. The installation is convenient, the positioning installation of the shutter dust cover is convenient to realize, and the protection of the infrared module is ensured simultaneously.
And a heat-conducting silica gel pad 7 is arranged between the detector 6 and the signal plate 8. The existing detector is matched with a signal plate in a direct inserting mode, signal distortion and the like caused by the fact that more heat is generated and the heat is dissipated badly are insufficient, heat is dissipated through a heat conduction silica gel pad, heat generated by a circuit board for signal acquisition and signal processing can be dissipated timely, and therefore transmission of signal quality of an infrared module is guaranteed.
The detector 6 is installed in the movement frame 4 through a detector bracket 5. The positioning and installation of the detector in the machine core frame are realized.
The shutter passes through four screws 11 to be installed in one side of core frame, and the setting of heat conduction silica gel pad is between detector and signal plate, and the pin cartridge of detector is put into the core frame with the detector support in the lump on the signal plate, at signal plate outside installation FPGA board, utilizes two screws with board support mounting at the opposite side of core frame, recycles four screws with soft or hard board subassembly and board leg joint.
The utility model fully utilizes the advantages of the soft and hard plate component, light weight and thin medium; the original procedure of assembling the FPC golden finger and the FPC connector is omitted, and the working efficiency is improved; the internal structural space of the miniature infrared module originally occupied by plates and the like is reduced; the reliability testing capability of the entire machine such as vibration impact and the like can be effectively improved.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (9)
1. The soft and hard board assembly is characterized by comprising an A circuit board, a B circuit board and a connecting board, wherein the A circuit board comprises a hard board layer A1 and a hard board layer A2, the B circuit board comprises a hard board layer B1 and a hard board layer B2, and the connecting board comprises a connecting cable, and connecting boards CA and CB arranged at two ends of the connecting cable;
an electric contact A used for being connected with the circuit board B is arranged on the hard board layer A1 and/or the hard board layer A2, and an electric contact B used for being connected with the circuit board A is arranged on the hard board layer B1 and/or the hard board layer B2;
a connection point CA matched with the electric contact A is arranged on the connection plate CA, and a connection point CB matched with the electric contact B is arranged on the connection plate CB;
the contact CA is communicated with the contact CB through the connecting cable;
the connection plates CA are crimped between the hard board layer A1 and hard board layer A2, and the connection plates CB are crimped between the hard board layer B1 and hard board layer B2.
2. The hardboard assembly of claim 1, wherein the A and B circuit boards are PCB boards and the connecting board is a flexible board.
3. An infrared module, comprising an infrared module assembly, and further comprising a rigid-flexible board assembly as recited in claim 1 or 2, wherein the infrared module assembly is mounted on the rigid-flexible board assembly through a board bracket.
4. The infrared module as set forth in claim 3 wherein the infrared module assembly is mounted on the A board.
5. The infrared module as set forth in claim 4, wherein the infrared module assembly comprises a core frame and an FPGA board, a signal board, a detector, a shutter disposed on the core frame.
6. The infrared module as set forth in claim 5 wherein a shutter dust cover is provided on an outer side of the shutter.
7. The infrared module as set forth in claim 6, wherein said shutter dust cover is provided with a positioning flange adapted to an outer contour of said shutter.
8. The infrared module as set forth in claim 5, wherein a thermally conductive silicone pad is disposed between said detector and said signal board.
9. The infrared module as set forth in claim 5 wherein said detector is mounted in said die carrier by a detector bracket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022627453.0U CN213364039U (en) | 2020-11-13 | 2020-11-13 | Soft and hard board subassembly and infrared module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022627453.0U CN213364039U (en) | 2020-11-13 | 2020-11-13 | Soft and hard board subassembly and infrared module |
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| Publication Number | Publication Date |
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| CN213364039U true CN213364039U (en) | 2021-06-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202022627453.0U Active CN213364039U (en) | 2020-11-13 | 2020-11-13 | Soft and hard board subassembly and infrared module |
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| CN (1) | CN213364039U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113566978A (en) * | 2021-07-23 | 2021-10-29 | 杭州微影软件有限公司 | Infrared thermal imaging shutter and infrared thermal imaging device |
-
2020
- 2020-11-13 CN CN202022627453.0U patent/CN213364039U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113566978A (en) * | 2021-07-23 | 2021-10-29 | 杭州微影软件有限公司 | Infrared thermal imaging shutter and infrared thermal imaging device |
| WO2023001197A1 (en) * | 2021-07-23 | 2023-01-26 | 杭州微影软件有限公司 | Infrared thermal imaging shutter and infrared thermal imaging device |
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