JP2001148437A - Solid image pickup element package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent temperature increase due to the heat generation of a solid image pickup element within an inexpensive and light configuration without newly adding any parts in a package for accommodating the solid image pickup element. SOLUTION: An uneven part 1c is provided at one portion or entire portion of the surface of a package for accommodating a solid image pickup element 2. Then, heat from the solid image pickup element 2 is transferred to the uneven part 1c with a large surface area through an adhesive 3 for efficient cooling. Also, inexpensive and light plastic is used as a plastic material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package for accommodating a solid-state imaging device, and more particularly to a solid-state imaging device package having a heat radiation function.

[0002]

2. Description of the Related Art In addition to a conventional silver halide film, a solid-state imaging device such as a CCD has been used as a medium for photographing a subject. Devices equipped with the solid-state imaging device, so-called electronic cameras, have already been commercialized. Have been. This solid-state imaging device is usually housed in a package that is resin-molded in a concave shape. However, heat generated during operation of the solid-state imaging device is trapped in the package, which causes a rise in the temperature of the solid-state imaging device. ing. The increase in the temperature causes an increase in the absolute value of the output signal level of a pixel defect called a white defect or a black defect. At this time, if an image is taken using an electronic camera equipped with the solid-state imaging device, the image quality deteriorates. I do.

As a countermeasure for this, three methods are conceivable. First, a member having a heat radiation effect as disclosed in JP-A-08-298303 and JP-A-09-064251 is newly added. There is a way to add it. FIG. 5 is a cross-sectional view showing a configuration of a solid-state imaging device package using the method.

In FIG. 5, reference numeral 100 denotes a package made of a thermosetting resin such as an epoxy resin, an imide resin, a polyimide resin, a silicone resin, an acrylic resin, a phenol resin, and an unsaturated polyester resin which are molded into a concave shape. The solid-state imaging device 10 is placed on the bottom of the concave portion 100a.
1 is provided on the lower surface side of the solid-state imaging device 101 in order to effectively dissipate heat.
Metal heat sink (1) 10 having an outer shape larger than 1
There are two. Further, the heat radiating plate (2) 103 connected to the heat radiating plate 102 is
0b is exposed to the outside.

Therefore, the heat generated by the solid-state image pickup device 101 is first absorbed by the heat radiating plate 102, and further transmitted through the outer heat radiating plate 103 to be radiated out of the package 100.

Reference numerals 104 and 105 denote outer leads and inner leads which are integrally formed with the package 100. The bonding pads of the solid-state image pickup device 101 and the inner leads 105 are electrically connected by wires 106 made of an aluminum thin wire or a gold thin wire. I have. A transparent cap 107 made of optical glass is adhered to the upper surface of the package 100 with a thermosetting epoxy resin or the like, thereby hermetically sealing the inside of the package 100.

As a second method, there is a method of correcting a pixel defect caused by a rise in temperature instead of a method of preventing a rise in temperature of a solid-state image pickup device, such as a defect correction method such as 0-order correction and primary interpolation. The PRN correction method has been put to practical use.

Third, the material of the package is made of plastic (thermal conductivity: 2 × 10 −4 cal / (m
m.sec..degree. C.)) to make a ceramic having a high thermal conductivity (40.times.10.sup.-4 cal / (mm.sec..degree. C.)). Most of the heat generated can be radiated to the atmosphere through the base frame on the back surface of the package, so that the signal level of the pixel defect is reduced to a level that does not cause any problem.

[0009]

However, in the above-described conventional solid-state imaging device package, the first measure of dissipating the heat of the solid-state imaging device to the outside by using a heat-radiating plate is the same as that of the heat-radiating plate. However, since the number of components increases, the cost of the device increases, and the airtightness of the package is impaired because a part of the heat sink is exposed to the outside.
There is a problem that moisture enters from outside and the moisture resistance is poor.

In the second method of correcting a pixel defect caused by a rise in temperature, the correction method must be changed in accordance with a change in temperature. Therefore, a new temperature sensor is required. Since a register for storing pixel data is also required, there arises a problem that the number of components increases and the cost increases.

In the third measure, a method of changing the package material from plastic to ceramic having a high thermal conductivity, ceramic is more expensive and has higher specific gravity than plastic (ceramic has a specific gravity of 2%). .0
-2.6, plastic is around 1.0), which is contrary to the recent demand for lower price, smaller size and lighter weight of the apparatus, and is not a very good method.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and can prevent a temperature rise of a solid-state imaging device which causes a pixel defect without newly adding a component. It is another object of the present invention to provide an inexpensive, compact and lightweight solid-state imaging device package.

[0013]

The solid-state image pickup device package according to the present invention is constructed as follows.

(1) A package for accommodating a solid-state image sensor, wherein a plurality of uneven portions are provided on the surface.

(2) In the structure of the above (1), the uneven portion is provided on a part of the surface.

(3) In the structure of the above (1), the uneven portion is provided on the entire surface.

(4) In any one of the above-mentioned constitutions (1) to (3), it is molded with plastic.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 1 and 2 are perspective views showing the appearance of the solid-state imaging device package of the embodiment. FIG. 1 shows a case when viewed from above, and FIG. 2 shows a case when viewed from below. Also,
FIG. 3 is a cross-sectional view showing a state of being mounted on a substrate, and FIG. 4 is a view showing a heat path.

1 to 4, reference numeral 1 denotes a solid-state imaging device 2.
This is a package for storing plastic. 3 is an adhesive, 4 is an inner lead, 5 is an outer lead, 6 is a wire, 7 is a cover glass, and 8 is a substrate.

In the solid-state image pickup device package structure of the present embodiment, as shown in the figure, the solid-state image pickup device 2 has a thermal conductivity higher than that of the package 1 in the concave portion 1a of the package 1 formed of resin (plastic) in a concave shape. They are bonded by a large adhesive 3. On the surface 2a of the solid-state imaging device 2, an image forming area where a photographic light beam forms an image and bonding pads are laid out therearound. The bonding pad is electrically connected to the inner lead 4 and the outer lead 5 by a wire 6. The outer leads 5 are mounted by soldering on a substrate 8 on which a driver or the like for controlling the solid-state imaging device 2 is mounted.

Further, a plurality of fin-shaped uneven portions 1c for providing a heat radiation effect are present on the surface side of the bottom 1b of the package 1, and the heat generated from the solid-state imaging device 2 passes through the adhesive 3 The light is transmitted from the bottom 1b of the package 1 to the uneven portion 1c, and diverges into the atmosphere from the uneven portion 1c having a larger surface area than a flat surface (path R1 in FIG. 4).

At this time, the side wall 1 of the package 1
The thickness T of the package 1 is made thin enough to maintain the strength of the package 1. Therefore, a path (R in FIG. 4) for transmitting from the side wall 1d of the package 1 to the upper surface 1e of the package 1 is formed.
2) is narrow, the amount of heat passing therethrough decreases, and most of the heat generated from the solid-state imaging device 2 passes through the route R1.

Further, the upper surface 1e of the package 1 and the cover glass 7 are bonded by a thermosetting adhesive, so that the inside of the package 1 is sealed, so that dust, dust and the like do not enter. I have.

As described above, in this embodiment, the solid-state imaging device 2
Temperature rise can be prevented without newly increasing components such as heat sinks. Further, even if the material of the package 1 is made of plastic, an inexpensive and lightweight solid-state image pickup device package having the heat radiation effect seen in the ceramic material can be realized.

The uneven portion 1 on the surface of the package 1
c can be provided on part or all of the surface.

[0026]

As described above, according to the present invention,
Since a plurality of concave-convex portions are provided on the surface of the package that houses the solid-state imaging device, it is possible to prevent the temperature of the solid-state imaging device from rising without adding additional components such as heat sinks, and to reduce the temperature without increasing the cost. The rise can be prevented.

Further, by using plastic as the material of the package, the heat radiation effect seen in the ceramic material can be provided without using expensive and high specific gravity ceramic for the package material. Package can be realized.

[Brief description of the drawings]

FIG. 1 is a perspective view showing the appearance of a solid-state imaging device package according to an embodiment of the present invention.

FIG. 2 is a perspective view illustrating an appearance of a solid-state imaging device package according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view illustrating a state where the solid-state imaging device package according to the embodiment is mounted on a substrate.

FIG. 4 is an explanatory diagram illustrating heat paths of the solid-state imaging device package according to the embodiment;

FIG. 5 is a sectional view showing a configuration of a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Package 1c Irregular shape part 2 Solid-state image sensor 3 Adhesive 8 Substrate

Claims (4)

[Claims] 1. A package for accommodating a solid-state imaging device, wherein a plurality of uneven portions are provided on the surface. 2. The solid-state imaging device package according to claim 1, wherein the uneven portion is provided on a part of the surface. 3. The solid-state imaging device package according to claim 1, wherein the uneven portion is provided on the entire surface. 4. The solid-state imaging device package according to claim 1, wherein the package is formed of plastic.