WO2023035933A1 - Module détecteur infrarouge et dispositif d'imagerie thermique infrarouge - Google Patents
Module détecteur infrarouge et dispositif d'imagerie thermique infrarouge Download PDFInfo
- Publication number
- WO2023035933A1 WO2023035933A1 PCT/CN2022/114223 CN2022114223W WO2023035933A1 WO 2023035933 A1 WO2023035933 A1 WO 2023035933A1 CN 2022114223 W CN2022114223 W CN 2022114223W WO 2023035933 A1 WO2023035933 A1 WO 2023035933A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- infrared detector
- infrared
- circuit board
- printed circuit
- detector chip
- Prior art date
Links
- 238000001931 thermography Methods 0.000 title claims abstract description 8
- 230000017525 heat dissipation Effects 0.000 claims abstract description 27
- 230000002093 peripheral effect Effects 0.000 claims abstract description 19
- 238000009434 installation Methods 0.000 claims description 103
- 238000005192 partition Methods 0.000 claims description 19
- 230000005540 biological transmission Effects 0.000 claims description 15
- 239000003292 glue Substances 0.000 claims description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 238000004382 potting Methods 0.000 claims description 5
- 230000001681 protective effect Effects 0.000 claims description 4
- 239000002245 particle Substances 0.000 description 18
- 230000000694 effects Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 238000004026 adhesive bonding Methods 0.000 description 7
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 230000035945 sensitivity Effects 0.000 description 7
- 239000000428 dust Substances 0.000 description 6
- 229910052732 germanium Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000007769 metal material Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- PFNQVRZLDWYSCW-UHFFFAOYSA-N (fluoren-9-ylideneamino) n-naphthalen-1-ylcarbamate Chemical compound C12=CC=CC=C2C2=CC=CC=C2C1=NOC(=O)NC1=CC=CC2=CC=CC=C12 PFNQVRZLDWYSCW-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
La présente invention concerne un module détecteur infrarouge et un dispositif d'imagerie thermique infrarouge. Le module détecteur infrarouge comprend un élément de dissipation de chaleur (100), une puce de détecteur infrarouge (200) et une carte de circuit imprimé (300). L'élément de dissipation de chaleur (100) est pourvu d'une cavité de montage (110). La puce de détecteur infrarouge (200) et la carte de circuit imprimé (300) sont toutes deux disposées dans la cavité de montage (110). La puce de détecteur infrarouge (200) est montée sur l'élément de dissipation de chaleur (100). La puce de détecteur infrarouge (200) et la carte de circuit imprimé (300) sont empilées, et la carte de circuit imprimé (300) comprend une zone périphérique située au niveau du bord externe de la puce de détecteur infrarouge (200). La puce de détecteur infrarouge (200) est électriquement connectée à la zone périphérique de la carte de circuit imprimé (300).
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122180634.8 | 2021-09-09 | ||
| CN202122180634.8U CN215683092U (zh) | 2021-09-09 | 2021-09-09 | 一种红外探测器模组 |
| CN202123289872.9U CN216899259U (zh) | 2021-12-24 | 2021-12-24 | 一种红外探测器模组及红外热成像装置 |
| CN202123289872.9 | 2021-12-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2023035933A1 true WO2023035933A1 (fr) | 2023-03-16 |
Family
ID=85506102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2022/114223 WO2023035933A1 (fr) | 2021-09-09 | 2022-08-23 | Module détecteur infrarouge et dispositif d'imagerie thermique infrarouge |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2023035933A1 (fr) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105280586A (zh) * | 2015-11-16 | 2016-01-27 | 长春乙天科技有限公司 | 非制冷型红外机芯散热装置及散热方法 |
| CN205958116U (zh) * | 2016-08-26 | 2017-02-15 | 湖北久之洋红外系统股份有限公司 | 一种非制冷红外探测器机电结构 |
| CN210602986U (zh) * | 2019-09-24 | 2020-05-22 | 成都鼎屹信息技术有限公司 | 一种非制冷型红外枪瞄机芯组件的导热结构 |
| CN113566978A (zh) * | 2021-07-23 | 2021-10-29 | 杭州微影软件有限公司 | 一种红外热成像快门及红外热成像装置 |
| CN216899259U (zh) * | 2021-12-24 | 2022-07-05 | 杭州海康微影传感科技有限公司 | 一种红外探测器模组及红外热成像装置 |
-
2022
- 2022-08-23 WO PCT/CN2022/114223 patent/WO2023035933A1/fr unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105280586A (zh) * | 2015-11-16 | 2016-01-27 | 长春乙天科技有限公司 | 非制冷型红外机芯散热装置及散热方法 |
| CN205958116U (zh) * | 2016-08-26 | 2017-02-15 | 湖北久之洋红外系统股份有限公司 | 一种非制冷红外探测器机电结构 |
| CN210602986U (zh) * | 2019-09-24 | 2020-05-22 | 成都鼎屹信息技术有限公司 | 一种非制冷型红外枪瞄机芯组件的导热结构 |
| CN113566978A (zh) * | 2021-07-23 | 2021-10-29 | 杭州微影软件有限公司 | 一种红外热成像快门及红外热成像装置 |
| CN216899259U (zh) * | 2021-12-24 | 2022-07-05 | 杭州海康微影传感科技有限公司 | 一种红外探测器模组及红外热成像装置 |
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