JP2007227739A - Package for receiving electronic component and electronic component device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for receiving electronic component which is prominent in reliability and capable of electrically connecting an external electrode to an external substrate stably for a long period of time, in the package for receiving electronic component which is provided with the external electrode, not requiring positioning even when there is variety in the size of products. <P>SOLUTION: The package for receiving electronic components is equipped with an insulating substrate 10 having a mounting unit on which principal surface an electronic component is mounted, and which side surface becomes a mounting surface opposed to the external substrate, the external electrode 30 formed on the mounting surface opposed to the external substrate of the insulating substrate 10 or the side surface, and a wiring conductor 20 with electronic components electrically connected thereto. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to semiconductor integrated circuit elements such as IC and LSI, LD (semiconductor laser), LED (light emitting diode), PD (photodiode), CCD, line sensor, image sensor and other optical semiconductor elements, piezoelectric vibrator, crystal The present invention relates to an electronic component storage package and an electronic component device for storing a vibrator such as a vibrator and other various electronic parts.

  Conventionally, semiconductor integrated circuit elements such as IC and LSI, optical semiconductor elements such as LD, LED, PD, CCD, line sensor and image sensor, vibrators such as piezoelectric vibrators and crystal vibrators, and other various electronic components The package for storing electronic components is generally formed of an electrically insulating material such as an aluminum oxide sintered body, and has an insulating base having an electronic component mounting portion on the upper surface, and from the mounting portion or its periphery to the side surface of the insulating base. This structure has a formed wiring conductor and a plurality of external electrodes formed on the lower surface of the insulating base.

  In addition to mounting the electronic component on the mounting portion of the insulating base, the electrodes for signal, grounding, power supply, etc. of the electronic component are connected to the corresponding wiring conductor via solder or bonding wires, and the electronic component is connected as necessary. The electronic device is completed by sealing the component with resin or a cap.

An electronic device manufactured using such a conventional electronic component storage package is mounted such that the lower surface on which the external electrode is formed faces the main surface of the external substrate. The external electrode formed on the lower surface of the insulating base is connected to the corresponding circuit wiring of the external substrate via a connecting material made of solder or the like, so that the electronic device is mounted on the external substrate.
Japanese Patent Laid-Open No. 3-62559

  2. Description of the Related Art In recent years, electronic component storage packages and electronic devices have been required to reduce the planar occupation area of an external board in accordance with the downsizing of the external board to be mounted.

  However, the above-described conventional electronic component storage package and electronic device are mounted with the lower surface parallel to the surface on which the electronic component is mounted facing the external substrate, so that it is mounted more than the external dimensions (planar area) of the electronic component. There is a restriction that the area cannot be reduced.

  SUMMARY OF THE INVENTION The present invention has been completed in view of the above-mentioned problems of the prior art, and an object of the present invention is to provide an electronic component storage package and an electronic device that have a small mounting area with respect to an external substrate, and preferably have high mounting reliability. Is to provide.

  An electronic component storage package according to the present invention has a mounting portion on which an electronic component is mounted on a main surface, an insulating base whose side surface is a mounting surface facing an external substrate, and the external substrate facing the external substrate. An external electrode formed on a side surface serving as a mounting surface and a wiring conductor to which the electronic component is electrically connected are provided.

  The electronic component storage package of the present invention is preferably characterized in that a side surface serving as the mounting surface has at least one of a concave shape and a convex shape.

The electronic component storage package of the present invention is preferably characterized in that the side surface serving as the mounting surface has a groove-shaped notch extending from the main surface of the insulating base toward the other main surface. It is.

  The electronic component storage package of the present invention is preferably characterized in that the side surface serving as the mounting surface has a groove-shaped notch extending parallel to the main surface.

  In the electronic component storage package of the present invention, it is preferable that the side surface serving as the mounting surface is a surface other than the groove-shaped notch, and the external electrode is disposed on a surface perpendicular to the main surface. It is characterized by having.

  In the electronic component storage package of the present invention, it is preferable that the side surface serving as the mounting surface is a surface other than the groove-shaped notch, and at least a portion adjacent to the main surface and the other main surface. On the other hand, it has a chamfered portion.

  In the electronic component storage package of the present invention, it is preferable that the chamfered portion has the external electrode.

  The electronic component device according to the present invention preferably includes the electronic component storage package, and an electronic component mounted on the mounting portion and electrically connected to the wiring conductor. is there.

  The electronic component storage package of the present invention has a mounting portion on which the electronic component is mounted on the main surface, and an insulating substrate whose side surface is a mounting surface facing the external substrate, and a mounting surface of the insulating substrate facing the external substrate Since the external electrode formed on the side surface and the wiring conductor to which the electronic component is electrically connected are provided, the occupied area viewed from the mounting direction when mounted on the external substrate is the side surface. Is equivalent to the area. Since the side surface has a smaller area (projected area) than the main surface, the area occupied by the external substrate can be kept small, and the electronic component device can be downsized. Further, when the area occupied by the electronic component device is reduced, it is possible to reduce the size of an electronic device (such as a computer or a mobile phone) incorporating an external substrate.

  In the electronic component storage package of the present invention, the side surface serving as the mounting surface has at least one of a concave shape and a convex shape. In the case of a side surface or a convex shape, an external electrode can be formed on the outer end surface. When a plurality of external electrodes are formed, the adjacent external electrodes are separated from each other by a step adjacent to the concave portion or the convex portion, so that electrical insulation between the external electrodes can be ensured.

  Furthermore, by using a full surface printing method instead of a printing method using a normal plate making mask, it is not necessary to perform alignment, and printing can be performed only on the side surface that is the intended mounting surface.

  Therefore, even on the narrow side surface of the insulating base, it is possible to form at least one external electrode that is sufficiently wide and that has good electrical insulation from each other. In this case, the electronic component storage package is mounted on the external substrate through a sufficient amount of connecting material, and the reliability of mechanical and electrical connection to the external substrate may be improved. it can. Therefore, according to this configuration, it is possible to provide an electronic component storage package with a small planar mounting area with respect to the external substrate and high mounting reliability.

  The electronic component storage package of the present invention has a groove-shaped notch that extends from the main surface of the insulating base to the other main surface on the side surface serving as a mounting surface. Even if it is mounted, the surface area of the insulating base is increased, so that the heat radiation effect of the mounting portion can be obtained. Moreover, since air can be flowed through the notch, a further heat dissipation effect can be obtained, and deterioration of mounting reliability due to heat can be prevented.

  In the electronic component storage package of the present invention, the side surface serving as the mounting surface has a groove-shaped notch extending parallel to the main surface. Here, for example, in the case where the side surface having the groove-shaped notch has a groove-shaped notch extending parallel to the main surface, one external electrode serving as a mounting portion is provided at two or more locations. Can be divided. Therefore, the external electrode which was one place before dividing | segmenting by a notch part can be used as a some external electrode, and the number of the external electrodes arrange | positioned on the side surface of an insulation base | substrate is increased significantly. Therefore, for example, even if the number of electrodes of an electronic component increases due to the increase in functionality or integration of the electronic component to be mounted, an electronic component storage package in which it is easy to form an external electrode corresponding to the electrode. be able to.

  In the electronic component storage package of the present invention, the mounting surface is a surface other than the groove-shaped notch, and the surface is perpendicular to the main surface. Even if it has a notch-like shape, it can be connected perpendicularly to the external substrate. Then, by processing the groove-shaped notch with an arbitrary size and shape, a surface other than the groove-shaped notch becomes an external electrode facing the external electrode.

  In the electronic component storage package of the present invention, the side surface serving as the mounting surface is a surface other than the groove-shaped notch, and has a chamfered portion on at least one of the main surface and a portion adjacent to the other main surface. This effectively prevents stresses such as thermal stress from concentrating via the connecting material on the side surface and a portion (ridge line portion) adjacent to the main surface or the other main surface. In addition, there are no corners that are prone to mechanical breakage such as chipping, and it is effectively prevented that mechanical breakage such as chipping occurs on the main surface of the insulating base or the portion between the other main surface and the side surface. , Improve reliability.

  Further, by having a chamfered portion, for example, when the surface wiring conductor is formed on the main surface or other main surface of the insulating base with high density (up to the vicinity of the outer side of the main surface or other main surface), the surface An electrical short circuit between the wiring conductor and the external electrode can be suppressed.

  That is, even if the wiring conductor is formed close to the outer edge of the insulating base, there is a chamfered portion between the main surface and the other main surface and the side surface. The distance between the external electrodes can be increased. Moreover, when the insulating material which comprises an insulating base | substrate is exposed to the chamfering part, it is prevented effectively that the connection material which consists of metal materials, such as solder, moves on a chamfering part, for example. Therefore, according to this configuration, it is possible to provide a highly reliable electronic component storage package in which an electrical short circuit between the external electrode and the surface wiring conductor is more effectively suppressed. Further, the shape of the external electrode can be arbitrarily set by changing the dimension of the chamfered portion.

  On the other hand, when the chamfered portion of the electronic component storage package of the present invention has an external electrode, when mounting with solder or the like, the solder is joined from the external electrode on the side surface of the insulating base to the external electrode of the chamfered portion, Since a meniscus can be formed on the chamfered portion, mounting reliability is improved.

  In addition, the electronic component device of the present invention includes an electronic component storage package and an electronic component that is mounted on the mounting portion and electrically connected to the wiring board. It is possible to provide an electronic device with excellent reliability.

  The electronic component storage package of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a cross-sectional view showing an example of an embodiment of an electronic component storage package according to the present invention.

  In FIG. 1, 10 is an insulating substrate, 20 is a wiring conductor, and 30 is an external electrode. The insulating base 10, the wiring conductor 20, and the external electrode 30 mainly constitute an electronic component housing package X such as a semiconductor element or a crystal oscillator. In FIG. 1, reference numeral 40 denotes a surface wiring conductor.

  The insulating base 10 has, for example, a rectangular parallelepiped shape, and has a mounting portion 10a on which an electronic component is mounted on the main surface. In the present embodiment, the insulating base 10 has a concave portion (no symbol) on the main surface, and the inside thereof is a mounting portion 10a for electronic components. In the present invention, the main surface means a surface on which an electronic component is mounted, the surface on the back side of the main surface is the other main surface, and the surface that is in direct contact with the main surface is the side surface.

  Electronic components (not shown) include semiconductor integrated circuit elements such as IC and LSI, LDs, LEDs, PDs, CCDs, optical semiconductor elements such as line sensors and image sensors, vibrators such as piezoelectric vibrators and crystal vibrators, Other various electronic components.

  The insulating base 10 is made of ceramic materials such as aluminum oxide sintered body (alumina ceramics), glass ceramic sintered body, aluminum nitride sintered body, mullite sintered body, organic resins such as epoxy resin and polyimide resin, Or it forms with insulating materials, such as a composite material formed by couple | bonding ceramic filler powder with organic resin.

  If the insulating base 10 is made of, for example, an aluminum oxide sintered body, a plurality of ceramic green sheets obtained by forming raw powders such as aluminum oxide and silicon oxide together with an organic binder into a sheet shape are laminated. It is formed by firing.

  In the insulating base 10, for example, the wiring conductor 20 is led out from the periphery of the mounting portion 10a to the outer surface serving as the mounting surface. In the wiring conductor 20, an electrode of an electronic component is electrically connected to a portion exposed around the mounting portion 10 a via a conductive connecting material (not shown) such as solder or a bonding wire to insulate the electrode of the electronic component. It functions to lead to the mounting surface of the substrate 10. The mounting surface means the surface of the insulating base 10 that faces the external substrate (not shown) when the electronic component storage package X is mounted on the external substrate.

  An external electrode 30 for electrically connecting the electronic component storage package X to the external substrate is formed on the mounting surface of the insulating base 10. The external electrode 30 is electrically connected to the electronic component via the wiring conductor 20, for example. The external electrode 30 is electrically connected to the electric circuit of the external substrate via a connecting material such as solder, so that the electronic component is electrically connected to the electric circuit (not shown) of the external substrate.

  These wiring conductor 20, external electrode 30, and surface wiring conductor 40 are made of a metal such as tungsten, molybdenum, manganese, copper, silver, gold, or palladium. The metal used as the wiring conductor 20, the external electrode 30, and the surface wiring conductor 40 is deposited on the insulating substrate 10 in the form of a metallized layer, a plating layer, a metal foil, or the like, for example, if it is made of a metallized layer of tungsten. It is formed by applying a metal paste obtained by adding and kneading an organic solvent and a binder to tungsten powder on a ceramic green sheet to be the insulating substrate 10.

  In the electronic component storage package X of the present invention, the mounting surface is the side surface of the insulating base 10, and the external electrode 30 is formed on the side surface.

  By using the side surface of the insulating base 10 as a mounting surface, the area occupied by the electronic component storage package X on the external substrate can be reduced. That is, when the electronic component storage package X is mounted on the external substrate, the occupied area viewed from the mounting direction corresponds to the side surface area. Since the side surface has a smaller area (projected area) than the main surface, the area occupied by the external substrate can be kept small.

  In addition, as shown in FIGS. 2A and 2B, the electronic component storage package X preferably has a side surface serving as a mounting surface having at least one of a concave shape and a convex shape. 2A shows an example in the case of having a concave shape, and FIG. 2B shows an example in the case of having a convex shape.

  2 (a) and 2 (b) are enlarged perspective views of main parts showing an enlarged side portion of the electronic component storage package shown in FIG. 2 (a) and 2 (b), the same parts as those in FIG.

  In this case, in the case of a concave shape on the side surface that becomes the mounting surface, the external electrode 30 can be entirely formed on the side surface portion remaining after the notch or the outer end surface in the case of the convex shape. When a plurality of external electrodes 30 are formed, the adjacent external electrodes 30 are separated from each other by a step adjacent to the concave portion or the convex portion, so that electrical insulation between the external electrodes 30 can be ensured. it can. Therefore, according to this configuration, it is possible to provide the electronic component storage package X having a small planar mounting area with respect to the external substrate and high mounting reliability.

  In addition, when providing a concave shape or a convex shape on the side surface of the insulating substrate 10, it is not necessary to provide only one of them as shown in the figure, and the concave shape and the convex shape may be mixed. Further, it is not necessary for all the concave shapes and convex shapes to have the same dimensions, shapes, and adjacent intervals, and various forms are possible depending on conditions such as the external dimensions of the insulating base 10 and the positions and sizes of the external electrodes. May be formed. For example, at both end portions of the side surface where stress such as thermal stress tends to act greatly, the convex end surface is enlarged to ensure a large area of the external electrode 30 and further improve connection reliability. Also good. However, in consideration of the mounting reliability of the electronic component storage package of the present invention, it is preferable to adjust the concave shape or the convex shape so that all the portions that become the external electrodes are connected perpendicularly to the external substrate. .

  Moreover, it is preferable that the concave portion or the convex portion penetrates the insulating substrate 1 in the thickness direction in consideration of productivity.

  The insulating base 10 having a concave shape or a convex shape on the side surface is subjected to, for example, mechanical punching processing or the like on the side surface of the ceramic green sheet laminate to be the insulating base 10 and penetrates from the main surface to the other main surface. It can produce by forming the punching part which does.

  Moreover, it can also form by laminating | stacking this, previously performing the same punching process on the side surface of a predetermined thing among several ceramic green sheets. With this method, an insulating base (not shown) having a concave shape or a convex shape only in a part of the side surface in the thickness direction can be produced.

  In addition, the external electrode in this case is, for example, a metal paste such as tungsten on the side surface of the laminated body of ceramic green sheets formed with a concave shape or a convex shape. In the case of a convex shape, it can be formed by printing using a printing plate making (pattern surface) which is patterned only on the outer end surface.

  Alternatively, a metal paste is printed (so-called solid coating) on the entire surface of the ceramic green sheet laminate, which is the mounting surface, and then punched to form a concave shape or a convex shape. It may be.

  FIG. 6 shows a side view when the electronic component storage package X of FIG. 2A is mounted on the external substrate 80, and FIG. 7 shows a front view thereof. In the present invention, the object of the present invention can be achieved by forming the external electrode 30 on the side surface serving as the mounting surface and connecting it so as to face the external substrate 80. That is, it is possible to provide the electronic component storage package X having a small mounting area of the external substrate and high mounting reliability.

  Further, the side surface serving as the mounting surface preferably has a groove-shaped notch 50 extending from the main surface of the insulating base 10 toward the other main surface, as shown in FIG. FIG. 3A is an enlarged perspective view showing an example of the embodiment in the case where the cutout portion 50 is provided.

  According to this embodiment, the side surface serving as the mounting surface has the groove-shaped notch 50 extending from the main surface of the insulating base 10 toward the other main surface. Even when a component is mounted, the surface area of the insulating base 10 is increased by the notch 50, so that the portion that comes into contact with the outside air is increased, a heat dissipation effect is obtained, and the influence of heat on the mounting portion can be suppressed.

  Moreover, since air can be flowed through the notch part 50, the further heat dissipation effect is acquired, the fall of the reliability by heat | fever can further be prevented, and the electronic component storage package X stable for a long term can be provided.

  Further, in order to obtain a heat dissipation effect directly under the electronic component, a metal such as Cu—W (copper and tungsten alloy) may be brazed to at least one of the main surface portion and the other main surface portion as a heat sink. However, when mounting a plurality of electronic component storage packages X in series or in parallel on the external board, the area of the mounting part of the external board increases due to the thickness of the heat sink or the weight of the heat sink increases. Accordingly, stress may be generated between the external electrode 30 and the mounting portion of the external substrate and the mounting reliability may be deteriorated. Therefore, it is preferable to employ the present invention as long as the effects of the present invention are not impaired.

  Further, it is more preferable that the side surface to be the mounting surface further has a groove-shaped cutout portion 60 extending parallel to the main surface. In this case, one place of the external electrode 30 serving as a mounting portion can be divided into two or more places. Therefore, the external electrode 30 that has been one place before being divided by the notch can be used as a plurality of external electrodes 30, and the number of external electrodes 30 arranged on the side surface of the insulating base 10 is greatly increased. . Therefore, for example, even if the number of electrodes of an electronic component increases due to the high functionality and high integration of the electronic component to be mounted, an electronic component storage package that can easily form the corresponding external electrode 30 can do.

  In this case, although the area per one external electrode 30 is reduced, the number of external electrodes itself is greatly increased, so that mechanical and electrical connection reliability to the external substrate is sufficiently ensured.

  In addition, the external electrode 30 divided by the notch 60 parallel to the main surface does not need to correspond to electrodes of different electronic parts on both sides of the notch 60, and one of the electronic parts One external electrode corresponding to the electrode (having the cutout portion 60) may be used. In this case, in addition to the notch 50 between the main surface and the other main surface, a heat radiation effect can be obtained also in the notch 60 parallel to the main surface.

  Such notches 50 and 60 are formed by, for example, performing mechanical or chemical polishing or cutting on the side surface of the laminated body of ceramic green sheets having a concave shape or a convex shape. can do.

  Further, the mounting electrode has a side surface other than the groove-shaped cutout portions 50 and 60, and the external electrode 30 is provided on a surface perpendicular to the main surface, so that a groove-shaped cutout portion is provided. Even if it is, it can connect with an external board | substrate perpendicularly | vertically. Then, by processing the groove-shaped cutout portions 50 and 60 with arbitrary dimensions and shapes, the surface other than the groove-shaped cutout portion becomes the external electrode 30 facing the external substrate.

  In the electronic component storage package X of the present invention, as shown in FIG. 4, the side surface serving as the mounting surface is a surface other than the groove-shaped notches 50 and 60 and is adjacent to the main surface and the other main surface. By having the chamfered portion 70 in at least one of the portions, it is effective that stress such as thermal stress is concentrated on the side surface and a portion (ridge line portion) adjacent to the main surface or the other main surface via the connecting material. Is prevented. Further, the corners that are likely to cause mechanical breakage such as chipping are eliminated, and mechanical breakage such as chipping is effectively prevented from occurring on the main surface of the insulating substrate 10 or between the other main surface and the side surface. And reliability is improved.

  Further, as shown in FIG. 5A, by having the chamfered portion 70, for example, on the main surface or other main surface of the insulating base 10 with high density (to the vicinity of the outer edge of the main surface or other main surface). ) When the surface wiring conductor 40 is formed, an electrical short circuit between the surface wiring conductor 40 and the external electrode 30 can be suppressed.

  That is, even if the surface wiring conductor 40 is formed to the vicinity of the outer edge of the insulating base 10, there is a chamfered portion 70 between the main surface or another main surface and the side surface. The distance between the surface wiring conductor 40 and the external electrode 30 can be increased. Moreover, when the insulating material which comprises the insulating base | substrate 10 is exposed to the chamfer 70, it is prevented effectively that the connection material which consists of metal materials, such as solder, moves on the chamfer 70, for example. Therefore, according to this configuration, it is possible to obtain a highly reliable electronic component storage package in which an electrical short circuit between the external electrode 30 and the surface wiring conductor 40 is more effectively suppressed. Further, the shape of the external electrode 30 can be arbitrarily set by changing the dimension of the chamfered portion 70.

  A side view when the electronic component storage package X of FIG. 5A is mounted on the external substrate 80 is shown in FIG. 8, and a front view is shown in FIG. In the present invention, the object of the present invention can be achieved by forming the external electrode 30 on the side surface serving as the mounting surface and connecting it so as to face the external substrate 80. That is, even when the surface wiring conductor 40 is formed close to the outer edge of the insulating base 10, the electronic component storage package X in which the electrical short circuit between the external electrode 30 and the surface wiring conductor 40 is more effectively suppressed is obtained. Can be provided.

  On the other hand, as shown in FIG. 5B, when the chamfered portion 70 of the electronic component storage package X of the present invention has the external electrode 30, when mounting with solder or the like, the solder is the insulating base 10. Since bonding is performed from the external electrode 30 on the side surface to the external electrode 30 of the chamfered portion 70, a meniscus can be formed on the chamfered portion, so that mounting reliability is improved.

  That is, for the chamfered portion 70, when the insulating material constituting the insulating base 10 is exposed (the external electrode 30 is not formed), the chamfered portion 70 is formed between the surface wiring conductor 40 on the main surface or the other main surface and the external electrode 30. This is effective in securing electrical insulation, and in the case of forming the external electrode 30, it is effective in further improving the connection reliability with respect to the external substrate.

  Such a chamfered portion 70 can be formed, for example, by subjecting a side surface of a laminated body of ceramic green sheets having a concave shape or a convex shape to processing such as mechanical and chemical polishing or cutting. it can.

  Further, the external electrode 30 on the chamfered portion 70 can be formed by means such as printing of a metal paste as described above.

  FIG. 10 shows a front view when the electronic component storage package X of FIG. 5B is mounted on the external substrate 80. In the present invention, the object of the present invention can be achieved by forming the external electrode 30 on the side surface serving as the mounting surface and connecting it so as to face the external substrate 80. That is, when the external electrode 30 is formed on the chamfered portion 70, it is possible to provide the electronic component storage package X that can further improve the connection reliability to the external substrate.

  In addition, the electronic component is mounted on the mounting portion 10a of the electronic component storage package X of the present invention, and the electronic component is sealed with a sealing means (not shown) such as a lid or a sealing resin as necessary. By electronically sealing, an electronic component device is formed.

  The mounting of the electronic component on the mounting portion 10a is performed, for example, by joining the electronic component to the mounting portion 10a via a low melting point brazing material such as a gold-silicon brazing material or a bonding material such as glass or resin.

  The electronic component device of the present invention includes the electronic component storage package X and the electronic component mounted on the mounting portion and electrically connected to the wiring conductor. It is suitable for improving the electrical long-term reliability between the external substrate and the external substrate. Further, since the side surface of the insulating base 10 is a mounting surface that is mounted facing the external substrate, it is suitable for reducing the occupied area in the external substrate.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.

It is sectional drawing which shows an example of embodiment of the electronic component storage package of this invention. It is an expansion perspective view which shows an example of embodiment of the electronic component storage package of this invention. It is an expansion perspective view which shows an example of embodiment of the electronic component storage package of this invention. It is sectional drawing which shows an example of embodiment of the electronic component storage package of this invention. It is an expansion perspective view which shows an example of embodiment of the electronic component storage package of this invention. It is a side view which shows an example which mounted the electronic component storage package of this invention in the external substrate. It is a front view which shows an example which mounted the electronic component storage package of this invention in the external substrate. It is a side view which shows an example which mounted the electronic component storage package of this invention in the external substrate. It is a front view which shows an example which mounted the electronic component storage package of this invention in the external substrate. It is a front view which shows an example which mounted the electronic component storage package of this invention in the external substrate.

Explanation of symbols

X Electronic Component Storage Package 10 Insulating Base 10a Mounting Portion 20 Wiring Conductor 30 External Electrode 40 Surface Wiring Conductor 50 Notch 60 Notch 70 Chamfer 80 External Substrate

Claims (8)

An insulating base having a mounting portion for mounting an electronic component on a main surface, and a side surface serving as a mounting surface facing the external substrate, and an external formed on the side surface of the insulating base serving as a mounting surface facing the external substrate An electronic component storage package comprising an electrode and a wiring conductor to which the electronic component is electrically connected. 2. The electronic component storage package according to claim 1, wherein a side surface serving as the mounting surface has at least one of a concave shape and a convex shape. The electronic component storage package according to claim 2, wherein the side surface serving as the mounting surface has a groove-shaped notch extending from the main surface of the insulating base toward the other main surface. 4. The electronic component storage package according to claim 2, wherein a side surface serving as the mounting surface has a groove-shaped cutout portion extending in parallel with the main surface. 5. The side surface to be the mounting surface is a surface other than the groove-shaped notch and has the external electrode on a surface perpendicular to the main surface. The package for electronic component storage as described. The side surface serving as the mounting surface is a surface other than the groove-shaped notch, and has a chamfered portion on at least one of the main surface and a portion adjacent to the other main surface. The electronic component storage package according to any one of claims 3 to 5. The electronic component storage package according to claim 6, wherein the chamfered portion includes the external electrode. An electronic component device comprising: the electronic component storage package according to claim 1; and an electronic component mounted on the mounting portion and electrically connected to the wiring conductor.

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