CN208938959U - Radiator structure and thermal imaging system - Google Patents
Radiator structure and thermal imaging system Download PDFInfo
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- CN208938959U CN208938959U CN201821886358.9U CN201821886358U CN208938959U CN 208938959 U CN208938959 U CN 208938959U CN 201821886358 U CN201821886358 U CN 201821886358U CN 208938959 U CN208938959 U CN 208938959U
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- chip
- heat
- radiator
- release hole
- heat release
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Abstract
This application discloses a kind of radiator structure and thermal imaging systems.Radiator structure includes substrate, chip and radiator；The substrate has first surface, second surface and the heat release hole mutually deviated from, the first surface has chip installation area, the heat release hole is through to the chip installation area by the second surface, and the chip is arranged on the chip installation area and the covering heat release hole；The radiator includes main body interconnected and heating column, and the main body is opposite with the second surface, the heating column protruded into the heat release hole by the second surface and with the chip thermal conductive contact.Thermal imaging system includes the radiator structure.Radiator structure and thermal imaging system provided by the embodiment of the present application can greatly improve heat dissipation effect.
Description
Technical field
This application involves image acquisition technology more particularly to a kind of radiator structures and thermal imaging system.
Background technique
With the development of science and technology, the means of people's environment of observation are also more and more, thermal imaging system is one of.Thermal imaging system
It is to receive the infrared radiation energy distribution pattern reflection of measured target using infrared detector and optical imaging objective to infrared spy
It surveys on the light-sensitive element of device, to obtain Infrared Thermogram, this thermography is corresponding with the heat distribution field of body surface.
In the related technology, as people require higher and higher to portable, the core devices chip of thermal imaging system is also more next
More minimize.Along with the miniaturization of chip, packaging technology is also evolved by initial Metal Packaging, ceramic package present
The encapsulation of wafer scale patch.
However, thermal energy aggregation extent is also higher and higher, and chip in original radiator structure with the miniaturization of chip
Generated heat needs to be transferred to radiator by substrate, and heat transfer efficiency is low, is no longer satisfied cooling requirements, therefore urgently
It improves.
Utility model content
The embodiment of the present application provides a kind of radiator structure and thermal imaging system, to solve the above problems.
The embodiment of the present application adopts the following technical solutions:
In a first aspect, the embodiment of the present application provides a kind of radiator structure, including substrate, chip and radiator；
The substrate has first surface, second surface and the heat release hole mutually deviated from, and the first surface has core
Piece installing zone, the heat release hole are through to the chip installation area by the second surface, and the chip is arranged in the chip
On installing zone and cover the heat release hole；
The radiator includes main body interconnected and heating column, and the main body is opposite with the second surface, institute
State heating column protruded into the heat release hole by the second surface and with the chip thermal conductive contact.
Optionally, in above-mentioned radiator structure, there are gaps between the end of the heating column and the chip, between described
Heat-conducting medium is provided in gap.
Optionally, in above-mentioned radiator structure, the width in the gap is 0.2~0.5mm.
Optionally, further include positioning seat in above-mentioned radiator structure, is provided between the positioning seat and the substrate
One location structure is provided with the second location structure between the positioning seat and the radiator.
Optionally, in above-mentioned radiator structure, first location structure includes the first positioning column and first positioning hole, institute
It states the first positioning column to be arranged on the positioning seat, the first positioning hole opens up on the substrate.
Optionally, in above-mentioned radiator structure, second location structure includes the second positioning column and second location hole, institute
It states the second positioning column to be arranged on the positioning seat, the second location hole opens up on the body.
Optionally, complete in the gap of the heating column and the chip and the heat release hole in above-mentioned radiator structure
Fill the heat-conducting medium in portion.
Optionally, in above-mentioned radiator structure, the heat-conducting medium is heat-conducting glue or heat conductive pad.
Optionally, in above-mentioned radiator structure, the chip has heat concentrated area, and the end of the heating column is at least
Cover the heat concentrated area.
Optionally, in above-mentioned radiator structure, the heat release hole is located at the middle part of the chip installation area, the chip
Edge is connect with the chip installation area.
Second aspect, the embodiment of the present application provide a kind of thermal imaging system, including the radiator structure.
The embodiment of the present application use at least one above-mentioned technical solution can reach it is following the utility model has the advantages that
Radiator structure and thermal imaging system disclosed in the embodiment of the present application by heating column protrude into heat release hole with chip is thermally conductive connects
Touching, can be directly by the heat transfer to radiator of chip, therefore can greatly improve heat dissipation effect.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present application, constitutes part of this application, this Shen
Illustrative embodiments and their description please are not constituted an undue limitation on the present application for explaining the application.In the accompanying drawings:
Fig. 1 is the detonation configuration view of the front observation visual angle of thermal imaging system disclosed in the embodiment of the present application；
Fig. 2 is the detonation configuration view at the overleaf observing visual angle of thermal imaging system disclosed in the embodiment of the present application；
Fig. 3 is the sectional view of thermal imaging system disclosed in the embodiment of the present application.
Description of symbols:
1- substrate, 10- first surface, the chip installation area 100-, 12- second surface, 14- heat release hole, 2- chip, 3- heat dissipation
Device, 30- main body, 32- heating column, the end 320-, 34- radiating groove, 4- heat-conducting glue, 5- lens mount, 6- camera lens, 70- first are positioned
Column, 72- first positioning hole, the second positioning column of 80-, 82- second location hole, 9- sealing ring.
Specific embodiment
To keep the purposes, technical schemes and advantages of the application clearer, below in conjunction with the application specific embodiment and
Technical scheme is clearly and completely described in corresponding attached drawing.Obviously, described embodiment is only the application one
Section Example, instead of all the embodiments.Based on the embodiment in the application, those of ordinary skill in the art are not doing
Every other embodiment obtained under the premise of creative work out, shall fall in the protection scope of this application.
Below in conjunction with attached drawing, the technical scheme provided by various embodiments of the present application will be described in detail.
The embodiment of the present application discloses a kind of radiator structure, and as shown in Figure 1 to Figure 3, which can be applied to thermal imagery
Instrument comprising substrate 1, chip 2 and radiator 3.Substrate 1 is integrated circuit board, for carrying comprising the electric appliance including chip 2
Part.Substrate 1 has the first surface 10 and second surface 12 mutually deviated from, has chip installation area on first surface 10
100 (dashed regions in Fig. 1).
The present embodiment is additionally provided with heat release hole 14 on substrate 1, and heat release hole 14 is through to chip by second surface 12 and installs
Area 100, chip 2 are arranged on chip installation area 100 and cover heat release hole 14.The specific location of heat release hole 14 can be according to chip
Link position required for 2 is determined, as long as the location of heat release hole 14 cannot influence chip 2 and chip installation area
100 normal connection, on this basis, heat release hole 14 may be at the marginal position of chip installation area 100, can also locate
In the middle part of chip installation area 100.
In order to make can be more securely attached to together between chip 2 and chip installation area 100, dissipating in the present embodiment
Hot hole 14 can be located at the medium position of chip installation area 100, and chip installation area 100 is made to form one in the periphery of heat release hole 14
Circle installation anchor ring (annular region in Fig. 1 between dotted line and heat release hole 14) be attached with chip 2, in this scheme, chip 2 and
The junction for installing anchor ring can surround heat release hole 14, so that chip 2 and chip installation area 100 be made to form firm connection knot
Structure.Chip 2 can be various feasible independent using pin welded connecting, pad solder connection, Nian Jie etc. with chip installation area 100
Or compound connection structure.
At the same time, radiator 3 has main body 30 and heating column 32, and main body 30 is the primary structure of radiator 3, is used for
Heat is distributed to free surrounding space, main body 30 and second surface 12 are opposite, and in order to improve radiating efficiency, main body 30 is deviating from second
Many radiating grooves 34 may be arranged in the side on surface 12.Heating column 32 is then protruded into heat release hole 14 by second surface 12 and and chip
2 thermal conductive contacts, the structure as conduction heat.
The heat as caused by chip 2 in the present embodiment can directly pass through the heating column of heat release hole 14 and radiator 3
32 thermal conductive contacts, so that heat caused by chip 2 is shed by radiator 3, without being carried out in heat by substrate 1 again
Turn, therefore heat transfer efficiency, improving radiating effect can be substantially improved.
Since circuit configuration will form heat concentrated area inside each chip 2, in the present embodiment, in order to improve heat dissipation
Effect, the end 320 of heating column 32 will at least cover these heat concentrated areas, so that the heat that these heat concentrated areas generate
Amount can be exported rapidly.
In the present embodiment, if end 320 can directly be contacted with chip 2, heat-transfer effect between the two will be located
In preferable horizontal.However, the difficulty for guaranteeing that end 320 is directly contacted with chip 2 is larger, to guarantee that end 320 and chip 2 are straight
Contact needs all many-sided progress works such as the accuracy of manufacture from components, the assembly precision of product, safety and reliability
Skill is promoted, thus will limit the synthesized competitiveness of product.
Comprehensively consider, can make between end 320 and chip 2 that there are certain intervals in the present embodiment, and does not connect directly
Heat-conducting medium 4 is arranged in assembly, using the mobility and high thermal conductivity characteristic of heat-conducting medium 4 in end 320 in touching in gap
Good, the stable passage of heat is formed between chip 2, to realize the transmitting of heat.Although this mode may heat transfer
Although rate is more slightly lower than the mode directly contacted, the requirement to manufacture and assembly precision can be greatly reduced, therefore produce
Product comprehensive performance is more excellent, has stronger competitiveness.
Gap width between end 320 and chip 2 may remain within the scope of 0.2~0.5mm, such one side precision
Of less demanding, on the other hand easily fabricated and assembly also can control the thickness of heat-conducting medium 4, prevent because of 4 thickness of heat-conducting medium
It is excessive and to cause rate of heat transfer to reduce excessive.
In the present embodiment, the material category of heat-conducting medium 4 is varied, such as can use heat-conducting glue or heat conductive pad,
Wherein heat-conducting silicone grease is a kind of material for being more suitble to the present embodiment.In order to simplify assembly technology, can be protruded into heating column 32
Excessive heat-conducting glue or the excessive heat conductive pad of package are smeared in the end of heating column 32 in advance before heat release hole 14, to heating column
32 protrude into after heat release hole 14, the heat-conducting mediums such as heat-conducting glue or heat conductive pad 4 can by between chip 2 and end 320 gap and
Gap between heat release hole 14 and heating column 32 completely fills out, and on the one hand eliminates accurate control 4 dosage of heat-conducting medium in this way
Process, on the other hand also being capable of enhancing structure intensity and stability.
In the present embodiment, in order to improve assembly precision, a positioning seat 5 can be set, positioning seat 5 and substrate 1 it
Between the first location structure is set, the second location structure is set between positioning seat 5 and radiator 3.In this way, substrate 1 and radiator 3
It is positioning datum with positioning seat 5, therefore assembly precision is higher.First location structure can be arranged simultaneously with the second location structure
It is multiple, to be positioned from multiple positions.
Specifically, the first location structure and the second location structure can use any structure that positioning function may be implemented,
Such as locating slot and the cooperation of positioning inserted block, positioning protrusion and location indentations cooperation etc..The first location structure can in the present embodiment
Using the cooperation location structure of the first positioning column 70 cooperation first positioning hole 72, wherein since substrate 1 is circuit board, thereon
Less convenient for setting positioning column, therefore first positioning hole 72 can be arranged on substrate 1, and by the setting of the first positioning column 70 fixed
On the seat 5 of position.Positioning seat 5 itself can use injection molding, and molding positioning column is also more convenient.
Likewise, the second location structure can also cooperate location structure with second location hole 82 using the second positioning column 80.
Since radiator 3 is usually metalwork (such as copper piece), and many radiating grooves 34 can be set in main body 30, therefore be arranged determine again
It is more complicated that position column will lead to structure.For these reasons, second location hole 82 can be arranged in main body 30, and by second
Positioning column 80 is arranged on positioning seat 5.
For thermal imaging system, itself usually there is lens mount, and lens mount can directly serve as positioning seat 5.Except this
Except, thermal imaging system usually may also include camera lens 6.Lens mount 5 (for ease of description, continuing to use the appended drawing reference of positioning seat below) one
Aspect is used for fixed lens 6, so that camera lens 6 is located in the front of chip 2, realizes the incidence of light.Lens mount 5 is on the other hand
It is also used for constituting accommodating chamber with radiator 3, accommodating chamber will be encapsulated in comprising other components including substrate 1 and chip 2
Inside play a protective role.It, can be between lens mount 5 and camera lens 6 in order to keep the sealing performance between lens mount 5 and camera lens 6
Sealing ring 9 is set.Lens mount 5 can be fastenedly connected with substrate 1 and radiator 3 using screw or other means.
In conclusion radiator structure and thermal imaging system provided by the embodiment of the present application can greatly improve heat dissipation effect.
Emphasis describes the difference between each embodiment, difference between each embodiment in the application foregoing embodiments
As long as optimization feature non-contradiction, can combine to form more preferably embodiment, it is contemplated that style of writing is succinct, then no longer superfluous at this
It states.
The above description is only an example of the present application, is not intended to limit this application.For those skilled in the art
For, various changes and changes are possible in this application.All any modifications made within the spirit and principles of the present application are equal
Replacement, improvement etc., should be included within the scope of the claims of this application.
Claims (11)
1. a kind of radiator structure, which is characterized in that including substrate, chip and radiator；
The substrate has first surface, second surface and the heat release hole mutually deviated from, and the first surface is pacified with chip
Area is filled, the heat release hole is through to the chip installation area by the second surface, and the chip setting is installed in the chip
In area and cover the heat release hole；
The radiator includes main body interconnected and heating column, and the main body is opposite with the second surface, described to lead
Plume protruded into the heat release hole by the second surface and with the chip thermal conductive contact.
2. radiator structure according to claim 1, which is characterized in that deposited between the end of the heating column and the chip
Heat-conducting medium is provided in gap, the gap.
3. radiator structure according to claim 2, which is characterized in that the width in the gap is 0.2~0.5mm.
4. radiator structure according to claim 3, which is characterized in that it further include positioning seat, the positioning seat and the base
It is provided with the first location structure between plate, the second location structure is provided between the positioning seat and the radiator.
5. radiator structure according to claim 4, which is characterized in that first location structure include the first positioning column with
First positioning hole, first positioning column are arranged on the positioning seat, and the first positioning hole opens up on the substrate.
6. radiator structure according to claim 4, which is characterized in that second location structure include the second positioning column with
Second location hole, second positioning column are arranged on the positioning seat, and the second location hole opens up on the body.
7. according to the described in any item radiator structures of claim 2 to 6, which is characterized in that the heating column and the chip with
And the heat-conducting medium is stuffed entirely in the gap of the heat release hole.
8. according to the described in any item radiator structures of claim 2 to 6, which is characterized in that the heat-conducting medium be heat-conducting glue or
Person's heat conductive pad.
9. radiator structure according to any one of claims 1 to 6, which is characterized in that the chip has heat concentration zones
Domain, the end of the heating column at least cover the heat concentrated area.
10. radiator structure according to any one of claims 1 to 6, which is characterized in that the heat release hole is located at the chip
The middle part of installing zone makes the chip installation area form a circle installation anchor ring, the chip and institute in the periphery of the heat release hole
Installation anchor ring connection is stated, and the junction of the chip and the installation anchor ring is around the heat release hole.
11. a kind of thermal imaging system, which is characterized in that including the described in any item radiator structures of claims 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821886358.9U CN208938959U (en) | 2018-11-15 | 2018-11-15 | Radiator structure and thermal imaging system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821886358.9U CN208938959U (en) | 2018-11-15 | 2018-11-15 | Radiator structure and thermal imaging system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208938959U true CN208938959U (en) | 2019-06-04 |
Family
ID=66727591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821886358.9U Active CN208938959U (en) | 2018-11-15 | 2018-11-15 | Radiator structure and thermal imaging system |
Country Status (1)
| Country | Link |
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| CN (1) | CN208938959U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022121476A1 (en) * | 2020-12-10 | 2022-06-16 | 中兴通讯股份有限公司 | Heat dissipation apparatus and electronic device |
-
2018
- 2018-11-15 CN CN201821886358.9U patent/CN208938959U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022121476A1 (en) * | 2020-12-10 | 2022-06-16 | 中兴通讯股份有限公司 | Heat dissipation apparatus and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200717 Address after: 311501 building A1, No. 299, Qiushi Road, Tonglu Economic Development Zone, Tonglu County, Hangzhou City, Zhejiang Province Patentee after: Hangzhou Haikang Micro Shadow Sensing Technology Co.,Ltd. Address before: 310051 518 Internet of Things Street, Binjiang District, Hangzhou City, Zhejiang Province Patentee before: Hangzhou Hikvision Digital Technology Co.,Ltd. |
|
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Hangzhou micro image software Co.,Ltd. Assignor: Hangzhou Haikang Micro Shadow Sensing Technology Co.,Ltd. Contract record no.: X2021990000038 Denomination of utility model: Heat dissipation structure and thermal imager Granted publication date: 20190604 License type: Common License Record date: 20210118 |