CN108490577A - Structured light projector, image acquiring device and electronic equipment - Google Patents
Structured light projector, image acquiring device and electronic equipment Download PDFInfo
- Publication number
- CN108490577A CN108490577A CN201810202147.7A CN201810202147A CN108490577A CN 108490577 A CN108490577 A CN 108490577A CN 201810202147 A CN201810202147 A CN 201810202147A CN 108490577 A CN108490577 A CN 108490577A
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- Prior art keywords
- structured light
- light projector
- collimating
- laser
- lens barrel
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/028—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
- G02B27/4205—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive optical element [DOE] contributing to image formation, e.g. whereby modulation transfer function MTF or optical aberrations are relevant
Abstract
The invention discloses a kind of structured light projector, image acquiring device and electronic equipments.Structured light projector includes laser emitter, collimating element, diffraction element and thermoelectric refrigeration element.Laser emitter is for emitting laser；Collimating element is for collimating the laser；Diffraction element is for the laser after the collimated element collimation of diffraction；Thermoelectric refrigeration element includes opposite cold and hot end, and cold end is contacted with the collimating sidewalls of collimating element thinks that collimating element radiates.A thermoelectric refrigeration element is arranged by the close position in collimating element in structured light projector, image acquiring device and the electronic equipment of embodiment of the present invention, the cold end of thermoelectric refrigeration element is contacted with the collimating sidewalls of collimating element, collimating element temperature can be transmitted heat by cold end when higher to hot junction, further it is discharged into the external world, so as to be collimation element radiating, the temperature for reducing collimating element avoids influencing the performance of collimating element because temperature raising leads to temperature drift.
Description
Technical field
The present invention relates to technical field of imaging, more particularly to a kind of structured light projector, image acquiring device and electronics are set
It is standby.
Background technology
Structured light projector is by light source, collimating element and diffraction optical element (diffractive optical
Elements, DOE) composition.Lens are generally comprised in collimating element, when variation of ambient temperature, it is existing that lens will produce temperature drift
As the focus of lens can even change when temperature drift is larger, be thrown into object space to influence structured light projector
The accuracy for the laser pattern penetrated.
Invention content
The embodiment provides a kind of structured light projector, image acquiring device and electronic equipments.
The present invention provides a kind of structured light projector.The structured light projector includes laser emitter, collimating element, spreads out
Penetrate element and thermoelectric refrigeration element.The laser emitter is for emitting laser.The collimating element is for collimating the laser.
The laser of the diffraction element for diffraction after collimating element collimation.The thermoelectric refrigeration element includes opposite
Cold and hot end, the cold end is contacted with the collimating sidewalls of the collimating element thinks the collimating element heat dissipation.
The present invention provides a kind of image acquiring device.Described image acquisition device includes above-mentioned structured light projector, figure
As collector and processor.Described image collector is used to acquire to be swashed from what the structured light projector was projected into object space
Light pattern.The processor is for handling the laser pattern to obtain depth image.
The present invention provides a kind of electronic equipment.Electronic equipment includes shell and above-mentioned image acquiring device.Image obtains
Device, which is arranged, to be exposed in shell and out of described shell to obtain depth image.
Structured light projector, image acquiring device and the electronic equipment of embodiment of the present invention pass through in structured light projector
The close position of collimating element one thermoelectric refrigeration element, the cold end of thermoelectric refrigeration element and the collimation side of collimating element are set
Wall contacts, and can transmit heat to hot junction by cold end when collimating element temperature is higher, and then be discharged into the external world by hot junction,
So as to collimate element radiating, reduce the temperature of collimating element, avoid influencing collimation member because temperature raising leads to temperature drift
The performance of part.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obviously, or practice through the invention is recognized.
Description of the drawings
Above-mentioned and/or additional aspect and advantage of the invention will become from the following description of the accompanying drawings of embodiments
Obviously and it is readily appreciated that, wherein：
Fig. 1 is the structural schematic diagram of the structured light projector of certain embodiments of the present invention.
Fig. 2 is schematic cross-section of the structured light projector along II-II lines of Fig. 1.
Fig. 3 is the structural schematic diagram of the thermoelectric refrigeration element of the structured light projector of certain embodiments of the present invention.
Fig. 4 to Fig. 7 is the structural schematic diagram of the structured light projector of certain embodiments of the present invention.
Fig. 8 to Figure 10 is the part-structure schematic diagram of the structured light projector of certain embodiments of the present invention.
Figure 11 is the structural schematic diagram of the image acquiring device of certain embodiments of the present invention.
Figure 12 is the structural schematic diagram of the electronic equipment of certain embodiments of the present invention.
Specific implementation mode
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to for explaining the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " first ", " second " are used for description purposes only, and cannot
It is interpreted as indicating or implies relative importance or implicitly indicate the quantity of indicated technical characteristic.Define as a result, " the
One ", the feature of " second " can explicitly or implicitly include one or more feature.In description of the invention
In, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
Can also be to be electrically connected or can be in communication with each other to be mechanical connection；It can be directly connected, it can also be by between intermediary
It connects connected, can be the interaction relationship of the connection or two elements inside two elements.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Also referring to Fig. 1 and Fig. 2, the present invention provides a kind of structured light projector 100.Structured light projector 100 includes
Lens barrel 40 and board unit 60.Board unit 60 includes substrate 62 and circuit board 61.Circuit board 61 carries on the substrate 62.Lens barrel
40 include lens barrel side wall 41 and the plummer 411 from the extension of lens barrel side wall 41.Lens barrel side wall 41 is arranged on circuit board 61, mirror
Cylinder side wall 41 is surrounded by host cavity 42 with circuit board 61.Structured light projector 100 further includes laser emitter 10, collimating element
20 and diffraction element 30.Laser emitter 10, collimating element 20 and diffraction element 30 are housed in host cavity 42, and collimate member
Light emission direction of the part 20 with diffraction element 30 along laser emitter 10 is arranged in order.Wherein, laser emitter 10 is sharp for emitting
Light.Collimating element 20 is used for the laser that collimation laser transmitter 10 emits.Diffraction element 30 is positioned on plummer 411, diffraction
Element 30 is for the laser after the collimated collimation of element 20 of diffraction to form laser pattern.Circuit board 61 offers via 611, swashs
Optical transmitting set 10 is housed in via 611.In this way, the height of structured light projector 100 can be reduced.
In addition, structured light projector 100 further includes thermoelectric refrigeration element 70.Thermoelectric refrigeration element 70 includes the cold end of heat absorption
701 and exothermic hot junction 702.Cold end 701 is contacted with the collimating sidewalls 21 of collimating element 20 thinks that laser emitter 10 radiates.Tool
Body, in conjunction with Fig. 2, thermoelectric refrigeration element 70 is cyclic structure, and thermoelectric refrigeration element 70 is arranged around collimating element 20, cold end
Heat-conducting glue 50 is provided between 701 and collimating sidewalls 21,50 one side of heat-conducting glue is for being fixedly connected with 70 He of thermoelectric refrigeration element
Collimating element 20, on the other hand can be by the heat transfer in 20 course of work of collimating element to cold end 701, then via cold end
701 are transferred to hot junction 702, are rejected heat in external environment by hot junction 702.It is also set between hot junction 702 and lens barrel side wall 41
It is equipped with heat-conducting glue 50, on the other hand 50 one side of heat-conducting glue can be led for being fixedly connected with thermoelectric refrigeration element 70 and lens barrel 40
Go out the heat of the release of hot junction 702.
Structured light projector 100 further includes protective cover 80.Protective cover 80 can be made of translucent material, such as glass, poly-
Methyl methacrylate (Polymethyl Methacrylate, PMMA), makrolon (Polycarbonate, PC), polyamides
Imines (Polyimide, PI) etc..Since the translucent materials such as glass, PMMA, PC and PI all have excellent light transmission, protection
Cover 80 can not have to open up loophole.In this way, protective cover 80 can be while preventing diffraction element 30 from falling off, additionally it is possible to avoid
Diffraction element 30 is exposed in the outside of lens barrel 40, to make 30 water proof and dust proof of diffraction element.Certainly, in other embodiments,
Protective cover 80 can offer loophole, and loophole is opposite with the optics effective district of diffraction element 30 to avoid blocking diffraction element
30 light path.
It is appreciated that when environment temperature increases, the temperature of collimating element 20 can also increase.The temperature of collimating element 20
Raising can cause temperature drift problem.The Focus Club of the lens of collimating element 20 changes when temperature drift is larger, to influence structure light
The accuracy for the laser pattern that the projector 100 is projected into object space.
A thermoelectric cooling is arranged in the close position of collimating element 20 in the structured light projector 100 of embodiment of the present invention
Element 70, the cold end 701 of thermoelectric refrigeration element 70 are contacted with the collimating sidewalls 21 of collimating element 20, and 20 temperature of collimating element is higher
When heat can be transmitted by cold end 701 to hot junction 702, and then be discharged into the external world by hot junction 702, so as to be collimation
Element 20 radiates, and reduces the temperature of collimating element 20, avoids influencing the use of collimating element 20 because temperature raising leads to temperature drift
Performance.
Specifically, thermoelectric refrigeration element 70 is that one kind is carried out based on pa note that effect principle, using semi-conductor thermoelectric material
The element of refrigeration.As shown in figure 3, thermoelectric refrigeration element 70 includes the first thermal insulation layer 71, semiconductor thermoelectric stack layers 73 and the
Two thermal insulation layers 72.First thermal insulation layer 71 is contacted by heat-conducting glue 50 with collimating sidewalls 21, semiconductor thermoelectric stack layers 73
It is arranged on the first thermal insulation layer 71, the second thermal insulation layer 72 is arranged in semiconductor thermoelectric stack layers 73, that is, semiconductor heat
Pile layer 73 is arranged between the first thermal insulation layer 71 and the second thermal insulation layer 72.Wherein, in semiconductor thermoelectric stack layers 73
At least one semiconductor refrigerating unit 74 is distributed with, each semiconductor refrigerating unit 74 includes the first metal electrode 731, p-type and N
Type semiconductor (including P-type semiconductor 733 and N-type semiconductor 734) and the second metal electrode 732.Autocollimatic straight sidewall 21 is to lens barrel
On the direction of side wall 41, the first metal electrode 731, p-type and N-type semiconductor, the second metal electrode 732 are arranged in order, that is, first
Metal electrode 731 and the second metal electrode 732 are located at the opposite both ends of p-type and N-type semiconductor, the first metal electrode 731
Between the first thermal insulation layer 71 and p-type and N-type semiconductor, the second metal electrode 732 be located at p-type and N-type semiconductor with
Between second thermal insulation layer 72.The one end and N-type semiconductor 734 of the P-type semiconductor 733 of same semiconductor refrigerating unit 74
One end be connected by the first metal electrode 731.When multiple semiconductor refrigerating lists are distributed in semiconductor thermoelectric stack layers 73
When member 74, the second metal electrode 732 is used for the connection between adjacent semiconductor refrigeration unit 74.
When DC current flows to P-type semiconductor 733 by N-type semiconductor 734, based on pa note that effect principle, N-type is partly led
Body 734 absorbs heat with the position that the contact site of the first metal electrode 731, P-type semiconductor 734 are contacted with the first metal electrode 731,
Referred to as cold end 701；The contact site of N-type semiconductor 734 and the second metal electrode 732, P-type semiconductor 733 and the second metal electricity
The contact site heat release of pole 732, referred to as hot junction 702.The heat that laser emitter 10 generates is passed across the first thermal insulation layer 71
It is handed to cold end 701, cold end 701 absorbs the heat, and hot junction 702 discharges the heat transmitted by cold end 701, and the heat discharged is logical
The second thermal insulation layer 72 is crossed to be transferred in external environment.
Preferably, it in order to improve refrigeration effect, is distributed with and two or more partly leads in semiconductor thermoelectric stack layers 73
Body refrigeration unit 74.Multiple semiconductor refrigerating unit 74 can be connected by way of serial or parallel connection, and be distributed in array-like.
Multiple semiconductor refrigerating units 74 expand the area of cold end 701 and hot junction 702, and refrigeration effect is more preferable.
Further, the material of the first thermal insulation layer 71 and the second thermal insulation layer 72 is preferably the nothing of high heat conductance
Machine material, for example, can be used any one in diamond-like, aluminium nitride, boron nitride, silicon nitride, alundum (Al2O3), magnesia
Any one in silver, copper, gold and aluminium can be selected in the material of kind, the first metal electrode 731 and the second metal electrode 732, to
Promote the heat dissipation performance of thermoelectric refrigeration element 70.Wherein, the material of the first thermal insulation layer 71 and the second thermal insulation layer 72 can
With identical or different.The thickness of first thermal insulation layer 71 and the second thermal insulation layer 72 can be identical or different.First metal
The material of electrode 731 and the second metal electrode 732 can be identical or different, the first metal electrode 731 and the second metal electrode 732
Thickness can be identical or different.
In this way, the structured light projector 100 of embodiment of the present invention is collimation by increasing a thermoelectric refrigeration element 70
Element 20 radiates, and reduces the influence of 20 performance of temperature drift collimation element.
Referring to Fig. 4, in some embodiments, thermoelectric refrigeration element 70 is electrically connected by conducting wire 90 with circuit board 61.
Power supply unit can be integrated on circuit board 61 to power for thermoelectric refrigeration element 70.Alternatively, 61 external power supply unit of circuit board,
After thermoelectric refrigeration element 70 is electrically connected by two conducting wires 90 with circuit board 61, it is electrically connected with power supply unit through circuit board 61.Its
In, the position of conducting wire 90 can be：Lens barrel 40 offers guide hole 44, and one in two conducting wires 90 is housed in guide hole 44, with
The second metal electrode 732 and circuit board 61 are connected, another is housed in host cavity 42 to connect the first metal electrode 731 and electricity
Road plate 61 (as shown in Figure 4)；Alternatively, two conducting wires 90 are housed in host cavity 42, that is, connect cold end 701 and circuit board 61
Conducting wire 90 is housed in host cavity, and the conducting wire 90 for connecting hot junction 702 and circuit board 61 is also housed in host cavity and is close to lens barrel
41 (not shown) of side wall.In this way, a conducting wire 90 connects cold end 701 and circuit board 61, another conducting wire 90 connects 702 He of hot junction
Circuit board 61, thus power supply unit, thermoelectric refrigeration element 70 and two conducting wires 90 form closed circuit, the logical upper direct current in circuit
Afterwards, the both ends of electric cooling module 70 just form cold end 701 and hot junction 702, to realize the heat dissipation to laser emitter 10.
Referring to Fig. 5, in some embodiments, lens barrel 40 opens up fluted 43, all receivings of thermoelectric refrigeration element 70
In groove 43.Wherein, the axial height of thermoelectric refrigeration element 70 is consistent with the axial height of collimating sidewalls 21, groove 43
Then height is collimated slightly larger than the height of thermoelectric refrigeration element 70 in this way, thermoelectric refrigeration element 70 can be initially charged in groove 43
Element 20 is packed into host cavity 42 from the one end of lens barrel 40 contacted with board unit 60 and is arranged and is fastened on the thermoelectricity of annular
In cooling module 70, at this point, the cold end 702 of thermoelectric refrigeration element 70 can be contacted directly with collimating sidewalls 21, led without setting
Hot glue 50.Certainly, the cold end 702 of thermoelectric refrigeration element 70 can also be contacted by heat-conducting glue 50 with collimating sidewalls 21.In addition, will
Thermoelectric refrigeration element 70 is housed in groove 43, can reduce the width of structured light projector 100.Certainly, in other embodiment party
In formula, thermoelectric refrigeration element 70 can also partial receipt in groove 43, the thermoelectric refrigeration element that is not housed in groove 43
70 protrude from groove 43 to the center of host cavity 42, and collimating element 20 can be solid by heat-conducting glue 50 and thermoelectric refrigeration element 70 at this time
Fixed connection, also can directly be connected together with thermoelectric refrigeration element 70.
Further, when thermoelectric refrigeration element 70 is housed in groove 43, it is electrically connected the hot junction 702 of thermoelectric refrigeration element 70
Conducting wire 90 with circuit board 61 can be with partial receipt in groove 43, and is close to lens barrel side wall 41 and is connected up.It is of course also possible to
Guide hole 44 is opened up on lens barrel 40 to be used for accommodating conducting wire 90.
Referring to Fig. 6, in some embodiments, lens barrel 41 offers one or more heat emission holes 45.Heat emission hole 45
Position is corresponding with the position of thermoelectric refrigeration element 70.Heat-conducting glue 50 is filled in heat emission hole 45.The hot junction of thermoelectric refrigeration element 70
The heat of 702 releases can be discharged into via heat-conducting glue 50 in external environment, further improving radiating effect.Wherein, lens barrel 40
When offering heat emission hole 45, thermoelectric refrigeration element 70 can be bonded on lens barrel side wall 41 by heat-conducting glue 50, heat emission hole 45
Position of opening and bonding the heat-conducting glue 50 of thermoelectric refrigeration element it is corresponding (as shown in Figure 6).Alternatively, lens barrel 40 offers heat dissipation
When hole 45, thermoelectric refrigeration element 70 can be housed in groove 43, and the position of opening of heat emission hole 45 is corresponding with groove 43 (to scheme not
Show).
Referring again to Fig. 1, in some embodiments, laser emitter 10 can be vertical cavity surface emitting laser
(Vertical Cavity Surface Emitting Laser, VCSEL), the light emission direction court of vertical cavity surface emitting laser
To collimating element 20.Since the light source of vertical cavity surface emitting laser is multiple spot and is in irregular array distribution, structure
The irrelevance for the laser pattern that light projector 100 projects is larger, is conducive to the acquisition precision for promoting depth image.
Referring to Fig. 7, in some embodiments, laser emitter 10 can be edge-emitting laser (edge-emitting
Laser, EEL), specifically, laser emitter 10 can be distributed feedback laser (Distributed Feedback
Laser, DFB).At this point, the light-emitting surface 11 of laser emitter 10 is towards collimating element 20.The temperature drift of distributed feedback laser compared with
It is small, and be single-point light emitting structure, it is not necessarily to array of designs structure, is made simply, the cost of structured light projector 100 is relatively low.
Also referring to Fig. 7 and Fig. 8, in some embodiments, laser emitter 10 is edge-emitting laser, at this point,
Structured light projector 100 further includes fixing piece.Specifically, laser emitter 10 is in the form of a column, and laser emitter 10 is far from substrate 62
An end face formed light-emitting surface 11.Laser is sent out from light-emitting surface 11, and light-emitting surface 11 is towards collimating element 20.Laser emitter 10
It fixes on the substrate 62.Fixing piece is sealing 15, and laser emitter 10 is bonded by sealing 15 on the substrate 62, for example, laser
The one side bonding opposite with light-emitting surface 11 of transmitter 10 is on the substrate 62.Incorporated by reference to Fig. 7 and Fig. 9, the side of laser emitter 10
Face 12 can also be bonded on the substrate 62, and sealing 15 wraps the side 12 of surrounding, can also only be bonded side 12 some
Face and substrate 62 or certain be bonded several face and substrate 62.Sealing at this time 15 can be heat-conducting glue, and laser emitter 10 is worked and is produced
Raw heat is conducted into substrate 62.Since edge-emitting laser is in usually fine strip shape, when the light-emitting surface 11 of edge-emitting laser
When towards collimating element 20, edge-emitting laser is placed vertically, and edge emitting device laser, which is susceptible to, at this time falls, shifts or shake
It is dynamic to wait surprisingly, therefore edge-emitting laser can be fixed by the way that sealing 15 is arranged, prevent edge-emitting laser from falling,
Displacement or shaking etc. are unexpected.
Also referring to Fig. 7 and Figure 10, in some embodiments, fixing piece can also be the supporting rack 16 of elasticity.Support
The number of frame 16 is two or more.Receiving space 161 is collectively formed in multiple supporting racks 16.Receiving space 161 is for receiving
Hold laser emitter 10, multiple supporting racks 16 are used to support laser emitter 10.In this way, laser emitter 10 can be prevented
It shakes.
Further, as shown in figure 8, in some embodiments, substrate 62 offers louver 621, louver 621
In can fill heat-conducting glue 50 with for laser emitter 10 radiate.
In addition, in some embodiments, substrate 62 can be omitted, laser emitter 10 is directly carried on circuit board 61
On, in this way, the thickness of structured light projector 100 can be reduced.
1 is please referred to Fig.1, the present invention also provides a kind of image acquiring devices 1000.The image of embodiment of the present invention obtains
Device 1000 includes structured light projector 100, image acquisition device 200 and the processor described in above-mentioned any one embodiment
300.Wherein, image acquisition device 200 is for acquiring the laser pattern projected into object space after 30 diffraction of diffraction element.Place
Reason device 300 is connect with structured light projector 100, image acquisition device 200 respectively.Processor 300 is used for according to temperature detection signal
The transmission power of laser emitter 10, and processing laser pattern are adjusted to obtain depth image.
Specifically, structured light projector 100 projects laser pattern into object space by projecting window 901, and image is adopted
Storage 200 is acquired by acquisition window 902 by the modulated laser pattern of target object.Image acquisition device 200 can be infrared phase
Machine, it is corresponding with reference pattern each that processor 300 uses image matching algorithm to calculate each pixel in the laser pattern
The deviation value of pixel further obtains the depth image of the laser pattern further according to deviation value.Wherein, image matching algorithm can
For related (Digital Image Correlation, the DIC) algorithm of digital picture.It is of course also possible to use other images match
Algorithm replaces DIC algorithms.
Structured light projector 100 in the image acquiring device 1000 of embodiment of the present invention passes through in collimating element 20
A thermoelectric refrigeration element 70, the collimating sidewalls of the cold end 701 and collimating element 20 of thermoelectric refrigeration element 70 are arranged in close position
21 contacts, can be transmitted heat by cold end 701 when 20 temperature of collimating element is higher, and then pass through hot junction 702 to hot junction 702
It is discharged into the external world, so as to radiate for collimating element 20, reduces the temperature of collimating element 20, avoid causing because of temperature raising
Temperature drift and the performance for influencing collimating element 20.
2 are please referred to Fig.1, the electronic equipment 3000 of embodiment of the present invention includes shell 2000 and the figure of the above embodiment
As acquisition device 1000.The setting of image acquiring device 1000 exposes in shell 2000 and from shell 2000 to obtain depth map
Picture.
Structured light projector 100 in the electronic equipment 3000 of embodiment of the present invention passes through in the neighbouring of collimating element 20
A thermoelectric refrigeration element 70 is arranged in position, and the cold end 701 of thermoelectric refrigeration element 70 connects with the collimating sidewalls 21 of collimating element 20
It touches, heat can be transmitted by cold end 701 to hot junction 702 when 20 temperature of collimating element is higher, and then discharged by hot junction 702
Into the external world, so as to radiate for collimating element 20, the temperature of collimating element 20 is reduced, avoids leading to temperature drift because of temperature raising
And influence the performance of collimating element 20.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changes, replacing and modification.
Claims (11)
1. a kind of structured light projector, which is characterized in that the structured light projector includes：
Laser emitter, the laser emitter is for emitting laser；
Collimating element, the collimating element is for collimating the laser；
Diffraction element, the laser of the diffraction element for diffraction after collimating element collimation；With
Thermoelectric refrigeration element, the thermoelectric refrigeration element include opposite cold and hot end, the cold end and the collimating element
Collimating sidewalls contact think collimating element heat dissipation.
2. structured light projector according to claim 1, which is characterized in that the structured light projector further includes：
Board unit, the board unit include the circuit board of substrate and carrying on the substrate, the laser emitter peace
On the board unit；With
Lens barrel, the lens barrel include lens barrel side wall and the plummer that extends from the lens barrel side wall, and the lens barrel side wall setting exists
On the circuit board, the lens barrel side wall is surrounded by host cavity, the laser emitter, the collimating element with the circuit board
And the diffraction element is housed in the host cavity.
3. structured light projector according to claim 2, which is characterized in that the thermoelectric refrigeration element is placed on the mirror
Between cylinder side wall and the collimating element, the hot junction is coated with heat-conducting glue, and the thermoelectric refrigeration element passes through the heat-conducting glue
It is Nian Jie with the lens barrel side wall.
4. structured light projector according to claim 3, which is characterized in that the lens barrel opens up fluted, the thermoelectricity
Cooling module is housed in the groove.
5. structured light projector according to claim 3 or 4, which is characterized in that the lens barrel is further opened with heat emission hole, institute
The position for stating heat emission hole is corresponding with the position of the thermoelectric refrigeration element, and the heat emission hole is filled with heat-conducting glue.
6. structured light projector according to claim 1, which is characterized in that the laser emitter is edge emitting laser
Device, the edge-emitting laser include light-emitting surface, and the light-emitting surface is towards the collimating element.
7. structured light projector according to claim 6, which is characterized in that the structured light projector further includes fixing
Part, the fixing piece are used to the edge-emitting laser being fixed on the board unit.
8. structured light projector according to claim 7, which is characterized in that the fixing piece includes sealing, the sealing
It is arranged between the edge-emitting laser and the circuit board, the sealing is heat-conducting glue.
9. structured light projector according to claim 7, which is characterized in that the fixing piece includes being arranged in the substrate
Receiving space, the receiving space is collectively formed in the supporting rack of at least two elasticity on component, at least two support frames as described above
For accommodating the laser emitter, at least two support frames as described above are used to support residence and state laser emitter.
10. a kind of image acquiring device, which is characterized in that described image acquisition device includes：
Structured light projector described in claim 1 to 9 any one；
Image acquisition device, described image collector is for acquiring the laser projected from the structured light projector into object space
Pattern；With
Processor, the processor is for handling the laser pattern to obtain depth image.
11. a kind of electronic equipment, which is characterized in that the electronic equipment includes：
Shell；With
Image acquiring device according to any one of claims 10, described image acquisition device are arranged in the shell and from the shells
Exposure is to obtain depth image.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810202147.7A CN108490577A (en) | 2018-03-12 | 2018-03-12 | Structured light projector, image acquiring device and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810202147.7A CN108490577A (en) | 2018-03-12 | 2018-03-12 | Structured light projector, image acquiring device and electronic equipment |
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| CN108490577A true CN108490577A (en) | 2018-09-04 |
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| CN201810202147.7A Pending CN108490577A (en) | 2018-03-12 | 2018-03-12 | Structured light projector, image acquiring device and electronic equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110895371A (en) * | 2018-09-13 | 2020-03-20 | 三赢科技（深圳）有限公司 | Optical projection device |
| WO2023134024A1 (en) * | 2022-01-12 | 2023-07-20 | 长鑫存储技术有限公司 | Semiconductor structure and forming method therefor |
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| WO2023134024A1 (en) * | 2022-01-12 | 2023-07-20 | 长鑫存储技术有限公司 | Semiconductor structure and forming method therefor |
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