JP2001053991A - Image pickup unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a heat radiating structure for an image pickup device which does not cause generating of noise and electromagnetic noise, keeps stress to an image pickup device within a proper range at a level equal to or lower than some level without remarkably varying with respect to the temperature variation of environment and is saved in space. SOLUTION: The image pickup unit incorporates plural image pickup devices 4(R), 4(G) and 4(B) each for photo-electrically converting light fetched from the outside and a heat transferring part for radiating heat generated from the device. The heat transferring part includes one common heat pipe 25 for guiding heat from each image pickup device via all the image pickup devices to the outer surface side of the unit and a hat receiving board 20 for receiving heat from the backside of the device to transfer the heat to the pipe 25. The board 20 has a buffering part 20c of low rigidity between both of the fixing parts 20a and 20b for the devices and the pipe. When the heat receiving board 20 is formed by laminating heat-transferring foils 21, an adhered layer 22 is not formed between the heat-transferring foils only at the part 20c to be easily curved to be bent.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup apparatus having a plurality of image pickup devices such as a three-panel video camera. Specifically, the present invention relates to a heat dissipation structure of an image pickup device that efficiently dissipates heat from the back surface of an image pickup device to an external panel or an externally mounted component.

[0002]

2. Description of the Related Art In a so-called three-plate type color video camera, incident light is reflected by a built-in diloic prism.
The light is separated into wavelength regions of (red), G (green), and B (blue), and input to three image sensors that are accurately positioned corresponding to a desired wavelength region. Therefore, a three-chip color video camera has a higher resolution than a single-chip color video camera which obtains a color image signal by reducing the resolution to 1/3 with an image pickup device having an on-chip filter, and is equal to or more than a monochrome image. High definition images can be obtained. The three image sensors in this video camera are required to have a sub-micron accuracy in their mutual positioning, and are fixed to the CCD stage with high accuracy in a total of six axes of three axes of x, y, z and a tilt angle of each axis. ing. In addition, in this high-performance video camera, there is a strict requirement for suppression of dark current caused by heat, and in the structure design, the heat radiation efficiency of the image sensor must be as high as possible to minimize the noise component due to dark current of the image signal. is important.

[0003] As a cooling method in a conventional color video camera, there are a fan cooling method, an electronic cooling method using a Peltier element, etc., a heat pipe for inducing heat to other parts having a large heat capacity, and for evaporating a refrigerant sealed in the pipe. There is a refrigerant vaporization method that absorbs heat using latent heat.
For example, Japanese Patent Application Laid-Open No. 9-98318 discloses these three types.
The three image sensors (C
An imaging device that achieves heat radiation of CD) is disclosed.

[0004]

However, in the cooling method of the CCD in this imaging apparatus, since the cooling of the fan is also used, noise generated by the fan itself may be picked up by a built-in microphone of the camera. Electromagnetic noise from the motor may be superimposed on the weak image signal of the CCD and adversely affect the image quality. In that sense, the use of the fan cooling method is not preferable.

[0005] In addition, in the electronic cooling, a Peltier element is provided for each CCD, and a circuit for controlling the driving of the Peltier element is required.

In the cooling method using the heat pipes described in the above-mentioned publication, the cost is increased because the heat pipe is provided for each CCD, and the piping space for the heat pipe is large, so that the space for the CCD block can be reduced. There is a problem that cannot be achieved.

Although not described in detail in the above publication, a heat transfer member is usually fixed to the back surface of the CCD with an adhesive material such as a low melting point solder, and one end of the heat transfer member is wound around a heat pipe. Fixed to Therefore, CC
When D generates heat, C differs due to the difference in thermal expansion coefficient with the heat transfer member.
Stress may be applied to the CD, and this stress may cause signal distortion. In addition, the positions of the CCDs may be slightly changed to make it difficult to image a desired wavelength region. It is also possible to use a liquid substance such as a soft grease as the adhesive material. However, if such a liquid substance is used, the position of the CCD may be slightly shifted, or the liquid substance may be applied and controlled. Is complicated and becomes a factor of inhibiting productivity.

SUMMARY OF THE INVENTION It is an object of the present invention to prevent noise and electromagnetic noise from occurring, to maintain the stress on an image pickup device within an appropriate range of a certain level or less without largely fluctuating with environmental temperature changes, and to reduce power consumption. An object of the present invention is to provide an imaging device having a space-like heat dissipation structure for an imaging device.

[0009]

An image pickup apparatus according to the present invention comprises a plurality of image pickup elements for photoelectrically converting light taken in from the outside, and a heat transfer section for transmitting heat generated by the image pickup element to an outer surface of the apparatus. , Wherein the heat transfer section includes one common heat pipe that guides heat from each image sensor to the outer surface of the device via all of the plurality of image sensors.

The heat transfer section includes a heat receiving plate that receives heat from the back surface of the image pickup device and transfers the heat to the common heat pipe passing nearby. The heat receiving plate preferably has a buffer portion having lower rigidity than both the fixing portions, between the element fixing portion to which the back surface of the imaging element is fixed and the pipe fixing portion to be fixed to the common heat pipe. The heat receiving plate is formed by laminating a plurality of heat transfer foils made of a material selected from the group of, for example, gold, silver, copper, aluminum, and graphite. In this case, preferably,
While the adhesive layer is interposed between the heat transfer foils in the element fixing portion and the pipe fixing portion, the buffer portion is formed by not interposing the adhesive layer between the heat transfer foils between the two fixing portions. Have been. Preferably, in the heat receiving plate, a fixing surface of the image pickup element and a fixing surface of the common heat pipe are formed stepwise, and the plurality of heat transfer foils in the buffer portion have, for example, a Z-shaped deflection as viewed from a side surface. It has.

The adhesive layer is preferably screen-printed on both sides or a part of one side of the heat transfer foil. Also,
The imaging device is fixed on the heat receiving plate via a heat conductive double-sided tape.

The above-mentioned common heat pipe is a pipe having a circular annular cross section, a refrigerant is sealed in the pipe, and is bent at several places with a curvature within a range in which predetermined heat conduction characteristics can be secured. The heat transfer section includes a heat radiating plate that holds one end of the common heat pipe and is fixed directly or indirectly to the device housing. The heat sink preferably has a groove corresponding to the outer shape of the heat pipe, one end of the heat pipe is housed in the groove, and the groove is formed by a fixture attached to the outer surface of the heat sink around the groove. It is pressed down on the inside.

According to another aspect of the present invention, there is provided an image pickup apparatus including a plurality of image pickup elements for photoelectrically converting light taken from a lens, and a heat transfer section for transmitting heat generated by the image pickup element to an outer surface of the apparatus. In the apparatus, the heat transfer unit includes a heat receiving plate that receives heat from a back surface of the image sensor, and a heat pipe that guides heat of the heat receiving plate warmed by the image sensor to an outer surface of the device. The plate has a buffer portion having lower rigidity than both the fixing portions, between the element fixing portion to which the back surface of the imaging element is fixed and the pipe fixing portion to be fixed to the heat pipe.

In the image pickup apparatus according to the present invention, the heat generated by the plural image pickup elements is released to the outside through the common heat pipe. Since this heat pipe is provided in common among a plurality of image pickup devices, its piping space is small.

Further, in the image sensor according to the present invention, since the image sensor is fixed to the heat receiving plate via the heat conductive double-sided tape, the stress at the time of fixing is lower than that of an adhesive material such as a low melting point solder. Somewhat relaxed. The heat receiving plate is a member that receives generated heat from the back surface side of the image sensor and transmits the heat to a heat pipe passing nearby. In the present invention, a buffer is provided in the middle of the heat receiving plate. When the heat receiving plate is constructed by laminating a plurality of heat transfer foils, an adhesive layer is required to fix the heat transfer foils to each other. It has weak bending. Even when the heat transfer efficiency is increased by increasing the number of heat transfer foils, the buffer portion having such a configuration is relatively easy to bend and has good moldability. Further, when the image pickup device radiates heat or the environmental temperature changes, stress generated due to a difference in thermal expansion coefficient between the heat receiving plate material and the package material of the image pickup device is absorbed by the buffer portion. For this reason, an excessive stress is not applied to the image sensor.

On the other hand, in the heat pipe after the heat transfer, a part of the surrounding heat is taken away when the refrigerant evaporates, and the remaining heat is transferred to the heat radiating plate provided at one end through the heat pipe. In the radiator plate, the heat pipe is pressed against the inner surface of the groove, so that the heat transfer loss is small. Therefore, the heat from the heat pipe is efficiently transmitted to the outer panel or the like through the heat radiating plate and then released to the outside.

[0017]

FIG. 1 is a side view of a commercial three-panel CCD color camera. This CCD color camera 1
Is provided with a lens attachment portion 3a outside the front panel 2, and the lens 3 is detachably attached to the attachment portion 3a. A three-plate CCD block 10 is fixed to the inner surface of the front panel 2 located just behind the attachment portion 3a of the lens.

FIG. 2 is a side view, FIG. 3 is a rear view, and FIG. 4 is a top view of the three-plate type CCD block mounted on the inner surface of the front panel 2. The three-plate CCD block 10 includes a base block 11 screwed to the front panel 2 of the camera, and a prism block 12 fixed to the base block 11 so as to overlap. These blocks 11 and 12 are made of, for example, an aluminum die-cast material having high thermal conductivity.

On the outer base surface of the prism block 12, a three or four compound prism (dichroic prism) 13 assembled with a dichroic film for reflecting light of a specific wavelength interposed therebetween is fixed. The dichroic film used here has two types, one for red reflection, which reflects light components having a wavelength in the red region, and the other for blue reflection, which reflects light components having a wavelength in the blue region. Let it through. Therefore, the green light goes straight, and the red light and the blue light are emitted in different directions according to the angles of the corresponding surfaces on which the dichroic films are installed. Hereinafter, the green light path (channel) branched in three directions is G-ch, and the red light path is R
−ch, the blue light path is described as B-ch.

As shown by the G-ch portion in FIG. 4, a first mounting part 15 of the CCD is provided on the prism end face of each channel with a trimming filter 14 for each color interposed therebetween.
Has been fixed. First mounting part 15 of this CCD
The CCD 4 (G) is fixedly accommodated in the case frame-shaped second mounting part 16. That is, C is located in the outer space partitioned by the peripheral wall of the second mounting part 16.
CD4 (G) is housed with its glass window 4b on the inside, and screws (see Fig. 3) for adjusting the x-axis, y-axis, z-axis and the tilt angle of each axis. After finely adjusting the position of the CCD inside the fixing portions 4a, 4a, which are provided in advance in both the CCD 4 (G) and the first mounting part 15,
The surfaces 15a are joined together and fixed with an adhesive or the like. Although the details of the mounting structure are not shown, the CCD 4 (B) for blue and the CCD 4 (R) for red also
Similarly, it is attached to the corresponding prism end face.

The second mounting part 16 has a board supporting wall 16a protruding outward at a central portion of a peripheral wall on a short side thereof. Although not shown in FIG. 3 for simplicity, the printed wiring board 5 is installed while being supported by the board support wall 16a as shown by G-ch in FIGS. 2 and 4. As shown in FIG. 2, the CCD 4 (R), 4 (G) or 4
The lead 4c extending from the back surface of (B) is inserted and connected to the conductive layer pattern on the substrate by soldering.

The three-plate type CCD block 10 has three CCs.
D4 (R), 4 (G), and 4 (B) have a heat transfer section for releasing the heat generated to outside air. The heat transfer section according to the present embodiment includes a heat receiving plate 20, a caulking sheet metal 24, a heat pipe 25, a pipe holder 26, and a radiator plate 27.

FIG. 5 is an enlarged view of a portion indicated by reference numeral A in FIG. 4, that is, a part of a heat transfer portion between the CCD and the heat pipe. FIG. 6 is a plan view and a side view of the heat receiving plate. As shown in FIGS. 5 and 6B, the heat receiving plate 20 is formed by, for example, stacking 12 to 16 aluminum foils (heat transfer foils) 21 having the same shape and a thickness of 0.05 mm. Heat transfer foils other than aluminum foil include gold,
A metal foil having high heat conductivity such as silver or copper, or a graphite sheet having a heat conductivity three to four times as high as aluminum can be used. The heat receiving plate 20 is divided into three regions (an element fixing portion, a pipe fixing portion, and a buffer portion) according to the area and the presence or absence of an adhesive layer between aluminum foils. Heat receiving plate 2
0, as shown in FIG. 6A, a U-shaped notch 20d at one short side edge, and a U-shaped notch near the other short side.
Although it has a character-shaped hole 20e, the wide area 20a sandwiched between the notch 20d and the hole 20e is called an "element fixing portion" because the back surface of the CCD is fixed. Also,
Since the heat pipe 25 is fixed to the edge region 20b along the other short side of the heat receiving plate 20, a "pipe fixing portion" is formed, and a region 20c between the pipe fixing portion 20b and the element fixing portion 20a is formed.
Is called a "buffer".

As shown in FIG. 5, an adhesive layer 22 made of, for example, a pressure-sensitive adhesive is interposed between the aluminum foils 21 in the element fixing portion 20a and the pipe fixing portion 20b. On the other hand, in the buffer portion 20c, such an adhesive layer 22 does not intervene between the layers of the aluminum foil 21. Therefore, in the buffer portion 20c, only a predetermined number of aluminum foils 21 are stacked with a gap therebetween.
In particular, the rigidity in the thickness direction is smaller than that of the first and second parts 0a and 20b. For this reason, the heat receiving plate 20 is easily bent at the buffer portion 20c. In the structure example of FIG. 5, the element fixing portion 20a and the pipe fixing portion 20b are located at different levels, and the buffer portion 20c has a Z-shaped bending as viewed from the side.

In the plan view of FIG. 6A, the formation position of the adhesive layer 22 is indicated by oblique lines. As a method for forming such a partial connection layer 22, screen printing is preferable because it is suitable for mass production and the cost is reduced. In this method, an adhesive layer is screen-printed in a repetitive pattern on a fixed-size aluminum foil cut from a roll, and a predetermined number of printed aluminum foils are pressed and pressed, and then die-cut or cut into a predetermined shape. To cut. When the adhesive layer 22 is made of a pressure-sensitive adhesive, the adhesive strength between the aluminum foils at the time of pressing increases.

As shown in FIG. 5, one surface of the element fixing portion 20a is covered with a double-sided tape 23 having high thermal conductivity, for example.
It is fixed to the back surface of D4 (G). On the other hand, a screw hole 20f is formed in the pipe fixing portion 20b (FIG. 6A).
It is screwed to the caulking sheet metal 24 at this screw hole. The caulking sheet metal 24 has a straight portion 24a that is in close contact with the pipe fixing portion 20b, and a caulking portion 24b that is wound in close contact with the heat pipe 25 in the circumferential direction.

FIG. 7 is a side view (FIG. 7 (A)), a rear view (FIG. 7 (B)), and a rear view showing the caulking sheet metal, the heat pipe, the pipe holder and the heat radiating plate extracted from FIGS. It is a top view (FIG. 7 (C)). 8 is a rear view and a top view of the swaged sheet metal, FIG. 9 is a side view and a rear view of the pipe holder, and FIG. 10 is a back view and a top view of the heat sink. The heat pipe 25 is commercially available as a general-purpose product, and for example, pure water is sealed as a refrigerant in a tube having an annular cross section of about 2φ. When the heat pipe 25 receives the heat, the internal refrigerant evaporates, and the heat pipe itself absorbs heat due to the latent heat at that time. Further, since the heat pipe 25 is made of a highly heat conductive material such as copper, the heat pipe 25 functions as a heat transfer tube for transmitting the remaining heat to the heat sink 27. As shown in FIG. 7 (A), the heat pipe 25 is bent at several places with a curvature that does not decrease the thermal conductivity and the heat absorption, and the caulking sheet metal 24 is attached to three straight portions.

The heat pipe 25 has a higher heat absorbing property as the heat source is located on the lower side where the refrigerant easily accumulates. Therefore, when the CCD shown in FIG. 2 is mounted, R-ch, G-c
The farther away from the h, B-ch and the heat radiating plate 27, the better the heat absorbing property. As a result, the cooling efficiency is not so varied among the CCDs 4 (R), 4 (G), 4 (B). .

The pipe holder 26 is, as shown in FIG.
A base 26a screwed to the prism block 12,
A wall 26b extending from one end of the base 26a at right angles to the base 26a, and an arm 26 extending parallel to the base 26a from both left and right sides of the wall 26b and holding the heat pipe 25 at a tip portion.
c. The base 26a, the wall 26b, and the arm 26c are integrally formed. The base 26
One of the screw holes provided in a is a long hole so that the position can be easily adjusted. When the pipe holder 26 is made of a material having a high thermal conductivity, heat can be released from the middle of the heat pipe 25 through the prism block 12 and the base block 11, particularly toward the lens attachment portion 3a.

The radiator plate 27 is made of, for example, JIS symbol: A
It is a plate made of high-purity aluminum having a high thermal conductivity, such as 1050 or A1100. As shown in FIG. 10, the insertion hole 27a of the heat pipe 25 extends from its side to the depth (or penetrates the opposing sides). Is formed. The heat radiating plate 27 is firmly screwed to the prism block 12 with the heat pipe 25 inserted so as to be in close contact with the inner wall of the insertion hole 27a.

FIG. 11 is a perspective view showing a modification of the heat sink.
FIG. 3 is a cross-sectional view illustrating a mounting structure. As shown in FIG. 11A, the heat radiating plate 30 according to this modification has a groove 30a into which the heat pipe 25 is dropped. FIG.
As shown in FIG. 1B, after the heat pipe 25 is dropped into the groove 30a, the stop plate 31 is screwed to the heat radiating plate 30 with the heat pipe 25 held down by the stop plate 31. In such a configuration, even when the heat pipe 25 and the heat radiating plate 30 contract or expand due to heat, the bending of the thin stopper plate 31 changes to absorb the stress.
5 and the heat radiating plate 30 can always be kept in good contact.

In the imaging apparatus 1 according to the present embodiment, the third
Three CCDs 4 in the plate-type CCD block 10
(R), 4 (G), and 4 (B) generate heat at the heat receiving plate 2.
0, after being transmitted to the front panel 2 or the lens side via the caulking sheet metal 24, the heat pipe 25, the heat radiating plate 27 (and the pipe holder 26), the prism block 12, and the base block 11, are released to the outside air. . The heat pipe 25 that efficiently transfers heat while absorbing part of the heat
Since the CCD block is provided in common, the cost and size of the CCD block are reduced. In addition, heat pipe 2
On the other hand, since the heat source (CCD heat receiving plate) is located at the lower side of the pipe at a position farther from the heat radiating plate 27 and the heat absorption efficiency is increased, even if the heat pipe 25 is common, the heat radiating characteristics of each CCD are not so large Not stick.

Further, a buffer portion 20c having a small rigidity is provided in the middle of the heat receiving plate 20, whereby internal stress generated due to a difference in thermal expansion coefficient of the material is absorbed by the buffer portion 20c, so that stress is applied to the CCD. Hateful. In particular,
In the structure of the present embodiment in which the heat receiving plate 20 is realized by the laminated structure of the aluminum foil 21 and the rigidity is weakened by not interposing the adhesive layer 22 between the aluminum foils 21 only in the buffer portion 20c, the thin aluminum foil 21 can be freely formed. Buffer part 20c because it is easily deformed
Has a high stress absorption effect, and can be batch-produced such as screen printing, making it easy to manufacture. Therefore, the displacement of the CCD and the deterioration of the image quality can be achieved at low cost.

Since the heat receiving plate 20 has the buffer portion 20c and is easy to bend, a larger number of aluminum foils can be laminated than the conventional one-piece (solid) aluminum plate having the same thickness. In other words, unlike the conventional one, there was a restriction on bending (the upper limit of the plate thickness) with a single aluminum plate material, and the aluminum plate could not be thickened unnecessarily. The heat resistance of the heat receiving plate 20 can be reduced by increasing the thickness and the cross-sectional area.

[0035]

According to the image pickup apparatus of the present invention, one common heat pipe is piped through all of the plural image pickup devices, so that the size and cost of the image pickup device can be reduced in a small space. Easy to plan. Further, the initial stress at the time of fixing the image sensor is reduced, and the buffer portion provided on the heat receiving plate absorbs the stress when the temperature changes, so that the image quality does not deteriorate due to the stress applied to the image sensor. Further, since the heat dissipation is sufficient by lowering the thermal resistance of the heat receiving plate or minimizing the heat transfer loss of the heat radiating plate, dark current caused by heat is sufficiently suppressed, and high image quality can be maintained.

[Brief description of the drawings]

FIG. 1 is a commercial three-plate CCD according to an embodiment of the present invention.
It is a side view of a color camera.

FIG. 2 is a side view of a three-plate CCD block according to the embodiment of the present invention.

FIG. 3 is a rear view of the three-plate CCD block according to the embodiment of the present invention.

FIG. 4 is a top view of a three-plate CCD block according to the embodiment of the present invention.

FIG. 5 is an enlarged view of a portion indicated by reference numeral A in FIG. 4 of the three-plate CCD block according to the embodiment of the present invention, that is, a part of a heat transfer unit between the CCD and the heat pipe.

FIG. 6 is a plan view and a side view of the heat receiving plate according to the embodiment of the present invention.

FIG. 7 constitutes a heat transfer section according to the embodiment of the present invention;
It is a side view, a rear view, and a top view showing an assembly of a caulking sheet metal, a heat pipe, a pipe holder, and a heat sink.

FIG. 8 is a rear view and a top view of the swaged sheet metal according to the embodiment of the present invention.

FIG. 9 is a side view and a rear view of the pipe holder according to the embodiment of the present invention.

FIG. 10 is a rear view and a top view of the heat sink according to the embodiment of the present invention.

FIG. 11 is a perspective view showing a modification of the heat sink in the embodiment of the present invention, and a sectional view after attachment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... 3 board | substrate CCD color camera (imaging device), 2 ... front panel, 3 ... lens, 3a ... lens attachment part, 4
(R), 4 (G), 4 (B) ... CCD (imaging device), 4
a: fixing portion, 4b: transparent window, 4c: lead, 5: printed wiring board, 10: CCD block, 11: base block, 12: prism block, 13: dichroic prism, 14: trimming filter, 15: first mounting Parts, 15a: fixing part, 16: second mounting part,
16a: substrate support wall, 20: heat receiving plate, 20a: element fixing part, 20b: pipe fixing part, 20c: buffer part, 21d ...
Notch, 21e: hole, 20f: screw hole, 21: aluminum foil (heat transfer foil), 22: adhesive layer, 23: double-sided tape,
24 ... caulking sheet metal, 24a ... straight part, 24b ...
Crimping part, 25: heat pipe, 26: pipe holder, 2
6a: base, 26b: wall, 26c: arm, 27,
30 heat sink, 27a insertion hole, 30a groove, 31
... Stop plate (fixture).

Claims (22)

[Claims] 1. An image pickup apparatus, comprising: a plurality of image pickup elements for photoelectrically converting light taken in from the outside; and a heat transfer unit for transmitting heat generated by the image pickup elements to an outer surface of the apparatus. The imaging device includes one common heat pipe that guides heat from each imaging device to the outer surface of the device via all of the plurality of imaging devices. 2. The image pickup apparatus according to claim 1, wherein the heat transfer section includes a heat receiving plate that receives heat from a back surface of the image pickup device and transfers the heat to a common heat pipe passing nearby. 3. The heat receiving plate has a buffer portion, which is lower in rigidity than both fixing portions, between an element fixing portion to which the back surface of the imaging element is fixed and a pipe fixing portion to be fixed to the common heat pipe. The imaging device according to claim 2. 4. The imaging device according to claim 2, wherein said heat receiving plate is formed by laminating a plurality of heat transfer foils. 5. The heat receiving plate is formed by laminating a plurality of heat transfer foils, and an adhesive layer is interposed between the heat transfer foils in the element fixing portion and the pipe fixing portion. The imaging device according to claim 3, wherein the buffer portion is formed by not interposing an adhesive layer between the heat transfer foils. 6. The heat receiving plate, wherein a fixing surface of the imaging element and a fixing surface of the common heat pipe are formed stepwise, and the plurality of heat transfer foils in the buffer portion are bent. An imaging device according to claim 1. 7. The imaging device according to claim 6, wherein the heat transfer foil in the buffer portion is bent in a Z shape when viewed from a side. 8. The imaging device according to claim 5, wherein said heat transfer foil is made of a material selected from the group consisting of gold, silver, copper, aluminum and graphite. 9. The imaging device according to claim 5, wherein said adhesive layer is screen-printed on both sides or a part of one side of said heat transfer foil. 10. The imaging device according to claim 2, wherein the imaging device is fixed on the heat receiving plate via a thermally conductive double-sided tape. 11. The heat pipe according to claim 1, wherein the common heat pipe is a circular pipe having a circular cross section, a refrigerant is sealed in the pipe, and the pipe is bent at several places with a curvature within a range capable of securing predetermined heat conduction characteristics. Imaging device. 12. The imaging apparatus according to claim 1, wherein said heat transfer section includes a heat radiating plate which holds one end of said common heat pipe and is fixed directly or indirectly to an apparatus housing. 13. A groove corresponding to the outer shape of the heat pipe is formed in the heat sink, and one end of the heat pipe is housed in the groove and attached to an outer surface of the heat sink around the groove. 13. The imaging device according to claim 12, wherein the fixing device is pressed against the inner surface of the groove. 14. The image pickup device according to claim 1, wherein each of the plurality of image pickup devices is fixed at a position capable of receiving light in a wavelength range of a specific range separated by a built-in prism having received light from the lens. An imaging device according to any one of the preceding claims. 15. The image pickup device according to claim 3, wherein each of the plurality of image pickup devices photoelectrically converts input image light in each of red, green, and blue wavelength regions.
The imaging device according to claim 14, wherein one is provided. 16. An image pickup apparatus incorporating a plurality of image pickup elements for photoelectrically converting light taken in from a lens, respectively, and a heat transfer section for transmitting heat generated by the image pickup elements to an outer surface of the apparatus. The unit includes a heat receiving plate that receives heat from the back surface of the imaging device, and a heat pipe that guides the heat of the heat receiving plate heated by the imaging device to the outer surface side of the device, wherein the heat receiving plate is a back surface of the imaging device. An image pickup apparatus, comprising: a buffer portion having a lower rigidity than both fixing portions, between an element fixing portion to which is fixed and a pipe fixing portion fixed to the heat pipe. 17. The imaging device according to claim 16, wherein the heat receiving plate is formed by laminating a plurality of heat transfer foils. 18. The heat receiving plate is formed by laminating a plurality of heat transfer foils, and an adhesive layer is interposed between the heat transfer foils in the element fixing portion and the pipe fixing portion. 17. The imaging device according to claim 16, wherein the buffer portion is formed by interposing no adhesive layer between the heat transfer foils. 19. The heat receiving plate according to claim 16, wherein the fixing surface of the image pickup element and the fixing surface of the heat pipe are formed stepwise, and the plurality of heat transfer foils in the buffer portion are bent. An imaging device according to any one of the preceding claims. 20. The imaging device according to claim 19, wherein the heat transfer foil in the buffer portion is bent in a Z-shape as viewed from a side. 21. The imaging device according to claim 16, wherein said heat transfer foil is made of a material selected from the group consisting of gold, silver, copper, aluminum, and graphite. 22. The imaging device according to claim 18, wherein said adhesive layer is screen-printed on both sides or a part of one side of said heat transfer foil.