CN111147699B - Electronic equipment, camera device and mounting base thereof - Google Patents
Electronic equipment, camera device and mounting base thereof Download PDFInfo
- Publication number
- CN111147699B CN111147699B CN201811302410.6A CN201811302410A CN111147699B CN 111147699 B CN111147699 B CN 111147699B CN 201811302410 A CN201811302410 A CN 201811302410A CN 111147699 B CN111147699 B CN 111147699B
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- imaging module
- metal
- plastic
- infrared thermal
- visible light
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The invention relates to an electronic device, an image pickup apparatus and a mounting base thereof. This mount pad includes: the metal bracket is used for mounting the infrared thermal imaging module; and the plastic bracket is connected with the metal bracket and used for installing the visible light imaging module. The mounting seat is a combined mounting seat, the visible light imaging module is arranged on the plastic support, and the heat conduction of the visible light imaging module is delayed by utilizing the characteristic of poor heat conduction performance of the plastic support; and the infrared thermal imaging module is arranged on the metal support, and the heat dissipation effect of the infrared thermal imaging module is accelerated by utilizing the characteristic of good heat conductivity of the metal support. Adopt the difference of the thermal conductivity of combination formula mount pad utilization plastic support and metal support, make infrared thermal imaging module ambient temperature adjust to the state that does not influence infrared thermal imaging module's normal work, can obtain the infrared thermal image of higher resolution ratio, better quality, thermal field information does benefit to the detection identification information who acquires biological living body.
Description
Technical Field
The present invention relates to the field of camera technology, and in particular, to an electronic device, a camera device, and a mounting base thereof.
Background
Electronic devices such as mobile phones and tablet computers generally have a camera device, and thus have a photographing function. But traditional single camera module has can't satisfy consumer's growing demand to the high quality shooting, has appeared two modules of making a video recording, the module of making a video recording even more gradually on this market.
The single camera module can be divided into visible light imaging module, infrared thermal imaging module etc. according to the function, and wherein, infrared thermal imaging module can accept the infrared energy of the target radiation of being shot to obtain the infrared thermal image corresponding with the thermal distribution field on the target surface of being shot, infrared thermal imaging module can be with the invisible infrared light that the target sent of being shot change visible infrared thermal image into. The infrared thermal imaging module is very suitable for using under the not good condition of night or light condition, but the infrared thermal imaging module can only show the profile of the target of shooing, can not clearly show the detail, and the infrared thermal image that also has resolution ratio low, the poor problem of quality. And including the infrared thermal imaging module and the two modules of making a video recording of visible light imaging module or the module of making a video recording more simultaneously, can fuse the infrared thermal image that the infrared thermal imaging module acquireed with the visible light image that the visible light imaging module acquireed, obtain high resolution, high-quality infrared thermal image.
And because infrared thermal imaging module has the consumption little, characteristics such as sensitive to the temperature, it is good to require infrared thermal imaging module to have the heat dissipation at the during operation, the ambient temperature can be in stable state, in order to reduce the influence of ambient temperature to infrared thermal imaging module, and visible light imaging module's consumption is big, the heat that gives off is great, the heat that the visible light imaging module gived off can influence the ambient temperature of adjacent infrared thermal imaging module, lead to infrared thermal imaging module's ambient temperature to rise by a wide margin, influence the quality of the infrared thermal image of acquireing.
Disclosure of Invention
Therefore, it is necessary to provide an electronic apparatus, an image pickup device and a mounting base thereof, aiming at the problem that the quality of an infrared thermal image is deteriorated due to the influence of heat emitted from a visible light imaging module on the ambient temperature of the infrared thermal imaging module during operation.
A mount, comprising:
the metal bracket is used for mounting the infrared thermal imaging module; and
and the plastic bracket is connected with the metal bracket and used for installing the visible light imaging module.
The mounting seat is a combined mounting seat, the visible light imaging module is arranged on the plastic support, and the heat conduction of the visible light imaging module is delayed by utilizing the characteristic of poor heat conduction performance of the plastic support; and the infrared thermal imaging module is arranged on the metal support, and the heat dissipation effect of the infrared thermal imaging module is accelerated by utilizing the characteristic of good heat conductivity of the metal support. Adopt the difference of the thermal conductivity of combination formula mount pad utilization plastic support and metal support, make infrared thermal imaging module ambient temperature adjust to the state that does not influence infrared thermal imaging module's normal work, can obtain the infrared thermal image of higher resolution ratio, better quality, thermal field information does benefit to the detection identification information who acquires biological living body.
In one embodiment, the mounting seat further comprises a metal substrate, and the metal bracket and the plastic bracket are arranged on the metal substrate at intervals. The metal support and the plastic support are arranged on the same metal substrate, the mounting base is a common substrate type mounting base, and the infrared thermal imaging module and the visible light imaging module are controlled to be flush with each other and adjusted to be close to one end of a shot object. And the metal support and the plastic support are arranged at intervals, so that heat transfer between the metal support and the plastic support can be further blocked.
In one embodiment, the metal bracket comprises a metal cylinder body, the metal cylinder body is a hollow structure with two open ends, the metal cylinder body is provided with a first cavity for installing the infrared thermal imaging module, one end of the metal cylinder body is arranged on the metal substrate, the other end of the metal cylinder body is provided with a step groove surrounding the metal cylinder body for one circle, so that one end of the metal cylinder body, which is far away from the metal substrate, is inserted into a shell of a correction module of the infrared thermal imaging module. Set up the ladder groove, can be so that metal cylinder not only does benefit to the quality that reduces metal cylinder with insert in the correction module's of infrared thermal imaging module shell, still do benefit to the correction module's of metal cylinder and infrared thermal imaging module shell equipment.
In one embodiment, the plastic support comprises a plastic cylinder, the plastic cylinder is a hollow structure with two open ends, one end of the plastic cylinder is arranged on the metal substrate, and the plastic cylinder is provided with a second cavity for installing the visible light imaging module and a third cavity which is located between the second cavity and the metal substrate and is communicated with the second cavity. Therefore, the heat emitted by the visible light imaging module can be dissipated through the air in the third cavity and the plastic cylinder wall surrounding the third cavity, namely, the heat dissipation space and the structure are increased between the metal substrate and the visible light imaging module, so that the heat emitted by the visible light imaging module can be further prevented from being transferred to the infrared thermal imaging module through the metal substrate. And set up the third cavity and can be raising visible light imaging module to when making visible light imaging module and infrared thermal imaging module be close to the one end of being shot the object and flush, can also reduce plastic support's quality, thereby be convenient for obtain the less mount pad of quality.
In one embodiment, the plastic support further comprises an annular partition plate, the annular partition plate is located in the plastic cylinder, the outer side wall of the annular partition plate is connected with the inner side wall of the plastic cylinder, the inner space of the plastic cylinder is divided into the second cavity and the third cavity, and the annular partition plate is used for bearing the visible light imaging module. Bear the weight of visible light imaging module through setting up annular baffle, be convenient for very much adopt sticky mode to be fixed in the plastic support with visible light imaging module.
In one embodiment, the plastic support further comprises an annular protrusion, the annular protrusion is arranged on the annular partition plate, the outer side wall of the annular protrusion and the inner side wall of the plastic cylinder are arranged at intervals to form a glue containing groove, and the annular protrusion is used for bearing the visible light imaging module. Therefore, when the visible light imaging module is fixed in the plastic support in an adhesive mode, overflowing glue can be contained in the glue containing groove, and the glue is prevented from overflowing from the inner side wall of the annular partition plate. And when holding gluey groove and being filled up the back by glue, hold all inner walls in gluey groove and all be connected with visible light imaging module through glue, increased the adhesive area of visible light imaging module and annular baffle for the visible light imaging module is connected more firmly with between the annular baffle.
In one embodiment, the inner diameter of one end of the second cavity close to the third cavity is smaller than that of the third cavity, and the inner side wall of the second cavity close to one end of the third cavity is used for being connected with the visible light imaging module. Also can see in the light imaging module adopts the mode of close-fitting to be fixed in plastic support, can reduce plastic support weight.
An image pickup apparatus comprising:
the mounting seat is arranged;
the infrared thermal imaging module is arranged on the metal bracket; and
the visible light imaging module is arranged on the plastic bracket.
Above-mentioned camera device includes infrared thermal imaging module and visible light imaging module to can fuse the infrared thermal image information that infrared thermal imaging module acquireed and the visible light image information that visible light imaging module acquireed, and then output high resolution, high-quality infrared thermal image. The mounting seat is a combined mounting seat, the visible light imaging module is arranged on the plastic support, and the heat conduction of the visible light imaging module is delayed by utilizing the characteristic of poor heat conduction performance of the plastic support; and the infrared thermal imaging module is arranged on the metal support, and the heat dissipation effect of the infrared thermal imaging module is accelerated by utilizing the characteristic of good heat conductivity of the metal support. Adopt the difference of the thermal conductivity of combination formula mount pad utilization plastic support and metal support, make infrared thermal imaging module ambient temperature adjust to the state that does not influence infrared thermal imaging module's normal work, can obtain the infrared thermal image of higher resolution ratio, better quality, thermal field information does benefit to the detection identification information who acquires biological living body.
In one embodiment, the infrared thermal imaging module comprises an infrared imaging module and a correction module, the infrared imaging module is arranged on the metal support, the correction module is arranged at one end, close to a shot object, of the infrared imaging module, the correction module can open or close a light path of the infrared imaging module, and the infrared imaging module can acquire a stable reference temperature point in each imaging. Thus, the temperature information of the object to be shot can be accurately output.
An electronic device comprises the image pickup device.
Drawings
Fig. 1 is a schematic perspective view of an image capturing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of the imaging device of FIG. 1;
fig. 3 is a schematic cross-sectional view of an image capturing apparatus according to another embodiment of the present invention;
FIG. 4 is a schematic cross-sectional view of the plastic bracket and the visible light imaging module shown in FIG. 2;
fig. 5 is a schematic cross-sectional view of a plastic bracket and a visible light imaging module according to another embodiment of the invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be construed as broadly as the present invention is capable of modification in various respects, all without departing from the spirit and scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1, a camera device 10 according to an embodiment of the present invention includes a mounting base 12, an infrared thermal imaging module 14, and a visible light imaging module 16, where the infrared thermal imaging module 14 and the visible light imaging module 16 are disposed on the mounting base 12. The infrared thermal imaging module 14 and the visible light imaging module 16 are respectively connected with an external circuit through a first flexible circuit board 18 and a second flexible circuit board 19. In this embodiment, the image capturing apparatus 10 is applied to an electronic device such as a mobile phone and a tablet, and the external circuit is a motherboard of the electronic device such as the mobile phone and the tablet. The camera device 10 comprises the infrared thermal imaging module 14 and the visible light imaging module 16, so that the infrared thermal image information acquired by the infrared thermal imaging module 14 and the visible light image information acquired by the visible light imaging module 16 can be fused, and then the high-resolution and high-quality infrared thermal image is output.
Wherein, infrared thermal imaging module 14 has the small power consumption, to characteristics such as temperature sensitivity, when the ambient temperature all around surpasss a definite value, influences greatly the accuracy of output infrared thermal image, consequently, requires infrared thermal imaging module 14 can in time dispel the heat at the during operation, and requires infrared thermal imaging module 14's ambient temperature all around can be stable, and is undulant little to reduce ambient temperature all around to infrared thermal imaging module 14's influence. But visible light imaging module 16 has the characteristics that the consumption is big, its heat that gives off is great, if adopt metal mount pad to connect infrared thermal imaging module 14 and visible light imaging module 16, because metal mount pad heat conductivity is good, the heat that visible light imaging module 16 gave off can transmit to infrared thermal imaging module 14's periphery, after a period, infrared thermal imaging module 14's peripheral temperature risees to a definite value, will influence infrared thermal imaging module 14 output infrared thermal image information, and then accuracy and the quality that camera device 10 output infrared thermal image are finally influenced.
How to reduce the influence of the heat dissipated by the power consumption of the visible light imaging module 16 on the infrared thermal imaging module 14 and control the ambient temperature of the infrared thermal imaging module 14 within a certain range, so that the infrared thermal imaging module 14 is influenced by the ambient temperature as little as possible, which is a problem to be solved urgently.
In the embodiment, the mounting base 12 includes a metal bracket 100 and a plastic bracket 200, and the infrared thermal imaging module 14 and the visible light imaging module 16 are respectively disposed on the metal bracket 100 and the plastic bracket 200. In the camera device 10 having both the infrared thermal imaging module 14 and the visible light imaging module 16, the visible light imaging module 16 is disposed on the plastic support 200, and the heat conduction of the visible light imaging module 16 is delayed by utilizing the characteristic of poor heat conduction performance of the plastic support 200; the infrared thermal imaging module 14 is disposed on the metal bracket 100, and the heat dissipation of the infrared thermal imaging module 14 is accelerated by utilizing the good thermal conductivity of the metal bracket 100. That is, the combined mounting base 12 of the camera device 10 utilizes the difference of the thermal conductivity of the plastic support 200 and the metal support 100, so as to effectively reduce the thermal conduction of the visible light imaging module 16 to the infrared thermal imaging module 14, so that the ambient temperature around the infrared thermal imaging module 14 is adjusted to a state that does not affect the normal operation of the infrared thermal imaging module 14, and finally, the camera device 10 can obtain an infrared thermal image with higher resolution and better quality, and thermal field information is beneficial to obtaining detection and identification information of a living organism. While extending the effective normal operating time of the camera device 10.
In the present embodiment, as shown in fig. 2, the mounting base 12 further includes a metal substrate 300, and the metal bracket 100 and the plastic bracket 200 are disposed on the metal substrate 300 at an interval. The metal bracket 100 and the plastic bracket 200 are disposed on the same metal substrate 300, that is, the mounting base 12 is a common substrate type mounting base, which is more beneficial to controlling the infrared thermal imaging module 14 and the visible light imaging module 16 to be aligned with each other and adjusting one end of the infrared thermal imaging module 14 and one end of the visible light imaging module 16 close to the object to be shot to be flush in the mounting process. And the metal bracket 100 and the plastic bracket 200 are arranged at intervals, so that the heat transfer between the metal bracket 100 and the plastic bracket 200 can be further blocked. As shown in fig. 3, in other embodiments, the sidewalls of the metal bracket 100a and the sidewalls of the plastic bracket 200a are connected by a connection plate 300 a. The connection plate 300a may be a metal plate or a plastic plate, wherein the connection plate 300a is a plastic plate that may further block heat transfer between the metal bracket 100 and the plastic bracket 200.
Further, in the present embodiment, the metal bracket 100 is integrally formed with the metal substrate 300. The metal holder 100 and the metal substrate 300 are made of steel. An adhesive layer (not shown) is disposed between the plastic bracket 200 and the metal substrate 300, that is, the plastic bracket 200 and the metal substrate 300 are fixed by gluing.
In the present embodiment, as shown in fig. 2, the metal bracket 100 includes a metal cylinder 102, the metal cylinder 102 is a hollow structure with two open ends, and the metal cylinder 102 has a first cavity 1022 for installing the infrared thermal imaging module 14. One end of the metal cylinder 102 is disposed on the metal substrate 300, and specifically, in the embodiment, the metal cylinder 102 is square, and the metal cylinder 102 and the metal substrate 300 are integrally formed, so that the manufacturing process of the mounting base 12 can be simplified. The other end of the metal cylinder 102 is provided with a stepped groove 1024 surrounding the metal cylinder 102 for one circle, so that the end of the metal cylinder 102 away from the metal substrate 300 is inserted into the housing 610 of the calibration module 600 of the infrared thermal imaging module 14. The stepped groove 1024 is formed, so that the metal cylinder 102 and the shell 610 of the correction module 600 inserted into the infrared thermal imaging module 14 can be conveniently assembled together, and the quality of the metal cylinder 102 is reduced, and the metal cylinder 102 and the shell 610 of the correction module 600 of the infrared thermal imaging module 14 can be conveniently assembled together.
One end of the infrared thermal imaging module 14 away from the object to be photographed is accommodated in the first cavity 1022, and one end of the infrared thermal imaging module 14 close to the object to be photographed is located outside the first cavity 1022. Compared with the way that the infrared thermal imaging module 14 is completely accommodated in the first cavity 1022, the way that the infrared thermal imaging module 14 is partially accommodated in the first cavity 1022 can reduce the height of the metal cylinder 102, thereby reducing the weight of the metal cylinder 102, and facilitating the obtaining of the light and thin camera device 10.
In this embodiment, the outer surface of the end of the infrared thermal imaging module 14 away from the object to be photographed contacts with the inner surface of the first cavity 1022, that is, the assembly manner of the end of the infrared thermal imaging module 14 away from the object to be photographed and the first cavity 1022 is a tight fit assembly, which is not only beneficial to the stable installation of the infrared thermal imaging module 14, but also beneficial to obtaining the miniaturized camera device 10.
In this embodiment, the metal substrate 300 is provided with the annular glue groove 302 located in the first cavity 1022, thereby when the infrared thermal imaging module 14 is fixed in the metal bracket 100 in a gluing manner, glue can be drawn on the surface of the metal substrate 300 and the inner side wall of the first cavity 1022, glue overflowing in the gluing process can be contained in the annular glue groove 302, thereby avoiding glue overflowing, and after the annular glue groove 302 is filled with glue, all inner walls of the annular glue groove 302 are connected with the infrared thermal imaging module 14 through glue, the glue adhering area of the infrared thermal imaging module 14 and the metal substrate 300 is increased, so that the connection between the infrared thermal imaging module 14 and the metal substrate 300 is firmer.
Specifically, in the present embodiment, the infrared thermal imaging module 14 includes a first photosensitive assembly 400, a first lens assembly 500 disposed on a photosensitive path of the first photosensitive assembly 400, and a calibration module 600 disposed on one end of the first lens assembly 500 close to the object to be photographed. The first photosensitive element 400 and the first lens element 500 form an infrared imaging module of the infrared thermal imaging module 14.
The first photosensitive assembly 400 includes a first circuit board 410, a first photosensitive chip 420, a first conductive wire 430, a first electronic component 440, and a first filter 450. The first photosensitive chip 420 is disposed on the first circuit board 410 and electrically connected to the first circuit board 410 through a first conductive wire 430. The first electronic component 440 is disposed on the first circuit board 410 and electrically connected to the first circuit board 410. The first filter 450 is directly disposed on the surface of the first photosensitive chip 420, and is spaced apart from the first filter 450 and the first photosensitive chip 420, so as to prevent light from being repeatedly reflected between the first filter 450 and the first photosensitive chip 420, which may cause glare.
The first lens assembly 500 includes a lens holder 510 and a lens 520, wherein the lens holder 510 is a hollow structure with two open ends, one end of the lens holder is disposed on the first circuit board 410, and the other end of the lens holder is connected to a lens barrel 522 of the lens 520. Lens 520 includes a barrel 522 and a lens 524 disposed in barrel 522. In this embodiment, the first lens assembly 500 is a zoom lens assembly, and the lens barrel 522 is screwed to the lens holder 510, so that the distance between the lens 524 and the lens holder 510 can be adjusted, and further the adjustment of the focal length is achieved. In other embodiments, the first lens assembly 500 may also be a fixed focus lens assembly.
The calibration module 600 can turn on or off the optical path of the first lens assembly 500, and can ensure that the first lens assembly 500 can obtain a stable reference temperature point every time of imaging. In this embodiment, the correction module 600 is a shutter, wherein the correction module 600 includes a housing 610 and a blade 620, the housing 610 is disposed at one end of the first lens assembly 500 close to the object to be photographed, a light through hole 6142 is disposed in a region of the housing 610 opposite to the light path of the first lens assembly 500, and the blade 620 can move close to or away from the light through hole 6142 to open or close the light through hole 6142. The surface uniformity of the blade 620 is greater than or equal to 90%, and a stable and uniform heat radiation source can be provided for the infrared imaging module, so that a stable reference temperature point is provided for the infrared imaging module, and accurate temperature information of a shot object is output.
In this embodiment, the infrared thermal imaging module 14 uses an uncooled infrared detector (the first photosensitive chip 420) as a core device to convert infrared radiation information into image information visible to human eyes, and the uncooled infrared detector can detect an infrared radiation band of 8-14 μm, so as to obtain a temperature distribution map of a photographed object. The uncooled infrared detector has the advantages of small size, low cost, low power consumption and the like. The first photosensitive chip 420 generally includes a plurality of photosensitive units arranged in an array, and due to a processing error, the photosensitive performance of different photosensitive units is inconsistent, that is, the uniformity of the first photosensitive chip 420 is poor, and the temperature information of the object to be photographed cannot be accurately output. Through setting up blade 620 that surface homogeneity is more than or equal to 90%, thereby when acquireing infrared thermography, acquire the temperature information of the infrared ray that blade 620 under the closed condition radiated earlier, give each photosensitive unit of first photosensitive chip 420 with the temperature information of blade 620 as the benchmark value, thereby make each photosensitive unit's homogeneity better, open blade 620 again, first photosensitive chip 420 accepts the temperature information of the infrared ray of being shot the object radiation, because each photosensitive unit's homogeneity is better, thereby can accurate output by the temperature information of being shot the object.
Further, in this embodiment, the housing 610 includes a connecting cylinder 612 and a body 614 having one end of the connecting cylinder 612, the other end of the connecting cylinder 612 is sleeved on the metal cylinder 102, and the connecting cylinder 612 is connected to the vertical sidewall and the horizontal sidewall of the stepped groove 1024 by adhesive. The body 614 is opposite to the first lens assembly 500, and the light-passing hole 6142 is opened on the body 614. Further, in the embodiment, the body 614 is in direct contact with the first lens assembly 500, and the body 614 is in direct contact with the first lens assembly 500 relative to the body 614 and the first lens assembly 500 which are arranged at intervals, so that the height of the image capturing apparatus 10 can be reduced.
As shown in fig. 2, the plastic bracket 200 includes a plastic cylinder 202, the plastic cylinder 202 is a hollow structure with two open ends, and one end of the plastic cylinder 202 is disposed on the metal substrate 300. The plastic cylinder 202 has a second cavity 2022 for mounting the visible light imaging module 16, and a third cavity 2024 located between the second cavity 2022 and the metal substrate 300 and communicated with the second cavity 2022. Therefore, the heat emitted by the visible light imaging module 16 can be dissipated through the air in the third cavity 2024 and the plastic cylinder wall surrounding the third cavity 2024, that is, by adding a heat dissipation space and structure between the metal substrate 300 and the visible light imaging module 16, the heat emitted by the visible light imaging module 16 can be further prevented from being transferred to the infrared thermal imaging module 14 through the metal substrate 300. And the third cavity 2024 is arranged to raise the visible light imaging module 16, so that the visible light imaging module 16 is flush with the end of the infrared thermal imaging module 14 close to the object to be shot, and the mass of the plastic bracket 200 can be reduced, thereby facilitating obtaining the mounting seat 12 with smaller mass.
Further, as shown in fig. 4, in the present embodiment, the plastic bracket 200 further includes an annular partition 204 and an annular protrusion 206. The annular partition 204 is located in the plastic cylinder 202, and an outer side wall of the annular partition 204 is connected to an inner side wall of the plastic cylinder 202, and divides an inner space of the plastic cylinder 202 into a second cavity 2022 and a third cavity 2024. The annular protrusion 206 is disposed on the annular partition 204, an outer sidewall of the annular protrusion 206 is spaced from an inner sidewall of the plastic cylinder 202 to form a glue receiving groove 208, and the visible light imaging module 16 is disposed on the annular protrusion 206. By providing the annular partition 204 and the annular protrusion 206 to support the visible light imaging module 16, it is very convenient to fix the visible light imaging module 16 in the plastic bracket 200 by gluing, and specifically, glue can be drawn on the inner sidewall of the second cavity 2022 and the annular protrusion 206. And the glue that overflows in the gluing process can be accommodated in glue containing groove 208, and the glue is prevented from overflowing from the inner side wall of annular partition plate 204. And when glue containing groove 208 is filled with glue, all inner walls of glue containing groove 208 are connected with visible light imaging module 16 through glue, increasing the gluing area of visible light imaging module 16 and annular partition 204, so that the connection between visible light imaging module 16 and annular partition 204 is firmer.
In other embodiments, as shown in fig. 5, the inner diameter of the end of the second cavity 2022 close to the third cavity 2024 is smaller than the inner diameter of the third cavity 2024, and the visible light imaging module 16 is disposed in the second cavity 2022 and contacts the inner sidewall of the end of the second cavity 2022 close to the third cavity 2024, that is, the visible light imaging module 16 is fixed in the plastic bracket 200 in a tight-fitting manner. Preferably, an adhesive layer is disposed between the visible light imaging module 16 and the inner sidewall of the second cavity 2022.
In this embodiment, as shown in fig. 4, one end of the visible light imaging module 16 away from the object to be photographed is accommodated in the second cavity 2022, and one end of the infrared thermal imaging module 14 close to the object to be photographed is located outside the second cavity 2022. Compared with the way that the visible light imaging module 16 is completely accommodated in the second cavity 2022, the way that the visible light imaging module 16 is partially accommodated in the second cavity 2022 can reduce the height of the second cavity 2022, thereby reducing the weight of the plastic bracket 200, and facilitating obtaining the light and thin camera device 10.
Specifically, in the present embodiment, the visible light imaging module 16 includes a second photosensitive element 700 and a second lens assembly 800 disposed on a photosensitive path of the second photosensitive element 700. The second photosensitive assembly 700 includes a second circuit board 710, a second photosensitive chip 720, a second conductive line 730, a second electronic component 740, and a second filter 750. The second photo sensor chip 720 is disposed on the second circuit board 710 and electrically connected to the second circuit board 710 through a second conductive wire 730. The second electronic component 740 is disposed on the second circuit board 710 and electrically connected to the second circuit board 710. The second filter 750 is opposite to and spaced apart from the second photosensitive chip 720, and is disposed on the second lens holder 810 of the second lens assembly 800.
The second lens assembly 800 includes a second lens holder 810 and a second lens 820, wherein one end of the second lens holder 810 is disposed on the second circuit board 710, and the other end is connected to the second lens 820. In this embodiment, the second lens assembly 800 is a zoom lens assembly, and the second lens 820 is in threaded connection with the second lens holder 810, so that the distance between the second lens 820 and the second photosensitive chip 720 can be adjusted, and further the adjustment of the focal length is realized. In other embodiments, the second lens assembly 800 may also be a fixed focus lens assembly.
Another embodiment of the present invention provides an electronic apparatus including the image pickup device of the above embodiment. The electronic device may be an infrared camera phone, a night vision device, a fire/surveillance camera, or the like.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A mount, comprising:
the metal bracket is used for mounting the infrared thermal imaging module; and
the plastic bracket is used for mounting the visible light imaging module;
the mounting seat further comprises a metal substrate, and the metal bracket and the plastic bracket are arranged on the metal substrate at intervals;
the plastic support comprises a plastic barrel, the plastic barrel is of a hollow structure with two open ends, one end of the plastic barrel is arranged on the metal substrate, the plastic barrel is provided with a second cavity for installing the visible light imaging module and a third cavity which is located between the second cavity and the metal substrate and communicated with the second cavity, the inner diameter of one end of the second cavity is smaller than that of the third cavity, and the inner side wall of one end of the third cavity, close to the second cavity, is used for being connected with the visible light imaging module.
2. The mount of claim 1, wherein the metal bracket and the metal substrate are made of steel.
3. The mount of claim 1, wherein the metal bracket comprises a metal cylinder, the metal cylinder is a hollow structure with two open ends, the metal cylinder has a first cavity for mounting the infrared thermal imaging module, one end of the metal cylinder is disposed on the metal substrate, and the other end of the metal cylinder is provided with a stepped groove surrounding the metal cylinder for a circle, so that one end of the metal cylinder, which is far away from the metal substrate, is inserted into a housing of a calibration module of the infrared thermal imaging module.
4. The mount of claim 1, wherein an adhesive layer is disposed between the plastic bracket and the metal base plate.
5. The mount of claim 1, wherein the plastic bracket further comprises an annular partition plate, the annular partition plate is located in the plastic cylinder, an outer side wall of the annular partition plate is connected with an inner side wall of the plastic cylinder and divides an inner space of the plastic cylinder into the second cavity and the third cavity, and the annular partition plate is used for bearing the visible light imaging module.
6. The mount of claim 5, wherein the plastic bracket further comprises an annular protrusion, the annular protrusion is disposed on the annular partition, an outer sidewall of the annular protrusion is spaced from an inner sidewall of the plastic cylinder, and forms a glue receiving groove, and the annular protrusion is used for bearing the visible light imaging module.
7. The mount of claim 1, wherein the metal bracket is integrally formed with the metal base plate.
8. An image pickup apparatus, comprising:
the mount of any one of claims 1-7;
the infrared thermal imaging module is arranged on the metal bracket; and
the visible light imaging module is arranged on the plastic bracket.
9. The camera device according to claim 8, wherein the infrared thermal imaging module includes an infrared imaging module and a calibration module, the infrared imaging module is disposed on the metal bracket, the calibration module is disposed at an end of the infrared imaging module close to a subject to be photographed, the calibration module can open or close a light path of the infrared imaging module, and it is ensured that the infrared imaging module can obtain a stable reference temperature point every time of imaging.
10. An electronic apparatus characterized by comprising the image pickup device according to claim 8 or 9.
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