CN216899259U - Infrared detector module and infrared thermal imaging device - Google Patents
Infrared detector module and infrared thermal imaging device Download PDFInfo
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- CN216899259U CN216899259U CN202123289872.9U CN202123289872U CN216899259U CN 216899259 U CN216899259 U CN 216899259U CN 202123289872 U CN202123289872 U CN 202123289872U CN 216899259 U CN216899259 U CN 216899259U
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Abstract
The embodiment of the application discloses an infrared detector module and an infrared thermal imaging device, relates to the technical field of infrared detection, and aims to improve imaging quality. The infrared detector module comprises a heat dissipation part, an infrared detector chip and a printed circuit board; the heat dissipation piece comprises a first mounting surface, and the infrared detector chip is arranged on the first mounting surface and is electrically connected with the printed circuit board; the infrared detector chip comprises an infrared window layer, and an infrared transmission piece is arranged on the outer side of the infrared window layer; the outer side of the infrared window layer is the side, far away from the infrared detector chip, of the infrared window layer. The embodiment of the application is suitable for infrared thermal imaging.
Description
Technical Field
The application relates to the technical field of infrared detection, in particular to an infrared detector module and an infrared thermal imaging device.
Background
The infrared detector chip is packaged by a metal tube shell and a ceramic tube shell in a packaging mode. In addition, the infrared detector chip can also adopt a wafer level packaging form, namely an infrared window layer can be directly pasted on the infrared detector chip, and the infrared window layer corresponds to the focal plane of the infrared detector chip. The packaging form does not need a metal tube shell and a ceramic tube shell, has small volume and is suitable for application of miniaturized and integrated products.
The wafer-level packaging form of the infrared window layer is directly pasted on the infrared detector chip, so that the infrared detector chip is not wrapped by similar metal and ceramic, the distance between the infrared window layer on the infrared detector chip and a focal plane of the infrared detector chip is very short, and if pollutants such as dust particles fall on the infrared window layer in the using process, white spots or dark spots can be formed on an image, and the quality of the image is influenced.
Disclosure of Invention
In view of this, the embodiment of the present application provides an infrared detector module and an infrared thermal imaging device, which are beneficial to improving imaging quality.
In a first aspect, an embodiment of the present application provides an infrared detector module, which includes a heat sink, an infrared detector chip, and a printed circuit board; wherein the content of the first and second substances,
the heat dissipation piece comprises a first mounting surface, and the infrared detector chip is arranged on the first mounting surface and is electrically connected with the printed circuit board;
the infrared detector chip comprises an infrared window layer, and an infrared transmission piece is arranged on the outer side of the infrared window layer; the outer side of the infrared window layer is the side, far away from the infrared detector chip, of the infrared window layer.
According to a specific implementation manner of the embodiment of the application, the heat sink further comprises a second mounting surface, and the printed circuit board is arranged on the second mounting surface; wherein the content of the first and second substances,
the first mounting surface and the second mounting surface are two mounting surfaces which are opposite to each other on the heat dissipation member;
alternatively, the first and second electrodes may be,
the first mounting surface and the second mounting surface are mounting surfaces on the same side of the heat sink.
According to a specific implementation mode of the embodiment of the application, the heat dissipation member comprises a side wall and a partition plate connected with the side wall, and the first installation surface and the second installation surface are arranged on the partition plate.
According to a specific implementation mode of the embodiment of the application, the infrared detector chip is located in a cavity surrounded by the side wall, and the infrared transmission piece is supported on the side wall.
According to a specific implementation manner of the embodiment of the application, the heat dissipation member, the printed circuit board and the infrared transmission member enclose a closed space, and the infrared detector chip is located in the closed space.
According to a concrete implementation mode of the embodiment of the application, be equipped with the apron on the side wall, first through-hole has on the apron, first through-hole with infrared window layer is corresponding, infrared piece of seeing through is established cover and is established first through-hole department on the apron.
According to a specific implementation manner of the embodiment of the application, the heat dissipation member, the printed circuit board, the cover plate and the infrared transmission member enclose a closed space, and the infrared detector chip is located in the closed space.
According to a specific implementation mode of the embodiment of the application, the side wall is provided with a step, and the cover plate is supported and fixed on the step.
According to a specific implementation manner of the embodiment of the present application, the infrared detector chip is disposed on a first side surface of the partition board, the printed circuit board is disposed on a second side surface of the partition board, and the first side surface and the second side surface are two opposite side surfaces of the partition board;
a groove is formed in the first side face of the partition plate, and the infrared detector chip is arranged in the groove.
According to a specific implementation manner of the embodiment of the application, the infrared detector chip and the printed circuit board are arranged on the same side of the partition board;
the printed circuit board is provided with a second through hole, and the infrared detector chip is arranged on the partition plate and is positioned at the position of the second through hole; alternatively, the first and second liquid crystal display panels may be,
the infrared detector chip is arranged on one side of the printed circuit board.
According to a specific implementation manner of the embodiment of the application, a protruding portion is arranged at a position, corresponding to the second through hole, on the partition board, and the infrared detector chip is arranged on the protruding portion.
According to a specific implementation manner of the embodiment of the application, at least one electronic device is arranged on the first side surface of the printed circuit board; in the at least one electronic device, at least part of the at least one electronic device is positioned in a cavity surrounded by the side wall; and/or the presence of a gas in the gas,
the second side surface of the printed circuit board is provided with at least one electronic device; in the at least one electronic device, at least part of the at least one electronic device is positioned in a cavity surrounded by the side wall;
wherein the second side and the first side of the printed circuit board are two oppositely facing sides on the printed circuit board.
In a second aspect, an embodiment of the present application further provides an infrared thermal imaging apparatus, including the infrared detector module described in any one of the foregoing implementation manners.
The infrared detector module and the infrared thermal imaging device of the embodiment of the application are provided with the infrared transmission piece in the outer side of the infrared window layer, dust particles can be prevented from falling on the infrared window layer, the reduction of the sensitivity of the infrared detector chip to the dust particles is facilitated, and the imaging quality of the infrared detector chip is improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic cross-sectional view of an infrared detector module according to an embodiment of the present application;
fig. 2 is another schematic cross-sectional view of an infrared detector module according to an embodiment of the present disclosure;
fig. 3 is a top view of the heatsink of fig. 1;
fig. 4 is a bottom view of the heatsink of fig. 1;
fig. 5 is a schematic cross-sectional view of an infrared detector module according to another embodiment of the present application.
Detailed Description
Embodiments of the present application are described in detail below with reference to the accompanying drawings. It should be understood that the embodiments described are only a few embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the application provides an infrared detector module, which comprises a heat dissipation piece, an infrared detector chip and a printed circuit board, wherein the infrared detector chip and the printed circuit board are arranged on different sides of the heat dissipation piece or on the same side of the heat dissipation piece, and the infrared detector chip and the printed circuit board are electrically connected; through the outside on the infrared window layer on the infrared detector chip sets up infrared penetrating piece, can prevent that the dust particulate matter from dropping on the infrared window layer on the infrared detector chip, is favorable to reducing the sensitivity of infrared detector chip to the dust particulate matter, improves the infrared thermal imaging quality of infrared detector chip. Furthermore, the infrared detector chip can be arranged in a closed space, and dust particles can be prevented from falling on the infrared window layer on the infrared detector chip from the side part of the infrared detector chip. The infrared detector module that this embodiment provided can survey the infrared light of detection object self transmission, can be applied to among the infrared thermal imaging device.
The heat dissipation piece can dissipate heat generated by the infrared detector chip during working. The heat sink may also be referred to as a heat sink or heat sink base, etc. The material of the heat dissipation element can be metal material such as aluminum or copper, and can also be non-metal material such as ceramic material or silicon-based material.
The heat sink is a structural form of the heat dissipation member, and may be a structural member formed by processing a metal material, and the following takes the heat sink as an example of the heat dissipation member, and the embodiments of the present application are described in detail.
Fig. 1 is a schematic structural diagram of an infrared detector module according to an embodiment of the present disclosure, and referring to fig. 1, an infrared detector module 100 according to an embodiment of the present disclosure may include a heat sink 102, an infrared detector chip 104, and a printed circuit board 106; wherein, the first and the second end of the pipe are connected with each other,
the heat sink 102 includes a first mounting surface 1021 and a second mounting surface 1022, the infrared detector chip 104 is disposed on the first mounting surface 1021, the printed circuit board 106 is disposed on the second mounting surface 1022, and the infrared detector chip 104 is electrically connected to the printed circuit board 106. The first mounting surface 1021 and the second mounting surface 1022 are two oppositely facing mounting surfaces on the heat sink 102.
The infrared detector chip 104 comprises an infrared window layer 1041, and an infrared transmission piece 108 is arranged on the outer side of the infrared window layer 1041; the outer side of the infrared window layer 1041 is a side of the infrared window layer 1041 away from the infrared detector chip 104.
An array of light sensing elements (i.e., an array of pixels) is arranged on the focal plane 1042 of the infrared detector chip 104. The infrared window layer 1041 is a packaging structure of the infrared detector chip 104, and the infrared detector chip 104 is vacuum-packaged through the infrared window layer 1041. The infrared detector chip 104 having the infrared window layer 1041 may be a chip obtained by wafer-level or pixel-level packaging the infrared detector chip 104. Infrared window layer 1041 may be a silicon wafer or a germanium wafer, and thus infrared window layer 1041 may also be referred to as a silicon window layer or a germanium window layer, which is referred to as a silicon window or a germanium window for short. The infrared detector chip 104 may be attached to the first mounting surface 1021 on the heat sink 102 by a thermally conductive adhesive (e.g., silicone adhesive, etc.).
The ir-transparent member 108 may be a sheet or plate made of an ir-transparent material, which is capable of transmitting ir light and blocking dust particles. The infrared transmitting material is a material which can transmit infrared light (wavelength range is 1-14 μm). The infrared transmitting material can be silicon, germanium, zinc sulfide, zinc selenide and the like. In this embodiment, the infrared transmitting member 108 is made of germanium, which can reduce the influence of the infrared transmitting member 108 on the infrared transmittance.
The printed Circuit Board 106 is a Circuit Board with components mounted thereon, and may be referred to as a pcba (printed Circuit Board assembly). The printed circuit board 106 may be provided with a connector for external electrical connection. The printed circuit board 106 may be adhered to the second mounting surface 1022 by a thermal conductive adhesive (e.g., silicone, etc.), or may be fixed to the second mounting surface 1022 by a fastener such as a screw.
The infrared detector chip 104 may be electrically connected to the printed circuit board 106 by gold wires. The infrared detector chip 104 and the printed circuit board 106 may be respectively provided with a bonding pad, and one end of the gold wire is welded to the bonding pad on the infrared detector chip 104, and the other end is welded to the bonding pad on the printed circuit board 106.
Referring to fig. 3 and 4, on the heat sink 102, a hollow structure 112 is disposed to penetrate the first mounting surface 1021 and the second mounting surface 1022, so that a gold wire electrically connected between the infrared detector chip 104 and the printed circuit board 106 penetrates the first mounting surface 1021 and the second mounting surface 1022.
In this embodiment, the infrared transmission member 108 is disposed on the outer side of the infrared window layer 1041, so that the particles can be prevented from falling on the infrared window layer 1041, the sensitivity of the infrared detector chip 104 to the particles can be reduced, and the imaging quality of the infrared detector chip 104 can be improved. Even if particulate matter falls on the outer surface of the infrared transmitting member 108, the distance from the external particulate matter to the focal plane 1042 of the infrared detector chip 104 is raised due to the existence of the infrared transmitting member 108, so that the sensitivity of the infrared detector chip 104 to the particulate matter can be reduced, and the imaging quality of the infrared detector chip 104 is improved.
The heat sink 102 may include a side wall 1023 and a partition plate 1024 connected to the side wall 1023, the partition plate 1024 is located in a cavity surrounded by the side wall 1023, and the first mounting surface 1021 and the second mounting surface 1022 are respectively disposed on two sides of the partition plate 1024.
The side walls 1023 can provide protection for the infrared detector chip 104 arranged on the first mounting surface 1021 and the printed circuit board 106 arranged on the second mounting surface 1022, and can increase the heat dissipation area and have stronger heat dissipation effect.
The side gusset 1023 can also provide support for the placement of the ir transparent member 108. The ir-transparent member 108 may be supported by providing a cover plate 114 over the side gusset 1023. Specifically, referring to fig. 1 and fig. 2, a cover plate 114 is disposed on the side wall 1023, a first through hole 1141 is disposed on the cover plate 114, the first through hole 1141 corresponds to the infrared window layer 1041, and the infrared transmitting element 108 is disposed on the cover plate 114 and covers the first through hole 1141. The ir-transparent member 108 is generally thin and fragile, and the cover 114 is used to support the ir-transparent member 108, so that the ir-transparent member 108 has a relatively small area and is not fragile during use.
The cover plate 114 may be in a sheet or plate shape, and the cover plate 114 may also be made of a metal material, such as copper, aluminum or an alloy material, so that the cover plate 114 itself can also dissipate heat generated by the infrared detector chip 104 during operation.
The cover plate 114 can be fixed on the side wall 1023 through glue bonding, and can also be fixed on the side wall 1023 through fasteners such as screws. In one example, the cover plate 114 is provided with a counter bore, the heat sink 102 is provided with a threaded hole, the counter bore corresponds to the threaded hole, a screw 116 is arranged in the counter bore, and a threaded portion of the screw 116 penetrates through the counter bore and is in threaded connection with the threaded hole.
The ir-transparent member 108 may be secured to the cover plate 114 by adhesive bonding. During installation, the ir-transparent member 108 can be adhered to the cover plate 114 and then the cover plate 114 can be fixed to the side gusset 1023.
The difference between the coefficient of thermal expansion of the cover plate 114 and the coefficient of thermal expansion of the ir transparent member 108 may be within a predetermined range, and preferably the coefficient of thermal expansion of the cover plate 114 is the same or substantially the same as the coefficient of thermal expansion of the ir transparent member 108 to avoid cracking of the ir transparent member 108 during thermal expansion due to large differences between the coefficients of thermal expansion. In one example, the IR transmissive member 108 is made of a germanium material and the cover 114 is made of a Kovar alloy.
To facilitate the positioning of the cover plate 114, the side edge 1023 may be provided with a step 110, and the cover plate 114 is supported and fixed on the step 110. By which support and circumferential positioning of the cover plate 114 may be provided. The step can be arranged on the inner wall of the side wall and extends along the circumferential direction of the side wall to form a ring shape.
In other embodiments, the ir transparent member 108 may be supported directly by the side gusset 1023, i.e., the cover plate 114 may not be disposed between the side gusset 1023 and the ir transparent member 108.
Referring to fig. 2, the first side of the spacer 1024 is provided with a groove 1025, and the infrared detector chip 104 is disposed in the groove 1025, so that the height difference between the infrared detector chip 104 and the printed circuit board 106 can be reduced, and the two can be electrically connected through a metal wire. In addition, the groove 1025 can also realize the positioning function of the infrared detector chip 104 and increase the heat dissipation area.
After the cover plate 114 with the ir-transmitting member 108 is fixed on the side wall 1023, a predetermined gap, such as a predetermined gap of 1mm or more and 6mm or less, may be formed between the inner side surface of the ir-transmitting member 108 and the outer side surface of the infrared window layer 1041, so as to increase the distance between the outer side surface of the ir-transmitting member 108 and the focal plane 1042 of the infrared detector chip 104, which is more beneficial to reducing the sensitivity of the infrared detector chip 104 to dust particles. The outer surface of the infrared transmitting element 108 is a surface of the infrared transmitting element 108 away from the infrared window layer 1041.
In order to prevent external particles from entering the gap from the side of the infrared detector chip 104 and falling on the infrared window layer 1041, the infrared detector chip 104 may be disposed in a closed space surrounded by the side wall 1023 and the printed circuit board 106. Specifically, referring to fig. 1 and 2, an enclosed space can be defined by the side walls 1023, the printed circuit board 106, the cover plate 114 and the ir-transparent member 108, and the ir detector chip 104 is located in the enclosed space. To enhance the sealing performance, a sealant may be applied to the contact connection between the printed circuit board 106 and the side wall 1023. In the case that the cover plate 114 is not disposed between the side edge 1023 and the ir-transparent member 108, a closed space can be defined by the side edge 1023, the printed circuit board 106 and the ir-transparent member 108.
In this embodiment, the first side of the printed circuit board 106 is fixed to the second mounting surface 1022 on the heat sink. Specifically, the second mounting surface 1022 on the heat sink may be mated and secured by a localized area of the first side of the printed circuit board 106.
At least one electronic device is disposed on the second side of the printed circuit board 106; in the at least one electronic device, at least part of the at least one electronic device is positioned in the cavity surrounded by the side wall, so that the side wall provides protection and heat dissipation effects for the at least one electronic device. Wherein the second side and the first side of the printed circuit board 106 are two oppositely facing sides on the printed circuit board 106.
In one example, in addition to the at least one electronic device on the second side of the printed circuit board 106, the at least one electronic device may also be on the first side of the printed circuit board; in the at least one electronic device, at least part of the at least one electronic device is positioned in a cavity surrounded by the side wall.
Fig. 5 is a schematic cross-sectional view of an infrared detector module according to another embodiment of the present application, and referring to fig. 5, an infrared detector module 200 according to this embodiment may include a heat sink 202, an infrared detector chip 204, and a printed circuit board 206; the heat sink 202 includes a first mounting surface 2021 and a second mounting surface 2022, the infrared detector chip 204 is disposed on the first mounting surface 2021, the printed circuit board 206 is disposed on the second mounting surface 2022, and the infrared detector chip 204 is electrically connected to the printed circuit board 206. The first mounting surface 2021 and the second mounting surface 2022 are two mounting surfaces of the heat sink 202 that are in the same direction, in other words, the first mounting surface 2021 and the second mounting surface 2022 are two mounting surfaces of the heat sink 202 that are on the same side.
The infrared detector chip 204 includes an infrared window layer 2041, and an infrared transmission member is disposed outside the infrared window layer 2041; the outer side of the infrared window layer 2041 is a side of the infrared window layer 2041 away from the infrared detector chip 204. The structure and operation of the infrared detector chip 204 are substantially the same as those of the infrared detector chip 204 in the embodiment shown in fig. 1.
By arranging the infrared transmission member 208 on the outer side of the infrared window layer 2041, particles can be prevented from falling on the infrared window layer 2041, which is beneficial to reducing the sensitivity of the infrared detector chip 204 to the particles and improving the imaging quality of the infrared detector chip 204. Even if particles fall on the outer surface of the infrared transmitting piece 208, the distance from external particles to the focal plane 1042 of the infrared detector chip 204 is raised due to the existence of the infrared transmitting piece 208, so that the sensitivity of the infrared detector chip 204 to the particles can be reduced, and the imaging quality of the infrared detector chip 204 is improved.
The printed Circuit Board 206 is a Circuit Board with components mounted thereon, and may be referred to as a pcba (printed Circuit Board assembly). The printed circuit board 206 may be provided with a connector for external electrical connection. The printed circuit board 206 may be adhered to the second mounting surface 2022 by a thermal conductive adhesive (e.g., silicone adhesive, etc.), or may be fixed to the second mounting surface 2022 by a fastener such as a screw.
The printed circuit board 206 is provided with a second through hole 2061, and the infrared detector chip 204 is provided on the partition 2024 and located at the second through hole, and is electrically connected to the printed circuit board 206 by a gold wire. The second through hole may be a through hole preset at a central position of the printed circuit board 206. The infrared detector chip 204 and the printed circuit board 206 may be respectively provided with a bonding pad, and one end of the gold wire is welded to the bonding pad on the infrared detector chip 204, and the other end is welded to the bonding pad on the printed circuit board 206.
The heat sink 202 may include a side wall 2023 and a partition 2024 connected to the side wall 2023, the partition 2024 is located in a cavity surrounded by the side wall 2023, and the first mounting surface 2021 and the second mounting surface 2022 are disposed on the same side of the partition 2024.
The partition 2024 has a protrusion 2025 thereon, the protrusion 2025 protrudes from the second through hole, a top surface of the protrusion 2025 forms a first mounting surface 2021, and the infrared detector chip 204 is disposed on the protrusion. Compared with other parts of the partition 2024, the protruding portion has a larger thickness, so that the flatness of the top surface of the protruding portion (i.e., the first mounting surface 2021) is improved by processing the top surface of the protruding portion, thereby facilitating control of the flatness of the focal plane 1042 of the infrared detector chip 204. The height difference between the infrared detector chip 204 and the printed circuit board 206 can also be controlled by controlling the height of the bumps. In other embodiments, the infrared detector chip 204 may be directly disposed in the second through hole without the protrusion portion on the partition 2024. The printed circuit board 206 may not have the second through hole, and the infrared detector chip 204 and the printed circuit board 206 may be arranged in parallel, that is, the infrared detector chip 204 is arranged outside the printed circuit board 206 and on one side of the printed circuit board 206.
The partition 2024 may have a hollow structure, and the connector 2062 of the pcb 206 for electrical connection with the outside may be located in the hollow structure so as to connect with an external cable.
The side wall 2023 can provide a protection effect for the infrared detector chip 204 disposed on the first mounting surface 2021 and the printed circuit board 206 disposed on the second mounting surface 2022, and at the same time, can increase the heat dissipation area and has a stronger heat dissipation effect.
The side wrap 2023 may also provide support for the placement of the infrared-transparent piece 208. The infrared-transmitting member 208 may be supported by providing a cover plate on the side wall 2023. Specifically, referring to fig. 5, the side wall 2023 is provided with a cover plate 214, the cover plate 214 is provided with a first through hole 2141, the first through hole 2141 corresponds to the infrared window layer 2041, and the infrared transmitting element 208 is disposed on the cover plate 214 and covers the first through hole. The ir-transparent member 208 is typically relatively thin and fragile, and the cover 214 supporting the ir-transparent member 208 allows the ir-transparent member 208 to have a relatively small area and be less fragile during use.
The cover plate 214 may also be made of a metal material, such as copper, aluminum, or an alloy material, so that the cover plate 214 itself can also dissipate heat generated by the infrared detector chip 204 during operation.
The cover plate 214 may be fixed to the side wall 2023 by adhesive bonding or may be fixed to the side wall 2023 by fasteners such as screws. The ir-transparent member 208 may be secured to the cover plate 214 by adhesive bonding. When the infrared transmitting member 208 is mounted, the cover 214 may be adhered to the cover 214, and then the cover 214 may be fixed to the side wall 2023.
The difference between the coefficient of thermal expansion of the cover 214 and the coefficient of thermal expansion of the ir transparent member 208 may be within a predetermined range, and preferably the coefficient of thermal expansion of the cover 214 is the same or substantially the same as the coefficient of thermal expansion of the ir transparent member 208 to avoid cracking of the ir transparent member 208 due to thermal expansion caused by the difference between the coefficients of thermal expansion. In one example, the IR transmissive member 208 is made of a germanium material and the cover plate 214 is made of an alloy material.
The cover plate 214 directly covers the top end of the side wall 2023. In other embodiments, side 2023 may have a step thereon for facilitating positioning of lid 214, and lid 214 may be supported and secured on the step.
In other embodiments, the ir-transparent member 208 may be supported directly by the side wall 2023, i.e., the cover plate 214 may not be disposed between the side wall 2023 and the ir-transparent member 208.
After the cover plate 214 with the infrared transmitting element 208 fixed thereon is fixed on the side wall 2023, a predetermined gap, such as a predetermined gap greater than or equal to 1mm and less than or equal to 6mm, may be formed between the inner side surface of the infrared transmitting element 208 and the outer side surface of the infrared window layer 2041, so as to increase the distance between the outer side surface of the infrared transmitting element 208 and the focal plane 1042 of the infrared detector chip 204, which is more favorable for reducing the sensitivity of the infrared detector chip 204 to dust particles. The outer surface of the ir-transmitting member 208 is a side surface of the ir-transmitting member 208 away from the infrared window layer 2041.
In order to prevent external particles from entering the gap from the side of the infrared detector chip 204 and falling on the infrared window layer 2041, the infrared detector chip 204 may be disposed in a closed space defined by the side walls 2023 and the printed circuit board 206. Specifically, referring to fig. 5, an enclosed space can be defined by the side walls 2023, the printed circuit board 206, the cover plate 214 and the infrared transmission member 208, and the infrared detector chip 204 is located in the enclosed space. In order to enhance the sealing performance, a sealant may be coated at the contact connection portion between the printed circuit board 206 and the side wall 2023. In the case where the cover plate 214 is not provided between the side wall 2023 and the infrared-transmitting member 208, a closed space may be defined by the side wall 2023, the printed circuit board 206, and the infrared-transmitting member 208.
In one example, at least one electronic device is disposed on the printed circuit board 206, and at least a portion of at least one electronic device is located in the cavity surrounded by the side wall 2023, so as to provide protection and heat dissipation for the at least one electronic device through the side wall 2023. For example, a portion of connector 2062 of printed circuit board 206 shown in FIG. 5 is located within the cavity defined by side wall 2023.
In this embodiment, the first side of the printed circuit board 206 is fixed to the second mounting surface 2022 on the heat sink. Specifically, the second mounting surface 2022 on the heat sink may be matched and fixed (e.g., fixed by adhesive bonding, etc.) by a partial region of the first side of the printed circuit board 206.
At least one electronic device is disposed on a first side of the printed circuit board 206; in the at least one electronic device, at least a part of the at least one electronic device is located in the cavity surrounded by the side wall 2023, so that the at least one electronic device is protected and cooled. For example, a portion of the connector 2062 of the printed circuit board 206 shown in fig. 5 is located within the cavity defined by the side wall 2023.
In one example, in addition to the at least one electronic device on the first side of the printed circuit board 206, the at least one electronic device may also be provided on the second side of the printed circuit board; in the at least one electronic device, at least part of the at least one electronic device is positioned in a cavity surrounded by the side wall.
Wherein the second side and the first side of the printed circuit board 206 are two oppositely facing sides on the printed circuit board 206.
The embodiment of the application also provides an infrared thermal imaging device which comprises the infrared detector module of any one of the previous embodiments.
The infrared thermal imaging device of this embodiment sets up the infrared piece that sees through the outside on the infrared window layer on the infrared detector chip, can prevent that the dust particulate matter from dropping on the infrared window layer on the infrared detector chip, is favorable to reducing the sensitivity of infrared detector chip to the dust particulate matter, improves the infrared thermal imaging quality of infrared detector chip.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
All the embodiments in the present specification are described in a related manner, and the same and similar parts among the embodiments may be referred to each other, and each embodiment focuses on the differences from the other embodiments.
For convenience of description, the above devices are described separately in terms of functional division into various units/modules. Of course, the functionality of the units/modules may be implemented in one or more software and/or hardware implementations when the present application is implemented.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (13)
1. An infrared detector module is characterized by comprising a heat radiating piece, an infrared detector chip and a printed circuit board; wherein the content of the first and second substances,
the heat dissipation piece comprises a first mounting surface, and the infrared detector chip is arranged on the first mounting surface and is electrically connected with the printed circuit board;
the infrared detector chip comprises an infrared window layer, and an infrared transmission piece is arranged on the outer side of the infrared window layer; the outer side of the infrared window layer is the side, far away from the infrared detector chip, of the infrared window layer.
2. The infrared detector module as set forth in claim 1, wherein said heat sink further comprises a second mounting surface, said printed circuit board being disposed on said second mounting surface; wherein the content of the first and second substances,
the first mounting surface and the second mounting surface are two mounting surfaces which are opposite to each other on the heat sink;
alternatively, the first and second electrodes may be,
the first mounting surface and the second mounting surface are mounting surfaces on the same side of the heat sink.
3. The infrared detector module as set forth in claim 2, wherein the heat sink includes a side wall and a partition connected to the side wall;
the first mounting surface and the second mounting surface are provided on the partition plate.
4. The infrared detector module as set forth in claim 3, wherein the infrared detector chip is located in a cavity surrounded by the side wall, and the infrared transmitting member is supported on the side wall.
5. The infrared detector module as set forth in claim 3, wherein the heat sink, the printed circuit board, and the infrared transmitting element enclose an enclosed space, and the infrared detector chip is located in the enclosed space.
6. The infrared detector module as set forth in any one of claims 1 to 3, wherein a cover plate is disposed on the side wall, the cover plate has a first through hole corresponding to the infrared window layer, and the infrared transmitting member is disposed on the cover plate and covers the first through hole.
7. The infrared detector module as set forth in claim 6, wherein the heat sink, the printed circuit board, the cover plate, and the infrared-transmitting element enclose an enclosed space, and the infrared detector chip is located in the enclosed space.
8. The infrared detector module as set forth in claim 6, wherein said side walls have steps thereon, and said cover plate is supported and fixed on said steps.
9. The infrared detector module as set forth in claim 3, wherein the infrared detector die are disposed on a first side of the spacer, the printed circuit board is disposed on a second side of the spacer, and the first and second sides are two oppositely facing sides of the spacer;
a groove is formed in the first side face of the partition plate, and the infrared detector chip is arranged in the groove.
10. The infrared detector module as set forth in claim 3, wherein said infrared detector chip and said printed circuit board are disposed on a same side of said partition;
the printed circuit board is provided with a second through hole, and the infrared detector chip is arranged on the partition board and positioned at the position of the second through hole; alternatively, the first and second electrodes may be,
the infrared detector chip is arranged on one side of the printed circuit board.
11. The infrared detector module as set forth in claim 10, wherein the partition has a protrusion at a position corresponding to the second through hole, and the infrared detector chip is disposed on the protrusion.
12. The infrared detector module as set forth in claim 3, wherein at least one electronic device is disposed on the first side of the printed circuit board; in the at least one electronic device, at least part of the at least one electronic device is positioned in a cavity surrounded by the side wall; and/or the presence of a gas in the gas,
at least one electronic device is arranged on the second side face of the printed circuit board; in the at least one electronic device, at least part of the at least one electronic device is positioned in a cavity surrounded by the side wall; the second side face and the first side face of the printed circuit board are two opposite side faces on the printed circuit board.
13. An infrared thermal imaging apparatus comprising the infrared detector module of any one of claims 1-12.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123289872.9U CN216899259U (en) | 2021-12-24 | 2021-12-24 | Infrared detector module and infrared thermal imaging device |
| PCT/CN2022/106865 WO2023001203A1 (en) | 2021-07-23 | 2022-07-20 | Infrared detector module and infrared thermal imaging device |
| PCT/CN2022/114223 WO2023035933A1 (en) | 2021-09-09 | 2022-08-23 | Infrared detector module and infrared thermal imaging device |
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| CN202123289872.9U CN216899259U (en) | 2021-12-24 | 2021-12-24 | Infrared detector module and infrared thermal imaging device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023001203A1 (en) * | 2021-07-23 | 2023-01-26 | 杭州微影软件有限公司 | Infrared detector module and infrared thermal imaging device |
| WO2023035933A1 (en) * | 2021-09-09 | 2023-03-16 | 杭州微影软件有限公司 | Infrared detector module and infrared thermal imaging device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023001203A1 (en) * | 2021-07-23 | 2023-01-26 | 杭州微影软件有限公司 | Infrared detector module and infrared thermal imaging device |
| WO2023035933A1 (en) * | 2021-09-09 | 2023-03-16 | 杭州微影软件有限公司 | Infrared detector module and infrared thermal imaging device |
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