CN205175557U

CN205175557U - Imaging system

Info

Publication number: CN205175557U
Application number: CN201390001132.5U
Authority: CN
Inventors: T·R·赫尔特; J·科斯切娃; P·布朗热; B·夏普; E·A·库尔特; N·霍根斯特恩; K·斯特兰德玛
Original assignee: Flir Systems Inc
Current assignee: Teledyne Flir LLC
Priority date: 2012-12-31
Filing date: 2013-12-31
Publication date: 2016-04-20
Anticipated expiration: 2023-12-31
Also published as: WO2014106276A3; WO2014106276A2

Abstract

The utility model discloses an imaging system, it includes the infrared imaging module. The shutter subassembly is offered the infrared imaging module and prevents outside infrared to reach the infrared sensor of infrared imaging module with optionally. For example, for example, the piece can be described including the oar to the shutter subassembly, and it is located optical element (lens) and removes in order to prevent outside infrared entering optical element basically through actuator optionally outside just being suitable for. The shutter subassembly can pile up for the casing of infrared imaging module and not the exceedingly increase the overall profile of infrared imaging module. Basically, the infrared that the low emissivity internal surface that reflects can provide on oar form with the infrared sensor subassembly that will derive from the infrared imaging module reflects back the infrared sensor subassembly.

Description

Imaging system

The cross reference of related application

This application claims that on Dec 31st, 2012 applies for, that name is called the U.S. Provisional Patent Application 61/747,789 of " INFRAREDIMAGINGDEVICEHAVINGASHUTTER " rights and interests, by reference it is incorporated herein in full.

The part continuity application that the application is application on August 13rd, 2013, name is called the U.S. Patent application 13/966,052 of " INFRAREDCAMERASYSTEMHOUSINGWITHMETALIZEDSURFACE ", is incorporated herein in full by it by reference.

The part continuity application that the application is application on Dec 9th, 2013, name is called the U.S. Patent application 14/101,245 of " LOWPOWERANDSMALLFORMFACTORINFRAREDIMAGING ", is incorporated herein in full by it by reference.

The application is application on Dec 6th, 2013, name is called the U.S. Patent application 14/099 of " NON-UNIFORMITYCORRECTIONTECHNIQUESFORINFRAREDIMAGINGDEVI CES ", the part continuity application of 818, is incorporated herein in full by it by reference.

The part continuity application that the application is application on Dec 9th, 2013, name is called the U.S. Patent application 14/101,258 of " INFRAREDCAMERASYSTEMARCHITECTURES ", is incorporated herein in full by it by reference.

The part continuity application that the application is application on Dec 21st, 2013, name is called the U.S. Patent application 14/138,058 of " COMPACTMULTI-SPECTRUMIMAGINGWITHFUSION ", is incorporated herein in full by it by reference.

U.S. Patent application 14/138,058 requires that on Dec 31st, 2012 applies for, name is called the rights and interests of the U.S. Provisional Patent Application 61/748,018 of " COMPACTMULTI-SPECTRUMIMAGINGWITHFUSION ", it is incorporated herein in full by reference.

The part continuity application that the application is application on Dec 21st, 2013, name is called the U.S. Patent application 14/138,040 of " TIMESPACEDINFRAREDIMAGEENHANCEMENT ", is incorporated herein in full by it by reference.

U.S. Patent application 14/138,040 requires that on March 15th, 2013 applies for, name is called the rights and interests of the U.S. Provisional Patent Application 61/792582 of " TIMESPACEDINFRAREDIMAGEENHANCEMENT ", it is incorporated herein in full by reference.

The part continuity application that the application is application on Dec 21st, 2013, name is called the U.S. Patent application 14/138,052 of " INFRAREDIMAGINGENHANCEMENTWITHFUSION ", is incorporated herein in full by it by reference.

U.S. Patent application 14/138,052 requires that on March 15th, 2013 applies for, name is called the rights and interests of the U.S. Provisional Patent Application 61/793952 of " INFRAREDIMAGINGENHANCEMENTWITHFUSION ", it is incorporated herein in full by reference.

Technical field

One or more embodiment of the present utility model relates generally to infrared imaging device, and more specifically, such as, relates to the infrared imaging device with shutter.

Background technology

Some infrared imaging devices can be equipped with shutter, and shutter may be used for calibration and other objects.Traditional shutter for infrared imaging device is usually located in the optical path between optical element (such as, lens) and the infrared sensor of infrared imaging device.But this layout of shutter also blocks outside the venue (such as, by housing and/or surround that the lens barrel of optical element launches) infrared radiation, thus do not allow and compensate this infrared radiation outside the venue to realize calibrating more accurately.Use traditional infrared imaging device shutter also may be difficult to realize accurate calibration, because traditional infrared imaging device is not allowed accurately measure shutter temperature.

In addition, traditional shutter for infrared imaging device generally increases very large volume and requires outside wiring, therefore remarkably adds the gross space requirement of equipment.For being designed to be integrated into small electronic appliances as the infrared imaging device of the small-shape factor in mobile phone, the space requirement of this increase may be problematic especially.

Utility model content

Shutter assembly can be provided to infrared imaging module with the infrared sensor optionally stoping outside infrared radiation to arrive infrared imaging module.Such as, according to one or more embodiment, shutter assembly can comprise paddle part, and it is positioned at optical element (such as, lens) outside and is adapted to pass through actuator and optionally moves substantially to stop outside infrared radiation to enter optical element.This layout of paddle part can be allowed to obtain when shutter assembly is used to alignment purpose and calibrated more accurately.In some embodiments, shutter assembly can be stacking relative to the housing of infrared imaging module and not excessively increase the general outline of infrared imaging module.In some embodiments, temperature sensor can be arranged on paddle part, on shutter assembly body or in housing, to allow to calibrate the temperature accurately measured with other objects and be associated with paddle part.In addition, according to some embodiments, so that electric signal is passed to the parts of shutter assembly and/or passed through from the electric signal of the parts of shutter assembly on the inner and/or outer surface that one or more conductive trace can be formed in housing.

In one embodiment, a kind of imaging system comprises infrared imaging module, and it comprises: infrared sensor package, and it has infrared sensor and is suitable for catching picture frame; And shutter assembly, it comprises: paddle part, and it is suitable for optionally stoping outside infrared radiation to arrive infrared sensor, and actuator, and it is suitable for optionally moving paddle part in response to control signal and arrives infrared sensor to stop outside infrared radiation.

In another embodiment, a kind of method comprises and optionally moves paddle part and arrive the infrared sensor of infrared sensor package to stop outside infrared radiation; Infrared sensor package is utilized to catch the picture frame of the infrared radiation launched from paddle part; Wherein optionally moving paddle part, wherein paddle part and actuator in response to control signal by actuator is a part for shutter assembly; Wherein shutter assembly and infrared sensor package are parts for infrared imaging module.

Scope of the present utility model is determined by claim, is incorporated in this section by reference.By the detailed description to one or more embodiment below consideration, the realization of the more complete understanding of the utility model embodiment and its other advantage will be provided to those skilled in the art.With reference to by by the first concise and to the point accompanying drawing described.

Accompanying drawing explanation

Fig. 1 shows the infrared imaging module being configured to be embodied in main process equipment according to embodiment of the present disclosure.

Fig. 2 shows the infrared imaging module assembled according to embodiment of the present disclosure.

Fig. 3 shows the exploded view of the infrared imaging module of juxtaposition on socket according to embodiment of the present disclosure.

Fig. 4 A-D shows the example implementations of optical element, and it can be implemented in the infrared imaging module according to embodiment of the present disclosure.

Fig. 5 A-1,5A-2,5B-1,5B-2,5C-1,5C-2,5D-1,5D-2,5E-1 and 5E-2 show the cut-open view of the infrared imaging module realized by several form factor according to the various embodiment of the disclosure.

Fig. 5 F-1,5F-2,5G-1,5G-2,5G-3,5H-1,5H-2,5I, 5J-1,5J-2,5K, 5L-1,5L-2,5L-3,5M-1,5M-2,5N, 5O-1,5O-2 and 5P show other views of the infrared imaging module realized by several form factor according to the various embodiment of the disclosure.

Fig. 6-8 shows the infrared imaging module realized by several layout according to the various embodiment of the disclosure.

Fig. 9 A-B shows the infrared imaging module be arranged in socket according to the various embodiment of the disclosure.

Figure 10 A show according to embodiment of the present disclosure by the infrared imaging module of Fig. 9 A removed from socket.

Figure 10 B shows the infrared imaging module of Fig. 9 A according to embodiment of the present disclosure, and the outer cover of its middle shell represents with translucent form the metal level showing housing.

Figure 10 C shows the infrared imaging module of Fig. 9 A according to embodiment of the present disclosure, and wherein outer cover and metal level all represent to show the several parts surrounded by housing with translucent form.

Figure 11 A-B shows the infrared imaging module of Fig. 9 A according to the various embodiment of the disclosure, and its middle shell is removed.

Figure 12 A-D shows several views of the housing of the infrared imaging module of Fig. 9 A according to the various embodiment of the disclosure, and it has inner metal layer.

Figure 12 E shows the housing with inside and outside metal level according to embodiment of the present disclosure.

Figure 13 shows the xsect of the housing 120 intercepted according to the line 13-13 along Figure 12 B of embodiment of the present disclosure.

Figure 14 shows the manufacturing process of the infrared imaging module of Fig. 9 A according to embodiment of the present disclosure.

Figure 15 A-15C shows the various views with the infrared imaging module of shutter assembly according to embodiment of the present disclosure.

Figure 16 A-16D shows the various views of the shutter assembly of Figure 15 A-15C according to embodiment of the present disclosure.

Figure 17 A-17C shows the various views with the infrared imaging module of shutter assembly according to another embodiment of the present disclosure.

Figure 18 A-18C shows the various views with the infrared imaging module of shutter assembly and housing according to embodiment of the present disclosure, and housing has setting conductive trace on one or more exterior surfaces.

Figure 19 shows the bottom perspective view of the shutter assembly of Figure 18 A-18C according to embodiment of the present disclosure.

Figure 20 A-20B shows the various views with the infrared imaging module of shutter assembly and housing according to embodiment of the present disclosure, and housing has the conductive trace be arranged on outer and inner surface.

Figure 21 shows the shutter assembly according to embodiment of the present disclosure.

Figure 22 shows the shutter assembly of Figure 21, and it is by the part of infrared imaging module locating to be assembled into according to embodiment of the present disclosure.

Figure 23 A-B shows the various views of the infrared imaging module according to various embodiment of the present disclosure, and wherein the shutter of Figure 21 is mounted and represents to illustrate the contact element of the shutter engaged with the pad in housing outer surface with translucent form.

Figure 24 shows the process flow diagram that the infrared imaging module having a shutter assembly according to the utilization of embodiment of the present disclosure catches the process of the view data of Uniform Irradiation degree scene.

Embodiment of the present utility model and advantage thereof are understood best by referring to detailed description below.But should be understood that, in one or more figure, same Reference numeral is for identifying same element.

Embodiment

Fig. 1 shows the infrared imaging module 100 (such as, infrared camera or infrared imaging device) being configured to be embodied in main process equipment 102 according to embodiment of the present disclosure.For one or more embodiment, infrared imaging module 100 can realize by little form factor, and realizes with the infrared camera encapsulation technology of other novelties discussed herein according to wafer-class encapsulation technical battery.

In one embodiment, infrared imaging module 100 can be configured to implement in little portable host device 102, as mobile phone, tablet computing device, lap-top computing devices, palm PC, visible light camera, music player or any other suitable equipment.In this respect, infrared imaging module 100 can be used for providing infrared imaging feature to main process equipment 102.Such as, infrared imaging module 100 can be configured to catch, process and/or otherwise manage infrared image and this infrared image be supplied to main process equipment 102 to use in any desired manner (such as, storing in memory to further process, show, used by the various application programs of operation on main process equipment 102, output to other equipment or for other purposes).

In various embodiments, infrared imaging module 100 can be configured to operate in temperature range under low voltage level and very wide.Such as, in one embodiment, infrared imaging module 100 can utilize the power supply of about 2.4 volts, 2.5 volts, 2.8 volts or more low-voltage to operate, and operation (such as, providing the suitable dynamic range exceeding about 80 degrees Celsius and performance) in the temperature range of about-20 degrees Celsius to about 60 degrees Celsius.In one embodiment, by operating infrared imaging module 100 under low voltage level, compared with the infrared imaging device of other types, the spontaneous heat of infrared imaging module 100 can reduce.Therefore, infrared imaging module 100 can operate when compensating this spontaneous heating without the need to significant additional measures.

As shown in fig. 1, main process equipment 102 can comprise socket 104, shutter 105, processor 195, storer 196, display 197 and/or miscellaneous part 198.Socket 104 can be configured to receive infrared imaging module 100, as shown by an arrow 101.In this, Fig. 2 shows the infrared imaging module 100 be assembled in socket 104 according to embodiment of the present disclosure.

Processor 195 can be implemented as any suitable treatment facility (such as, logical device, microcontroller, processor, special IC (ASIC) or other equipment), it can be used to perform suitable instruction by main process equipment 102, as the software instruction provided in storer 196.Display 197 may be used for infrared image and/or other images, data and the information of display capture and/or process.Miscellaneous part 198 may be used for any feature realizing main process equipment 102, and it may be desired for various application (such as, visible light camera or miscellaneous part).

In various embodiments, infrared imaging module 100 and socket 104 can be implemented for large-scale production, so that volume applications, such as, for implementing in mobile phone or (such as, requiring small-shape factor) other equipment.In one embodiment, when infrared imaging module 100 is arranged in socket 104, the combination of infrared imaging module 100 and socket 104 can show the overall dimensions of about 8.5mm × 8.5 millimeter × 5.9 millimeters.

Fig. 3 shows the exploded view of the infrared imaging module 100 of juxtaposition on socket 104 according to embodiment of the present disclosure.Infrared imaging module 100 can comprise lens barrel 110, housing 120, infrared sensor package 128, circuit board 170, pedestal 150 and processing module 160.

Lens barrel 110 can surround optical element 180 at least in part, and optical element 180 is that aperture 112 part in scioptics lens barrel 110 is visible in figure 3.Lens barrel 100 can comprise columniform extension 114 substantially, and it may be used for engaging the aperture 122 in (interface) lens barrel 100 and housing 120.

Infrared sensor package 128 can such as with the lid 130 be arranged on substrate 140 (such as, block) realize, infrared sensor package 128 can comprise multiple infrared sensor 132 (such as, infrared eye), it to realize on substrate 140 with array or other modes and tegmentum 130 covers (such as, shown in Fig. 5 A-1 to 5K, Fig. 5 M-1 to 5P and Fig. 8).Such as, in one embodiment, infrared sensor package 128 may be implemented as focal plane arrays (FPA) (FPA).This focal plane arrays (FPA) such as may be implemented as Vacuum Package assembly (such as, tegmentum 130 and substrate 140 seal).In one embodiment, infrared sensor package 128 may be implemented as wafer-class encapsulation (such as, infrared sensor package 128 can be cut down by from the one group of Vacuum Package assembly be arranged on wafer).In one embodiment, infrared sensor package 128 may be embodied to and operates with the power supply of about 2.4 volts, 2.5 volts, 2.8 volts or similar voltage.In various embodiments, infrared sensor package 128 can realize with infrared sensor 132 and any other parts as required.

Infrared sensor 132 can be configured to detect from target scene infrared radiation (such as, infrared energy), its other thermal imaging wave bands such as comprising medium-wave infrared wave band (MWIR), long wave infrared region (LWIR) and/or may expect in specific implementation.In one embodiment, infrared sensor package 128 can be provided according to wafer-class encapsulation technology.

The thermal imaging infrared sensor of other types that infrared sensor 132 such as can be implemented as micro-bolometer or arranges with any required array pattern, to provide multiple pixel.In one embodiment, infrared sensor 132 can be implemented as vanadium oxide (VOx) detector with 17 micron pixel spacing.In various embodiments, the array of the infrared sensor 132 of about 32 × 32, the infrared sensor 132 of about 64 × 64, the infrared sensor 132 of about 80 × 64 or other array sizes can be used.

In one embodiment, substrate 140 can comprise various circuit, comprises, such as, and the reading integrated circuit (ROIC) that size is less than about 5.5 millimeters × 5.5 millimeters.Substrate 140 can also comprise bond pad 142, contacts the complementary connection be positioned on housing 120 inside surface, as Fig. 5 A-1, shown in 5A-2,5B-1,5B-2,5C-1 and 5C-2 when it is used in assembling infrared imaging module 100.In one embodiment, ROIC can use low-dropout regulator (LDO) to realize to perform voltage-regulation, to reduce the power supply noise being incorporated into infrared sensor package 128, thus provides the Power Supply Rejection Ratio (PSRR) of improvement.In addition, by implementing LDO (such as, in wafer-class encapsulation) with ROIC, less chip area can be consumed and need less discrete chip (or wafer).

Infrared sensor package 128 can catch image (such as, picture frame), and provides this image with different speed from its ROIC.Processing module 160 may be used for carrying out suitable process to the infrared image of catching, and can realize according to any suitable architecture.In one embodiment, processing module 160 may be implemented as ASIC.In this respect, this ASIC can be configured to high-performance and/or highly-efficient implementation image procossing.In another embodiment, processing module 160 can use general Central Processing Unit (CPU) to realize, it can be configured to perform suitable software instruction to perform image procossing, coordinate with various image processing program block and perform image procossing, the interface between Coordination Treatment module 160 and main process equipment 102 connects.In another embodiment, processing module 160 can use field programmable gate array (FPGA) to realize.In other embodiments, processing module 160 can realize with the process of other types and/or logical circuit, as those skilled in the art understand.

In these and other embodiments, in suitable occasion, processing module 160 can also realize with miscellaneous part, as, volatile memory, nonvolatile memory and/or one or more interface are (such as, infrared eye interface, internal integrated circuit (I2C) interface, mobile Industry Processor Interface (MIPI), JTAG (JTAG) interface are (such as, IEEE1149.1 standard test access port and boundary scan architecture), and/or other interfaces).

When assembling infrared imaging module 100, housing 120 can surround infrared sensor package 128, pedestal 150 and processing module 160 substantially.Housing 120 can so that the connection of various parts of infrared imaging module 100.Such as, in one embodiment, housing 120 can provide electrical connector 126 to connect various parts, as further described.

When assembling infrared imaging module 100, electrical connector 126 (such as, the web member of conductive path, conductive trace or other types) can be electrically connected with bond pad 142.In various embodiments, electrical connector 126 can be embedded in housing 120, is arranged on the inside surface of housing 120, and/or is otherwise provided by housing 120.Electrical connector 126 can end at from the outstanding web member 124 in the bottom surface of housing 120, as shown in Figure 3.When assembling infrared imaging module 100, web member 124 can be connected with circuit board 170 (such as, housing 120 can rest circuit board 170 and push up, as shown in Fig. 5 A-1 to 5C-2 and Fig. 5 F-1 to 5I).Processing module 160 can be electrically connected with circuit board 170 by suitable electrical connector.Therefore, infrared sensor package 128 can be electrically connected with processing module 160 by such as conductive path, and this conductive path is provided by such as lower component: the complementary connection on bond pad 142, housing 120 inside surface, the electrical connector 126 of housing 120, web member 124 and circuit board 170.Advantageously, such layout can be implemented and without the need to providing bonding wire between infrared sensor package 128 and processing module 160.

In various embodiments, the electrical connector 126 in housing 120 can be made up of any material requested (such as, copper or any other suitable conductive material).In one embodiment, electrical connector 126 can help to dispel the heat from infrared imaging module 100.

The substrate 140 of infrared sensor package 128 can be arranged on pedestal 150.In various embodiments, pedestal 150 (such as, base) can such as be formed and the copper one-tenth with black oxide or nickel plating coating by passing through metal injection moulding (MIM).In various embodiments, pedestal 150 can be made up of any material requested according to the needs of given application, such as zinc, aluminium or magnesium, and can be formed by any required technique be suitable for, such as aluminum casting, MIM or zinc quick cast, it may for needed for application-specific.In various embodiments, pedestal 150 may be implemented as provides support structure, various circuit pathways, radiator performance and other features in suitable occasion.In one embodiment, pedestal 150 can be at least in part with the sandwich construction that stupalith realizes.

In various embodiments, circuit board 170 can receive housing 120, thus physically can support the various parts of infrared imaging module 100.In various embodiments, circuit board 170 may be implemented as printed circuit board (PCB) (such as, the circuit board of FR4 circuit board or other types), the interconnection element of rigidity or flexibility (such as, the interconnection element of adhesive tape or other types), flexible circuit board, flexible plastic substrates, or other suitable structures.In various embodiments, pedestal 150 can realize with the various characteristic sum attributes described for circuit board 170, and vice versa.

Socket 104 can comprise the cavity 106 (such as, as shown in the assembly drawing of Fig. 2) being configured to receive infrared imaging module 100.Infrared imaging module 100 and/or socket 104 can comprise suitable projection, arm, pin, securing member or any other suitable engagement member, it can be used to utilize friction, infrared imaging module 100 is fixed on interpolation block 104 by tension force, adhesion and/or any other suitable mode or in.Such as, as as shown in Fig. 2-3, Fig. 5 A-1 to 5F-2,5H-1,5H-2,5J-1,5J-2,5L-1 to 5M-2 and 5O-1 to 5P, socket 104 can comprise engagement member 107, when infrared image-forming module 100 is inserted in the cavity 106 of socket 104, engagement member 107 can the surface 109 of engage 120.In other embodiments, the engagement member of other types can be used.

Infrared imaging module 100 can be electrically connected with socket 104 by suitable electrical connector (such as, contact element, pin, electric wire or any other suitable web member).Such as, as as shown in Fig. 3 and Fig. 5 A-1-Fig. 5 P, socket 104 can comprise electrical connector 108, it can contact the electrical connector of the correspondence of infrared imaging module 100 (such as, other electrical connectors on other electrical connectors, bond pad 142 or pedestal 150 on the side of interconnect pad, contact element or circuit board 170 or bottom surface, or other web members).Electrical connector 108 can be made up of any material requested (such as, copper or any other suitable conductive material).In one embodiment, when infrared image-forming module 100 inserts in the cavity 106 of socket 104, electrical connector 108 can by mechanically bias voltage to be pressed against on the electrical connector of infrared imaging module 100.In one embodiment, infrared imaging module 100 can be fixed in socket 104 by electrical connector 108 at least in part.The electrical connector of other types can be used in other embodiments.

Socket 104 can be electrically connected with main process equipment 102 by the electrical connector of similar type.Such as, in one embodiment, main process equipment 102 can comprise the electrical connector (such as, welded connections, be connected together part or other web members) be connected with through the electrical connector 108 of aperture 190, as shown in Fig. 2-3 and Fig. 5 A-1-Fig. 5 P.In various embodiments, this electrical connector can be fabricated onto sidepiece and/or the bottom of socket 104.

The various parts of infrared imaging module 100 can realize with flip chip technology (fct), and this technology is used in when not having additional clearance and parts are directly installed to circuit board, this additional clearance normally bonding wire connect needed for.As an example, flip-chip connection may be used for the overall dimensions of reduction infrared imaging module 100 for use in the application of compact small-shape factor.Such as, in one embodiment, can connect with flip-chip processing module 160 is installed to circuit board 170.Such as, in Fig. 5 A-1 to 5C-2,5F-1 to 5I, 5L-1,5L-2 and 5L-3 (it further describes in this article), infrared imaging module 100 can realize by this flip-chip arrangement.

In various embodiments, infrared imaging module 100 and/or the parts be associated can according to various technology (such as, wafer-class encapsulation technology) realize, as the U.S. Patent application 12/844124 applied on July 27th, 2010 with to set forth in the U.S. Provisional Patent Application 61/469651 of application on March 30th, 2011, it is all incorporated herein by reference at this.In addition, according to one or more embodiment, infrared imaging module 100 and/or the parts be associated can be implemented according to various technology, calibration, test and/or use, such as at the United States Patent (USP) 7470902 that on Dec 30th, 2008 announces, the United States Patent (USP) 6028309 that on February 22nd, 2000 announces, the United States Patent (USP) 6812465 that on November 2nd, 2004 announces, the United States Patent (USP) 7034301 that on April 25th, 2006 announces, the United States Patent (USP) 7679048 that on March 16th, 2010 announces, the United States Patent (USP) 7470904 that on Dec 30th, 2008 announces, illustrate in the U.S. Patent application 12/202896 that the U.S. Patent application 12/202880 of application on September 2nd, 2008 and on September 2nd, 2008 apply for, by reference they are incorporated herein in full.

Fig. 4 A-4D shows the example implementations of optical element 180, and it can be implemented in the infrared imaging module 100 according to embodiment of the present disclosure.In one embodiment, optical element 180 may be implemented as the silicon etching wafer scale unit eyeglass according to the various sizes shown in Fig. 4 B-4D.

As shown in Figure 4 A, optical element 180 can be embodied as cube substantially, but on the face providing aperture, have two protruding a little faces.Such as, optical element 180 can comprise physical pore size 182 and less clear aperature 184.Optical element 180 allows that required infrared wavelength is by arriving infrared sensor package 128.

In one embodiment, optical element 180 can be the single etched wafer level optical element be made up of silicon with following specification: the plane of delineation of 0.54 millimeter × 0.54 millimeter (such as, when be implemented as have 17 micron pixel spacing there is the infrared sensor package 128 of 32 × 32 infrared array sensors 132 time); The horizontal field of view (FOV) of about 55.7 degree; F/# approximates 0.91 greatly; At the modulation transfer function (MTF) of about 0.46 of 29cy/mm; The antireflecting coating that the loss of every face is less than about 2 percent; And focus on infinite distance.

In some embodiments, optical element 180 can be integrated into a part for the wafer-class encapsulation comprising infrared sensor package 128.Such as, optical element 180 may be implemented as a part for lid 130, be stacked on (such as, the suitable separator with being arranged on therebetween) on the various parts of infrared sensor package 128, or the various parts of otherwise integrated infrared sensor package 128.

In some embodiments, main process equipment 102 can comprise miscellaneous part 198, as non-thermal camera (such as, the non-thermographic device of Visible Light Camera or other types).Non-thermal camera can be image-forming module or the imaging device of small-shape factor, and in some embodiments, can realize in the mode similar with the various embodiments of infrared imaging module 100 that disclose in the application, wherein one or more sensors and/or sensor array are in response to the radiation (radiation such as, in visible wavelength, ultraviolet wavelength and/or other non-thermal wavelengths) in non-thermal spectrum.Such as, in some embodiments, non-thermal camera can use charge-coupled image sensor (CCD) sensor, electron multiplication CCD (EMCCD) sensor, complementary metal oxide semiconductor (CMOS) (CMOS) sensor, science CMOS (sCMOS) sensor or other wave filters and/or sensor to realize.

In some embodiments, non-thermal camera can be positioned at same position with infrared imaging module 100 and be orientated to the FOV making the visual field of non-thermal camera (FOV) overlapping infrared imaging module 100 at least in part.In one example in which, according to the U.S. Provisional Patent Application 61/748 of applying on Dec 31st, 2012, the various technology described in 018, infrared imaging module 100 and non-thermal camera may be implemented as the dual sensor module of shared public substrate, are incorporated herein by the full text of this temporary patent application by reference.

For there is the embodiment of this non-thermo-optical camera, various parts (such as, processor 195, processing module 160 and/or other processing element) can overlap be configured to, merge, mixing, or otherwise combine the infrared image of being caught by infrared imaging module 100 (such as, comprise heat picture) and the non-thermographic of being caught by non-thermal camera is (such as, comprise visible images), no matter substantially at one time or different time catch (such as, the time interval exceedes some hours, some skies, day at m-night, and/or otherwise).

In some embodiments, heat picture and non-thermographic can be processed to produce composograph (such as, in some embodiments to one or more process that these images carry out).Such as, the NUC process (as hereinafter further described) based on scene can being performed, true color process can be performed, and/or high-contrast process can be performed.

About true color process, such as, by mixing with the respective components of non-thermographic according to the radiancy component of hybrid parameter by heat picture, heat picture can be made to mix with non-thermographic, in some embodiments, hybrid parameter can by user and/or machine adjustments.Such as, can according to hybrid parameter in conjunction with the brightness of heat picture and non-thermographic or chromatic component.In one embodiment, this hybrid technology can be called as true color infrared image method.Such as, by day in imaging, the image of mixing can comprise non-thermal coloured image, and it comprises luminance component and chromatic component, and wherein its brightness value is replaced by the brightness value from heat picture and/or mixes with it.Use from the brightness data of heat picture makes the light intensity of non-thermal true color image brighten according to the temperature of object or dimmed.Like this, these hybrid technologies provide thermal imaging for daytime or visible images.

About high-contrast process, high spatial frequency content (such as, by performing high-pass filtering, Difference Imaging and/or other technologies) can be obtained from one or more heat and non-thermographic.Composograph can comprise radiancy component and the mixed components of heat picture, mixed components comprise the scene mixed with high spatial frequency content according to hybrid parameter infrared (such as, heat) characteristic, in some embodiments, hybrid parameter can by user and/or machine adjustments.In some embodiments, by high spatial frequency content is added on heat picture, high spatial frequency content from non-thermographic can mix with heat picture, and its high spatial frequencies content substitutes or rewrite those parts corresponding with the situation that high spatial frequency content exists of heat picture.Such as, high spatial frequency content can be included in the edge of the object described in the image of scene, but can not be present in the inside of this object.In such embodiment, blended image data can comprise high spatial frequency content simply, can be encoded into one or more components of composograph subsequently.

Such as, the radiancy component of heat picture can be the chromatic component of heat picture, and high spatial frequency content may from the brightness of non-thermographic and/or chromatic component.In this embodiment, composograph can comprise radiancy component (such as, the chromatic component of heat picture) and high spatial frequency content, radiancy component is encoded into the chromatic component of composograph, high spatial frequency content is encoded directly (such as, as mixing view data but do not have heat picture contribute) one-tenth composograph luminance component.By doing like this, the radiancy calibration of the radiancy component of heat picture can be retained.In similar embodiment, the view data of mixing can comprise the high spatial frequency content be added in the luminance component of heat picture, and the blended data finally obtained is encoded into the luminance component of the composograph finally obtained.

Such as, any technology disclosed in following application can be used in each embodiment: the U.S. Patent application 12/477,828 of application on June 3rd, 2009; The U.S. Patent application 12/766,739 of application on April 23rd, 2010; The U.S. Patent application 13/105,765 of application on May 11st, 2011; The U.S. Patent application 13/437,645 of application on April 2nd, 2012; The U.S. Provisional Patent Application 61/473,207 of application on April 8th, 2011; The U.S. Provisional Patent Application 61/746,069 of application on Dec 26th, 2012; The U.S. Provisional Patent Application 61/746,074 of application on Dec 26th, 2012; The U.S. Provisional Patent Application 61/748,018 of application on Dec 31st, 2012; The U.S. Provisional Patent Application 61/792,582 of application on March 15th, 2013; The U.S. Provisional Patent Application 61/793,952 of application on March 15th, 2013; International Patent Application PCT/the EP2011/056432 of application on April 21st, 2011; The U.S. Patent application 13/966,052 of application on August 13rd, 2013; The U.S. Provisional Patent Application 61/747,789 of application on Dec 31st, 2012; The U.S. Provisional Patent Application 61/683,124 of application on August 14th, 2012; The U.S. Patent application 14/099,818 of application on Dec 6th, 2013; The U.S. Patent application 14/101,245 of application on Dec 9th, 2013; The U.S. Patent application 14/101,258 of application on Dec 9th, 2013; The U.S. Patent application 14/138,040 of application on Dec 21st, 2013; The U.S. Patent application 14/138,052 of application on Dec 21st, 2013; The U.S. Patent application 14/138,058 of application on Dec 21st, 2013, it is incorporated herein by all these applications all by reference in full.Any technology described in other applications that are that describe in the application or that quote in the application or patent, can be applicable to any one in the purposes described in various hot equipment, non-thermal equipment and the application.

Referring again to Fig. 1, in various embodiments, main process equipment 102 can comprise shutter 105.In this respect, when infrared image-forming module 100 is arranged in socket 104, shutter 105 optionally can be positioned at (such as, as shown by arrows 103) above socket 104.In this respect, shutter 105 such as can when not using for the protection of infrared imaging module 100.Shutter 105 also can be used as a part for the calibration process (such as, Nonuniformity Correction (NUC) process or other calibration processes) of infrared imaging module 100 as temperature reference, as one skilled in the art will appreciate that.

In various embodiments, shutter 105 can be made up of various material, such as, and polymkeric substance, glass or other materials.In various embodiments, shutter 105 can comprise one or more coating with optionally filter electromagnetic radiation and/or the various optical properties (such as, uniform black matrix coating or reflexive gold plating) regulating shutter 105.

In another embodiment, shutter 105 can be fixed in appropriate location to protect infrared imaging module 100 all the time.In this case, a part for shutter 105 or shutter 105 can be made up of the suitable material (such as, polymkeric substance) substantially not filtering required infrared wavelength.In another embodiment, shutter can be implemented as a part (such as, in the lens barrel or miscellaneous part of infrared imaging module 100 or as its part) for infrared imaging module 100, as one skilled in the art will appreciate that.Alternatively, in another embodiment, do not need to provide shutter (such as, the outside or inside shutter of shutter 105 or other types), but the calibration carrying out NUC process or other types without fast gate technique can be utilized.

Fig. 5 A-1,5A-2,5B-1,5B-2,5C-1,5C-2,5D-1,5D-2,5E-1 and 5E-2 show the cut-open view of the infrared imaging module 100 realized by several form factor according to the various embodiment of the disclosure.Particularly, each in Fig. 5 A-1 to 5E-2 shows the cross-sectional view of infrared imaging module 100 when being arranged in corresponding socket 104, and another cross-sectional view of the same infrared imaging module 100 be separated with corresponding socket 104.

Should be understood that, Fig. 5 A-1 to 5E-2 shows the physics realization of the various parts shown in Fig. 1-4D.Such as, Fig. 5 A-1 and 5A-2 shows the physics realization of infrared imaging module 100 corresponding to embodiment shown in Fig. 2-3 and socket 104, and Fig. 5 B-1 to 5E-2 shows other examples of physics realization.

It is to be further understood that in Fig. 5 A-1 to 5C-2, electrical connector 126 can be arranged on as discussed in housing 120 and lead to infrared sensor package 128 and circuit board 170.On the contrary, in Fig. 5 D-1 to 5E-2, bonding wire 143 and 145 may be used for infrared sensor package 128 to be connected to processing module 160.In one embodiment, bonding wire 143 and 145 can pass pedestal 150.In another embodiment, bonding wire 143 and 145 can be connected to the circuit in pedestal 150 and not pass pedestal 150.In yet, bonding wire 143 and 145 can be connected to electrical connector 147 to provide the electrical connection of leading to socket 104 and/or main process equipment 102 between each several part of infrared imaging module 100.

In some embodiments, the socket 104 shown in Fig. 5 A-1 to 5E-2 may be implemented as can according to the various part numbers of mark in table 1 below from the Lisle's of such as Illinois the mobile phone camera socket that Incorporated obtains.Table 1 also identifies each illustrative aspects of the socket 104 shown in Fig. 5 A-1 to 5E-2.

Table 1

Fig. 5 F-1,5F-2,5G-1,5G-2,5G-3,5H-1,5H-2,5I, 5J-1,5J-2,5K, 5L-1,5L-2,5L-3,5M-1,5M-2,5N, 5O-1,5O-2 and 5P show other views of the infrared imaging module 100 realized by several form factor according to the various embodiment of the disclosure.Such as, Fig. 5 F-1 and Fig. 5 F-2 shows the embodiment of the infrared imaging module 100 being similar to Fig. 5 A-1 and Fig. 5 A-2.In Fig. 5 F-1 and Fig. 5 F-2, electrical connector 126 be represented as be in housing 120 inside surface on.In addition, electrical connector 108 is described so that clearer by with contrast colors.In addition, electrical connector 147 be represented as be in the circuit board 170 that can be connected to electrical connector 108 side surface on.

Fig. 5 G-1,5G-2 and 5G-3 shows the embodiment of the infrared imaging module 100 being similar to Fig. 5 A-1 and 5A-2, wherein described with contrast colors so that clearer electrical connector 108 is on the bottom surface of socket 104, it can be used to be connected with the suitable web member of main process equipment 102.

Fig. 5 H-1 and 5H-2 shows the embodiment of the infrared imaging module 100 being similar to Fig. 5 C-1 and 5C-2.In Fig. 5 H-1 and 5H-2, electrical connector 126 be represented as be in housing 120 inside surface on.In addition, electrical connector 108 is described so that clearer by with contrast colors.

Fig. 5 I shows the embodiment of infrared imaging module 100, which provides another view of the embodiment shown in Fig. 5 H-1 and 5H-2.In Fig. 5 I, contact element 172 be represented as be in circuit board 170 bottom surface on, when infrared image-forming module 100 inserts in socket 104, this bottom surface can contact electrical connector 108.Therefore, should be understood that, the various parts of infrared imaging module 100 can be electrically connected to main process equipment 102 by contact element 172 and electrical connector 108.

Fig. 5 J-1 and 5J-2 shows the embodiment of the infrared imaging module 100 being similar to Fig. 5 D-1 and 5D-2, and it has the socket 104 be similar to shown in Fig. 5 E-1 and 5E-2.In Fig. 5 J-1 and 5J-2, electrical connector 108 is described so that clearer by with contrast colors.In addition, electrical connector 147 be represented as be in the circuit board 170 that can be connected to electrical connector 108 side on.

Fig. 5 K shows the embodiment of infrared imaging module 100, which provides another view of the embodiment shown in Fig. 5 J-1 and 5J-2.In Fig. 5 K, electrical connector 147 by be expressed as further be in the circuit board 170 that can be connected with suitable electrical connector 108 bottom surface on.

Fig. 5 L-1,5L-2 and 5L-3 show the exploded view of several embodiments of infrared imaging module 100.Such as, at Fig. 5 L-1, in 5L-2 and 5L-3, electrical connector 126 be represented as be in housing 120 inside surface on.Further, electrical connector 147 be represented as be in the circuit board 170 that can be connected to electrical connector 108 side on.In addition, electrical connector 108 is described with contrast colors to make inner socket more clear, and is also on the bottom surface of socket 104, and this bottom surface can be used for being connected with main process equipment 102 with infrared imaging module 100.

Fig. 5 M-1 with 5M-2 shows the embodiment of the infrared imaging module 100 realized with the various parts (such as, lid 130 and substrate 140) with consistent width substantially of infrared sensor package 128.In one embodiment, such realization can allow that the various parts of infrared sensor package 128 cut in the fabrication process together.In Fig. 5 M-1 and 5M-2, substrate 140 can with having the segmentation of ROIC (such as, multilayer) implementation realizes, ROIC is arranged on one or two layer and goes up and other circuit (such as, by the perforation of suitable silicon or other web members) being connected to substrate 140 by layer.Same as shown in Fig. 5 M-1 and 5M-2, substrate 140 can be connected to pedestal 150 (such as, implement flip-chip and install) by solder ball 144, and processing module 160 can be connected to pedestal 150 by bonding wire 145.Fig. 5 N shows the embodiment of infrared imaging module 100, which provides another view of the embodiment shown in Fig. 5 M-1 and 5M-2.

Fig. 5 O-1 and 5O-2 shows the embodiment of infrared imaging module 100, and wherein infrared sensor package 128 realizes in the mode similar with Fig. 5 M-1,5M-2 and 5N.In Fig. 5 O-1 and 5O-2, processing module 160 can be integrated into a part for substrate 140.

Fig. 5 P shows the embodiment of infrared imaging module 100, which provides another view of the embodiment shown in Fig. 5 O-1 and 5O-2.Fig. 5 P further illustrates the electrical connector 108 on socket 104 bottom surface.

Also the other implementation of infrared imaging module 100 can be expected.Such as, Fig. 6-8 shows the infrared imaging module 100 realized by several layout according to the various embodiment of the disclosure.

Such as, Fig. 6 shows the infrared imaging module 100 after encapsulation.Fig. 7 shows infrared imaging module 100, and wherein processing module 160 to be arranged on circuit board 170 and to be positioned at housing 120 outside to provide the bottom overall profile of image-forming module 100.

Fig. 8 shows the infrared imaging module 100 of Fig. 7, and wherein in order to the example of array and bonding wire 143 that lid 130, infrared sensor 132 are described, housing 120 is represented as transparent.As shown in Figure 8, the various parts of infrared sensor package 128 can be connected to circuit board 170 by bonding wire 143.

According to other embodiment of the present disclosure, housing 120 can use nonmetallic outer cover substantially to realize, and it is configured to substantially or surrounds the various parts of infrared imaging module 100 completely.One or more metal level can be arranged on the inner and/or outer surface of difference (such as, multiple, most of, substantially all or all this surfaces) of outer cover.This implementation can be used for reducing the impact of various environmental baseline, and environmental baseline adversely may affect the performance of infrared imaging module 100.In addition, one or more conductive trace (such as, electrical connector) can be based upon in housing 120 and/or on the surface of housing 120 so that the signal of parts as infrared sensor package 128, temperature measurement unit and/or miscellaneous part from infrared imaging device passes through.These and other feature and advantage will further describe in this article.

Fig. 9 A and 9B respectively illustrates the top skeleton view being arranged on the infrared imaging module 100 in socket 104 according to the various embodiment of the disclosure and end skeleton view.Illustrate further as previously described and in figure 9 a, infrared imaging module 100 can comprise housing 120 and have the lens barrel 110 of aperture 112.Also illustrate further as previously described and in figures 9 b and 9, socket 104 can comprise electrical connector 108, and it can contact the electrical connector of the correspondence of infrared imaging module 100.

Figure 10 A show according to embodiment of the present disclosure by the infrared imaging module 100 removed from socket 104.As previously described and illustrate further in Figure 10 A, infrared imaging module 100 can comprise pedestal 150, and it has electrical connector 147 so that each several part of infrared imaging module 100 is connected to socket 104 and/or main process equipment 102.

In Figure 10 A, housing 120 is represented as has nonmetallic outer cover 910 substantially, and it has the outside surface of exposure.In embodiment shown in this, the outside surface of housing 120 is not covered, typically with metal layers covering.Figure 10 B shows the infrared imaging module 100 according to embodiment of the present disclosure, and the outer cover 910 of its middle shell 120 represents with translucent form the metal level 920 (such as, metalized surface) showing housing 120.In embodiment shown in this, metal level 920 is arranged on substantially all inside surfaces of outer cover 910.

Figure 10 C shows the infrared imaging module 100 according to embodiment of the present disclosure, and wherein outer cover 910 and metal level 920 all represent to show the several parts surrounded by housing 120 with translucent form.In this respect, when assembling infrared imaging module 100, housing 120 can surround various parts substantially.Such as, as shown in figure 10 c, housing 120 can surround infrared sensor package 128 substantially, and its focal plane arrays (FPA) that such as can be used in the Vacuum Package assembly sealed by lid 130 and substrate 140 realizes.

Although housing 120 is represented as the shape (being further described in this application) with roughly square or rectangle in Fig. 9 A, 10A-C and 12A-E, any required shape can be used at least in part or fully surround the one or more required parts of infrared imaging module 100.In addition, although in Figure 10 A-C, housing 120 is represented as and is arranged on pedestal 150, also can imagine other Install and configure.In various embodiments, required any parts group can be surrounded substantially or completely by housing 120, to seal these parts, itself and external environment condition is isolated.

Figure 11 A-B shows the infrared imaging module 100 according to the various embodiment of the disclosure, and its middle shell 120 is removed.Such as, in Figure 11 A, the lid 130 of infrared sensor package 128 and substrate 140 are represented as and are arranged on pedestal 150, and heating radiator 1102 (such as, in some embodiments, copper or graphite) is therebetween.And in Figure 11 A, bonding wire contact element 1104 and 1106 is represented as and is in respectively on substrate 140 and pedestal 150 to receive bonding wire 143 (not shown in Figure 11 A).

In Figure 11 B, processing module 160 be represented as be arranged on pedestal 150 downside on.Such as, in some embodiments, processing module 160 can be connected to substrate 140 by bonding wire 143 and 145 (not shown in Figure 11 B), as described earlier.

Figure 12 A-E shows several views of the housing 120 according to various embodiment of the present disclosure.As discussed, housing 120 can comprise outer cover 910 and one or more metal level.Outer cover 910 can be nonmetallic outer cover substantially, and this outer cover implements (such as, in some embodiments, emissivity is in the scope of about 0.8 to about 0.95) with having relatively low thermal conductivity with the material of relative high emissivity.Such as, outer cover 910 can be made up of plastics and/or other suitable materials substantially.

One or more metal level 920 can be arranged on different inner and/or outer (such as, inner side and/or outside) surface (such as, multiple, most of, substantially all or all this surfaces) of outer cover 910.Such as, in one embodiment, metal level 920 can with the mode shown in Figure 12 A-D be arranged in outer cover 910 in the face of infrared sensor package 128 different inside surfaces on.In another embodiment, metal level 920 can be arranged in outer cover 910 on the different outside surfaces of external component or external environment condition.In another embodiment, combination that is interior and outer metal level 920 can be used.Such as, in fig. 12e, in two metal levels 920 are presented at respectively and on outside surface, represented by 920A and 920B.In some embodiments, outer cover 910 can stand metalized, and wherein various metal level is deposited and/or is otherwise arranged on outer cover 910.

As shown in Figure 12 A-E and 13, housing 120 can comprise the various conductive traces 930 with metal level 920 electrical isolation.In various embodiments, conductive trace 930 can be arranged on one or more inside surface, one or more outside surface, and/or in the wall of outer cover 910.In various embodiments, conductive trace 930 may be used for the electrical connection providing electrical connection between the various parts in the internal cavities 912 (space such as, occupied by infrared sensor package 128 and/or miscellaneous part) surrounded by housing 120 and/or provide from the various parts in cavity 912 to housing 120 outside.In one embodiment, insulating material (such as, having low conductivity) can be arranged in the region 940 between conductive trace 930 and metal level 920.In another embodiment, conductive trace 930 can be surrounded by insulating material substantially.In another embodiment, space (such as, white space) can be introduced between conductive trace 930 and metal level 920 to make nonconducting outer cover 910 substantially come out and effectively conductive trace 930 and metal level 920 to be kept apart.

In various embodiments, metal level 920 can with having relatively high thermal conductivity, relatively low emissivity (such as, in some embodiments, emissivity is in the scope of about 0.02 to about 0.11) material realize, even and if described material have and be exposed to the tendency that various environmental baseline also maintains these character for several years.

In some embodiments, metal level 920 may be implemented as the one or more layers (such as, being directly arranged on outer cover 910 and/or one or more middle layer and/or structure) be arranged on outer cover 910.In some embodiments, metal level 920 can be realized by multiple different metallic sub-layer, and each sublayer can have useful characteristic to allow that the implementation of multilayer obtains the improvement performance more superior than the implementation of the individual layer using single type metal.

Such as, copper sublayer can provide with low cost, and it demonstrates high thermal conductivity and invests well on plastics.This copper sublayer can be oxidized to high emissivity rapidly, thus in some embodiments can be coated.As another example, can provide nickel sublayer, it even also keeps low-launch-rate after oxidation.As another example, the thick layer deposition of gold layer may be expensive and may can not invest on plastics well very well, but it demonstrates low-launch-rate and generally anti-oxidant.Therefore, by metal level 920 is embodied as multiple sublayer, metal level 920 can show the various advantages relevant to dissimilar metal, also compensates for the compromise of the various performances relevant to the metal of particular type simultaneously.

In this, Figure 13 shows the xsect of the housing 120 obtained according to the line 13-13 at Figure 12 B of embodiment of the present disclosure.In fig. 13, metal level 920 is implemented as the multiple sublayers on outer cover 910.In embodiment shown in this, metal level 920 can comprise: be arranged in the copper sublayer 922 (such as, bottom layer) on outer cover 910, its thickness is about 10 μm; Nickel sublayer 924 (such as, intermediate part-layer), its thickness be about 6 μm (such as, or thicklyer providing the performance on electromagnetic interference shield to improve metal level 920, this can further describe in this article); And/or gold layer 926 (such as, holder layer), its thickness is in the scope of about 0.1 μm to about 3 μm.

As shown in Figure 12 B-D, metal level 920 may be implemented as and to extend on the lip of outer cover 910 in region 950 and to extend on the outside surface of outer cover 910.Region 950 such as may be used for metal level 920 being electrically connected to one or more electrical connector 1110 (see Figure 10 A-C and 11A).

Similarly, as shown in Figure 12 A-D, conductive trace 930 may be implemented as and to extend on the lip of outer cover 910 in region 960 and to extend on the outside surface of outer cover.Region 960 such as may be used for one or more conductive trace 930 being electrically connected to one or more electrical connector 1108 (see Figure 11 A).

Electrical connector 1108 and 1110 as one sees fit for various object, can comprise, such as, and ground connection, production and assembly evaluation, operation (such as, send between the various components and/or receive electric signal), and/or other objects.In some embodiments, conductive epoxy resin or solder can be provided to be fixed respectively in region 950 and/or 960 and to be electrically connected to one or more electrical connector 1110 and/or 1108.

In some embodiments, housing 120 can manufacture in the following manner: allow conductive trace 930 and/or miscellaneous part to be comprised among housing 120 or on.Such as, conductive trace 930 can be manufactured to a part for metal level 920.In this, conductive trace 930 can effectively be provided with metal level 920 in metallization operations process, then passes through the remainder electrical isolation of suitable insulating material or space and metal level 920.In addition, provide conductive trace 930 by a part for the metallization process as metal level 920, the total cost of housing 120 can provide the classic method of electrical connector to reduce than with the electric wire/cable be separated.

Such as, in the embodiment shown in Figure 13, conductive trace 930 is formed a part for the metallization process of metal level 920, and metal level 920 uses identical sublayer 922,924 and 926.Space in region 940 such as can be formed by covering outer cover 910, upon formation etching area 940 and/or other suitable technology in the process forming metal level 920.

In some embodiments, housing 120 can be the molded interconnection devices (MID) manufactured according to suitable injection moulding technology.In this respect, housing 120 can realize with electrical connector (such as, electrical connector 126 described herein or other suitable electrical connectors).

In some embodiments, in various parts can partly or completely embed (such as, implant, be formed in or be otherwise arranged on) housing 120, or this manufacturing technology is used to be arranged on the suitable inner or outer surface of housing 120.Such as, as shown in Figure 12 A-C and 12E, temperature measurement unit 980 (such as, thermistor, temp diode and/or other suitable parts) can be provided.Temperature measurement unit 980 also can be electrically connected to one or more conductive trace 930 and/or electrical connector 126.Therefore, temperature measurement unit 980 can be provided for the signal accurately measuring the temperature be associated with housing 120.Such temperature can comprise, such as, and the temperature of housing 120 itself, the temperature of cavity 912, the temperature being arranged in the parts in cavity 912 and/or other relevant temperature.

Such as, the suitable parts of the suitable components and/or infrared imaging module 100 that can be sent to housing 120 outside by conductive trace 930 and/or electrical connector 126 from wall or the cavity 912 of housing 120 from the signal of temperature measurement unit 980 are to process.This temperature survey can be used for determining more accurately the radiation contributions from source outside the venue, improves the thermal imaging precision of infrared sensor package 128, and performs various Nonuniformity Correction process as supplementary flat field correction and/or correct off-site radiation.

By providing metal level 920 on the inner and/or outer surface of outer cover 910, the various problems relevant to traditional infrared imaging system can show and reduce.Such as, traditional system may experience the reduction of thermal imaging precision and may show low spatial frequency heterogeneity, its by undesirable external radiation caused by off-site radiation, described off-site radiation is received from the position outside the visual field of the target scene of wishing imaging, and/or is received from the various parts of this system.

The low-launch-rate that these undesirable external radiation effects can be covered, typically with metal layers 920 in infrared imaging module 100 significantly reduces.Particularly, by reducing the power launched towards infrared sensor package 128 of housing 120, the low-launch-rate of metal level 920 can reduce the impact of the off-site radiation received by infrared sensor package 128.

In this, can be expressed as W (λ, T) * e by the power of surface emitting, wherein λ is the wavelength of infrared radiation, and T is the temperature on surface, and e is the emissivity on surface.Therefore, the power of transmitting can be considered to the linear function of emissivity.

Metal (such as gold) has the emissivity of about 0.02, the emissivity scope of nickel is about 0.05 to about 0.11, the emissivity scope of aluminium is about 0.05 to about 0.09, all these may be less than the emissivity of outer cover 910 (such as considerably, when plastics or similar material, its emissivity scope is about 0.8 to about 0.95).Therefore, consider emissivity discussed above, the power launched from metal level 920 can be about 1/10th of the power from outer cover 910 transmitting.

Therefore, deposit in case at metal level 920, infrared sensor package 128 receives less off-site radiation (such as, power) (such as, reducing about 90% in some embodiments) in response to the temperature variation of outer cover 910.Compared with outer cover 910, the power launched by metal level 920 reduces, this exporting change causing infrared sensor package 128 to experience in response to this radiation is less (such as, the less impact of off-site radiation will show in the picture frame of being caught by infrared sensor package 128) accordingly.Therefore, infrared sensor package 128 can with larger thermal imaging precision operations, because when carrying out the temperature survey of the object in target scene, not too need compensating field external radiation.In addition, compared with outer cover 910, the radiant quantity of being launched by metal level 920 reduces, and this can cause infrared sensor package 128 to show less low spatial frequency heterogeneity.In addition, by reducing the radiation that infrared sensor package 128 receives, can the possible mistake of corresponding minimizing when estimating the contribution of off-site radiation.Therefore, infrared sensor package 128 can with the thermal imaging precision improved and homogeneity operation.

Metal level 920 may be used for the thermal conductivity improving infrared imaging module 100, thus reduces the other problem be associated with traditional infrared imaging system.In this respect, traditional system may experience the non-uniform heat flux (such as, focus) from various parts (such as, be arranged within housing or outside) and/or various external heat source.Therefore, Temperature Distribution in such systems may marked change, particularly when various subassembly selection switch on and off time.If do not revised, the non-uniform heat flux of housing may cause low spatial frequency heterogeneity to show on a sensor.

By the high heat conductance of metal level 920, the impact of such non-uniform heating can reduce considerably in infrared imaging module 100.Outer cover 910 can realize with the material (such as, being substantially made up of plastics and/or other materials) with relatively low thermal conductivity (such as, also having relatively slow thermal time constant).But, there is the metal level 920 of higher thermal conductivity (such as by providing than outer cover 910, also there is thermal time constant faster), heat can more uniformly be distributed in around infrared sensor package 128, thus reduce the deleterious effect of non-uniform heating, especially when close to the occasion using infrared imaging module 100 when miscellaneous part, such as in the personal electronic devices.

In addition, the high heat conductance of metal level 920 can allow that the parts of infrared imaging module 100 are more effectively cooled by convection current.In this respect, the different surfaces that the heat that infrared sensor package 128 and processing module 160 produce can be covered, typically with metal layers 920 receives and is delivered to housing 120, and it provides large surface area to cool for convection current.Therefore, the temperature variation in housing 120 can reduce the more accurate temperature survey (such as, by temperature measurement unit 980) of allowing housing 120.In some embodiments, the hot-fluid of the increase in housing 120 allows that infrared imaging module 100 realizes lower steady state operating temperature, which improves the dynamic range of infrared sensor 132 and the reliability of infrared imaging module 100.

The mode that metal level 920 also may be used for overcoming the Railway Project be associated with classic method provides electromagnetic interference (EMI) (EMI) to shield.In this respect, traditional system can adopt the EMI shielding part being implemented as independent structure, and it must be positioned at the top of various parts to shield.This structure takies valuable space, and reduce convection current cooling, and relate to extra assembly cost, all these makes them can not be applicable to the application of small-shape factor well.

These shortcomings can be reduced considerably by metal level 920.In some embodiments, metal level 920 can ground connection (such as, in region 950, as discussed), and operate as EMI shielding part.Particularly, metal level 920 can as shielding part operation to decay by infrared sensor package 128, processing module 160 and/or the EMI that launched by the various parts that housing 120 surrounds considerably, thus the parts of shielding main process equipment 102 and/or external environment condition reduce possible interference from EMI.Metal level 920 also can as shielding part operation with the EMI (such as, being incident on the EMI on outer cover 910) of attenuate external considerably with the various parts shielding infrared sensor package 128 and/or surrounded by housing 120.

Therefore, compared with traditional EMI shielding part, metal level 920 effectively provides and housing 120 compact EMI shielding part integrally, and its space outerpace not outside occupying volume and not needing installs extra external component (such as, thus reduce material and assembly cost).In addition, as in some embodiments herein discuss, in fact metal level 920 can improve the cooling of infrared imaging module 100.

Figure 14 shows the technique of the manufacture infrared imaging module 100 according to embodiment of the present disclosure.Although identify specific operation in fig. 14, the operation of less or more quantity can be performed as required according to suitable manufacturing technology.

In operation 1410, provide outer cover 910.In some embodiments, operate 1410 can comprise and utilize MID technology various electrical connector 126 and/or parts (such as, temperature measurement unit 980 or miscellaneous part) be embedded in partially or completely in outer cover 910 and form outer cover 910.In addition and/or in replacement scheme, can be attached and/or link in operation 1440, operation 1440 can further describe in this article.

In operation 1420, provide metal level 920.In some embodiments, executable operations 1420 can be carried out as a part for MID manufacturing process (such as, the part as operation 1410) by the surface of the outer cover 910 that metallizes, thus save cost and time.In some embodiments, according to suitable metallization technology, metal level 920 can be formed as single layer and/or several sublayer (such as, sublayer 922,924,926 and/or other).In some embodiments, in the process of operation 1420, outer cover 910 can suitably be covered to limit conductive trace 930 and/or region 940.In this, conductive trace 930 can be formed as multiple parts of metal level 920 in the process of operation 1420.In other embodiments, conductive trace 930 and/or region 940 can be provided in other operations.

In operation 1430, provide conductive trace 930 (such as, if be not provided in operation 1420).In some embodiments, operation 1430 can comprise etching and/or otherwise remove metal level 920 multiple parts with exposed region 940, thus limit conductive trace 930 from metal level 920.In other embodiments, conductive trace 930 can be the metal provided separately in operation 1430.Such as, the multiple parts removing metal level 920 in the region receiving conductive trace 930 can specified in region 940 and also.Then suitable being removed in region between the existing part of metal level 920 one or more metal levels of conductive trace 930 can be provided for.

In some embodiments, operate 1430 can also comprise and make conductive trace 930 and metal level 920 isolate (such as, electric isolution) (such as, if be not performed in operation 1420).This can comprise, and such as, the space in retaining zone 940, provides isolated material in region 940, substantially or completely surrounds conductive trace 930 with isolated material, and/or other suitable isolation technologies.

In operation 1440, one or more parts are attached to housing 120 and/or are connected to conductive trace 930.Such as, in one embodiment, temperature measurement unit 980 can be connected to conductive trace 930 and be arranged on the inside surface of housing 120.

In operation 1450, provide the parts being intended to the infrared imaging module 100 resided in cavity 912.Such as, in some embodiments, operate 1450 and can comprise the miscellaneous part manufacturing or otherwise provide infrared sensor package 128 and/or infrared imaging module 100.

In operation 1460, the parts provided in operation 1450 are enclosed in cavity 912 substantially or completely.In some embodiments, operation 1460 can comprise and makes infrared sensor package 128 and housing 120 relative to each other locate to make housing 120 at least substantially surround infrared sensor package 128, and make metal level 920 be arranged in outer cover 910 faced by infrared sensor package 128 each inside surface on.Such as, outer cover 910 can decline on infrared sensor package 128.As another example, infrared sensor package 128 can be inserted in cavity 912.

In some embodiments, operation 1460 can comprise various operation to assemble infrared imaging module 100, as passed through to be arranged on pedestal 150 or circuit board 170 by housing 120.In other embodiments, operate 1460 can comprise the different piece of housing 120 is fitted together to surround parts.In other embodiments, housing 120 can be formed in around parts in its manufacture process.

In operation 1470, such as, according to various technology described herein, infrared imaging module 100 is engaged with socket 104.In some embodiments, operation 1470 can comprise inserts in the socket 104 of main process equipment 102 by infrared imaging module 100, engages with socket 104 to make housing 120.

Also other embodiments can be expected.Such as, although metal level 920 is mainly described to be on one or more inside surfaces of outer cover 910, but when may expect to realize further various emissivity, conductivity, shielding and provided by metal level 920 other advantages time, metal level 920 can be arranged on the inner and/or outer surface of difference of outer cover 910.

Figure 15 A-15C represents the several various view with the infrared imaging module 100 of shutter assembly 1500 according to embodiment of the present disclosure.Specifically, Figure 15 A represents the top perspective view of infrared imaging module 100, wherein shutter assembly 1500 be stacked on housing 120 and/or lens barrel 110 top on and wherein processing module 160 be arranged on circuit board 170 and outside housing 120, Figure 15 B represents the top plan view of the infrared imaging module 100 of Figure 15 A, and Figure 15 C represents the cross-sectional view of the line 15C-15C of the infrared imaging module 100 along Figure 15 B.

According to extra embodiment of the present disclosure, shutter assembly 1500 can be suitable for responsive control signal (such as, driving voltage/electric current) optionally substantially stop outside infrared radiation to enter optical element 180A (such as, comprising the multiple elements defining multi-element lens) and/or aperture 112.In this respect, according to different embodiments, shutter assembly 1500 can comprise paddle part 1502, it optionally can be moved by actuator 1504 and change into provide from paddle part 1502 by aperture 112 and/or optical element 180A to the infrared radiation of infrared sensor 132, to get rid of the outside infrared radiation from scene.

Therefore, such as, shutter assembly 1500 can as the body of the approximate black for performing NUC process or other calibration processes, as the skilled person will appreciate.Such as, shutter assembly 1500 can be used for performing the flat field correction based on shutter (FFC) process come through suitable amendment from the FFC technology based on shutter, its U.S. Patent application 12/391 applied on February 23rd, 2009, illustrate in 156, by reference the document is incorporated herein in full.

Shown in embodiment as shown in figures 15 a-15 c, according to some embodiments, shutter assembly 1500 can be suitable for relative to housing 120 and/or lens barrel 110 stacking in one way, which allows that the height 1506 of the increase caused by shutter 1500 in general outline is only a part for the height 1508 of shutter assembly.Like this, shutter assembly 1500 can be included in infrared imaging module 100 to provide shutter to be positioned at benefit outside optical element 180/180A, as discussed further, still keeps the compact overall dimensions of infrared imaging module 100 herein simultaneously.In addition, because shutter assembly 1500 can be arranged dividually with housing 120, so shutter assembly 1500 can above such as about Fig. 5 A-1-Figure 14 various embodiments described by various shape factor and topological structure in be combined with infrared imaging module 100, and hardly with what amendment or design variation.

By outside at optical element 180/180A instead of provide shutter (such as between infrared sensor 132 and optical element 180/180A, paddle part 1502), can work as when such as performing the above-described different calibration process based on shutter, realize calibrating more accurately.Namely, the paddle part 1502 of optical element 180/180A outside may can not stop the off-site radiation sent from housing 120 and/or lens barrel 110 to arrive infrared sensor 132, thus allow that calibration process corrects this off-site radiation more accurately when obtaining calibration data.Such as, by allowing that this off-site radiation arrives infrared sensor 132, Nonuniformity Correction process may can correct the low spatial frequency heterogeneity that may be caused by this off-site radiation.

In another example, radiancy calibration process may can determine the output of the infrared sensor package 128 caused by this off-site radiation, and the contribution compensating this off-site radiation is to provide the radiometry of the temperature be associated with scene or object more accurately.More particularly, when during paddle part 1202 is in the closed position with stop external radiation arrive optical element 180/180A, the infrared flux that infrared sensor 132 receives can be the infrared flux launched from source (such as, housing 120 and/or lens barrel 110) outside the venue and the summation of infrared flux of launching from paddle part 1202.Therefore, when during paddle part 1202 is in the closed position the output example of infrared sensor package 128 as being expressed as:

Output=(IR_flux _paddle+ IR_flux _out-of-field) × Resp+Offset (equation 1)

According to an embodiment, wherein, Resp represents the responsiveness of infrared sensor 132, and Offset represents the deviation of the output of infrared sensor package 128.

If know the optical characteristics of the temperature and light element 180A/180 of paddle part 1202 (such as, transmission and f-number), then as those skilled in the art understand, can calculate and launch from paddle part 1202 infrared flux (the IR_flux arriving infrared sensor 132 _paddle).Then, can be drawn as follows by the output that source causes outside the venue:

Output _out-of-field=Output – (IR_Flux _paddle× Resp+Offset) (equation 2)

Then output (the Output of the infrared sensor package 128 caused by the infrared radiation from housing 120 and/or lens barrel 110 can be deducted during image capture or afterwards _out-of-field), to make the output finally obtained can represent the infrared flux level be associated with scene, thus produce the image obtaining calibrating in radiancy.Therefore, such as, the NUC of more accurate infrared imaging module 100, radiometric and/or other calibrations can advantageously be allowed according to the infrared imaging module 100 with shutter assembly 1500 of one or more embodiment.

Describe shutter assembly 1500 in more detail referring now to Figure 16 A-16D and manufacture the method with the infrared imaging module 100 of shutter assembly 1500, Figure 16 A-16D shows the different views of the shutter assembly 1500 according to embodiment of the present disclosure.Figure 16 A represents the top perspective view of shutter assembly 1500.As being in as shown in Figure 16 A in contrasting tone to be easier to understand, shutter assembly 1500 can comprise the body 1510 being suitable for the various parts carrying or otherwise support shutter assembly 1500, and is coupled to body 1510 to close the lid 1512 of some parts of shutter assembly 1500 at least in part.

In shown embodiment and other embodiments, shutter assembly 1500 can comprise formation (such as, molded, punching press, machining or otherwise manufacture) recess 1514 on body 1510 surface, as illustrated in figure 16b, Figure 16 B represents the bottom perspective view of shutter assembly 1500.In various embodiments, recess 1514 can be shaped as and receives housing 120 and/or lens barrel 110 at least partially, to make when shutter assembly 1500 is stacking relative to housing 120, as described with reference to figure 15C, the height 1506 of increase can be reduced above.Depend on specific embodiment, housing 120 and lens barrel 110 can have various shape and/or configuration at their intersection.Such as, as shown in this article, in certain embodiments, lens barrel 110 can have from the outstanding part of housing 120, and/or in certain embodiments, housing 120 can have the outstanding lip of the part around lens barrel 110.Therefore, depend on specific embodiment, recess 1514 can be shaped as a part for receiver lens lens barrel 110 (such as, outshot), the part of housing 120 (such as, outstanding lip), or lens barrel 120 and the part both housing 110.In the embodiment of shown Figure 15 C, such as, recess 1514 can be shaped as the outshot of receiver lens lens barrel 110 and the outstanding lip portion of housing 120, to make shutter assembly 1500 can be enclosed within the top of lens barrel 110 with the paddle part 1502 of positioning optical element 180A/180 outside, still keep thin profile simultaneously.

Also the embodiment not having recess 1514 or there is difform recess can be expected.Such as, body 1510 can be L shape or be configured as other shapes and be not enclosed within lens barrel 110 and/or housing 120 by substantially all shutter assemblies 1500 to reduce monnolithic case so that large parts (such as, actuator 1504) are navigated to side substantially.In other embodiments, if such as increase the special applications that the whole height of shutter assembly 1500 does not affect infrared imaging module 100, then shutter assembly 1500 may not need the recess 1514 that is formed on body 1510.It will also be appreciated that, for the embodiment of infrared imaging module 100 not having independent lens barrel, if such as optical element 180A/180 is arranged on housing or housing achieves lens barrel, then recess 1514 can be shaped as the part receiving this housing.

In some embodiments, shutter assembly 1500 can be fixed in correct position relative to housing 120 and/or lens barrel 100 by recess 1514, recess 1514 receives the appropriate section that ground engages (such as, utilizing friction and/or pressure to keep) housing 120 and/or lens barrel 110.In some embodiments, except or replace receive ground engage 120 and/or lens barrel 110 appropriate section recess 1514 except, shutter assembly 1500 can utilize bonding agent, protuberance, arm, pin, securing member, screw or any other suitable joint element to be fixed in correct position.

Can describe all parts of shutter assembly 1500 in more detail by reference diagram 16C, Figure 16 C shows the top perspective view of shutter assembly 1500, and its middle cover 1512 is removed to show all parts.In shown embodiment and other embodiments, body 1510 can be suitable for carrying, support various parts and/or provide suitable installation site for various parts, and described parts comprise paddle part 1502, actuator 1504, lid 1512 and/or base plate 1516.In some embodiments, shutter assembly 1500 can comprise base plate 1516, and it is such as arranged on body 1510 by the supporting pin 1518A-1518B stretched out from body 1510 or is otherwise arranged on body.In some embodiments, base plate 1516 can have aperture 1517 formed thereon, aperture 1517 be suitable for being positioned to when paddle part 1502 in an open position middle time allow that infrared radiation is by aperture 112 and/or optical element 180A/180, as shown in fig. 16 c.

Actuator 1504 can be suitable in response to control signal (such as, driving voltage or electric current) optionally make paddle part 1502 move between open position (as shown in fig. 16 c) and off-position, control signal is received from the suitable components of infrared imaging module 100 (such as, processing module 160, or miscellaneous part) or be received from external source (such as, by the parts on circuit board 170 and/or web member).In some embodiments, No. 1504, actuator with magnet rotor, motor or can be applicable to other the similar electromechanical actuators realization producing motion and/or power in response to received current and/or voltage.For other embodiments, other implementations of actuator 1504 also can be expected.Such as, the thermal actuator of motion can be produced with being suitable for being expanded by thermal expansion, being suitable for realizing actuator 1504 by the piezo-activator of piezoelectric effect generation motion or microelectromechanical systems (MEMS) actuator of other types.

In shown embodiment and other embodiments, actuator 1504 can be suitable for optionally moving trundle 1520, and this makes again paddle part 1502 move pivotally between open and closed positions around supporting pin 1518A.According to some embodiments, as shown in the arrow in Figure 16 D, trundle 1520 can in response to reception control signal (such as, drive current/voltage) actuator 1504 make paddle part 1502 move to off-position pivotally from open position (as shown in the figure), Figure 16 D shows relative to housing 120 and/or the stacking shutter assembly 1500 of lens barrel 110, and wherein the lid 1512 of shutter assembly 1500 illustrates with translucent form with easy to understand.When being in open site, paddle part 1502 can allow that outside infrared radiation passes to aperture 112 and/or optical element 180A/180, and when in the closed position middle time, paddle part 1502 can stop outside infrared radiation to arrive aperture 112 and/or optical element 180A/180 substantially.Can for other embodiments provide be suitable for making paddle part 1502 or any other suitable shutter elements (such as, focal plane shutter, leaf type shutter, or other) other drives structure of optionally movement between the open and closed positions.

As discussed above, if the temperature of paddle part 1502 can be determined, then can realize calibrating more accurately of infrared sensor package 128 with paddle part 1202.In this respect, according to different embodiments, shutter assembly 128 can comprise the temperature sensor 1522 being suitable for detecting the temperature be associated with paddle part 1502.In shown embodiment and other embodiments, temperature sensor 1522 can be realized with being arranged on paddle part 1502 and/or the discreet component be embedded at least in part in paddle part 1502.Can with thermistor, thermopair, temperature sensing diode, maybe can be arranged on paddle part 1502 other the suitable inferior quality temp sensor devices significantly not increasing paddle part 1502 quality and to realize discrete temperature sensor 1522.In some embodiments, shutter assembly 1500 can comprise the one or more electric wires 1524 being routed on paddle part 1502 and/or being embedded at least in part in paddle part 1502, it is suitable for being electrically connected to discrete temperature sensor 1522 to obtain temperature reading (other characteristic electrons such as, being expressed as resistance, voltage, electric current or being produced by temperature sensor 1522).

In some embodiments, paddle part 1502 can be the molded interconnection devices (MID) utilizing suitable MID method to be formed, and it can allow the conductive trace forming embedding on paddle part 1502.Therefore, in some embodiments, one or more electric wire 1524 can be realized with this conductive trace (such as, completely or partially embed, formed, implant, or otherwise provide) be embedded in MID paddle part 1502.

In some embodiments, paddle part 1502 can be manufactured by silicon substrate, and utilizes suitable semiconductor fabrication process to manufacture temperature sensor 1522 and electric wire 1524 on a silicon substrate as integrated circuit.In this respect, silicon paddle part 1502 can scribble suitable adulterant at least one surface to reduce the ir transmissivity of silicon paddle part 1502, thus silicon paddle part 1502 can in the closed position middle time substantially stop outside infrared radiation.In some embodiments, temperature sensing diode can be fabricated to integrated component on silicon paddle part 1502 to realize temperature sensor 1522.In a concrete example, the temperature sensing diode realizing temperature sensor 1522 can be copied and be suitable for thermometric 2N2222 transistor (such as, suitably being changed by it).

According to the various semiconductor fabrication process for various embodiment, have integrated temperature sensor 1522 and electric wire 1524 a large amount of silicon paddle parts 1502 can manufactured on a single wafer (such as, a nearly hundreds of silicon paddle part 1502 on wafer, this depends on the size of wafer and the size of paddle part).In a concrete example, be of a size of about 3 millimeters and take advantage of 7 millimeters can be fabricated on the technique wafer of typical 0.35 μm close to 1,000 silicon paddle parts 1502, thus reduce the manufacturing cost of each paddle part 1502.In some embodiments, cut can be utilized or be suitable for other suitable cutting techniques of the circuit small pieces dice of irregular shaping being cut the silicon paddle part 1502 be manufactured on wafer.

In other embodiments, can provide in other parts of infrared imaging module 100 or parts place the temperature sensor detecting paddle part temperature.Such as, in one embodiment, temperature sensor (such as, thermistor, thermopair, temperature sensing diode, thermoelectric pile, pyroelectric sensor or other suitable sensors) can be adapted to pass through to be arranged on towards/the position of detecting the temperature be associated with paddle part 1502 from the convection current of paddle part 1502 and/or radiation heat transmission on shutter assembly body 1510 or in.As another example, according to embodiment of the present disclosure, Figure 17 A-17C represents the different views of infrared imaging module 100, and it has the temperature sensor 980A be arranged on housing 120 inside surface and the heat conductor 1702 being suitable for transferring heat energy between the body 1510 and temperature sensor 980A of shutter assembly 1500.More particularly, Figure 17 A represents the top perspective view of infrared imaging module 100, it has temperature sensor 980A and heat conductor 1702, Figure 17 B represents the infrared imaging module 100 of Figure 17 A, its middle shell 120 represents to show the temperature sensor 980A be arranged on housing 120 inside surface with translucent form, Figure 17 C represents the cross-sectional view of the line 17C-17C of the infrared imaging module 100 along Figure 17 A-17B.

In one or more embodiment, temperature sensor 980A can to realize with the same or analogous mode of temperature measurement unit 980 of Figure 12 A-12C and 12E.In the embodiment shown, temperature sensor 980A embeds partially or completely (such as, implant, formed or otherwise provide) in the inside surface of housing 120, or is arranged on the inside surface of housing 120.In other embodiments, temperature sensor 980A can be embedded in the outside surface of shell 120 partially or completely, or is arranged on the outside surface of shell 120.In various embodiments, temperature sensor 980A can be electrically connected to one or more conductive trace 930A, and conductive trace 930A is formed on the surface of shell 120 with the mode similar to the conductive trace of Figure 12 A-12E or other suitable modes or is embedded at least in part in the surface on surface 120.

In one or more embodiment, heat conductor 1702 can be arranged in the gap 1704 between shutter assembly body 1510 and housing 120 with (part such as, near temperature sensor 980A) at least partially that make shutter assembly body 1510 be thermally coupled to housing 120.In this respect, housing 120 and/or shutter assembly body 1510 can have one or more surface, and described surface raises, reduces or be otherwise shaped to reduce gap 1704, such as to utilize less heat conductor 1702 to realize better thermal coupling.Heat conductor 1702 can be made up of any suitable material with high-termal conductivity.Such as, in one or more embodiment, or the epoxy resin of heat conduction, solder, heat pad, copper backing or other suitable heat conductor materials otherwise can be provided to realize heat conductor 1702 with thermal coupling housing 120 and shutter assembly body 1510 by application between gap 1704.Therefore, heat conductor 1702 can promote at housing 120 at least partially (such as, part near temperature sensor 980A) and shutter assembly body 1510 between heat energy transmission, to make it possible to detect approximate temperature around paddle part 1502 by temperature sensor 980A.

As discussed above, in various embodiments, actuator 1504 can be suitable for receiving the control signal (such as, driving voltage or electric current) from suitable components.According to some embodiments, can from or via the suitable components reception control signal substrate 140 and/or circuit board 170.Also according to some embodiments, from the temperature sensor on temperature sensor 1522 or shutter assembly body 1510 temperature reading (such as, show as other electrical characteristics that resistance, voltage, electric current or temperature sensor produce) suitable components on substrate 140 and/or circuit board 170 can be sent to (such as, processing module 160), with by suitable external component (such as, processor 195) utilize and/or be sent to suitable external component (such as, processor 195) further via the parts on substrate 140 and/or circuit board 170.In this respect, for some embodiments, one or more conductive trace can be arranged on one or more surfaces of housing 120, and can be suitable for transmission of control signals and/or temperature reading between shutter assembly body 1510 and substrate 140/ circuit board 170.

Such as, according to embodiment of the present disclosure, Figure 18 A shows the top perspective view of the infrared imaging module 100 with conductive trace 930B, conductive trace 930B is arranged on one or more outside surfaces of housing 120, and Figure 18 B shows the infrared imaging module 100 of Figure 18 A, wherein shutter assembly body 1510 is represented to show the electric liner being suitable for being connected with conductive trace 930B with translucent form.In the embodiment shown, with transfer control signal and temperature reading on one or more outside surfaces that conductive trace 930B can be formed in housing 120, but also can be formed in the mode similar with the conductive trace 930 above described by composition graphs 12A-13 or provide.Embodiment in housing 120 can be arranged on (such as temperature sensor 980A, above in conjunction with the embodiment that 17A-17C describes), conductive trace 930B may not need to transmit temperature reading, but can transmit temperature reading with wire 930A, as mentioned above.

Conductive trace 930B can connect up or otherwise patterning with between the suitable electrical contact part on circuit board 170 and the electric liner 1802 on shutter assembly body 1510 extend.As shown in Figure 18 B and 18C, conductive trace 930B can contact or at least arrive near the correspondence electricity liner 1802 on shutter assembly body 1510.In some embodiments, the interface that solder, conductive epoxy resin or other suitable materials can be applied in the electric liner 1802 of conductive trace 930B and correspondence sentences the electrical connection just providing and/or strengthen between conductive trace 930B and the electric liner 1802 of correspondence.Electricity liner 1802 is more clearly presented in Figure 19, and it illustrates the bottom perspective view of the shutter assembly 1502 according to embodiment of the present disclosure, it has the electric liner 1802 be arranged on body 1510.In various embodiments, electric liner 1802 can be electrically connected to corresponding contact part and/or the electric wire 1524 of actuator 1504 via the conductive trace be arranged on body 1510 and/or substrate 1516 and/or electric wire.

Figure 20 A shows the top perspective view of infrared imaging module 100, it has the conductive trace 930C be formed on the one or more outer and inner surface of housing 120, Figure 20 B represents the top perspective view of the infrared imaging module 100 of Figure 20 A, and wherein shutter assembly body 1510 illustrates to show the electric liner 1802 according to embodiment of the present utility model with translucent form.As shown in the figure, in other embodiments, according to the special needs designing and/or require, conductive trace 930C can be routed on one or more inside surfaces of housing 120 in addition or alternatively.Be similar to conductive trace 930B, conductive trace 930C can be connected to the corresponding electric liner 1802 be arranged on shutter assembly body 1510.

Therefore, according to the one or more embodiments of infrared imaging module 100 with shutter assembly 1500, the control signal of actuator 1504 and/or can not needed the web member of extra cable and/or infrared imaging module 100 outside from the temperature reading of temperature sensor 1522 by communicating, thus save extra cable and/or the expense of web member, reduce total space requirement, and/or otherwise eliminate there is extra cable and/or the complicacy of web member.In addition, as discussed above, utilize and be suitable for optionally stoping outside infrared radiation to enter the paddle part 1502 of optical element 180A/180, the various embodiments with the infrared imaging module 100 of shutter assembly 1500 can provide the calibration target of optical element 180A/180 outside to calibrate more accurately to allow valuably.Advantageously, according to one or more embodiment, paddle part 1502 can be arranged on optical element 180A/180 outside and increase the monnolithic case of infrared imaging module 100 within bounds.Be oriented to by providing and be suitable for obtaining the temperature sensor 1522/980A of accurate temperature readings be associated with paddle part 1502, the various embodiments with the infrared imaging module 100 of shutter assembly 1500 advantageously can also allow the temperature accurately measured and be associated with paddle part 1502, thus allow that realization is calibrated more accurately.

Figure 21 shows another shutter assembly 11700, it can be installed to be a part for infrared imaging module 100, Figure 22 shows shutter assembly 11700, it is positioned to the part for being assembled into infrared imaging module 100, Figure 23 A-B shows the various views of infrared imaging module 100, and wherein shutter assembly 11700 is represented with translucent form to show the contact element 11702 engaged with the liner 11402 on the outside surface of another housing 11120 according to various embodiment of the present disclosure.In appropriate circumstances, replace any one parts of the present disclosure and/or except any one parts of the present disclosure, any parts of Figure 21-23B can be used.Such as, in suitable embodiment, shutter assembly 1500 and/or housing 120 can be replaced with shutter assembly 11700 and/or housing 11120.

Conductive trace 11400 can be arranged on housing 11120 and for providing electrical connection.Conductive trace 11400 comprises liner 11402 and 11408, and various center section, as shown in the figure.In some embodiments, liner 11402 can be located substantially on the end face of housing 11120, on the downside that liner 11408 can be positioned at housing 11120 bottom surface and/or can be wound on below housing 11120 bottom surface around.When housing 11120 is arranged on pedestal 11800 (see pedestal 11800, it is provided by circuit board in Figure 22 and Figure 23 A-B), conductive trace 11400 can make electric signal (such as, control signal, data-signal, power, and/or other types, depend on the circumstances) pedestal 11800 electrical connector 11802 (such as, liner) and be electrically connected to liner 11402 parts (such as, various electrical equipment, as the electrical equipment of infrared imaging module 100 and/or the desired part of various shutter assembly discussed herein) between transmit.Conductive trace 11400 can be connected to pedestal 150, circuit board 170, socket 104 and the electrical connector at the miscellaneous part of suitable occasion in various installation.

Shutter assembly 11700 comprises contact element 11702, and when shutter assembly 11700 is installed to be infrared imaging module 100 a part of, contact element 11702 can engage with the liner 11402 of housing 11120.In some embodiments, contact element 11702 can be compression contact element (such as, spring contacts), and it is configured to be biased in (see Figure 19) on liner 11402 when shutter assembly 11700 is arranged on housing 11120.In other embodiments, contact element 11702 can realize with other suitable forms and/or can be soldered to or be otherwise connected to liner 11402.

Shutter assembly 11700 comprises paddle part 11502, actuator 11504, and may further include any one in the various parts discussed in conjunction with shutter assembly 1500 in this article.Electric signal for operate actuator 11504 (such as, with mobile paddle part 11502) can pass through the center section of electrical connector 11802, liner 11408, conductive trace 11400, liner 11402, contact element 11702 and electric wire 11701 and transmit between pedestal 11180 and actuator 11504.

Shutter assembly 11700 also comprises recess 11704, and it is configured to the external rings 11810 of receiver lens lens barrel 110 and housing 11120 when shutter assembly 11700 is installed on housing 11120.Shutter assembly 11700 also comprises guide slot 11706, and its directed protuberance 11808 being configured to receive housing 11120 aligns relative to housing 11120 to make shutter assembly 11700.

Referring now to Figure 24, it illustrates the process flow diagram using infrared imaging module 100 to catch the process 2100 of the view data of Uniform Irradiation degree scene, infrared imaging module 100 has shutter assembly 1500 according to disclosure embodiment (such as, or shutter assembly 11700).Such as, process 2100 can be performed the infrared imaging module 100 obtaining calibration, as those of ordinary skill in the art will understand as a part for various NUC and/or radiancy calibration process.

At block 2102, paddle part 1502 can rotate pivotally, slide or otherwise mobile substantially to stop outside infrared radiation to enter aperture 112 and/or optical element 180A/180.Such as, in one or more embodiment, control signal (such as, driving voltage and/or electric current) can by suitable parts (such as, the miscellaneous part of processing module 160, processor 195, other suitable external components and/or infrared imaging module 100) produce and be transferred to actuator 1504 to make paddle part 1502 rotate pivotally, slide or otherwise move to a position (such as via conductive trace 930B/930C, off-position), substantially to block aperture 112 and/or optical element 180A/180.

At block 2104, the infrared picture data of the scene (such as, Uniform Irradiation degree scene) provided by paddle part 1502 can be caught at infrared sensor package 128.Such as, the infrared radiation sent by paddle part 1502 can be received by optical element 180A/180 and at the infrared sensor 132 of infrared sensor package 128.The ROIC of infrared sensor package 128 can produce the infrared image frame corresponding with the infrared radiation received, and provides this picture frame with various speed, as described herein.In some embodiments, the scene infrared image frame of catching provided by paddle part 1502 can be processed by the processing module 160 of infrared imaging module 100, and the picture frame in some embodiments, after process can be supplied to the processor 195 of main process equipment 102 to be further processed.

At block 2106, the temperature be associated with paddle part 1502 can be detected.In various embodiments, the temperature around the temperature of paddle part 1502 or paddle part 1502 can detect with temperature sensor 1522 or 980A.As above regard to described by various embodiment, other electrical characteristics of resistance, voltage, electric current or expression temperature can be transmitted from temperature sensor 1522 or 980A via electric wire 1524, conductive trace 930A and/or conductive trace 930B/930C.Such as, can be received by other suitable components for the treatment of element 160, processor 195 and/or infrared imaging module 100 or main process equipment and treatment temperature reading and the infrared picture data of catching at block 2104, to perform various radiometric calibration process, NUC process or other calibration processes.The operation of block 2106 can be carried out before block 2104 or block 2102, and did not deviate from the scope of the present disclosure and spirit.Such as, can in the process that the scene infrared picture data provided by paddle part 1502 is provided or before detect the temperature that is associated with paddle part 1502.

At block 2108, paddle part 1502 can rotate pivotally, slide or be otherwise moved back into open position to allow that outside infrared radiation enters aperture 112 and/or optical element 180A/180.Such as, in some embodiments, the control signal for making actuator 1504 paddle part 1502 be moved to off-position can be lowered, cancels or otherwise remove to allow that paddle part 1502 turns back to open position.In another embodiment, another control signal can by suitable parts (such as, processing module 160, processor 195, the miscellaneous part of other suitable external components and/or infrared imaging module 100) produce and be transferred to actuator 1504 to make paddle part 1502 rotate pivotally, slide or otherwise move back to open position via conductive trace 930B/930C.When during paddle part 1502 is in an open position to allow the view data of catching outside infrared radiation, infrared imaging module 100 and/or main process equipment 102 can perform normal image capture operation or utilize outer scene to perform calibration operation.

In some embodiments, shutter assembly 1500/11700 can realize by various minimum and maximum specification.But should understand, the specification set forth herein is only example, can use other specifications in suitable occasion.

In some embodiments, shutter assembly 11170/1500 may be embodied as about 0.6 millimeter or less of the whole height (such as, Z dimension) increasing infrared imaging module 100.In some embodiments, shutter assembly 11170/1500 may be embodied as length and width (such as, X and Y dimension) and is less than about 9 millimeters and takes advantage of about 11 millimeters.In some embodiments, length and width can be about 8.5 millimeters and take advantage of about 8.5 millimeters.In some embodiments, length, width and highly can be not more than about 10.5 millimeters and take advantage of about 10.5 millimeters to take advantage of about 2 millimeters.In some embodiments, length, width and highly can be not more than about 8.5 millimeters and take advantage of about 8.5 millimeters to take advantage of about 2 millimeters.

In some embodiments, paddle part 1502/11502 (such as, blade) can have the diameter by visible about 1.9 millimeters of infrared imaging module 100.In some embodiments, paddle part 1502/11502 can show the opening and closing time being less than about 30 milliseconds.In some embodiments, this opening and closing time can be less than about 10 milliseconds.

In some embodiments, actuator 1504/11504 can use about 2.0 volts or lower driving voltage, and shows about 400 milliwatts or less driving power consumption.In some embodiments, this driving voltage can be about 1.8 volts.In some embodiments, paddle part 1502/11502 is kept not needing power in the open position.

In some embodiments, paddle part 1502/11502 can provide surface that is high and/or low-launch-rate.In some embodiments, paddle part 1502/11502 can show high thermal conductivity.In some embodiments, paddle part 1502/11502 and actuator 1504/11504 can be rated for the reliability of service life being greater than 100000 cycles.In some embodiments, this reliability of service life can be greater than 1000000 cycles.In some embodiments, shutter assembly 1500/11700 may be embodied as and operates in the temperature range of about-10 degrees Celsius to about+65 degrees Celsius.In some embodiments, shutter assembly 1500/11700 may be embodied as and bears at least 10000g0.2 millisecond impact.

In some infrared imaging device, the signal detected by FPA corresponds to any uncompensated output shift sum focusing on the infrared radiation of the scene on infrared sensor, camera lens autoradiolysis, outside the venue scenery signal (such as, being sent by housing, lens barrel and/or miscellaneous part) from scioptics and be associated with FPA temperature variation or FPA1/f noise.In this case, in order to accurately measure the temperature of object in scene, the signal contribution from scene must be known from the signal contribution from above-mentioned source usually independently, and this may need to calculate the signal contribution from all sources.

In the implementation that some are traditional, when shutter close, replace the signal contribution from scene with the infrared signal contribution from high emission shutter (such as, paddle part).If the temperature of shutter is also known, then the signal contribution from shutter can be calculated and be used for determining other signal contribution according to following relation: the output signal caused by the shutter contribution of (contribution of the contribution+uncompensated signal drift of signal of the contribution of lens self-emission signal+outside the venue)=FPA total output signal-calculate based on shutter thermometer.Unfortunately, in thermal imaging apparatus, the occasion before lens is positioned at shutter, be difficult to know shutter temperature, thus be difficult to calculate from shutter signal contribution (such as, on paddle part or near may need temperature sensor, which increase weight, cost and complicacy and may increased in size be needed).In addition, even if shutter is maintained at known and uniform temperature (such as, being undertaken heating or cooling by utilizing suitable parts) substantially, such technology also shows similar shortcoming.

In some embodiments, contrary with traditional implementation, can mirror shutter be provided.With reference to figure 15C, 17C and 23B, in some embodiments, paddle part 1502/11502 can be configured with the low-launch-rate inside surface 1503/11503 substantially reflected, its paddle part 1502/11502 in the closed position middle time in the face of FPA (such as, comprising the infrared sensor package 128 of infrared sensor 132).Infrared (such as, the heat) radiation reflective being derived from FPA can be returned FPA by surface 1503/11503.Such as, as shown in ray-traces 1507, infrared radiation from infrared sensor 132, can continue through the various parts of infrared imaging module 100, and by surface 1503 reflection, reversion by the various parts of infrared imaging module 100, and is received by infrared sensor 132.This ray-traces can be reflected similarly in surface 11503.

Infrared imaging module 100 can comprise one or more temperature sensor (such as, one or more temperature sensor 1505 can be embedded in FPA and/or be arranged on other places), it allows that infrared imaging module 100 knows the one or more temperature be associated with one or more regions of FPA.By the infrared radiation imaging will be reflected back by inside surface 1503/11503, infrared imaging module 100 and/or various suitable processor can utilize the described one or more known temperature be associated with FPA to calibrate the infrared sensor 132 of FPA (such as, perform the calibration of its thermal imagery), and do not need the actual temperature understanding paddle part 1502/11502 itself.Therefore, in some embodiments, can when there is no temperature sensor, the heating be not associated further or cooling-part are (such as, for keeping uniform temperature substantially) when, realize paddle part 1502/11502 and/or shutter assembly 1500/11500, thus saving in weight and cost, and reduce thickness and complicacy.In some embodiments, this calibration can explain the decay of the infrared radiation such as caused by the various parts passing twice through infrared imaging module 100 (such as further, in different ray-traces 1507, ray-traces 1507 can comprise from infrared sensor 132 upwards by optical element 180A arrival surface 1503/11503, and turns back to infrared sensor 132 by optical element 180A backward from surface 1503/11503).

In some embodiments, surface 1503/11503 can scribble gold plating or aluminum coating.These and/or other coating or surface can use as required, and to make when paddle part 1502/11502 is closed, paddle part 1502/11502 reveals negligible self-emission relative to the signal list detected by infrared sensor 132.Although inside surface 1503/11503 is represented as substantially smooth, but other surface configurations (such as, curved surface) can be used in other embodiments such as extra infrared radiation is reflected back into FPA, for providing required spot size by the region of independent infrared sensor 132 imaging, and/or the proper characteristics on intense adjustment surface 1503/11503.

Under applicable circumstances, the various embodiments that the disclosure provides can realize with the combination of hardware, software or hardware and software.The occasion be suitable for, the various hardware component of setting forth herein and/or software part can be combined into and comprise software, hardware and/or the composite component of the two, and do not deviate from spirit of the present disclosure.The occasion be suitable for, the various hardware component of setting forth herein and/or software part can be divided into and comprise software, hardware or both sub-components, and do not deviate from spirit of the present disclosure.In addition, the occasion be suitable for, can expect that software part may be implemented as hardware component, vice versa.

According to software of the present utility model, as non-transitory instruction, program code and/or data, can be stored in one or more non-transitory computer-readable medium.Also can expect, the software related to herein with one or more universal or special computing machine and/or computer system, network and/or otherwise can realize.The occasion be suitable for, the sequence of various step described herein can change, and is combined into composite steps, and/or is separated into sub-step, to provide feature described herein.

Above-mentioned embodiment describes but does not limit the utility model.Should also be understood that, according to principle of the present utility model, many modifications and variations are possible.Therefore, scope of the present utility model is only limited by claim below.

Claims

1. an imaging system, is characterized in that, comprising:

Infrared imaging module, it comprises:

Infrared sensor package, it has infrared sensor and is suitable for catching picture frame; With

Shutter assembly, it comprises:

Paddle part, it is suitable for optionally stoping outside infrared radiation to arrive described infrared sensor, and

Actuator, it is suitable for optionally moving described paddle part in response to control signal and arrives described infrared sensor to stop outside infrared radiation.

2. imaging system as claimed in claim 1, is characterized in that,

Described infrared imaging module also comprises optical element, and it is suitable for infrared radiation is passed through and arrives described infrared sensor;

Described paddle part is arranged in described optical element outside and is suitable for optionally stoping outside infrared radiation to arrive described optical element; With

Described paddle part comprises the surface substantially reflected, its be suitable for described paddle part in the closed position middle time the infrared radiation deriving from described infrared sensor package is reflected back into described infrared sensor package to calibrate described infrared sensor.

3. imaging system as claimed in claim 1, it is characterized in that, described infrared imaging module also comprises temperature sensor, and it is suitable for detecting the temperature be associated with described paddle part.

4. imaging system as claimed in claim 3, it is characterized in that, described temperature sensor is arranged in described paddle part or on described paddle part.

5. imaging system as claimed in claim 4, it is characterized in that, described shutter assembly comprises electric wire, and it to be arranged on described paddle part and to be electrically connected to described temperature sensor.

6. imaging system as claimed in claim 4, is characterized in that, described paddle part be molded interconnection devices and comprise be formed in described paddle part surface on and be electrically connected to the conductive trace of described temperature sensor.

7. imaging system as claimed in claim 4, is characterized in that,

Described paddle part is made up of silicon substrate, and comprises:

At least one surface, it is doped the transmissivity of the infrared radiation be reduced by wherein, and

The electric wire of described temperature sensor is electrically connected to semiconductor fabrication process manufacture; Be manufactured on the semiconductor devices on described paddle part with described temperature sensor.

8. imaging system as claimed in claim 1, is characterized in that,

Described infrared imaging module also comprises housing, and it surrounds described infrared sensor package at least substantially; With

Described shutter assembly comprises the body carrying described paddle part.

9. imaging system as claimed in claim 8, is characterized in that,

Described housing is molded interconnection devices, and it has the conductive trace on the inner and/or outer surface of described housing; With

Described conductive trace is suitable for described control signal to be delivered to described actuator.

10. imaging system as claimed in claim 9, it is characterized in that, shutter assembly body comprises electric liner, and it is suitable for being connected with the described conductive trace on described housing.

11. imaging systems as claimed in claim 8, it is characterized in that, described infrared imaging module also comprises:

Be arranged in the temperature sensor on the inside surface of described housing;

Heat conductor, its be suitable for by shutter assembly body at least partially with the thermal coupling at least partially of described housing so that between shutter assembly body and described temperature sensor transferring heat energy; With

Be configured to the processor producing composograph, composograph comprises:

The radiancy component of at least one in infrared image frame, it is encoded into the chromatic component of described composograph, and

The brightness of at least one non-thermographic and/or chromatic component, it is encoded into the luminance component of described composograph.

12. imaging systems as claimed in claim 8, it is characterized in that, described infrared imaging module also comprises temperature sensor, and it to be arranged in described shutter assembly or shutter assembly is suitable for detecting the temperature be associated with described paddle part.

13. imaging systems as claimed in claim 8, is characterized in that,

Described infrared imaging device also comprises lens barrel, and it is couple to described housing and is positioned at described housing at least in part;

Described lens barrel surrounds optical element substantially, and described optical element is suitable for infrared radiation is passed through and arrives described infrared sensor;

Shutter assembly body comprises recess, and it is configured as and receives described lens barrel and/or described housing at least partially; With

By receiving described housing and/or described lens barrel at least partially in described recess, shutter assembly body is stacking relative to described housing.