CN113566978A - Infrared thermal imaging shutter and infrared thermal imaging device - Google Patents
Infrared thermal imaging shutter and infrared thermal imaging device Download PDFInfo
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- CN113566978A CN113566978A CN202110838264.4A CN202110838264A CN113566978A CN 113566978 A CN113566978 A CN 113566978A CN 202110838264 A CN202110838264 A CN 202110838264A CN 113566978 A CN113566978 A CN 113566978A
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- 238000001931 thermography Methods 0.000 title claims abstract description 162
- 230000000903 blocking effect Effects 0.000 claims abstract description 11
- 230000005540 biological transmission Effects 0.000 claims description 54
- 239000000463 material Substances 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims 1
- 238000001514 detection method Methods 0.000 abstract description 2
- 239000000428 dust Substances 0.000 description 50
- 239000002245 particle Substances 0.000 description 26
- 239000013618 particulate matter Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 8
- 230000035945 sensitivity Effects 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229910052732 germanium Inorganic materials 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- PFNQVRZLDWYSCW-UHFFFAOYSA-N (fluoren-9-ylideneamino) n-naphthalen-1-ylcarbamate Chemical compound C12=CC=CC=C2C2=CC=CC=C2C1=NOC(=O)NC1=CC=CC2=CC=CC=C12 PFNQVRZLDWYSCW-UHFFFAOYSA-N 0.000 description 2
- 241000519995 Stachys sylvatica Species 0.000 description 2
- 239000005083 Zinc sulfide Substances 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 description 2
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 2
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 1
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009461 vacuum packaging Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/0205—Mechanical elements; Supports for optical elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0803—Arrangements for time-dependent attenuation of radiation signals
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B9/00—Exposure-making shutters; Diaphragms
- G03B9/08—Shutters
- G03B9/10—Blade or disc rotating or pivoting about axis normal to its plane
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J2005/0077—Imaging
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Abstract
The embodiment of the application discloses an infrared thermal imaging shutter and an infrared thermal imaging device, relates to the technical field of infrared detection, and aims to improve the infrared thermal imaging quality. The infrared thermal imaging shutter comprises a shutter body, wherein a light transmitting opening is formed in the shutter body, and an infrared transmitting piece is arranged at the position of the light transmitting opening in a blocking mode. The infrared thermal imaging device comprises the infrared thermal imaging shutter and a detector module; the detector module comprises an infrared detector chip, wherein an infrared window layer is arranged on the infrared detector chip; the light-transmitting opening corresponds to the infrared window layer. The embodiment of the application is suitable for infrared thermal imaging.
Description
Technical Field
The application relates to the technical field of infrared detection, in particular to an infrared thermal imaging shutter and an infrared thermal imaging device.
Background
The infrared detector chip is packaged in a metal package, a ceramic tube package, and a Chip On Board (COB) package which is currently popular. Because the COB encapsulation can be directly paste the infrared detector chip on PCB Board (Printed Circuit Board), lean on the gold thread to connect between infrared detector chip and the PCB Board, consequently this kind of packaging method does not need metal casing and ceramic tube, and the volume can be done very little, is fit for the miniaturization, integrates the product application.
However, the COB-packaged infrared detector chip is not wrapped by similar metal and ceramic, the distance between an infrared window layer on the infrared detector chip and a focal plane inside the chip is very short, and if pollutants such as dust particles fall on the infrared window layer in the using process, white spots or particles can be formed on an image, so that the quality of the image is influenced.
Disclosure of Invention
In view of this, the present disclosure provides an infrared thermal imaging shutter and an infrared thermal imaging apparatus, which are convenient for improving the infrared thermal imaging quality.
In a first aspect, an embodiment of the present application provides an infrared thermal imaging shutter, including: the shutter comprises a shutter body, wherein a light transmitting opening is formed in the shutter body, and an infrared transmitting piece is arranged at the light transmitting opening in a blocking mode.
According to a specific implementation manner of the embodiment of the application, the infrared transmission piece is arranged on the light emitting side of the light transmission opening in a blocking manner; or the infrared transmission piece is arranged on the light inlet side of the light transmission opening in a blocking manner; or the infrared transmission piece is arranged in the light transmission port in a blocking mode.
According to a specific implementation manner of the embodiment of the application, the shutter body is provided with a groove on the light emitting side of the light transmitting opening, and the infrared transmitting piece is arranged in the groove.
According to a specific implementation manner of the embodiment of the application, the infrared transmission piece is a sheet-shaped body or a plate-shaped body made of an infrared transmission material.
According to a specific implementation manner of the embodiment of the application, the infrared transmission piece is bonded on the shutter body through colloid; or the infrared transmission piece is pressed against the shutter body through a pressing piece; or the infrared transmission piece is clamped on the shutter body through a clamping piece.
In a second aspect, an embodiment of the present application further provides an infrared thermal imaging apparatus, including: the infrared thermal imaging shutter and detector module; the detector module comprises an infrared detector chip, wherein an infrared window layer is arranged on the infrared detector chip; the infrared thermal imaging shutter is the infrared thermal imaging shutter according to any one of the foregoing implementation manners, and the light-transmitting opening corresponds to the infrared window layer.
According to a specific implementation manner of the embodiment of the application, the detector module further comprises a printed circuit board, and a heat conduction layer is arranged on the printed circuit board; the infrared detector chip is arranged on the heat conduction layer and penetrates through the heat conduction layer through a metal wire to be electrically connected with the printed circuit board; or, the detector module further comprises a printed circuit board, and the infrared detector chip is arranged on the printed circuit board and is electrically connected with the printed circuit board through a metal lead.
According to a specific implementation manner of the embodiment of the application, an accommodating cavity is formed between the infrared thermal imaging shutter and the heat conducting layer, and the infrared detector chip is located in the accommodating cavity; or, an accommodating cavity is formed between the infrared thermal imaging shutter and the printed circuit board, and the infrared detector chip is positioned in the accommodating cavity.
According to a specific implementation manner of the embodiment of the application, an annular side wall is arranged on one side, close to the infrared thermal imaging shutter, of the heat conduction layer, an end surface of the side wall is in contact with one side, close to the heat conduction layer, of the infrared thermal imaging shutter, and the side wall, one side, close to the infrared thermal imaging shutter, of the heat conduction layer, and one side, close to the heat conduction layer, of the infrared thermal imaging shutter enclose the accommodating cavity; or, an annular side wall is arranged on one side, close to the heat conducting layer, of the infrared thermal imaging shutter, the end face of the side wall is in contact with one side, close to the infrared thermal imaging shutter, of the heat conducting layer, and the side wall, one side, close to the heat conducting layer, of the infrared thermal imaging shutter and one side, close to the infrared thermal imaging shutter, of the heat conducting layer enclose the accommodating cavity.
According to a specific implementation manner of the embodiment of the application, a flexible dustproof piece is arranged on the heat conduction layer and around the infrared detector chip; the first side surface of the flexible dustproof piece is in contact with the heat conducting layer, and the second side surface of the flexible dustproof piece is in contact with the infrared thermal imaging shutter; or a flexible dustproof piece is arranged on the printed circuit board and around the infrared detector chip; the first side of the flexible dustproof piece is in contact with the printed circuit board, and the second side of the flexible dustproof piece is in contact with the infrared thermal imaging shutter.
According to a specific implementation manner of the embodiment of the application, a first threading hole is formed in the printed circuit board, a second threading hole is formed in the heat conduction layer, and the first threading hole corresponds to the second threading hole; the flexible dustproof piece is provided with a threading notch or a third threading hole, and the threading notch or the third threading hole corresponds to the second threading hole.
According to a specific implementation manner of the embodiment of the application, the heat conducting layer is provided with a groove, and the infrared detector chip is arranged in the groove.
According to a specific implementation manner of the embodiment of the application, the distance between the outer side surface of the infrared transmission piece and the focal plane of the infrared detector chip is greater than or equal to 1mm and less than or equal to 6 mm; the outer side surface of the infrared transmission piece is the surface of one side, far away from the infrared detector chip, of the infrared transmission piece.
The embodiment of the application provides infrared thermal imaging shutter and infrared thermal imaging device sets up infrared through the light transmission port department at infrared thermal imaging shutter, and this infrared is seen through a permeable infrared light, but can block dust particulate matter etc. and get into in order to influence infrared thermal imaging from light transmission port to be convenient for improve infrared thermal imaging quality.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic perspective view of an infrared thermal imaging shutter according to an embodiment of the present application;
FIG. 2 is a schematic cross-sectional view of FIG. 1 (omitting the blades and the like in the light-transmitting opening);
FIG. 3 is a schematic diagram of an overall structure of an infrared detector according to an embodiment of the present application;
FIG. 4 is a schematic perspective view of the IR thermal imaging shutter of FIG. 3;
FIG. 5 is a schematic perspective view of the detector module shown in FIG. 3;
FIG. 6 is a schematic cross-sectional view of FIG. 3;
fig. 7 is an enlarged schematic view of fig. 6.
Detailed Description
The embodiments of the present application will be described in detail below with reference to the accompanying drawings. It should be understood that the embodiments described are only a few embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the application aims at providing an infrared thermal imaging shutter and infrared thermal imaging device, and the light transmission opening through at infrared thermal imaging shutter department sets up infrared transmission piece, can prevent dust particulate matter etc. from the light transmission opening entering of infrared thermal imaging shutter in order to influence infrared thermal imaging to be convenient for improve infrared thermal imaging quality.
The infrared thermal imaging mainly utilizes spectral radiation emitted by an observation object to obtain a target image, and mainly works in two atmospheric windows of 3-5 μm and 8-14 μm. In one example, the infrared detector of embodiments of the present application may operate in an 8 μm to 14 μm atmospheric window.
Fig. 1 is a schematic structural diagram of an infrared thermal imaging shutter according to an embodiment of the present application, and referring to fig. 1, the infrared thermal imaging shutter 1 according to the present embodiment includes: the shutter comprises a shutter body 2, wherein a light transmitting opening 3 is formed in the shutter body 2, and an infrared transmitting piece 4 is arranged at the position of the light transmitting opening 3 in a blocking mode.
The infrared transmitting member 4 is a member made of an infrared transmitting material. The infrared transmission material is a material which can transmit infrared light and has a wavelength range of 1-14 μm. The infrared transmitting material can be silicon, germanium, zinc sulfide, zinc selenide and the like. The infrared transmitting member 4 may be in the form of a sheet, a plate, or the like. At least one side of the infrared transmitting member 4 may be plated with an antireflection film.
The infrared transmission piece 4 can be fixed on the infrared thermal imaging shutter in a colloid pasting mode, can also be fixed on the infrared thermal imaging shutter in a pressing mode through a pressing piece, and can also be clamped on the shutter body through a clamping piece. The pressing piece or the clamping piece can be a pressing piece or a clamping piece with elasticity or a pressing piece or a clamping piece without elasticity. The infrared transmission piece 4 and the infrared thermal imaging shutter can be tightly connected, so that dust cannot penetrate through the joint surface of the infrared transmission piece and the infrared thermal imaging shutter.
In this embodiment, through set up infrared see-through 4 in light-transmitting opening 3 department, this infrared see-through 4 permeable infrared light, but can block dust particulate matter etc. and get into in order to influence infrared thermal imaging from light-transmitting opening to be convenient for improve infrared thermal imaging quality.
An extendable or retractable blade is usually provided in the light-transmitting opening 3, and the opening and closing of the blade can be controlled by a control circuit board. In order to avoid the dust particles possibly existing at the blade from running out of the light-emitting side 5 of the light-transmitting opening 3, in one example, the infrared transmitting piece 4 is arranged at the light-emitting side 5 of the light-transmitting opening 3 in a blocking manner, so that the dust particles outside the infrared thermal imaging shutter can be prevented from running out of the light-emitting side 5 of the light-transmitting opening 3 and then falling on an imaging device (such as an infrared detector chip), and the dust particles possibly existing at the blade inside the light-transmitting opening 3 can be prevented from running out of the light-emitting side of the light-transmitting opening 3 and then falling on the imaging device, so that the dust particles can be prevented from influencing infrared thermal imaging more thoroughly, and the infrared thermal imaging quality can be improved better.
The embodiment of the present invention is not limited to this, and in another example, the infrared transmitting member 4 may be disposed on the light incident side 6 of the light transmitting opening 3. In yet another example, the infrared transmission member 4 can be blocked in the light transmission opening 3. It should be understood that when the infrared transmission member 4 is blocked in the light transmission opening 3, the infrared transmission member 4 does not interfere with the blades that can be extended or retracted in the light transmission opening 3.
Referring to fig. 2, when the infrared transmission part 4 is arranged on the light emitting side 5 of the light transmission opening 3, a groove 7 is arranged on the light emitting side 5 of the light transmission opening 3 on the shutter body 2, and the infrared transmission part 4 is arranged in the groove 7, so that the whole infrared thermal imaging shutter is more compact in structure.
Referring to fig. 3, the infrared thermal imaging apparatus 10 of the present embodiment may include: the infrared thermal imaging system comprises a detector module 20 and an infrared thermal imaging shutter 30, wherein the detector module 20 comprises an infrared detector chip 201, and an infrared window layer 202 is arranged on the infrared detector chip 201; the infrared thermal imaging shutter 30 has a light-transmitting opening 301, an infrared transmitting element 302 is disposed at the light-transmitting opening 301, and the light-transmitting opening 301 corresponds to the infrared window layer 202.
The infrared detector of the embodiment can be a refrigeration type or non-refrigeration type infrared focal plane infrared detector. An array of photosensitive elements (i.e., an array of pixels) is arranged in the focal plane of the infrared detector chip. The infrared window layer is a packaging structure of the infrared detector chip, and the infrared detector chip is subjected to vacuum packaging through the infrared window layer. The infrared detector chip with the infrared window layer can be a chip obtained by carrying out wafer-level or pixel-level packaging on the infrared detector chip. The infrared window layer can be a silicon wafer or a germanium wafer, and therefore, the infrared window layer can also be called a silicon window layer or a germanium window layer, which is called a silicon window or a germanium window for short.
The infrared thermal imaging shutter 30 may be fixedly connected to the detector module 20. An extendable or retractable blade (not shown) may be disposed in the light-transmitting opening 301 of the infrared thermal imaging shutter 30, and the zero adjustment correction of the detector module may be realized by controlling the opening and closing of the blade.
The infrared-transmitting member 302 provided on the infrared thermal imaging shutter 30 is a member made of an infrared-transmitting material. The infrared transmission material is a material which can transmit infrared light and has a wavelength range of 1-14 μm. The infrared transmitting material can be silicon, germanium, zinc sulfide, zinc selenide and the like. The infrared transmitting member 302 may be sheet-shaped, plate-shaped, or the like. At least one side of the infrared transmitting member 302 may be coated with an antireflection coating.
The infrared transmitting member 302 may be fixed to the infrared thermal imaging shutter 30 by being stuck, or may be fixed to the infrared thermal imaging shutter 30 by being pressed by a pressing member. The infrared transmission piece and the infrared thermal imaging shutter can be tightly connected, so that dust cannot penetrate through the joint surface of the infrared transmission piece and the infrared thermal imaging shutter. When the infrared transmission piece is installed, the surface of the infrared transmission piece needs to be kept clean and free from dirt, and dust particles are not introduced.
The infrared transmission piece 302 is arranged at the light transmission opening 301 in a blocking mode, so that external dust particles are prevented from falling on the infrared window layer 202 after entering through the light transmission opening 301, and the thermal imaging quality of the infrared detector chip 201 is improved. Even if dust particles fall on the surface of the infrared transmitting piece 302, the dust particles are relatively far away from the focal plane of the infrared detector chip 201 due to the existence of the infrared transmitting piece 302, so that the sensitivity of the infrared detector chip 201 to the dust particles can be reduced, and the thermal imaging quality of the infrared detector chip 201 can be improved to a certain extent.
Referring to fig. 4, in the present embodiment, the infrared transmitting member 302 is disposed on a side of the infrared thermal imaging shutter 30 close to the detector module 20 (also referred to as a bottom of the infrared thermal imaging shutter), so that a spatial position of the side of the infrared thermal imaging shutter 30 close to the detector module 20 can be fully utilized, and the whole structure can be made more compact while having a dustproof effect. In other embodiments, the infrared transmitting member 302 may be disposed on a side of the infrared thermal imaging shutter 30 away from the detector module 20, or in the light transmitting opening.
When the infrared transmitting member 302 is disposed on a side of the infrared thermal imaging shutter 30 close to the detector module 20, in order to increase a distance between the infrared transmitting member 302 and the infrared window layer 202 as much as possible and to more effectively reduce sensitivity of the infrared detector chip 201 to dust particles, a groove 303 is disposed on a side of the infrared thermal imaging shutter 30 close to the detector module 20, and the infrared transmitting member 302 is disposed in the groove 303.
Referring to fig. 6, the detector module 20 further includes a printed circuit board 203, and a heat conductive layer 204 may be disposed on the printed circuit board 203; the infrared detector chip 201 is disposed on the heat conductive layer 204 and electrically connected to the printed circuit board 203 through the heat conductive layer 204 by metal wires. The heat of the infrared detector chip 201 can be dissipated through the heat conduction layer 204. In one example, the thermally conductive layer 204 may be a metallic thermally conductive sheet. The embodiment of the present application is not limited thereto, and in other embodiments, the infrared detector chip 201 may also be directly disposed on the printed circuit board and electrically connected to the printed circuit board through a metal wire. The printed circuit board can be a semi-finished product after SMT/wave soldering, and can also be called PCBA.
A receiving cavity 205 may be formed between the infrared thermal imaging shutter 30 and the heat conductive layer 204, and the infrared detector chip 201 is located in the receiving cavity 205.
In this embodiment, an annular side wall 206 is disposed on a side of the heat conduction layer 204 close to the infrared thermal imaging shutter 30, an end surface of the side wall 206 contacts with a side of the infrared thermal imaging shutter 30 close to the heat conduction layer 204, and the side wall 206, a side of the heat conduction layer 204 close to the infrared thermal imaging shutter 30, and a side of the infrared thermal imaging shutter 30 close to the heat conduction layer 204 enclose the accommodating cavity. The thermally conductive layer 204 with the side walls 206 may also be referred to as a heat sink.
In other embodiments, an annular side wall (not shown) is disposed on a side of the infrared thermal imaging shutter 30 close to the heat conduction layer 204, an end surface of the side wall contacts with a side of the heat conduction layer 204 close to the infrared thermal imaging shutter 30, and the side wall, a side of the infrared thermal imaging shutter 30 close to the heat conduction layer 204, and a side of the heat conduction layer 204 close to the infrared thermal imaging shutter 30 enclose the receiving cavity.
The infrared detector chip can be protected by the accommodating cavity, and the possibility that dust particles fall on the infrared window layer from the side (namely from the position between the infrared thermal imaging shutter and the heat conducting layer) is reduced.
Referring to fig. 5 and 6, in order to more thoroughly block dust particles (especially, finer dust particles) from falling onto the infrared window layer 202 between the infrared thermal imaging shutter 30 and the heat conducting layer 204, the flexible dust-proof member 40 may be disposed around the infrared detector chip 201 in the accommodating cavity 205, and a first side of the flexible dust-proof member 40 is in contact with the heat conducting layer 204 and a second side of the flexible dust-proof member 40 is in contact with the infrared thermal imaging shutter 30, so that a closed cavity is formed between the flexible dust-proof member 40, the heat conducting layer 204 and the infrared thermal imaging shutter 30, and the infrared detector chip 201 is located in the closed cavity, and the dust particles are more thoroughly (or more effectively) blocked from entering between the infrared thermal imaging shutter 30 and the mounting surface of the detector module 20 and falling onto the infrared window layer 202 by the closed cavity.
In this embodiment, the infrared piece that sees through of infrared thermal imaging shutter bottom assembly can completely cut off the dust granule introduction of detector top, flexible dustproof can block that dust particulate matter gets into between the fitting surface of infrared thermal imaging shutter and detector module, to sum up dustproof effect between them for the infrared detector chip is sealed in a less cavity, stops outside dust and introduces.
Referring to fig. 7, if the height of the top surface (i.e., the outer side surface) of the infrared transmitting piece from the focal plane of the infrared detector chip is h1, the thickness of the infrared transmitting piece is t, the height of the top surface of the infrared window layer of the infrared detector chip from the focal plane is h2, and the gap between the bottom surface of the infrared transmitting piece and the top surface of the detector chip is s, then h1 is h2+ s + t; in this embodiment, outside dust particulate matter can be isolated in infrared piece outside of passing through, and the minimum distance h of dust particle height and detector focal plane is h1 h2+ s + t promptly, and h > h2 effectively raises the distance of dust particulate matter and infrared detector chip focal plane promptly, reduces the sensitivity of infrared detector chip to dust particulate matter, even infrared piece surface dust that falls, can not cause obvious influence to infrared detector chip formation of image yet.
In one example, the distance h between the outer side surface of the infrared transmitting piece and the focal plane of the infrared detector chip is more than or equal to 1mm and less than or equal to 6mm, so that the sensitivity of the infrared detector chip to dust particles can be obviously reduced; the outer side surface of the infrared transmission piece is the surface of one side, far away from the infrared detector chip, of the infrared transmission piece.
The height of the flexible dust-proof member 40 may be greater than the height of the side wall 206, so that when the infrared thermal imaging shutter 30 and the detector module 20 are fixed together, the flexible dust-proof member 40 is pressed by the infrared thermal imaging shutter 30, and two sides (i.e., the aforementioned first side and second side) of the flexible dust-proof member 40 can be ensured to be in close contact with the heat conduction layer 204 and the infrared thermal imaging shutter 30, respectively, so as to improve the sealing performance.
The flexible dustproof member 40 may be a flat annular body with a window at the middle. The flexible dust guard 40 may be made of rubber, foam, or the like, and in one example, the flexible dust guard 40 is made of dust-free foam.
Larger dust particles are blocked from falling onto the infrared window layer 202 from between the infrared thermal imaging shutter 30 and the thermally conductive layer 204 by the receiving cavity formed between the infrared thermal imaging shutter 30 and the thermally conductive layer 204. Further, the enclosed cavity formed by the flexible dust-proof member 40, the heat conducting layer 204 and the infrared thermal imaging shutter 30 can prevent finer dust particles from entering between the infrared thermal imaging shutter 30 and the mounting surface of the detector module 20 and falling onto the infrared window layer 202.
The printed circuit board is provided with a heat conduction layer, when the accommodating cavity (not shown) is not formed between the infrared thermal imaging shutter and the heat conduction layer, in order to prevent dust particles from entering from the space between the infrared thermal imaging shutter and the assembly surface of the detector module and falling on the infrared window layer, a flexible dustproof piece can be arranged around the infrared detector chip; the first side of the flexible dust guard contacts the heat conducting layer and the second side contacts the infrared thermal imaging shutter 30. Therefore, a closed cavity is formed among the flexible dustproof piece, the heat conducting layer and the infrared thermal imaging shutter, the infrared detector chip is located in the closed cavity, and dust particles can be effectively prevented from entering the space between the infrared thermal imaging shutter and the assembly surface of the detector module and falling on the infrared window layer through the closed cavity.
The ir thermal imaging shutter 30 may be provided with a driving circuit board 304 for driving the blades of the ir thermal imaging shutter 30 to extend or retract, and the driving circuit board 304 may be electrically connected to the ir thermal imaging shutter connector 207 on the printed circuit board 203 through a wire. Specifically, a first threading hole 208 is formed in the printed circuit board 203, a second threading hole 209 is formed in the heat conduction layer 204, and the first threading hole 208 corresponds to the second threading hole 209; the lead wires connected to the driving circuit board 304 at the bottom of the infrared thermal imaging shutter 30 are electrically connected to the infrared thermal imaging shutter connector 207 on the printed circuit board 203 through the second threading hole 209 and the first threading hole 208. Be equipped with threading notch 401 or third through wires hole on flexible dustproof member 40, threading notch 401 or third through wires hole and second through wires hole 209 corresponding, threading notch 401 or third through wires hole can be right the effect is dodged to the wire for the existence of flexible dustproof member 40 can not be right the wire is to drive circuit board and the last infrared thermal imaging shutter connector 207 electricity of printed circuit board is connected and is played the hindrance effect.
When the infrared detector chip is directly arranged on the printed circuit board (not shown), an accommodating cavity can be formed between the infrared thermal imaging shutter and the printed circuit board, and the infrared detector chip is positioned in the accommodating cavity. The receiving cavity is formed in a manner similar to the receiving cavity between the infrared thermal imaging shutter and the thermally conductive layer in the previous embodiment.
In the holding cavity that forms between infrared thermal imaging shutter and printed circuit board, also can set up flexible dustproof spare around the infrared detector chip, and make the first side of flexible dustproof spare contact with printed circuit board, the second side contacts with infrared thermal imaging shutter, like this, form a confined cavity between flexible dustproof spare, printed circuit board and infrared thermal imaging shutter, the infrared detector chip is located this confined cavity, can more thoroughly (or more effectively) block dust particulate matter and get into and fall on infrared window layer from between the assembly surface of infrared thermal imaging shutter and detector module through this confined cavity.
The accommodating cavity formed between the infrared thermal imaging shutter and the printed circuit board can prevent larger dust particles from entering from the space between the infrared thermal imaging shutter and the assembly surface of the detector module and falling on the infrared window layer. Furthermore, the closed cavity formed among the flexible dustproof piece, the printed circuit board and the infrared thermal imaging shutter can prevent finer dust particles from entering the infrared thermal imaging shutter and the assembly surface of the detector module and falling on the infrared window layer.
The infrared detector chip 201 is placed on the heat conduction layer 204, and except for playing the role of heat dissipation to the infrared detector chip 201, in order to play the guard action to the infrared detector chip 201, can set up recess 210 on the heat conduction layer 204, the infrared detector chip 201 is established in recess 210, can play the guard action to the infrared detector chip 201 through recess 210. The embodiment of the application is not limited to this, and the recess that is used for placing the infrared detector chip may not be provided on the heat conduction layer.
A detector module pair external connector 211 may be provided on the back side of the printed circuit board 203.
When the infrared detector chip is directly arranged on the printed circuit board but an accommodating cavity is not formed between the infrared thermal imaging shutter and the printed circuit board (not shown), in order to prevent dust particles from entering from the space between the infrared thermal imaging shutter and the assembly surface of the detector module and falling on the infrared window layer, a flexible dustproof piece can be arranged around the infrared detector chip; the first side of the flexible dustproof piece is in contact with the printed circuit board, and the second side of the flexible dustproof piece is in contact with the infrared thermal imaging shutter. Therefore, a closed cavity is formed among the flexible dustproof piece, the printed circuit board and the infrared thermal imaging shutter, the infrared detector chip is located in the closed cavity, and dust particles can be effectively prevented from entering from the space between the infrared thermal imaging shutter and the assembly surface of the detector module and falling on the infrared window layer through the closed cavity.
The embodiment of the application also provides an infrared thermal imaging device which comprises the infrared detector in any one of the previous embodiments.
The infrared thermal imaging device of this embodiment sets up the infrared piece that sees through on infrared thermal imaging shutter at infrared detector, can prevent that the dust particulate matter from dropping on the infrared window layer on the infrared detector chip, is favorable to reducing the sensitivity of infrared detector chip to the dust particulate matter, improves the imaging quality of infrared detector chip.
In the infrared detector and the infrared thermal imaging device, the space at the bottom of the infrared thermal imaging shutter can be effectively utilized, the infrared transmission piece is additionally arranged at the bottom of the infrared thermal imaging shutter, and the introduction of dust in the area above the detector is isolated; meanwhile, the periphery of the detector chip can be covered with the flexible dustproof piece, and after the infrared thermal imaging shutter is assembled to the detector module, the flexible dustproof piece is pressed to isolate the introduction of dust on the side surface and the bottom surface of the detector, namely, the detector chip is completely sealed in a small cavity to isolate other dust from introducing into the detector.
Install infrared penetrating piece additional in infrared thermal imaging shutter bottom, the dust particulate matter only can fall on infrared penetrating piece surface, has increased the distance of detector chip focal plane and dust particulate matter, effectively reduces the sensitivity of detector chip to the dust, can not cause the image white spot problem, has greatly improved the imaging quality, has reduced the management and control degree of difficulty of dust particulate matter in the production process.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
All the embodiments in the present specification are described in a related manner, and the same and similar parts among the embodiments may be referred to each other, and each embodiment focuses on the differences from the other embodiments.
For convenience of description, the above devices are described separately in terms of functional division into various units/modules. Of course, the functionality of the units/modules may be implemented in one or more software and/or hardware implementations when the present application is implemented.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (13)
1. An infrared thermal imaging shutter, comprising: the shutter comprises a shutter body, wherein a light transmitting opening is formed in the shutter body, and an infrared transmitting piece is arranged at the light transmitting opening in a blocking mode.
2. The infrared thermal imaging shutter according to claim 1, wherein the infrared transmission member is disposed on a light exit side of the light transmission opening; or,
the infrared transmission piece is arranged on the light inlet side of the light transmission opening in a blocking mode; or,
the infrared transmission piece is arranged in the light transmission opening in a blocking mode.
3. The shutter according to claim 1, wherein a recess is formed in the shutter body on a light exit side of the light transmissive opening, and the infrared transmissive member is disposed in the recess.
4. The infrared thermal imaging shutter according to claim 1, wherein the infrared-transmissive member is a sheet or plate made of an infrared-transmissive material.
5. The infrared thermal imaging shutter according to claim 1 wherein said infrared transmissive member is bonded to said shutter body by a glue; or,
the infrared transmission piece is pressed against the shutter body through a pressing piece; or,
the infrared transmission piece is clamped on the shutter body through the clamping piece.
6. An infrared thermal imaging apparatus, comprising: the infrared thermal imaging shutter and detector module; wherein,
the detector module comprises an infrared detector chip, and an infrared window layer is arranged on the infrared detector chip;
the infrared thermal imaging shutter is the infrared thermal imaging shutter according to any one of the preceding claims 1 to 4, wherein the light-transmitting opening corresponds to the infrared window layer.
7. The infrared thermal imaging device of claim 6, wherein the detector module further comprises a printed circuit board with a thermally conductive layer disposed thereon; the infrared detector chip is arranged on the heat conduction layer and penetrates through the heat conduction layer through a metal wire to be electrically connected with the printed circuit board;
or,
the detector module further comprises a printed circuit board, and the infrared detector chip is arranged on the printed circuit board and is electrically connected with the printed circuit board through a metal lead.
8. The infrared thermal imaging apparatus according to claim 7, wherein a housing cavity is formed between said infrared thermal imaging shutter and said heat conductive layer, said infrared detector chip being located in said housing cavity;
or,
an accommodating cavity is formed between the infrared thermal imaging shutter and the printed circuit board, and the infrared detector chip is positioned in the accommodating cavity.
9. The infrared thermal imaging device according to claim 8, wherein an annular side wall is disposed on a side of the heat conducting layer close to the infrared thermal imaging shutter, an end surface of the side wall is in contact with a side of the infrared thermal imaging shutter close to the heat conducting layer, and the side wall, a side of the heat conducting layer close to the infrared thermal imaging shutter, and a side of the infrared thermal imaging shutter close to the heat conducting layer enclose the accommodating cavity; or,
the infrared thermal imaging shutter is close to one side of heat-conducting layer is equipped with annular side wall, the terminal surface of side wall with the heat-conducting layer is close to one side of infrared thermal imaging shutter contacts, the side wall, infrared thermal imaging shutter is close to one side of heat-conducting layer, and the heat-conducting layer is close to one side of infrared thermal imaging shutter encloses into the holding cavity.
10. The infrared thermal imaging device according to claim 7, characterized in that a flexible dust-proof member is provided on said heat conductive layer around said infrared detector chip; the first side surface of the flexible dustproof piece is in contact with the heat conducting layer, and the second side surface of the flexible dustproof piece is in contact with the infrared thermal imaging shutter; or,
a flexible dustproof piece is arranged on the printed circuit board and around the infrared detector chip; the first side of the flexible dustproof piece is in contact with the printed circuit board, and the second side of the flexible dustproof piece is in contact with the infrared thermal imaging shutter.
11. An infrared thermal imaging apparatus according to claim 10, wherein a first threading hole is provided in said printed circuit board, a second threading hole is provided in said heat conductive layer, and said first threading hole and said second threading hole correspond;
the flexible dustproof piece is provided with a threading notch or a third threading hole, and the threading notch or the third threading hole corresponds to the second threading hole.
12. The infrared thermal imaging device according to claim 7, wherein a recess is provided on said heat conductive layer, said infrared detector chip being disposed in said recess.
13. The infrared thermal imaging apparatus according to claim 6, wherein a distance between an outer side surface of the infrared transmitting member and a focal plane of the infrared detector chip is 1mm or more and 6mm or less; the outer side surface of the infrared transmission piece is the surface of one side, far away from the infrared detector chip, of the infrared transmission piece.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110838264.4A CN113566978A (en) | 2021-07-23 | 2021-07-23 | Infrared thermal imaging shutter and infrared thermal imaging device |
| PCT/CN2022/106810 WO2023001197A1 (en) | 2021-07-23 | 2022-07-20 | Infrared thermal imaging shutter and infrared thermal imaging device |
| CN202290000214.7U CN220437589U (en) | 2021-07-23 | 2022-07-20 | Infrared thermal imaging shutter and infrared thermal imaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110838264.4A CN113566978A (en) | 2021-07-23 | 2021-07-23 | Infrared thermal imaging shutter and infrared thermal imaging device |
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| CN113566978A true CN113566978A (en) | 2021-10-29 |
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| CN202110838264.4A Pending CN113566978A (en) | 2021-07-23 | 2021-07-23 | Infrared thermal imaging shutter and infrared thermal imaging device |
| CN202290000214.7U Active CN220437589U (en) | 2021-07-23 | 2022-07-20 | Infrared thermal imaging shutter and infrared thermal imaging device |
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| CN202290000214.7U Active CN220437589U (en) | 2021-07-23 | 2022-07-20 | Infrared thermal imaging shutter and infrared thermal imaging device |
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| WO (1) | WO2023001197A1 (en) |
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| WO2023035933A1 (en) * | 2021-09-09 | 2023-03-16 | 杭州微影软件有限公司 | Infrared detector module and infrared thermal imaging device |
| WO2023185477A1 (en) * | 2022-03-28 | 2023-10-05 | 杭州微影软件有限公司 | Thermal imaging module and electronic device |
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| WO2023001197A1 (en) | 2023-01-26 |
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