CN105280586A - Uncooled infrared movement cooling apparatus and method - Google Patents
Uncooled infrared movement cooling apparatus and method Download PDFInfo
- Publication number
- CN105280586A CN105280586A CN201510782969.3A CN201510782969A CN105280586A CN 105280586 A CN105280586 A CN 105280586A CN 201510782969 A CN201510782969 A CN 201510782969A CN 105280586 A CN105280586 A CN 105280586A
- Authority
- CN
- China
- Prior art keywords
- infrared
- refrigeration type
- printed circuit
- circuit board
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides an uncooled infrared movement cooling apparatus and method, and belongs to the uncooled infrared imaging field and can solve the problem for cooling an existing uncooled infrared movement. The cooling method comprises: designing two heat sink structures which are suitable for cooling an uncooled infrared detector, and providing a cooling path for the infrared detector; setting a printed circuit board cooling mode based on a heat conduction hole array and a heat conduction aluminium layer, and providing a cooling path for heating power components; and providing a multi-temperature-spot thermoelectric cooler (TEC) control method to realize low-power consumption and stable working within the wide temperature difference range. The cooling method can cool the infrared detector and heating power components in the uncooled infrared movement, and at the same time can enable the uncooled infrared movement to work stably within the wide temperature difference range, and can improve the imaging quality of the infrared movement and can prolong the service life of the infrared movement.
Description
Technical field
The invention belongs to non-refrigeration type infrared imagery technique field, be specifically related to the infrared movement heat abstractor of a kind of non-refrigeration type and heat dissipating method.
Background technology
Infrared movement is just towards the future development such as miniaturized, round-the-clock, remote, high definition, high-performance, low-power consumption, infrared movement is divided into refrigeration mode and the infrared movement of non-refrigeration type, the infrared movement of non-refrigeration type due to volume and power consumption less, be widely used gradually, but the infrared movement of non-refrigeration type also also exists a lot of shortcoming.
The infrared movement limited space of non-refrigeration type, circuit board size is less, just very limited concerning space components' placement.Current components and parts are tending towards characteristic that is miniaturized, highly integrated, high frequency, and its heat density obviously strengthens.Traditional non-refrigeration type infrared machine core inner mainly comprises non-refrigeration type Infrared Detectors 6, non-refrigeration type Infrared Detectors drive circuit, temperature controller, power supply chip and other discrete chip; Non-refrigeration type Infrared Detectors 6 mainly comprises infrared temperature sensor, infrared temp. control chip 9, infrared power supply chip 10 and TEC thermoelectric refrigerating unit, and outside mainly comprises non-refrigeration type infrared detector package and mechanical erection face 7 etc.; Non-refrigeration type Infrared Detectors drive circuit mainly comprises the heating power such as temperature-control circuit, infrared power circuit components and parts, the sinking path of high heating power components and parts is the surface air heat radiations towards periphery by components and parts, but it is very inadequate for only leaning on very little surface area to dispel the heat.Take stability and the reliability of effective cooling measure guarantee circuit.The object of heat radiation is when components and parts temperature exceedes Reliability Assurance temperature, takes suitable heat radiation countermeasure, temperature is reduced within the scope of reliability Work.
Non-refrigeration type Infrared Detectors 6 is integrated with TEC thermoelectric refrigerating unit in shell inside, are accessed in the TEC control loop of Infrared Detectors outside together with the temperature signal that itself and Infrared Detectors internal temperature sensor are exported, the refrigeration to non-refrigeration type Infrared Detectors 6 or heating can be realized, non-refrigeration type Infrared Detectors 6 is made to maintain on a stable temperature spot, but at background ambient temperature with when selecting temperature deviation larger, the power consumption of infrared movement will be increased, produce a large amount of heats, reduce the overall performance of the infrared movement of non-refrigeration type.
Summary of the invention
In order to solve prior art Problems existing, the present invention is according to the function of each part in the infrared movement of non-refrigeration type and temperature characterisitic, a kind of infrared movement heat abstractor of non-refrigeration type and heat dissipating method are reliably proposed, improve Iimaging Stability and the reliability of the infrared movement of non-refrigeration type, thus ensure the image quality of the infrared movement of non-refrigeration type.When the infrared movement of non-refrigeration type exceedes Reliability Assurance temperature, take suitable heat radiation countermeasure, temperature is reduced within the scope of reliability Work.
The technical scheme that the present invention adopts for technical solution problem is as follows:
The infrared movement heat abstractor of non-refrigeration type of the present invention, comprising:
Be designed to the printed circuit board of sandwich construction, on a printed circuit board, the infrared temp. control chip of non-refrigeration type Infrared Detectors inside and infrared power supply chip are welded on top layer and the bottom of printed circuit board to the welding of non-refrigeration type Infrared Detectors respectively;
The first heat sink structure be connected with the bottom shell of non-refrigeration type Infrared Detectors, described first heat sink structure is connected with the infrared movement housing of non-refrigeration type;
The second heat sink structure be connected with the mechanical erection face of non-refrigeration type Infrared Detectors both sides, described second heat sink structure respectively movement housing infrared with non-refrigeration type is connected with the first heat sink structure;
Arrange on a printed circuit board and regularly arranged multiple thermal hole arrays, multiple thermal hole array is all positioned at immediately below infrared temp. control chip and infrared power supply chip;
Be arranged on the heat conduction aluminium lamination of printed circuit intralamellar part, described thermal hole array is penetrated into heat conduction aluminium lamination from printed circuit board surface, and the part that described heat conduction aluminium lamination stretches out printed circuit board two ends is crimped onto on the second heat sink structure.
Further, described first heat sink structure and the second heat sink structure all select thermal resistance lower than the heat conduction aluminium block of 4K/W.
Further, described first heat sink structure is of a size of 15mm × 10mm, and described second heat sink structure is of a size of 23.5mm × 3.5mm.
Further, described printed circuit board is 10 Rotating fields: between the layers 2 and 3 of printed circuit board, arrange heat conduction aluminium lamination, also arranges heat conduction aluminium lamination between the 8th layer and the 9th layer of printed circuit board simultaneously.
Further, described printed circuit intralamellar part is also provided with thick line, Copper Foil or thin plate.
Present invention also offers the infrared movement heat dissipating method of a kind of non-refrigeration type, the method comprises the following steps:
Step one, non-refrigeration type Infrared Detectors is welded on independent printed circuit board, described printed circuit board is arranged to sandwich construction, and the infrared temp. control chip of non-refrigeration type Infrared Detectors and infrared power supply chip are welded on top layer and the bottom of printed circuit board respectively;
Step 2, design two are applicable to the heat sink structure of non-refrigeration type Infrared Detectors heat radiation, be respectively the first heat sink structure and the second heat sink structure, the bottom shell of non-refrigeration type Infrared Detectors is fixed on the first heat sink structure center, the first heat sink structure is connected with the infrared movement housing of non-refrigeration type;
Step 3, to add load onto the second heat sink structure in the mechanical erection face of non-refrigeration type Infrared Detectors both sides, the second heat sink structure respectively movement housing infrared with the first heat sink structure and non-refrigeration type is connected; By arranging the first heat sink structure and the second heat sink structure dispels the heat to help non-refrigeration type Infrared Detectors, reduce non-refrigeration type Infrared Detectors power consumption;
Step 4, arrange the thermal hole array of multiple regular array on a printed circuit board, multiple thermal hole array is positioned at immediately below infrared temp. control chip and infrared power supply chip;
Step 5, arrange multiple heat conduction aluminium lamination at printed circuit intralamellar part, described thermal hole array is penetrated into heat conduction aluminium lamination from printed circuit board surface, and the part that described heat conduction aluminium lamination stretches out printed circuit board two ends is crimped onto on the second heat sink structure; By designing the radiating mode based on thermal hole array and heat conduction aluminium lamination, providing the heat dissipation path of heating power components and parts, improving radiating efficiency;
Step 6, design many temperature spots TEC thermoelectric refrigerating unit control mode
TEC thermoelectric refrigerating unit is integrated with in non-refrigeration type infrared detector package inside, the temperature signal that the infrared temperature sensor of itself and non-refrigeration type Infrared Detectors inside exports is accessed in the TEC control loop of non-refrigeration type Infrared Detectors outside jointly, realize the refrigeration of non-refrigeration type Infrared Detectors or heating, non-refrigeration type Infrared Detectors is maintained on a stable temperature spot.
The invention has the beneficial effects as follows:
1, present invention employs the heat sink structure of non-refrigeration type Infrared Detectors, the efficiently radiates heat path of Infrared Detectors is provided, reduces the working temperature of non-refrigeration type Infrared Detectors.
2, the present invention additionally uses the printed circuit board radiating mode based on thermal hole array and heat conduction aluminium lamination, provides the heat dissipation path of heating power components and parts.
3, many temperature spots thermoelectric refrigerating unit (TEC) control method of the present invention's proposition, achieve low-power consumption in wide temperature range, steady operation, this non-refrigeration type infrared movement heat dissipating method improves stability and the reliability of the infrared movement temperature of non-refrigeration type, drastically increases the image quality of the infrared movement of non-refrigeration type.
Accompanying drawing explanation
Fig. 1 is the position annexation schematic diagram between printed circuit board, heat sink structure and non-refrigeration type Infrared Detectors in the present invention, the infrared movement housing of non-refrigeration type.
Fig. 2 is the thermal hole array that adopts in the present invention and heat conduction aluminium lamination sinking path schematic diagram.
Fig. 3 is single temperature spot TEC power consumption profile (T=30 DEG C).
Fig. 4 is many temperature spots TEC power consumption profile (T=-10 DEG C, 10 DEG C, 30 DEG C, 50 DEG C).
In figure: 1, printed circuit board, the 2, first heat sink structure, the 3, second heat sink structure, 4, thermal hole array, 5, heat conduction aluminium lamination, 6, non-refrigeration type Infrared Detectors, 7, mechanical erection face, 8, the infrared movement housing of non-refrigeration type, 9, infrared temp. control chip, 10, infrared power supply chip.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in further detail.
As depicted in figs. 1 and 2, the infrared movement heat abstractor of non-refrigeration type of the present invention, mainly comprises: printed circuit board 1, first heat sink structure 2, second heat sink structure 3, multiple thermal hole array 4, multiple heat conduction aluminium lamination 5.
Non-refrigeration type Infrared Detectors 6 belongs to temperature sensor, and the change of its temperature directly affects the image quality of non-refrigeration type Infrared Detectors 6, therefore, must carry out heat dissipation design to non-refrigeration type Infrared Detectors 6 shell.As shown in Figure 1, the heat sink structure that two are suitable for non-refrigeration type Infrared Detectors 6 is designed.Non-refrigeration type Infrared Detectors 6 needs away from heating element, and be usually welded on independent printed circuit board 1, printed circuit board 1 is arranged to sandwich construction.The bottom shell of non-refrigeration type Infrared Detectors 6 is fixed on the first heat sink structure 2 center, and the first heat sink structure 2 is connected with the infrared movement housing 8 of non-refrigeration type, and the first heat sink structure 2 is of a size of 15mm × 10mm.Add in the mechanical erection face 7 of non-refrigeration type Infrared Detectors 6 both sides and load onto the second heat sink structure 3, second heat sink structure 3 is of a size of 23.5mm × 3.5mm, second heat sink structure 3 is connected with the first heat sink structure 2, second heat sink structure 3 also movement housing 8 infrared with non-refrigeration type is connected, and the mechanical erection face 7 of non-refrigeration type Infrared Detectors 6 is of a size of 23.5mm × 3.5mm.By arranging the first heat sink structure 2 and the second heat sink structure 3 dispels the heat to help non-refrigeration type Infrared Detectors 6, reduce the power consumption of non-refrigeration type Infrared Detectors 6, meanwhile, around the top of non-refrigeration type Infrared Detectors 6, enough spaces should be left, be conducive to the flowing of heat radiation gas.
As shown in Figure 2, two infrared temp. control chips 9 of non-refrigeration type Infrared Detectors 6 and two infrared power supply chips 10 are arranged on top layer and the bottom of printed circuit board 1 respectively, be the 1st layer of outside that 10 layers: two infrared temp. control chips 9 are placed on printed circuit board 1 for printed circuit board 1, two infrared power supply chips 10 are placed on the 10th layer of outside of printed circuit board 1; Printed circuit board 1 arranges the thermal hole array 4 of a large amount of rule, and these thermal hole arrays 4 are positioned at immediately below infrared temp. control chip 9 and infrared power supply chip 10; In the inside of printed circuit board 1, multiple heat conduction aluminium lamination 5 is set, it is 10 layers for printed circuit board 1: between the layers 2 and 3 of printed circuit board 1, be provided with one piece of heat conduction aluminium lamination 5, between the 8th layer and the 9th layer of printed circuit board 1, be also provided with one piece of heat conduction aluminium lamination 5, or arrange between other interlayers; Thermal hole array 4 is penetrated into heat conduction aluminium lamination 5 from printed circuit board 1 surface; Heat conduction aluminium lamination 5 is crimped onto second heat sink structure 3 at printed circuit board 1 two ends.
The drive circuit of non-refrigeration type Infrared Detectors 6 comprises the heating power such as temperature-control circuit, infrared power circuit components and parts, the sinking path of heating power components and parts is the surface air heat radiations towards periphery by components and parts, but it is very inadequate for only leaning on very little surface area to dispel the heat.Adopt heat dissipation path that thermal hole array 4 and heat conduction aluminium lamination 5 carry out dispelling the heat as shown in Figure 2, on printed circuit board 1, immediately below infrared temp. control chip 10 and infrared power supply chip 11, a large amount of regular thermal hole array 4 is set, be equivalent to thin copper conductor tube one by one and be penetrated into heat conduction aluminium lamination 5 along printed circuit board 1 thickness direction from surface, the heat conduction of heating power components and parts top layer on printed circuit board 1 can be made like this to heat conduction aluminium lamination 5, heat conduction aluminium lamination 5 transfers heat to second heat sink structure 3 at printed circuit board 1 two ends, second heat sink structure 3 contacts with the infrared movement housing 8 of non-refrigeration type, such heat just can be transmitted to the infrared movement housing 8 of non-refrigeration type smoothly.Meanwhile, also comprise other heat dissipating method when printed circuit board 1 designs, such as adopt thick line, thick Copper Foil, thin plate, multilayer, large area to spread copper etc.Printed circuit board 1 radiating mode based on thermal hole array 4 and heat conduction aluminium lamination 5 is set, the heat dissipation path of heating power components and parts is provided, improve radiating efficiency.
The infrared movement heat dissipating method of a kind of non-refrigeration type of the present invention, mainly realize based on above heat abstractor, the method comprises the following steps:
Step one, design two are conducive to the heat sink structure that non-refrigeration type Infrared Detectors 6 dispels the heat
As shown in Figure 1, two heat sink structures are respectively the first heat sink structure 2 and the second heat sink structure 3, non-refrigeration type Infrared Detectors 6 is welded on independent printed circuit board 1, the bottom shell of non-refrigeration type Infrared Detectors 6 is fixed on the first heat sink structure 2 center, first heat sink structure 2 is connected with the infrared movement housing 8 of non-refrigeration type, and the first heat sink structure 2 is of a size of 15mm × 10mm.Add in the mechanical erection face 7 of non-refrigeration type Infrared Detectors 6 both sides and load onto the second heat sink structure 3, second heat sink structure 3 is connected with the first heat sink structure 2, second heat sink structure 3 also movement housing 8 infrared with non-refrigeration type is connected, and the second heat sink structure 3 is of a size of 23.5mm × 3.5mm.By arranging the first heat sink structure 2 and the second heat sink structure 3 dispels the heat to help non-refrigeration type Infrared Detectors 6, reduce the power consumption of non-refrigeration type Infrared Detectors 6, meanwhile, around the top of non-refrigeration type Infrared Detectors 6, enough spaces should be left, be conducive to the flowing of heat radiation gas.
Step 2, design radiating mode based on thermal hole array 4 and heat conduction aluminium lamination 5
As shown in Figure 2, printed circuit board 1 is arranged to sandwich construction, two infrared temp. control chips 9 of non-refrigeration type Infrared Detectors 6 and two infrared power supply chips 10 are arranged on top layer and the bottom of printed circuit board 1 respectively, be the 1st layer of outside that 10 layers: two infrared temp. control chips 9 are placed on printed circuit board 1 for printed circuit board 1, two infrared power supply chips 10 are placed on the 10th layer of outside of printed circuit board 1; Printed circuit board 1 arranges the thermal hole array 4 of a large amount of rule, and these thermal hole arrays 4 are positioned at immediately below infrared temp. control chip 9 and infrared power supply chip 10; Arranging heat conduction aluminium lamination 5 in the inside of printed circuit board 1, is 10 layers for printed circuit board 1: between the layers 2 and 3 of printed circuit board 1, be provided with heat conduction aluminium lamination 5, between the 8th layer and the 9th layer of printed circuit board 1, be also provided with heat conduction aluminium lamination 5; Thermal hole array 4 is penetrated into heat conduction aluminium lamination 5 from printed circuit board 1 surface; Heat conduction aluminium lamination 5 is crimped onto second heat sink structure 3 at printed circuit board 1 two ends.
On printed circuit board 1, immediately below infrared temp. control chip 10 and infrared power supply chip 11, a large amount of regular thermal hole array 4 is set, be equivalent to thin copper conductor tube one by one and be penetrated into heat conduction aluminium lamination 5 along printed circuit board 1 thickness direction from surface, the heat conduction of heating power components and parts top layer on printed circuit board 1 can be made like this to heat conduction aluminium lamination 5, heat conduction aluminium lamination 5 transfers heat to second heat sink structure 3 at printed circuit board 1 two ends, second heat sink structure 3 is connected with the infrared movement housing 8 of non-refrigeration type, such heat just can be transmitted to the infrared movement housing 8 of non-refrigeration type smoothly.The drive circuit of non-refrigeration type Infrared Detectors 6 comprises the heating power such as temperature-control circuit, infrared power circuit components and parts, the sinking path of heating power components and parts is the surface air heat radiations towards periphery by components and parts, but it is very inadequate for only dispelling the heat by very little surface area, by designing printed circuit board 1 radiating mode based on thermal hole array 4 and heat conduction aluminium lamination 5, the heat dissipation path of heating power components and parts is provided, improves radiating efficiency.
Meanwhile, also comprise other heat dissipating method when printed circuit board 1 designs, such as adopt thick line, thick Copper Foil, thin plate, multilayer, large area to spread copper etc.
Step 3, design many temperature spots TEC thermoelectric refrigerating unit control mode
TEC thermoelectric refrigerating unit is integrated with in non-refrigeration type Infrared Detectors 6 shell inside, are accessed in the TEC control loop of non-refrigeration type Infrared Detectors 6 outside together with the temperature signal that itself and the infrared temperature sensor of non-refrigeration type Infrared Detectors 6 inside are exported, the refrigeration to non-refrigeration type Infrared Detectors 6 or heating can be realized, non-refrigeration type Infrared Detectors 6 is maintained on a stable temperature spot.
In present embodiment, first heat sink structure 2 and the second heat sink structure 3 select thermal resistance lower than the heat conduction aluminium block of 4K/W, contact heat resistance is reduced by the area increasing heat conduction aluminium block contact-making surface, but excessively increasing heat conduction aluminium block quality, increase heat conduction aluminium block sectional area etc. all can make the quality of focal plane component increase, and will consider in the design.
In present embodiment, adopt non-refrigeration type Infrared Detectors 6 grade of following model as heat radiation object, be specially: the producer of non-refrigeration type Infrared Detectors 6 and model are respectively Beijing Guang Weiji electricity company, GWIR0302X1A, the model of temperature controller is MAX1978, and the model of two infrared power supply chips 9 is respectively ADR440 and LT1529.Heat abstractor of the present invention and the non-refrigeration type Infrared Detectors 6 of heat dissipating method to above-mentioned model is adopted to dispel the heat, result as shown in Figure 3 and Figure 4, as shown in Figure 3, many temperature spots TEC power consumption profile (T=-10 DEG C, 10 DEG C, 30 DEG C, 50 DEG C) as shown in Figure 4 for single temperature spot TEC power consumption profile (T=30 DEG C).Known by the contrast of Fig. 3 and Fig. 4, heat abstractor of the present invention and heat dissipating method is adopted to dispel the heat to non-refrigeration type Infrared Detectors 6, adopt many temperature spots TEC thermoelectric refrigerating unit control mode simultaneously, can make non-refrigeration type Infrared Detectors 6 under different background ambient temperature, reliablely and stablely can work in wide temperature range, reduce power consumption to greatest extent, promote the overall performance of the infrared movement of non-refrigeration type.
Claims (6)
1. the infrared movement heat abstractor of non-refrigeration type, is characterized in that, comprising:
Be designed to the printed circuit board (1) of sandwich construction, non-refrigeration type Infrared Detectors (6) is welded on printed circuit board (1), and the infrared temp. control chip (9) of non-refrigeration type Infrared Detectors (6) and infrared power supply chip (10) are welded on top layer and the bottom of printed circuit board (1) respectively;
The first heat sink structure (2) be connected with the bottom shell of non-refrigeration type Infrared Detectors (6), described first heat sink structure (2) is connected with the infrared movement housing (8) of non-refrigeration type;
The second heat sink structure (3) be connected with the mechanical erection face (7) of non-refrigeration type Infrared Detectors (6) both sides, described second heat sink structure (3) respectively movement housing (8) infrared with non-refrigeration type is connected with the first heat sink structure (2);
Be arranged on multiple thermal hole arrays (4) that printed circuit board (1) is upper and regularly arranged, multiple thermal hole array (4) is all positioned at immediately below infrared temp. control chip (9) and infrared power supply chip (10);
Be arranged on the heat conduction aluminium lamination (5) that printed circuit board (1) is inner, described thermal hole array (4) is penetrated into heat conduction aluminium lamination (5) from printed circuit board (1) surface, and the part that described heat conduction aluminium lamination (5) stretches out printed circuit board (1) two ends is crimped onto on the second heat sink structure (3).
2. the infrared movement heat abstractor of non-refrigeration type according to claim 1, is characterized in that, described first heat sink structure (2) and the second heat sink structure (3) all select thermal resistance lower than the heat conduction aluminium block of 4K/W.
3. the infrared movement heat abstractor of non-refrigeration type according to claim 1, is characterized in that, described first heat sink structure (2) is of a size of 15mm × 10mm, and described second heat sink structure (3) is of a size of 23.5mm × 3.5mm.
4. the infrared movement heat abstractor of non-refrigeration type according to claim 1, it is characterized in that, described printed circuit board (1) is 10 Rotating fields: between the layers 2 and 3 of printed circuit board (1), arrange heat conduction aluminium lamination (5), also arranges heat conduction aluminium lamination (5) between the 8th layer and the 9th layer of printed circuit board (1) simultaneously.
5. the infrared movement heat abstractor of non-refrigeration type according to claim 1, is characterized in that, described printed circuit board (1) inside is also provided with thick line, Copper Foil or thin plate.
6. the heat dissipating method of the infrared movement heat abstractor of non-refrigeration type as claimed in claim 1, it is characterized in that, the method comprises the following steps:
Step one, non-refrigeration type Infrared Detectors (6) is welded on independent printed circuit board (1), described printed circuit board (1) is arranged to sandwich construction, and the infrared temp. control chip (9) of non-refrigeration type Infrared Detectors (6) and infrared power supply chip (10) are welded on top layer and the bottom of printed circuit board (1) respectively;
Step 2, design two heat sink structures being applicable to non-refrigeration type Infrared Detectors (6) and dispelling the heat, be respectively the first heat sink structure (2) and the second heat sink structure (3), the bottom shell of non-refrigeration type Infrared Detectors (6) is fixed on the first heat sink structure (2) center, and the first heat sink structure (2) is connected with the infrared movement housing (8) of non-refrigeration type;
Step 3, to add load onto the second heat sink structure (3) in the mechanical erection face of non-refrigeration type Infrared Detectors (6) both sides, the second heat sink structure (3) respectively movement housing (8) infrared with the first heat sink structure (2) and non-refrigeration type is connected; By arranging the first heat sink structure (2) and the second heat sink structure (3) dispels the heat to help non-refrigeration type Infrared Detectors (6), reduce non-refrigeration type Infrared Detectors (6) power consumption;
Step 4, on printed circuit board (1), arrange the thermal hole array (4) of multiple regular array, multiple thermal hole array (4) is positioned at immediately below infrared temp. control chip (9) and infrared power supply chip (10);
Step 5, multiple heat conduction aluminium lamination (5) is set in printed circuit board (1) inside, described thermal hole array (4) is penetrated into heat conduction aluminium lamination (5) from printed circuit board (1) surface, and the part that described heat conduction aluminium lamination (5) stretches out printed circuit board (1) two ends is crimped onto on the second heat sink structure (3); By designing the radiating mode based on thermal hole array (4) and heat conduction aluminium lamination (5), providing the heat dissipation path of heating power components and parts, improving radiating efficiency;
Step 6, design many temperature spots TEC thermoelectric refrigerating unit control mode
TEC thermoelectric refrigerating unit is integrated with in non-refrigeration type Infrared Detectors (6) shell inside, the temperature signal that the infrared temperature sensor that itself and non-refrigeration type Infrared Detectors (6) are inner exports is accessed jointly in the TEC control loop of non-refrigeration type Infrared Detectors (6) outside, realize the refrigeration of non-refrigeration type Infrared Detectors (6) or heating, non-refrigeration type Infrared Detectors (6) is maintained on a stable temperature spot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510782969.3A CN105280586B (en) | 2015-11-16 | 2015-11-16 | The infrared movement heat abstractor of non-refrigeration type and heat dissipating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510782969.3A CN105280586B (en) | 2015-11-16 | 2015-11-16 | The infrared movement heat abstractor of non-refrigeration type and heat dissipating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105280586A true CN105280586A (en) | 2016-01-27 |
| CN105280586B CN105280586B (en) | 2017-12-26 |
Family
ID=55149358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510782969.3A Active CN105280586B (en) | 2015-11-16 | 2015-11-16 | The infrared movement heat abstractor of non-refrigeration type and heat dissipating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105280586B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108493271A (en) * | 2018-03-13 | 2018-09-04 | 东南大学 | A kind of chip-scale superminiature refrigeration machine for non-refrigeration type infrared detector |
| CN109405978A (en) * | 2018-11-28 | 2019-03-01 | 西安泰豪红外科技有限公司 | A kind of infrared machine core of refrigeration mode and preparation method thereof |
| CN109587380A (en) * | 2018-12-06 | 2019-04-05 | 天津津航技术物理研究所 | Minimize hot operation multiplex roles refrigeration mode infrared imaging device |
| CN109698173A (en) * | 2019-02-14 | 2019-04-30 | 江苏亨通光网科技有限公司 | It is accurately positioned the optical module structure and its assembling mode of light, electrical chip bonding |
| CN111147699A (en) * | 2018-11-02 | 2020-05-12 | 南昌欧菲光电技术有限公司 | Electronic equipment, camera device and mounting base thereof |
| CN112015030A (en) * | 2020-08-28 | 2020-12-01 | 天津津航技术物理研究所 | Refrigeration infrared core assembly heat radiation structure and refrigeration infrared core |
| WO2023035933A1 (en) * | 2021-09-09 | 2023-03-16 | 杭州微影软件有限公司 | Infrared detector module and infrared thermal imaging device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5763885A (en) * | 1995-12-19 | 1998-06-09 | Loral Infrared & Imaging Systems, Inc. | Method and apparatus for thermal gradient stabilization of microbolometer focal plane arrays |
| CN101478634A (en) * | 2008-12-25 | 2009-07-08 | 中国传媒大学 | Uncooled array type infrared image sensor |
| US20090282852A1 (en) * | 2004-10-22 | 2009-11-19 | Nextreme Thermal Solutions, Inc. | Thin Film Thermoelectric Devices for Hot-Spot Thermal Management in Microprocessors and Other Electronics |
| CN103606546A (en) * | 2013-11-28 | 2014-02-26 | 华为技术有限公司 | Optical device |
-
2015
- 2015-11-16 CN CN201510782969.3A patent/CN105280586B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5763885A (en) * | 1995-12-19 | 1998-06-09 | Loral Infrared & Imaging Systems, Inc. | Method and apparatus for thermal gradient stabilization of microbolometer focal plane arrays |
| US20090282852A1 (en) * | 2004-10-22 | 2009-11-19 | Nextreme Thermal Solutions, Inc. | Thin Film Thermoelectric Devices for Hot-Spot Thermal Management in Microprocessors and Other Electronics |
| CN101478634A (en) * | 2008-12-25 | 2009-07-08 | 中国传媒大学 | Uncooled array type infrared image sensor |
| CN103606546A (en) * | 2013-11-28 | 2014-02-26 | 华为技术有限公司 | Optical device |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108493271A (en) * | 2018-03-13 | 2018-09-04 | 东南大学 | A kind of chip-scale superminiature refrigeration machine for non-refrigeration type infrared detector |
| CN111147699A (en) * | 2018-11-02 | 2020-05-12 | 南昌欧菲光电技术有限公司 | Electronic equipment, camera device and mounting base thereof |
| CN111147699B (en) * | 2018-11-02 | 2022-01-07 | 南昌欧菲光电技术有限公司 | Electronic equipment, camera device and mounting base thereof |
| CN109405978A (en) * | 2018-11-28 | 2019-03-01 | 西安泰豪红外科技有限公司 | A kind of infrared machine core of refrigeration mode and preparation method thereof |
| CN109587380A (en) * | 2018-12-06 | 2019-04-05 | 天津津航技术物理研究所 | Minimize hot operation multiplex roles refrigeration mode infrared imaging device |
| CN109698173A (en) * | 2019-02-14 | 2019-04-30 | 江苏亨通光网科技有限公司 | It is accurately positioned the optical module structure and its assembling mode of light, electrical chip bonding |
| CN109698173B (en) * | 2019-02-14 | 2024-03-12 | 亨通洛克利科技有限公司 | Optical module structure for precisely positioning optical and electric chip bonding and assembling mode thereof |
| CN112015030A (en) * | 2020-08-28 | 2020-12-01 | 天津津航技术物理研究所 | Refrigeration infrared core assembly heat radiation structure and refrigeration infrared core |
| CN112015030B (en) * | 2020-08-28 | 2022-06-14 | 天津津航技术物理研究所 | Refrigeration infrared core assembly heat radiation structure and refrigeration infrared core |
| WO2023035933A1 (en) * | 2021-09-09 | 2023-03-16 | 杭州微影软件有限公司 | Infrared detector module and infrared thermal imaging device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105280586B (en) | 2017-12-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105280586A (en) | Uncooled infrared movement cooling apparatus and method | |
| US7299639B2 (en) | Thermoelectric module | |
| CN109405978A (en) | A kind of infrared machine core of refrigeration mode and preparation method thereof | |
| JP5783212B2 (en) | Power supply | |
| CN102801105A (en) | Package of quantum cascade laser with thermoelectric refrigerator | |
| CN103021877A (en) | High-density chip radiating method by dual-path heat transfer | |
| CN202455251U (en) | Cooling and dustproof structure of small frequency converter | |
| CN107479151A (en) | A kind of heat pipe semiconductor temperature control module for All-in-One optical module | |
| CN209027680U (en) | A kind of infrared machine core of refrigeration mode | |
| CN115047961A (en) | Edge server cooling system and wide-ring-temperature edge server | |
| CN107525988A (en) | A kind of general microwave components aging test equipment | |
| CN217062830U (en) | Wide temperature range laser instrument temperature control device | |
| CN217606907U (en) | Battery module | |
| CN206819982U (en) | Semiconductor refrigeration sheet | |
| CN114899300A (en) | Semiconductor thermoelectric device | |
| CN210868549U (en) | High heat conduction soaking plate structure and active phased array TR subassembly heat radiation structure | |
| CN208938956U (en) | Board structure | |
| CN208141275U (en) | Sealed computer cabinet | |
| CN207394789U (en) | A kind of high-powered LED lamp housing radiating device | |
| CN110167318A (en) | A kind of temperature control system and electronics cabinet | |
| CN110739282A (en) | Power device packaging structure and module power supply | |
| CN220123357U (en) | Shielding cover, wireless communication module and electronic equipment | |
| CN221487945U (en) | Circuit heat radiation structure and circuit board | |
| CN219696445U (en) | Power module and motor controller with same | |
| CN219874436U (en) | Heat radiation structure and solid laser temperature control system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Fan Zhanjun Inventor before: Li Guoning Inventor before: Zhang Yu |
|
| CB03 | Change of inventor or designer information |