WO2023035933A1

WO2023035933A1 - Infrared detector module and infrared thermal imaging device

Info

Publication number: WO2023035933A1
Application number: PCT/CN2022/114223
Authority: WO
Inventors: 戴挺; 何春晓; 胡长伟; 蒋红卫; 刘旭峰; 岳振东; 丁金玲
Original assignee: 杭州微影软件有限公司
Priority date: 2021-09-09
Filing date: 2022-08-23
Publication date: 2023-03-16

Abstract

An infrared detector module and an infrared thermal imaging device. The infrared detector module comprises a heat-dissipation member (100), an infrared detector chip (200), and a printed circuit board (300). The heat-dissipation member (100) is provided with a mounting cavity (110). The infrared detector chip (200) and the printed circuit board (300) are both arranged in the mounting cavity (110). The infrared detector chip (200) is fitted to the heat-dissipation member (100). The infrared detector chip (200) and the printed circuit board (300) are stacked, and the printed circuit board (300) comprises a peripheral area located at the outer edge of the infrared detector chip (200). The infrared detector chip (200) is electrically connected to the peripheral area of the printed circuit board (300).

Description

Infrared detector module and infrared thermal imaging device

technical field

The present disclosure relates to the technical field of infrared detection, in particular to an infrared detector module and an infrared thermal imaging device.

Background technique

Infrared detector modules mostly use COB packaging (Chips on Board, chip on board packaging), that is, the infrared detector chip is adhered to the interconnection substrate with conductive adhesive or non-conductive adhesive, and then wire bonded to realize its electrical connection. This packaging method has the advantages of miniaturization and integration because it does not require metal shells and ceramic shells.

However, the infrared detector module is packaged in COB. Since the infrared detector chip is pasted on the substrate, the infrared detector chip will generate a lot of heat when it works, and the heat dissipation effect of the chip and the substrate is poor, which will affect the life and use effect of the chip. .

Contents of the invention

The present disclosure provides an infrared detector module to solve the technical problem of poor heat dissipation of the infrared detector module in the related art. The present disclosure adopts the following technical solutions:

The present disclosure provides an infrared detector module, including a heat sink, an infrared detector chip, and a printed circuit board; wherein: the heat sink is provided with an installation cavity, and the infrared detector chip and the printed circuit board are all arranged in the installation cavity, the infrared detector chip is attached to the heat sink, the infrared detector chip is stacked with the printed circuit board, and the infrared detector chip and the Printed circuit board electrical connection.

In the infrared detector module provided by the embodiment of the present disclosure, the heat sink is provided with an installation cavity, the infrared detector chip and the printed circuit board are both arranged in the installation cavity, the infrared detector chip is attached to the heat sink, and the infrared detector chip The generated heat can be transmitted to the heat sink by contact for heat dissipation, and the heat sink can perform rapid heat exchange with the air, which accelerates the heat dissipation of the infrared detector chip and ensures the use effect of the infrared detector module.

At the same time, the stacking arrangement of the infrared detector chip and the printed circuit board can not only reduce the volume of the infrared detector module, but also make the internal structure of the infrared detector module compact, and the hot air in the installation cavity can also pass through the infrared detector chip. The surrounding area of the infrared detector is discharged outwards to accelerate the heat dissipation of the infrared detector module; the installation cavity can protect the infrared detector chip and the printed circuit board, prevent the infrared detector chip and the printed circuit board from being scratched, and ensure The stability of the use of the infrared detector module prolongs the service life of the infrared detector module.

The present disclosure also provides an infrared thermal imaging device, including the foregoing infrared detector module.

Description of drawings

In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings that need to be used will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present disclosure. For those skilled in the art, other drawings can also be obtained based on these drawings without any creative effort.

FIG. 1 is a schematic structural diagram of an infrared detector module according to an exemplary embodiment of the present disclosure;

Fig. 2 is a structural schematic diagram of another viewing angle of an infrared detector module according to an exemplary embodiment of the present disclosure;

3 is a cross-sectional view of an infrared detector module according to an exemplary embodiment of the present disclosure;

Fig. 4 is a schematic structural diagram of an infrared detector module according to another exemplary embodiment of the present disclosure;

5 is a cross-sectional view of an infrared detector module according to yet another exemplary embodiment of the present disclosure;

Fig. 6 is an exploded schematic diagram of an infrared detector module according to yet another exemplary embodiment of the present disclosure;

7 is a cross-sectional view of an infrared detector module according to an embodiment of the present disclosure;

8 is another cross-sectional view of an infrared detector module according to an embodiment of the present disclosure;

Fig. 9 is a top view of the heat sink in Fig. 1;

Fig. 10 is a bottom view of the heat sink in Fig. 1;

FIG. 11 is a cross-sectional view of an infrared detector module according to another embodiment of the present disclosure.

Detailed ways

In order to make the purpose, technical solution and advantages of the present disclosure clearer, the technical solution of the present disclosure will be described in detail below. Apparently, the described embodiments are only some of the embodiments of the present disclosure, not all of them. Based on the embodiments in the present disclosure, all other implementation manners obtained by those skilled in the art without creative efforts fall within the protection scope of the present disclosure.

The terms "first", "second" and the like in the specification and claims of the present disclosure are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the present disclosure are capable of practice in sequences other than those illustrated or described herein, and references to "first", "second", etc. to distinguish Objects are generally of one type, and the number of objects is not limited. For example, there may be one or more first objects.

The infrared detector module provided by the embodiments of the present disclosure will be described in detail below through specific embodiments and application scenarios with reference to accompanying drawings 1 to 6 .

An embodiment of the present disclosure provides an infrared detector module, including a heat sink 100 , an infrared detector chip 200 and a printed circuit board 300 .

Wherein, the infrared detector chip 200 is electrically connected to the printed circuit board 300 , and the heat sink 100 provides a basis for installation and protection of the infrared detector chip 200 and the printed circuit board 300 . When the infrared detector module is assembled and connected to the electronic device, the heat sink 100 is fixed to the electronic device, and the printed circuit board 300 is electrically connected to the electronic device to realize the installation of the infrared detector module. Components are mounted on the printed circuit board 300 , which may also be called PCBA (Printed Circuit Board Assembly).

The heat sink 100 is provided with an installation cavity 110, the infrared detector chip 200 and the printed circuit board 300 are both arranged in the installation cavity 110, the infrared detector chip 200 is attached to the heat sink 100, and the heat generated is conducted to the heat sink 100 for heat dissipation, and the infrared detector chip 200 can be attached to the bottom wall of the installation cavity 110 .

The printed circuit board 300 may be larger than the infrared detector chip 200 , the printed circuit board 300 includes a peripheral area outside the edge of the infrared detector chip 200 , and the infrared detector chip 200 is electrically connected to the peripheral area of the printed circuit board 300 . In one embodiment, the infrared detector chip 200 is electrically connected to the peripheral area of the printed circuit board 300 through a plurality of wires 400 .

In the embodiment of the present disclosure, the infrared detector chip 200 can be stacked with the printed circuit board 300, that is, the infrared detector chip 200 and the printed circuit board 300 can be stacked in the installation cavity 110. Such a layout can make the infrared detector The module has the advantages of small size and compact internal structure; at the same time, the hot air in the installation cavity 110 can be discharged outward through the peripheral area of the infrared detector chip 200, thereby improving the heat dissipation effect of the infrared detector module.

In the infrared detector module of the embodiment of the present disclosure, both the infrared detector chip 200 and the printed circuit board 300 are installed in the installation cavity 110, and the infrared detector chip 200 is attached to the heat sink 100 to conduct heat to the heat sink. 100, thereby realizing heat dissipation and cooling of the infrared detector chip 200. Through the heat exchange between the heat sink 100 and the air, the heat dissipation of the infrared detector chip 200 can be accelerated, so that the temperature of the infrared detector chip 200 meets the operating requirements, thereby ensuring the use effect of the infrared detector chip 200 .

At the same time, the installation cavity 110 can protect the infrared detector chip 200, the printed circuit board 300 and the lead wire 400 placed therein, preventing the infrared detector chip 200, the printed circuit board 300 or the lead wire 400 from being scratched. damage to avoid failure of the infrared detector module.

In one embodiment, the printed circuit board 300 can be attached to the heat sink 100, so that part of the heat generated by the remaining electronic devices on the printed circuit board 300 can also be conducted to the heat sink 100 through the printed circuit board 300, That is, the heat generated by the infrared detector chip 200 and the heat generated by the electronic devices on the printed circuit board 300 can be conducted to the heat sink 100 for heat dissipation. The heat dissipation element 100 of this embodiment has the advantages of simple structure, low cost and convenient processing, and can significantly improve the heat dissipation effect of the infrared detector module.

Referring to FIGS. 4-6 , the heat sink 100 is provided with an installation cavity 110 , and the infrared detector chip 200 and the printed circuit board 300 are both arranged on the bottom wall of the installation cavity 110 . As shown in FIG. 6 , the heat sink 100 includes a bottom plate 180 and a peripheral protective frame 140, the bottom plate 180 is connected to the inner side wall of the peripheral protective frame 140, and defines an installation cavity 110 between the two, the bottom plate 180 has an inner surface, and the inner surface Facing the installation cavity 110 , the inner surface of the bottom plate 180 forms the bottom wall of the installation cavity 110 , and the inner surface of the peripheral protection frame 140 forms the side wall of the installation cavity 110 .

In this embodiment, the bottom plate 180 is a structural member made of a material with good thermal conductivity, such as copper, copper alloy, aluminum, aluminum alloy, etc. The specific material of the bottom plate 180 is not limited in this embodiment of the present disclosure. Furthermore, the outer protective frame 140 can be a structural member made of a material with better thermal conductivity, which can strengthen the heat exchange between the infrared detector module and the air, and improve the heat dissipation efficiency of the infrared detector module.

In this embodiment, as shown in FIG. 5 , the printed circuit board 300 can be installed on the bottom wall of the installation cavity 110 by means of gluing, screw connection, etc., and the inner surface of the bottom plate 180 can be provided with a boss 120, printed The circuit board 300 is provided with a first avoidance hole 310 for avoiding the boss 120 , and the infrared detector chip 200 can be attached to the boss 120 by glue.

The boss 120 has an installation end surface 1201 facing the outside of the heat sink 100, the infrared detector chip 200 can be attached to the installation end surface 1201 of the boss 120, the boss 120 is set on the bottom wall of the installation cavity 110, and the installation end surface 1201 of the boss 120 The area is smaller than the area of the bottom wall of the installation cavity 110, so that it is easy to ensure the flatness of the installation end surface 1201 of the boss 120 during the processing, and the processing is convenient. Further, the area of the mounting end face 1201 is larger than the area of the infrared detector chip 200 towards the side of the boss 120, so that the infrared detector chip 200 can be completely attached to the mounting end face 1201, increasing the distance between the infrared detector chip 200 and the boss 120. The contact area can improve the heat dissipation effect.

At the same time, when the infrared detector chip 200 is arranged on the boss 120, the infrared detector chip 200 and the printed circuit board 300 can have a height difference, so that the infrared detector chip 200 and the printed circuit board 300 can be electrically connected. The plurality of lead wires 400 are arranged in an orderly manner to avoid twisting and dislocation of the lead wires 400 .

In one embodiment, the heat sink 100 may be provided with two installation cavities, and the infrared detector chip 200 and the printed circuit board 300 may be respectively provided in the two installation cavities. As shown in FIG. 3 , the heat sink 100 has a first end and a second end opposite to each other. The installation cavity 110 includes a first installation cavity 111 and a second installation cavity 112 . On the other hand, the infrared detector chip 200 is attached to the bottom wall of the first installation cavity 111, the second installation cavity 112 is opened on the second surface of the heat sink 100, and the printed circuit board 300 is attached to the bottom wall of the second installation cavity 112. .

In this way, the infrared detector chip 200 quickly exchanges heat with the heat sink 100 in the first installation cavity 111, and the printed circuit board 300 performs heat exchange with the heat sink 100 in the second installation cavity 112, and the infrared detector chip 200 works Although the large amount of heat generated will cause the ambient temperature in the first installation cavity 111 to rise, it has little effect on the temperature in the second installation cavity 112, thereby ensuring that other electronic devices mounted on the printed circuit board 300 can run stably .

At the same time, the infrared detector chip 200 and the printed circuit board 300 are respectively arranged in the first installation cavity 111 and the second installation cavity 112, which increases the heat exchange area with the heat sink 100 and significantly improves the performance of the infrared detector module. heat radiation.

In the above scheme, the infrared detector chip 200 and the printed circuit board 300 are respectively arranged in the first installation cavity 111 and the second installation cavity 112. In order to ensure that the infrared detector chip 200 and the printed circuit board 300 can be electrically connected, refer to As shown in FIG. 1 , the heat sink 100 may be provided with a wiring hole 130 , and the wiring hole 130 may communicate with the first installation cavity 111 and the second installation cavity 112 . And the wiring hole 130 is located outside the edge of the infrared detector chip 200 , one end of the lead wire 400 is connected to the infrared detector chip 200 , and the other end of the lead wire 400 is connected to the printed circuit board 300 through the wiring hole 130 .

Further, there may be two wiring holes 130 , and the two wiring holes 130 may be distributed on both sides of the pins of the infrared detector chip 200 . In addition, the bottom wall of the first installation cavity 111 and the bottom wall of the second installation cavity 112 are respectively opposite sides of the base plate 180, and a positioning groove corresponding to the size of the infrared detector chip 200 can be provided on the base plate 180. The infrared detector chip 200 can be arranged in the positioning groove by means of gluing or the like, thereby preventing the infrared detector chip 200 from slipping and misaligning.

In an optional embodiment, the infrared detector module may further include a potting glue 500 , through which a plurality of leads 400 are potted with the potting glue 500 to protect the leads 400 .

In an optional embodiment, the printed circuit board 300 is provided with a temperature sensor 600 , and the temperature sensor 600 may be provided in the installation cavity 110 provided with the infrared detector chip 200 . In this way, the temperature sensor 600 can not only monitor the working environment temperature of the infrared detector chip 200 in real time, but also enable the heat sink 100 to protect the temperature sensor 600, so as to prevent the temperature sensor 600 from being scratched by external objects.

In the thickness direction of the infrared detector module, the infrared detector chip 200 can be lower than the end surface of the peripheral protection frame 140 , and the electronic devices on the printed circuit board 300 are all lower than the end surface of the peripheral protection frame 140 . In this way, during installation or use, if the infrared detector module rubs against an external object, the peripheral protection frame 140 will be scratched and worn first, so as to protect the electronic devices placed in the installation cavity 110 .

As shown in Figure 4 or Figure 6, the peripheral protection frame 140 can be provided with a mounting hole 150 and a positioning hole 160, and the infrared detector module can be connected with the electronic device through a connector passing through the mounting hole 150, and the positioning hole 160 is used for Cooperate with the positioning of the infrared detector module and the electronic equipment.

In an optional embodiment, the peripheral protection frame 140 can be a square frame structure, the installation holes 150 and the positioning holes 160 can be distributed at the four corners of the peripheral protection frame 140, and the connectors can be threaded connectors. A threaded hole for placing and fixing the infrared detector module is provided, and the threaded connector passes through the mounting hole 150 and is threadedly engaged with the threaded hole. Electronic equipment and infrared detector modules can be positioned through pin holes to improve assembly accuracy, thereby ensuring the quality of use of the infrared detector modules. Certainly, in the case that the electronic device and the heat sink 100 are positioned and matched by pin holes, the heat sink 100 can also be connected to the electronic device by adhesive.

The printed circuit board 300 is provided with a connector 320, and the printed circuit board 300 can be electrically connected with the electronic device through the connector 320. As shown in FIG. 170 is used for avoiding the connector 320, and the connector 320 is disposed in the second avoiding hole 170 to electrically connect the printed circuit board 300 with the electronic device.

Further, the printed circuit board 300 has a first side opposite to a second side, the first side is electrically connected to the infrared detector chip 200, and the second side is provided with electronic devices. In such a configuration, the heat generated by the infrared detector chip 200 has less influence on the rest of the electronic devices on the printed circuit board 300 , so that the rest of the electronic devices can be guaranteed to have a relatively stable temperature working environment. At the same time, the structure of the infrared detector module can be made compact, which is conducive to reducing the volume of the infrared detector module and realizing structural optimization.

The electronic device may include a gyroscope 700 and a power chip 800 disposed on the printed circuit board 300, the gyroscope 700 and the power chip 800 may be located in the installation cavity 110, and the installation cavity 110 can protect the gyroscope 700 and the power chip 800 , the gyroscope 700 can monitor the attitude of the infrared detector module, and the power supply chip 800 is used for power supply management of the infrared detector chip 200 .

In this embodiment, the infrared detector module further includes an infrared transmission part 900, the infrared transmission part 900 is opposite to the infrared detector chip 200, the infrared transmission part 900 is arranged in the installation cavity 110, and the infrared transmission part 900 is lower than The end surface of the heat sink 100 , in this way, the installation cavity 110 can protect the infrared transparent component 900 . The infrared transmission part 900 can not only ensure the detection performance of the infrared detector chip 200, but also play a dustproof role, and can ensure the use effect of the infrared detector module.

In an embodiment of the present disclosure, the infrared detector chip and the printed circuit board can be arranged on different sides of the heat sink, or on the same side of the heat sink, and the infrared detector chip and the printed circuit board are electrically connected. The infrared detector chip can include an infrared window layer, and by setting an infrared transparent member outside the infrared window layer on the infrared detector chip, dust particles can be prevented from falling on the infrared window layer on the infrared detector chip, which is beneficial to Reduce the sensitivity of the infrared detector chip to dust particles and improve the infrared thermal imaging quality of the infrared detector module. Furthermore, the infrared detector chip can be arranged in a closed space, which can also prevent dust particles from entering from the side of the infrared detector chip and falling on the infrared window layer. The infrared detector module provided by the embodiment of the present disclosure can detect the infrared light emitted by the detection object itself, and can be applied to an infrared thermal imaging device.

The heat dissipation element can dissipate heat generated when the infrared detector chip is in operation. The heat sink can also be called a heat sink or a heat sink. The heat sink can be made of metal materials such as aluminum or copper, or non-metal materials such as ceramic materials or silicon-based materials.

A heat sink is a structural form of a heat sink, which may be a structural part processed and formed from a metal material. The following uses a heat sink as a heat sink as an example to describe other embodiments of the present disclosure in detail.

7 is a cross-sectional view of an infrared detector module according to an embodiment of the present disclosure. Referring to FIG. 7 , the infrared detector module according to an embodiment of the present disclosure may include a heat sink 102 , an infrared detector chip 104 and a printed circuit board 106 .

The heat sink 102 can include a first mounting surface 1021 and a second mounting surface 1022, the infrared detector chip 104 is arranged on the first mounting surface 1021, the printed circuit board 106 is arranged on the second mounting surface 1022, and the infrared detector chip 104 It is electrically connected with the printed circuit board 106 . The first installation surface 1021 and the second installation surface 1022 are two opposite installation surfaces on the heat sink 102 .

The infrared detector chip 104 includes an infrared window layer 1041 , and an infrared transparent member 108 is arranged outside the infrared window layer 1041 ;

The focal plane 1042 of the infrared detector chip 104 is arranged with an array of photosensitive elements (ie, a pixel array). The infrared window layer 1041 is a package structure of the infrared detector chip 104 , and the infrared detector chip 104 is vacuum packaged through the infrared window layer 1041 . The infrared detector chip 104 with the infrared window layer 1041 may be a chip obtained by packaging the infrared detector chip 104 at the wafer level or at the pixel level. The infrared window layer 1041 can be a silicon wafer or a germanium wafer. Therefore, the infrared window layer 1041 can also be called a silicon window layer or a germanium window layer, and is referred to as a silicon window or a germanium window. The infrared detector chip 104 can be bonded on the first mounting surface 1021 of the heat sink 102 by thermally conductive glue (such as silica gel, etc.).

The infrared transparent member 108 can be a sheet or a plate made of infrared transparent material, which can not only transmit infrared light, but also block dust particles. The infrared transparent material is a material capable of transmitting infrared light (with a wavelength range of 1-14 μm). The infrared transparent material can be silicon, germanium, zinc sulfide, zinc selenide, etc. In this embodiment, the infrared transparent member 108 can be made of germanium, which can reduce the influence of the infrared transparent member 108 on the transmittance of infrared light.

The printed circuit board 106 may be provided with a socket for electrical connection with the outside. The printed circuit board 106 can be bonded on the second mounting surface 1022 by thermally conductive glue (such as silica gel, etc.), or can be fixed on the second mounting surface 1022 by fasteners such as screws.

The infrared detector chip 104 can be electrically connected to the printed circuit board 106 through metal wires. The infrared detector chip 104 and the printed circuit board 106 can be respectively provided with pads, and one end of the metal wire is welded together with the pads on the infrared detector chip 104, and the other end is welded with the pads on the printed circuit board 106. together.

9 and 10, on the heat sink 102, there is a hollow structure 1020 that runs through the first mounting surface 1021 and the second mounting surface 1022, so as to be used to electrically connect the infrared detector chip 104 and the metal of the printed circuit board 106. The wires pass through the first mounting surface 1021 and the second mounting surface 1022 .

In this embodiment, by setting the infrared transparent member 108 outside the infrared window layer 1041, particles can be prevented from falling on the infrared window layer 1041, which is conducive to reducing the sensitivity of the infrared detector chip 104 to particles and improving the infrared detector chip. 104 image quality. Even if particles fall on the outer surface of the infrared transmission part 108, due to the existence of the infrared transmission part 108, the distance from the external particles to the focal plane 1042 of the infrared detector chip 104 is raised, and the infrared detector chip 104 can also be reduced. Sensitivity to particles improves the imaging quality of the infrared detector chip 104 .

The heat sink 102 can include a side wall 1023 and a partition 1024 connected to the side wall 1023, the partition 1024 is located in the cavity surrounded by the side wall 1023, and the first installation surface 1021 and the second installation surface 1022 can be respectively arranged on the partition 1024 on both sides.

The side wall 1023 can provide protection for the infrared detector chip 104 on the first mounting surface 1021 and the printed circuit board 106 on the second mounting surface 1022, and can also increase the heat dissipation area, so that the heat sink 102 has Stronger cooling effect.

The side wall 1023 can also provide support for the arrangement of the infrared transparent element 108 . The infrared transparent element 108 can be supported by disposing the cover plate 114 on the side wall 1023 . 7 and 8, the side wall 1023 is provided with a cover plate 114, the cover plate 114 has a through hole 1141, the through hole 1141 corresponds to the infrared window layer 1041, and the infrared transparent member 108 is arranged on the cover plate 114 and covers Set at the through hole 1141. The infrared transparent member 108 is usually relatively thin and brittle, and the infrared transparent member 108 is supported by the cover plate 114 so that the area of the infrared transparent member 108 is relatively small, and it is not easy to be brittle during use.

Cover plate 114 can be sheet-like or plate-shaped, and cover plate 114 also can be made of metal material, as made by copper, aluminum or alloy material, and cover plate 114 itself also can be produced when infrared detector chip 104 works like this To dissipate heat.

The cover plate 114 can be fixed on the side wall 1023 by glue bonding, and can also be fixed on the side wall 1023 by screws and other fasteners. In one example, as shown in Figure 8, a counterbore is provided on the cover plate 114, a threaded hole is provided on the heat sink 102, and the counterbore corresponds to the threaded hole, and a screw 116 is provided in the counterbore, and the thread of the screw 116 The part passes through the counterbore and threadedly connects with the threaded hole.

In a possible implementation manner, the infrared transparent member 108 may be fixed on the cover plate 114 by glue bonding. During installation, the infrared transparent member 108 can be glued on the cover plate 114 first, and then the cover plate 114 can be fixed on the side wall 1023 .

The difference between the thermal expansion coefficient of the cover plate 114 and the thermal expansion coefficient of the infrared transparent member 108 can be within a preset range. In one embodiment, the thermal expansion coefficient of the cover plate 114 is consistent with the thermal expansion coefficient of the infrared transparent member 108 or They are approximately equal to avoid the infrared transparent member 108 being cracked during thermal expansion due to a large difference in thermal expansion coefficient between the two. In one example, the infrared transparent element 108 is made of germanium, and the cover plate 114 is made of Kovar.

To facilitate the positioning of the cover plate 114 , a step 1026 may be provided on the side wall 1023 , and the cover plate 114 is supported and fixed on the step 1026 . Support and circumferential positioning of the cover plate 114 is provided by the step 1026 . The step 1026 may be provided on the inner wall of the side wall 1023 , extending along the circumference of the side wall 1023 in a ring shape.

In other embodiments, the infrared transparent element 108 may also be directly supported by the side wall 1023 , that is, the above-mentioned cover plate 114 may not be provided between the side wall 1023 and the infrared transparent element 108 .

Referring to Fig. 8, a groove 1025 is provided on the first side of the partition 1024, and the infrared detector chip 104 can be arranged in the groove 1025, so that the height between the infrared detector chip 104 and the printed circuit board 106 can be reduced Poor, to facilitate the electrical connection between the two through metal wires. In addition, the groove 1025 can also realize the positioning function of the infrared detector chip 104 and increase the heat dissipation area.

After fixing the cover plate 114 with the infrared transparent member 108 fixed on the side wall 1023, there may be a predetermined gap between the inner surface of the infrared transparent member 108 and the outer surface of the infrared window layer 1041, such as greater than or equal to 1mm, less than or equal to A predetermined gap of 6mm is used to increase the distance between the outer surface of the infrared transparent member 108 and the focal plane 1042 of the infrared detector chip 104, which is more conducive to reducing the sensitivity of the infrared detector chip 104 to dust particles. Wherein, the outer surface of the infrared transparent member 108 is the side surface of the infrared transparent member 108 away from the infrared window layer 1041 .

In order to prevent external particles from entering the above-mentioned gap from the side of the infrared detector chip 104 and falling on the infrared window layer 1041, the infrared detector chip 104 can be arranged on the side wall surrounded by the side wall 1023 and the printed circuit board 106. In an enclosed space. Referring to FIG. 7 and FIG. 8 , a closed space can be formed by the side wall 1023 , the printed circuit board 106 , the cover plate 114 and the infrared transmission member 108 , and the infrared detector chip 104 is located in the closed space. In order to enhance the sealing performance, a sealant can be applied at the joint between the printed circuit board 106 and the side wall 1023 . In an example where the above-mentioned cover plate 114 is not provided between the side wall 1023 and the infrared transparent element 108 , a closed space can be formed by the side wall 1023 , the printed circuit board 106 and the infrared transparent element 108 .

In this embodiment, the first side surface of the printed circuit board 106 is fixed on the second mounting surface 1022 on the heat sink. A partial area of the first side of the printed circuit board 106 can be matched with the second installation surface 1022 on the heat sink and fixed on the second installation surface 1022 .

At least one electronic device is provided on the second side of the printed circuit board 106; in the at least one electronic device, at least part of at least one electronic device is located in the cavity surrounded by the side wall 1023, so as to pass The side wall provides protection and heat dissipation for the at least one electronic device. Wherein, the second side and the first side of the printed circuit board 106 are two opposite sides on the printed circuit board 106 .

In one example, in addition to being provided with at least one electronic device on the second side of the printed circuit board 106, at least one electronic device may also be provided on the first side of the printed circuit board; Among the electronic devices, at least part of at least one electronic device is located in the cavity surrounded by the side wall 1023 .

FIG. 11 is a cross-sectional view of an infrared detector module according to another embodiment of the present disclosure. Referring to FIG. 11 , the infrared detector module of this embodiment may include a heat sink 202, an infrared detector chip 204 and a printed circuit board 206; , the heat sink 202 includes a first mounting surface 2021 and a second mounting surface 2022, the infrared detector chip 204 is arranged on the first mounting surface 2021, the printed circuit board 206 is arranged on the second mounting surface 2022, and the infrared detector chip 204 It is electrically connected with the printed circuit board 206 . The first installation surface 2021 and the second installation surface 2022 are two installation surfaces facing the same direction on the heat sink 202. In other words, the first installation surface 2021 and the second installation surface 2022 are two installation surfaces on the same side of the heat sink 202. noodle.

The infrared detector chip 204 includes an infrared window layer 2041 , and an infrared transparent member is arranged outside the infrared window layer 2041 ; The structure and working principle of the infrared detector chip 204 are basically the same as those of the infrared detector chip 104 in the embodiment shown in FIG. 7 .

By being provided with an infrared transparent member 208 outside the infrared window layer 2041, particles can be prevented from falling on the infrared window layer 2041, which is conducive to reducing the sensitivity of the infrared detector chip 204 to particles and improving the imaging quality of the infrared detector chip 204 . Even if particles fall on the outer surface of the infrared transmission part 208, due to the existence of the infrared transmission part 208, the distance from the external particles to the focal plane 1042 of the infrared detector chip 204 is raised, and the infrared detector chip 204 can also be reduced. Sensitivity to particles improves the imaging quality of the infrared detector chip 204 .

The printed circuit board 206 is a circuit board on which components are mounted, and may be called a PCBA (Printed Circuit Board Assembly). The printed circuit board 206 may be provided with a socket for electrical connection with the outside. The printed circuit board 206 can be bonded on the second mounting surface 2022 by thermally conductive glue (such as silica gel, etc.), or can be fixed on the second mounting surface 2022 by fasteners such as screws.

The printed circuit board 206 is provided with an avoidance hole 2061, and the infrared detector chip 204 is arranged on the separator 2024 at the position of the avoidance hole 2061, and is electrically connected to the printed circuit board 206 through a metal wire. The escape hole 2061 may be a preset through hole at the center of the printed circuit board 206 . The infrared detector chip 204 and the printed circuit board 206 can be respectively provided with pads, and one end of the metal wire is welded together with the pads on the infrared detector chip 204, and the other end is welded with the pads on the printed circuit board 206. together.

The heat sink 202 may include a side wall 2023 and a partition 2024 connected to the side wall 2023, the partition 2024 is located in the cavity surrounded by the side wall 2023, and the first installation surface 2021 and the second installation surface 2022 are arranged on same side.

The partition 2024 has a raised platform 2025 protruding from the escape hole 2061 , the top surface of the raised platform 2025 forms the first installation surface 2021 , and the infrared detector chip 204 is disposed on the raised platform 2025 . Compared with other parts of the partition plate 2024, the boss 2025 has a larger thickness, which is convenient for processing the top surface of the boss 2025 to improve the flatness of the top surface of the boss 2025 (ie, the first mounting surface 2021), thereby facilitating The flatness of the focal plane of the infrared detector chip 204 is controlled. The height difference between the infrared detector chip 204 and the printed circuit board 206 can also be controlled by controlling the height of the boss 2025 . In this embodiment, the escape hole 2061 on the printed circuit board 206 can be used to avoid the boss 2025 . In other embodiments, the above-mentioned boss 2025 may not be provided on the partition 2024 , and the infrared detector chip 204 may be directly provided in the escape hole 2061 . The above-mentioned escape hole 2061 may not be set on the printed circuit board 206, and the infrared detector chip 204 and the printed circuit board 206 may be arranged in parallel, that is, the infrared detector chip 204 is arranged outside the printed circuit board 206 and located on the printed circuit board. 206 side.

The partition 2024 may be provided with a hollow structure, and the plug connector 2062 on the printed circuit board 206 for electrical connection with the outside may pass through the hole of the hollow structure so as to be connected with an external cable.

The side wall 2023 can provide protection for the infrared detector chip 204 on the first mounting surface 2021 and the printed circuit board 206 on the second mounting surface 2022, and can also increase the heat dissipation area and improve the performance of the infrared detector. The heat dissipation effect of the module.

The side wall 2023 can also provide support for the arrangement of the infrared transparent element 208 . The infrared transparent element 208 can be supported by setting a cover plate on the side wall 2023 . Referring to Fig. 11, the side wall 2023 is provided with a cover plate 214, and the cover plate 214 has a through hole 2141 corresponding to the infrared window layer 2041. at the hole. The infrared transparent member 208 is generally relatively thin and brittle, and the infrared transparent member 208 is supported by the cover plate 214 so that the area of the infrared transparent member 208 is relatively small, and it is not easy to be brittle during use.

The cover plate 214 can also be made of metal materials, such as copper, aluminum or alloy materials, so that the cover plate 214 itself can also dissipate heat generated by the infrared detector chip 204 during operation.

The cover plate 214 can be fixed on the side wall 2023 by glue bonding, and can also be fixed on the side wall 2023 by fasteners such as screws. The infrared transparent element 208 can be fixed on the cover plate 214 by glue bonding. During installation, the infrared transparent member 208 can be glued on the cover plate 214 first, and then the cover plate 214 can be fixed on the side wall 2023 .

The difference between the thermal expansion coefficient of the cover plate 214 and the thermal expansion coefficient of the infrared transparent member 208 may be within a preset range. In one embodiment, the thermal expansion coefficient of the cover plate 214 is consistent with the thermal expansion coefficient of the infrared transparent member 208 or They are roughly equal to avoid the infrared transparent member 208 being broken due to the large difference in thermal expansion coefficient between the two during thermal expansion. In one example, the infrared transparent element 208 is made of germanium material, and the cover plate 214 is made of alloy material.

The cover plate 214 is directly covered on the top of the side wall 2023 . In other embodiments, in order to facilitate the positioning of the cover plate 214, a step may be provided on the side wall 2023, and the cover plate 214 is supported and fixed on the step.

In other embodiments, the infrared transparent element 208 may also be directly supported by the side wall 2023 , that is, the above-mentioned cover plate 214 may not be provided between the side wall 2023 and the infrared transparent element 208 .

After fixing the cover plate 214 with the infrared transparent member 208 fixed on the side wall 2023, there may be a predetermined gap between the inner surface of the infrared transparent member 208 and the outer surface of the infrared window layer 2041, such as greater than or equal to 1mm, less than or equal to A predetermined gap of 6mm is used to increase the distance between the outer surface of the infrared transparent member 208 and the focal plane 1042 of the infrared detector chip 204, which is more conducive to reducing the sensitivity of the infrared detector chip 204 to dust particles. Wherein, the outer surface of the infrared transparent member 208 is the side surface of the infrared transparent member 208 away from the infrared window layer 2041 .

In order to prevent external particles from entering the above-mentioned gap from the side of the infrared detector chip 204 and thus falling on the infrared window layer 2041, the infrared detector chip 204 can be arranged on a wall surrounded by the side wall 2023 and the printed circuit board 206, etc. In an enclosed space. Referring to FIG. 11 , a closed space can be formed by the side wall 2023 , the printed circuit board 206 , the cover plate 214 and the infrared transmission member 208 , and the infrared detector chip 204 is located in the closed space. In order to enhance the sealing performance, a sealant can be applied at the contact connection between the printed circuit board 206 and the side wall 2023 . In an example where the cover plate 214 is not provided between the side wall 2023 and the infrared transparent element 208 , a closed space can be formed by the side wall 2023 , the printed circuit board 206 and the infrared transparent element 208 .

In this embodiment, the first side surface of the printed circuit board 206 is fixed on the second mounting surface 2022 on the heat sink. A partial area of the first side of the printed circuit board 206 can be matched with the second mounting surface 2022 on the heat sink and fixed (such as by glue bonding, etc.) on the second mounting surface 2022 .

At least one electronic device is provided on the first side of the printed circuit board 206; in the at least one electronic device, at least part of at least one electronic device is located in the cavity surrounded by the side wall 2023, so as to pass The side wall 2023 provides protection and heat dissipation for the at least one electronic device. For example, a part of the connector 2062 on the printed circuit board 206 shown in FIG. 11 is located in the cavity surrounded by the side wall 2023 .

In one example, in addition to being provided with at least one electronic device on the first side of the printed circuit board 206, at least one electronic device may also be provided on the second side of the printed circuit board; Among the electronic devices, at least part of at least one electronic device is located in the cavity surrounded by the side wall.

Wherein, the second side and the first side of the printed circuit board 206 are two opposite sides on the printed circuit board 206 .

An embodiment of the present disclosure also provides an infrared thermal imaging device, which includes the infrared detector module of any one of the foregoing embodiments.

It should be noted that, in this document, the term "comprising", "comprising" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article or apparatus comprising a set of elements includes not only those elements, It also includes other elements not expressly listed, or elements inherent in the process, method, article, or device. Without further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of additional identical elements in the process, method, article, or apparatus comprising that element. In addition, it should be noted that the scope of the methods and apparatus in the disclosed embodiments is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order depending on the functions involved. Functions are performed, for example, the described methods may be performed in an order different from that described, and various steps may also be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

The above is only a specific implementation of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Anyone skilled in the art can easily think of changes or substitutions within the technical scope of the present disclosure. should fall within the protection scope of the present disclosure.

Claims

An infrared detector module, comprising a heat sink (100), an infrared detector chip (200) and a printed circuit board (300); wherein:

The heat sink (100) is provided with an installation cavity (110), and the infrared detector chip (200) and the printed circuit board (300) are both arranged in the installation cavity (110);

The infrared detector chip (200) is attached to the heat sink (100), and the infrared detector chip (200) is stacked with the printed circuit board (300);

The infrared detector chip (200) is electrically connected with the printed circuit board (300).
The infrared detector module according to claim 1, wherein the printed circuit board (300) is arranged on the bottom wall of the installation cavity (110), and the bottom wall of the installation cavity (110) has a boss (120);

The printed circuit board (300) is provided with a first avoidance hole (310), the first avoidance hole (310) is used to avoid the boss (120), and the infrared detector chip (200) is pasted on the boss (120).
The infrared detector module according to claim 1, wherein the heat sink (100) has a first surface and a second surface opposite to each other,

The installation cavity (110) includes a first installation cavity (111) opened on the first surface and a second installation cavity (112) opened on the second surface, and the heat sink (100) is provided with wiring hole (130), the wiring hole (130) communicates with the first installation cavity (111) and the second installation cavity (112), and the wiring hole (130) is located in the infrared detector chip (200 ) outside the edge of the region, for connecting the infrared detector chip (200) and the lead wire (400) of the printed circuit board (300) through the wiring hole (130);

The infrared detector chip (200) is arranged in the first installation cavity (111) and attached to the bottom wall of the first installation cavity (111), and the printed circuit board (300) It is arranged in the second installation cavity (112).
The infrared detector module according to claim 3, wherein the infrared detector module further comprises potting glue (500), and the infrared detector chip (200) is connected to the The printed circuit board (300) is electrically connected, and the potting glue (500) is used for potting the lead (400).
The infrared detector module according to claim 1, wherein the printed circuit board (300) is provided with a temperature sensor (600), and the temperature sensor (600) is used to monitor the infrared detector chip (200 ) working environment temperature.
The infrared detector module according to claim 2, wherein the heat sink (100) comprises a base plate (180) and a peripheral protection frame (140), and the base plate (180) is connected to the peripheral protection frame (140) ), and construct the installation cavity (110) between the two, the bottom plate (180) has an inner surface, the inner surface faces the installation cavity (110), and the inner surface is provided with The boss (120).
The infrared detector module according to claim 6, wherein, along the thickness direction of the infrared detector module, the infrared detector chip (200) is lower than the end face of the peripheral protective frame (140), and The electronic devices on the printed circuit board (300) are all lower than the end face of the peripheral protection frame (140).
The infrared detector module according to claim 7, wherein the printed circuit board (300) has a first side and a second side opposite to each other, and the first side is connected to the infrared detector chip (200) ) are electrically connected, and the second side is provided with the electronic device.
The infrared detector module according to claim 1, wherein the infrared detector module further comprises an infrared transmission member (900), and the infrared transmission member (900) is connected to the infrared detector chip (200 ) in contrast, the infrared transparent member (900) is arranged in the installation cavity (110), and the infrared transparent member (900) is lower than the end surface of the heat dissipation member (100).
The infrared detector module according to claim 1, wherein,

The installation cavity includes a first installation surface (1021), and the infrared detector chip (104) is arranged on the first installation surface (1021);

The infrared detector chip (104) includes an infrared window layer (1041), and an infrared transparent member (108) is arranged on the outside of the infrared window layer (1041); wherein, the outside of the infrared window layer (1041) is the side of the infrared window layer (1041) away from the infrared detector chip (104).
According to the infrared detector module according to claim 10, the installation cavity further includes a second installation surface (1022), and the printed circuit board (106) is arranged on the second installation surface (1022); wherein ,

The first installation surface (1021) and the second installation surface (1022) are two opposite installation surfaces on the heat sink (102); or,

The first installation surface (1021) and the second installation surface (1022) are installation surfaces on the same side of the heat sink (102).
The infrared detector module according to claim 11, wherein the heat sink (102) comprises a side wall (1023) and a partition (1024) connected to the side wall (1023);

The first installation surface (1021) and the second installation surface (1022) are arranged on the partition (1024).
The infrared detector module according to claim 12, wherein the infrared detector chip (104) is located in the cavity surrounded by the side wall (1023), and the infrared transparent member (108) is supported on on the side wall (1023).
The infrared detector module according to claim 10 or 11, wherein the heat dissipation element (102), the printed circuit board (106), and the infrared transmission element (108) form a closed space , the infrared detector chip (104) is located in the enclosed space.
The infrared detector module according to claim 13, wherein, the side wall (1023) is provided with a cover plate (114), and the cover plate (114) has a through hole (1141), and the through hole (1141) corresponds to the infrared window layer (1041), and the infrared transparent member (108) is arranged on the cover plate (114) and covers the through hole (1141).
The infrared detector module according to claim 15, wherein the heat dissipation element (102), the printed circuit board (106), the cover plate (114) and the infrared transmission element (108) A closed space is enclosed, and the infrared detector chip (104) is located in the closed space.
The infrared detector module according to claim 15 or 16, wherein a step (1026) is provided on the side wall (1023), and the cover plate (114) is supported and fixed on the step (1026) .
The infrared detector module according to claim 12, wherein the infrared detector chip (104) is arranged on the first side of the partition (1024), and the printed circuit board (106) is arranged on On the second side of the partition (1024), the first side and the second side are two opposite sides of the partition (1024);

A groove (1025) is provided on the first side of the partition (1024), and the infrared detector chip (104) is arranged in the groove (1025).
The infrared detector module according to claim 12, wherein the infrared detector chip (204) and the printed circuit board (206) are arranged on the same side of the partition (2024);

An avoidance hole (2061) is provided on the printed circuit board, and the infrared detector chip (204) is arranged on the partition (2024) and located at the position of the avoidance hole (2061); or,

The infrared detector chip (204) is arranged on one side of the printed circuit board (206).
The infrared detector module according to claim 19, wherein, on the partition (2024), there is a boss (2025) at a position corresponding to the avoidance hole (2061), and the infrared detector chip (204) is arranged on the boss (2025).
An infrared thermal imaging device, comprising the infrared detector module according to any one of claims 1-20.