JP4182598B2 - Imaging device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an imaging apparatus having a plurality of imaging elements such as a three-plate video camera. Specifically, the present invention relates to a heat dissipation structure for an image pickup apparatus that efficiently releases heat from the back surface of the image pickup device to an outer panel or an externally mounted component.
[0002]
[Prior art]
In a so-called three-plate color video camera, incident light is dispersed into each wavelength region of R (red), G (green), and B (blue) with a built-in dichroic prism, and accuracy corresponding to a desired wavelength region is obtained. Input to three well-positioned image sensors. Therefore, the three-plate type color video camera has a higher resolution than a single-plate type in which an image sensor with an on-chip filter reduces the resolution to 1/3 and obtains a color image signal. High definition images can be obtained.
The three image sensors in this video camera are required to have sub-micron accuracy for their mutual positioning, and are accurately fixed to the CCD stage with a total of six axes including three axes of x, y, and z and the tilt angles of each axis. ing.
In addition, this high-performance video camera has strict requirements for suppressing dark current caused by heat, and in its structural design, in order to reduce the noise component due to dark current of the image signal as much as possible, the heat dissipation efficiency of the image sensor should be as high as possible. is important.
[0003]
Cooling methods for conventional color video cameras include fan cooling methods, electronic cooling methods using Peltier elements, etc., heat pipes are used to induce heat to other parts with large heat capacities, and latent heat is used when the refrigerant sealed in the pipes is vaporized There is a refrigerant vaporization system that absorbs heat.
For example, Japanese Patent Laid-Open No. 9-98318 discloses an image pickup apparatus in which all three cooling methods are combined to achieve heat dissipation of three image pickup devices (CCD).
[0004]
[Problems to be solved by the invention]
However, since the CCD cooling method in this imaging apparatus uses fan cooling, noise generated by the fan itself may be picked up by the built-in microphone of the camera, and electromagnetic noise from the fan motor is weak in the CCD. Therefore, it is not preferable to use a fan cooling system in that sense.
[0005]
In addition, in the electronic cooling, a Peltier element is provided for each CCD, and a circuit for controlling the driving of the Peltier element is required.
[0006]
The cooling method using the heat pipe described in the above publication increases the cost because the heat pipe is provided for each CCD, and the space for the heat pipe is large, so that the space for the CCD block cannot be saved. There are challenges.
[0007]
Although the details are not described in the above publication, the heat transfer member is usually fixed to the back surface of the CCD by an adhesive material such as a low melting point solder, and one end side of the heat transfer member is fixed so as to be wound around the heat pipe. The Therefore, when the CCD generates heat, a stress is applied to the CCD due to the difference in thermal expansion coefficient with the heat transfer member, and this stress may cause signal distortion. Imaging in the wavelength region may not be successful.
In addition, it is possible to use a liquid substance such as soft grease as the adhesive material, but if such a liquid substance is used, the position of the CCD may be slightly shifted, and the liquid substance may be applied and managed. This process is complicated and becomes an obstacle to productivity.
[0008]
An object of the present invention is to generate an image with no noise and electromagnetic noise, and maintain an image sensor within an appropriate range of a certain level or less without greatly changing the stress on the image sensor with respect to environmental temperature changes, and saving space. An object of the present invention is to provide an imaging device having an element heat dissipation structure.
[0009]
[Means for Solving the Problems]
Imaging device according to the present invention includes a plurality of imaging devices for converting respectively photoelectrically taken from the outside, and a heat transfer unit for transmitting generated heat to the device outer surface side in the plurality of imaging elements, the upper Symbol The heat transfer unit includes one common heat pipe that guides heat from each image sensor to the outer surface of the apparatus via all of the plurality of image sensors, and a heat transfer foil made of gold, silver, copper, or aluminum. A plurality of heat receiving plates formed in a stacked manner and arranged for each of the image pickup devices, and transferring heat from the image pickup devices to the common heat pipe, and each of the plurality of heat receiving plates includes the heat transfer plate. An element fixing portion where one outer surface in the stacking direction of the foil is fixed to the back surface of the imaging device, a pipe fixing portion where the common heat pipe is fixed, and a buffer between the element fixing portion and the pipe fixing portion Part, the element fixing part and the pipe fixing In each of the above, by interposing an adhesive layer between each layer of the laminated heat transfer foil, and not interposing the adhesive layer in the buffer portion, it is possible to absorb the stress generated when the imaging element is fixed and when heat is generated. Gaps are formed between the layers of the plurality of heat transfer foils.
[0010]
According to the configuration of the present invention, an adhesive layer is interposed between the heat transfer foils in the element fixing portion and the pipe fixing portion, while an adhesive layer is interposed between the heat transfer foils between the two fixing portions. The buffer part is formed by not making it.
Preferably, in the present invention, the heat receiving plate is formed such that a fixing surface of the imaging element and a fixing surface of the common heat pipe are formed in steps, and more preferably, the plurality of heat transfer foils in the buffer portion, for example, Z-shaped bending is given from the side.
[0011]
The adhesive layer is preferably screen-printed on both sides of the heat transfer foil or part of one side.
The image sensor is fixed on the heat receiving plate via a heat conductive double-sided tape.
[0012]
In the present invention, preferably, the sheet metal is in close contact with the outer surface of the pipe fixing portion in the stacking direction of the heat transfer foil and is wound in close contact with the common heat pipe passing in the vicinity of the common heat pipe. The heat receiving plate and the common heat pipe are fixed to each other.
In the present invention, it is preferable that the common heat pipe is a pipe having a circular cross section, and a refrigerant is sealed in the pipe, and is bent at several places with a curvature within a range in which predetermined heat conduction characteristics can be secured.
In the present invention, preferably, the heat transfer unit includes a heat radiating plate that holds one end of the common heat pipe and is directly or indirectly fixed to the apparatus housing. The heat radiating plate is preferably, has a groove corresponding to the outer shape of the common heat pipe, one end of the common heat pipe is accommodated in the groove, a fixture attached to the heat radiating plate outer surface of the circumferential groove Is pressed against the inner surface of the groove.
[0013]
The present invention preferably includes a lens and a prism, and each of the plurality of image pickup devices is positioned at a position where it can receive light in a wavelength range of a specific range dispersed by the built-in prism that has received light from the lens. Is fixed . More preferably, three image sensors are provided for photoelectrically converting input image light in each of the red, green, and blue wavelength regions .
[0014]
In the imaging apparatus according to the present invention configured as described above, heat generated by a plurality of imaging elements is released to the outside through a common heat pipe. Since this heat pipe is provided in common among a plurality of image sensors, its piping space is small.
[0015]
In the imaging apparatus according to the present invention, an imaging device, for example via a thermally conductive double-sided tape, it is fixed to one side outer surface of the stacking direction of the plurality of heat transfer foils of the heat receiving plate. For this reason, the stress at the time of fixation is relieved to some extent as compared with the case where an adhesive material such as a low melting point solder is used . The heat receiving plate is a member that receives generated heat from the back side of the image sensor and transmits it to a heat pipe that passes nearby. In the present invention, a buffer portion is provided in the middle of the heat receiving plate. When the heat receiving plate is configured by laminating a plurality of heat transfer foils, an adhesive layer for fixing the heat transfer foils is required . However , since no adhesive layer is interposed in the buffer portion, gaps are formed between the layers of the heat transfer foil so as to be able to absorb stress generated when the image sensor is fixed and heat is generated. Thereby , the rigidity of the buffer part is weaker than other parts. The buffer portion having such a configuration is relatively easy to bend and has good moldability even when the number of heat transfer foils is increased to increase the heat conduction efficiency. In addition, when the image sensor radiates heat or the environmental temperature changes, stress generated due to a difference in thermal expansion coefficient between the heat receiving plate material and the package material of the image sensor is absorbed by the buffer unit. For this reason, the image sensor is not excessively stressed.
[0016]
On the other hand, in the heat pipe after heat transfer, when the refrigerant is vaporized, a part of the surrounding heat is taken, and the remaining heat is transferred to the heat radiating plate provided at one end through the heat pipe. In the heat radiating plate, the heat pipe is pressed against the inner surface of the groove, so that there is little heat transfer loss. Therefore, the heat from the heat pipe is efficiently transmitted to the outer panel through the heat radiating plate and then released to the outside.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a side view of a commercial three-plate CCD color camera.
The CCD color camera 1 is provided with a lens attachment portion 3a outside the front panel 2, and the lens 3 is detachably attached to the attachment portion 3a. A three-plate CCD block 10 is fixed to the inner surface of the front panel 2 located just behind the lens attachment portion 3a.
[0018]
FIG. 2 is a side view, FIG. 3 is a rear view, and FIG. 4 is a top view of the three-plate CCD block attached to the inner surface of the front panel 2.
The three-plate CCD block 10 includes a base block 11 that is screwed to the front panel 2 of the camera and a prism block 12 that is overlapped and fixed to the base block 11. These blocks 11 and 12 are made of, for example, an aluminum die cast material having high thermal conductivity.
[0019]
Fixed to the outer base surface of the prism block 12 is a composite prism (dichroic prism) 13 having three or four components assembled with a dichroic film that reflects light of a specific wavelength interposed therebetween. The dichroic films used here are for red reflection that reflects the light component of the wavelength in the red region and for blue reflection that reflects the light component of the wavelength in the blue region. Pass through. Therefore, the green light travels straight, and the red light and the blue light are emitted in different directions depending on the angle of the installation surface of the corresponding dichroic film. Hereinafter, the green light path (channel) branched in these three directions is denoted as G-ch, the red light path is denoted as R-ch, and the blue light path is denoted as B-ch.
[0020]
As representatively shown by the G-ch portion in FIG. 4, a first mounting part 15 of the CCD is fixed to the prism end face of each channel with a trimming filter 14 for each color interposed therebetween.
The CCD 4 (G) is fixed to the first mounting part 15 of the CCD while being accommodated in the second mounting part 16 having a case frame shape. That is, the CCD 4 (G) is housed in the outer space partitioned by the peripheral wall of the second mounting part 16 with the surface having the glass window 4b inside, and the rotation of the x axis, the y axis, the z axis, and each axis. After the CCD position in the part is finely adjusted by turning a screw for adjusting the corner (see FIG. 3), the surfaces of the fixing portions 4a and 15a provided in advance in both the CCD 4 (G) and the first mounting part 15 They are put together and fixed with an adhesive or the like.
Although details of the mounting structure are not shown, the blue CCD 4 (B) and the red CCD 4 (R) are similarly mounted to the corresponding prism end faces.
[0021]
The second attachment part 16 includes a substrate support wall 16a that protrudes high outward at the central portion of the short side peripheral wall. Although not shown in FIG. 3 for simplification, as shown in G-ch of FIGS. 2 and 4, the printed wiring board 5 is installed in a state supported by the board support wall 16a. As shown in FIG. 2, a lead 4c extending from the back surface of the CCD 4 (R), 4 (G) or 4 (B) is inserted into the through hole of the printed wiring board 5, and soldered to the conductive layer pattern on the board. ing.
[0022]
The three-plate CCD block 10 has a heat transfer unit for releasing heat generated by the three CCDs 4 (R), 4 (G), and 4 (B) to the outside air.
The heat transfer unit according to this embodiment includes a heat receiving plate 20, a caulking sheet metal 24, a heat pipe 25, a pipe holder 26, and a heat radiating plate 27.
[0023]
FIG. 5 is an enlarged view of a portion indicated by symbol A in FIG. 4, that is, a part of the heat transfer portion between the CCD and the heat pipe. FIG. 6 is a plan view and a side view of the heat receiving plate.
As shown in FIGS. 5 and 6B, the heat receiving plate 20 is configured, for example, by stacking about 12 to 16 aluminum foils (heat transfer foils) 21 having the same shape with a thickness of 0.05 mm. As the heat transfer foil other than the aluminum foil, a metal foil having a high thermal conductivity such as gold, silver, or copper, or a graphite sheet having a thermal conductivity 3 to 4 times that of aluminum can be used.
The heat receiving plate 20 is divided into three regions (an element fixing portion, a pipe fixing portion, and a buffer portion) depending on the area and the presence or absence of an adhesive layer between the aluminum foils. As shown in FIG. 6A, the heat receiving plate 20 has a U-shaped notch 20d at the edge of one short side and a U-shaped hole 20e in the middle of the other short side. However, the wide region 20a sandwiched between the notch 20d and the hole 20e is referred to as an “element fixing portion” because the back surface of the CCD is fixed. Further, since the heat pipe 25 is fixed to the edge region 20b along the other short side of the heat receiving plate 20, the “pipe fixing portion” and the region 20c between the pipe fixing 20b and the element fixing portion 20a are “buffered”. Part ".
[0024]
As shown in FIG. 5, in the element fixing portion 20a and the pipe fixing portion 20b, an adhesive layer 22 made of, for example, a pressure sensitive adhesive is interposed between the aluminum foil 21 layers. On the other hand, in the buffer portion 20 c, such an adhesive layer 22 is not interposed between the aluminum foil 21 layers. Therefore, in the buffer portion 20c, only a predetermined number of aluminum foils 21 are stacked with a gap therebetween, and as a result, the rigidity in the thickness direction is particularly small compared to both the fixing portions 20a and 20b. For this reason, the heat receiving plate 20 is easily bent at the buffer portion 20c. In the structural example of FIG. 5, the element fixing portion 20 a and the pipe fixing portion 20 b are positioned at different levels, and the buffer portion 20 c is bent in a Z shape as viewed from the side.
[0025]
In the plan view of FIG. 6 (A), the formation position of the adhesive layer 22 is indicated by oblique lines. As a method of forming such a partial connection layer 22, screen printing is preferable because the cost is reduced for mass production. In this method, an adhesive layer is screen-printed in a repetitive pattern on a standard-sized aluminum foil cut out from a roll, a predetermined number of printed aluminum foils are stacked and pressed, and then die-cut or formed into a predetermined shape. Cut. When the adhesive layer 22 is made of a pressure sensitive adhesive, the adhesive strength between the aluminum foils is increased during pressing.
[0026]
As shown in FIG. 5, one surface of the element fixing portion 20a is fixed to the back surface of the CCD 4 (G) with, for example, a double-sided tape 23 having high thermal conductivity.
On the other hand, a screw hole 20f is formed in the pipe fixing portion 20b (FIG. 6A), and is screwed to the caulking sheet metal 24 at this screw hole portion. The caulking sheet metal 24 includes a straight portion 24a that is in close contact with the pipe fixing portion 20b, and a caulking portion 24b that is wound in close contact with the circumferential direction of the heat pipe 25.
[0027]
7 shows a side view (FIG. 7A), a rear view (FIG. 7B), and a top view (FIG. 7A) of the caulking sheet metal, the heat pipe, the pipe holder and the heat radiating plate extracted from FIGS. FIG. 7C). 8 is a rear view and a top view of the caulking sheet metal, FIG. 9 is a side view and a rear view of the pipe holder, and FIG. 10 is a rear view and a top view of the heat radiating plate.
The heat pipe 25 is commercially available as a general-purpose product, and pure water, for example, is sealed as a refrigerant in a tube having an annular cross section of about 2φ. When the heat pipe 25 receives heat, the internal refrigerant is vaporized, and the heat pipe itself absorbs heat by the latent heat at that time. Further, since the heat pipe 25 is made of a highly heat conductive material such as copper, it functions as a heat transfer tube that transfers the remaining heat to the heat radiating plate 27.
As shown in FIG. 7A, the heat pipe 25 is bent at several places with a curvature within a range in which the thermal conductivity and the endothermic property are not lowered, and the crimping sheet metal 24 is attached to three straight portions.
[0028]
Such a heat pipe 25 has better heat absorption as the heat source is located on the lower side where the refrigerant tends to accumulate. Therefore, when the CCD shown in FIG. 2 is mounted, the farther away from the R-ch, G-ch, B-ch and the heat radiating plate 27, the better the heat absorption. As a result, each CCD 4 (R), 4 (G), 4 (B ) Is devised so that the cooling efficiency does not vary so much.
[0029]
As shown in FIG. 9, the pipe holder 26 includes a base portion 26a screwed to the prism block 12, a wall portion 26b extending from one end side of the base portion 26a at a right angle to the base portion 26a, and a base portion from both the left and right sides of the wall portion 26b. 26a, and an arm portion 26c that extends parallel to 26a and holds the heat pipe 25 at the tip portion. The base part 26a, the wall part 26b, and the arm part 26c are integrally formed. One of the screw holes provided in the base portion 26a is a long hole so that the position can be easily adjusted.
If the pipe holder 26 is made of a material having a high thermal conductivity, heat can be released from the middle of the heat pipe 25 through the prism block 12 and the base block 11 in the direction of the lens attachment portion 3a.
[0030]
The heat radiating plate 27 is a plate material made of high-purity aluminum having a high thermal conductivity, such as JIS symbols: A1050 and A1100, for example, and as shown in FIG. The insertion hole 27a of the heat pipe 25 is formed. With the heat pipe 25 inserted so as to be in close contact with the inner wall of the insertion hole 27 a, the heat radiating plate 27 is firmly screwed to the prism block 12.
[0031]
FIG. 11 is a perspective view showing a modification of the heat sink and a cross-sectional view showing the mounting structure.
As shown in FIG. 11A, the heat radiating plate 30 according to this modification has a groove 30a into which the heat pipe 25 is dropped. As shown in FIG. 11B, after the heat pipe 25 is dropped into the groove 30 a, the stop plate 31 is screwed to the heat radiating plate 30 with the heat pipe 25 held down by the stop plate 31.
In such a configuration, even when the heat pipe 25 and the heat radiating plate 30 are contracted or expanded by heat, the bending state of the thin stopper plate 31 is changed to absorb the stress. Therefore, the adhesion between the heat pipe 25 and the heat radiating plate 30 is improved. Can always keep good.
[0032]
In the imaging apparatus 1 according to the present embodiment, heat generated by the three CCDs 4 (R), 4 (G), and 4 (B) in the three-plate CCD block 10 is converted into the heat receiving plate 20, the caulking sheet metal 24, and the heat pipe. 25, the heat radiating plate 27 (and the pipe holder 26), the prism block 12, and the base block 11, and then transmitted to the front panel 2 or the lens side, and then released to the outside air. Since the heat pipe 25 for efficiently transferring heat while partially absorbing heat is provided in common for the three CCDs, the cost and size of the CCD block are reduced. Further, since the heat source (CCD heat receiving plate) is located on the lower side of the pipe with respect to the heat pipe 25 to increase the heat absorption efficiency, the heat radiation of each CCD is increased. Characters do not vary much.
[0033]
In addition, a buffer portion 20c having a small rigidity is provided in the middle of the heat receiving plate 20, and internal stress generated due to a difference in the thermal expansion coefficient of the material is absorbed by the buffer portion 20c, so that it is difficult to apply stress to the CCD. In particular, in the structure of the present embodiment in which the heat receiving plate 20 is realized by a laminated structure of the aluminum foil 21 and the rigidity is weakened by not interposing the adhesive layer 22 between the aluminum foil 21 only in the buffer portion 20c, the thin aluminum foil 21 is formed. Since it is easy to deform freely, the buffer 20c has a high stress absorption effect, and batch production such as screen printing is possible and easy to make. Therefore, CCD misalignment and image quality degradation can be achieved at low cost.
[0034]
Since this heat receiving plate 20 has a buffer portion 20c and is easy to bend, more aluminum foils can be stacked than the number for making the same thickness as a conventional single plate (solid) aluminum plate material. In other words, the conventional aluminum sheet material has a limitation on bending (upper limit of the plate thickness) and cannot be thickly increased. However, in this embodiment, the effective thickness of the aluminum portion (aluminum foil thickness × number of sheets) is conventionally set. The cross-sectional area can be increased by increasing the thickness, and the thermal resistance of the heat receiving plate 20 can be lowered.
[0035]
【The invention's effect】
According to the imaging apparatus according to the present invention, since one common heat pipe is provided via all of the plurality of imaging elements, the imaging element can be easily reduced in size and cost.
In addition, the initial stress when the image sensor is fixed is reduced, and the buffer portion provided on the heat receiving plate absorbs the stress when the temperature changes, so that the image quality does not deteriorate due to the stress applied to the image sensor. Moreover, since heat radiation is sufficient by lowering the heat resistance of the heat receiving plate or making the heat transfer loss of the heat radiating plate as small as possible, the dark current caused by heat is sufficiently suppressed, and high image quality can be maintained.
[Brief description of the drawings]
FIG. 1 is a side view of a commercial three-plate CCD color camera according to an embodiment of the present invention.
FIG. 2 is a side view of a three-plate CCD block according to an embodiment of the present invention.
FIG. 3 is a rear view of the three-plate CCD block according to the embodiment of the present invention.
FIG. 4 is a top view of a three-plate CCD block according to an embodiment of the present invention.
5 is an enlarged view of a portion indicated by reference symbol A in FIG. 4 of the three-plate CCD block according to the embodiment of the present invention, that is, a part of a heat transfer portion between the CCD and the heat pipe.
FIG. 6 is a plan view and a side view of a heat receiving plate according to an embodiment of the present invention.
FIGS. 7A and 7B are a side view, a rear view, and a top view showing an assembly of a caulking sheet metal, a heat pipe, a pipe holder, and a heat radiating plate constituting the heat transfer unit according to the embodiment of the present invention.
FIG. 8 is a rear view and a top view of a caulking sheet metal according to an embodiment of the present invention.
FIG. 9 is a side view and a rear view of a pipe holder according to an embodiment of the present invention.
FIGS. 10A and 10B are a rear view and a top view of a heat sink according to an embodiment of the present invention. FIGS.
FIG. 11 is a perspective view showing a modified example of the heat sink in the embodiment of the present invention and a cross-sectional view after attachment.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... 3 plate type CCD color camera (imaging device), 2 ... Front panel, 3 ... Lens, 3a ... Lens attachment part, 4 (R), 4 (G), 4 (B) ... CCD (imaging device), 4a ... Adhering portion, 4b ... transparent window, 4c ... lead, 5 ... printed wiring board, 10 ... CCD block, 11 ... base block, 12 ... prism block, 13 ... dichroic prism, 14 ... trimming filter, 15 ... first mounting part, 15a ... fixed part, 16 ... second mounting part, 16a ... substrate support wall, 20 ... heat receiving plate, 20a ... element fixing part, 20b ... pipe fixing part, 20c ... buffer part, 21d ... notch part, 21e ... hole part 20f ... screw hole, 21 ... aluminum foil (heat transfer foil), 22 ... adhesive layer, 23 ... double-sided tape, 24 ... caulking sheet metal, 24a ... straight part, 24b ... caulking part, 25 Heat pipe, 26 ... pipe holder, 26a ... base portion, 26b ... wall portion, 26c ... arm portion, 27, 30 ... heat radiating plate, 27a ... insertion hole, 30a ... groove, 31 ... stop plate (fixture).

Claims (11)

A plurality of image sensors each photoelectrically converting light taken from outside;
A heat transfer section that transfers heat generated by the plurality of image sensors to the outer surface of the apparatus ;
Have
Above Kinetsu transmission unit,
One common heat pipe for guiding the heat from each image sensor to the outer surface side of the apparatus via all of the plurality of image sensors ;
A plurality of heat receiving foils, each of which is formed by laminating a plurality of heat transfer foils of gold, silver, copper or aluminum and arranged for each of the image pickup elements, and a plurality of heat receiving plates for transferring heat from the image pickup elements to the common heat pipe,
Including
Each of the plurality of heat receiving plates includes an element fixing portion where one outer surface in the stacking direction of the heat transfer foil is fixed to the back surface of the imaging element, a pipe fixing portion where the common heat pipe is fixed, and the element A buffer portion between the fixing portion and the pipe fixing portion, and in each of the element fixing portion and the pipe fixing portion, an adhesive layer is interposed between the layers of the laminated heat transfer foils, and the buffer portion In the image pickup apparatus , a gap is formed between the layers of the plurality of heat transfer foils so that the stress generated when the image pickup element is fixed and heat is generated can be absorbed by not interposing the adhesive layer . The imaging apparatus according to claim 1 , wherein the heat receiving plate has a fixing surface of the imaging element and a fixing surface of the common heat pipe formed in steps, and the plurality of heat transfer foils in the buffer section are bent. . The imaging device according to claim 2 , wherein the heat transfer foil in the buffer portion is bent in a Z shape when viewed from a side surface. The imaging device according to claim 1 , wherein the adhesive layer is screen-printed on both surfaces or a part of one surface of the heat transfer foil. The imaging device according to claim 1 , wherein the imaging element is fixed on the heat receiving plate via a thermally conductive double-sided tape. The heat-receiving foil is attached to the outer surface of the heat-transfer foil in the stacking direction of the pipe fixing portion, and the heat-receiving member is connected to the common heat pipe passing therethrough through a sheet metal that is wound and adhered in a circumferential direction of the common heat pipe. The plate and the common heat pipe are fixed
  The imaging device according to claim 1. The imaging device according to claim 1, wherein the common heat pipe is an annular tube having a circular cross section and is bent at several places with a curvature within a range in which a refrigerant is sealed in the tube and a predetermined heat conduction characteristic can be ensured. The imaging apparatus according to claim 1, wherein the heat transfer unit includes a heat radiating plate that holds one end of the common heat pipe and is directly or indirectly fixed to the apparatus housing. A groove corresponding to the outer shape of the common heat pipe is formed in the heat radiating plate, and one end of the common heat pipe is accommodated in the groove, and is fixed by a fixture attached to the outer surface of the heat radiating plate around the groove. The imaging device according to claim 8 , wherein the imaging device is pressed against an inner surface of the groove. Having a lens and a prism,
Said plurality of image pickup elements, the position where it can receive light in a wavelength region of a specific range are dispersed by a built-in the prism which receives the light from the lens, an imaging apparatus according to claim 1, each being fixed . Upper Symbol IMAGING elements, red, green, and blue imaging apparatus according to claim 10 which is 3 provided to convert each photoelectric input image light of each wavelength region of.

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